IPC WINTERCOM 2024

Date
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Join colleagues from around the globe for a week of active participation in IPC standards development committee meetings during IPC WinterCom 2024, Barcelona, Spain, January 22 - 25, 2024.

IPC WinterCom 2024 is a new event to support IPC standards development committees in face-to-face sessions. During the weeklong series of meetings, the global electronics manufacturing industry will meet to develop and maintain the IPC standards they use to build electronics better.

Committee meeting topics will include materials, design, PCB fabrication, PCB assembly, Factory of the Future, e-textiles and all of the most widely used IPC standards will be discussed.

This event is open and free to both IPC members and nonmembers with an interest in IPC standards development committee meetings, from newcomers to IPC standards to longtime industry committee participants and leaders. IPC appreciates your contribution to the industry standards and guidelines relied on by your company, customers, suppliers, and competitors.

We look forward to welcoming you to Barcelona in January!

Register Now

Committee Meetings Schedule 

8:00 am-8:45 am | Welcome Remarks and Keynote Session, Port Vell Room Networking Area

9:00 am-5:30 pm
5-22A and 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting

The 5-22A task group is responsible for the joint industry soldering standard, J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies.

The 7-31B task group is responsible for maintaining IPC-A-610 Acceptability of Electronic Assemblies.

9:00 am-12:00 pm
5-33C: Conformal Coating Handbook Task Group

The 5-33C task group is responsible for the maintenance of the IPC-HDBK-830 Guidelines for Design, Selection, and Application of Conformal Coatings.

5-21N: Cold Joining/Press-fit Task Group
The 5-21N task group is responsible for the handbook that explains accepted industry practices for users of IPC-9797. The handbook details the process techniques, equipment, materials, tests and acceptance requirements for the production of acceptable press-fit hardware.

12:00 pm-1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:00 pm
2-17A: IPC-CFX Standard Task Group
The 2-17A task group is responsible for the management of IPC-2591, Connected Factory Exchange, which establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing.

1:30 pm-5:30 pm
7-31FHV: IPC/WHMA-A-620 High-Voltage Cable Addendum Task Group

The 7-31FHV task group is looking at high voltage cable applications in the electric mobility industry.

Smart Plastics Congress
The 7-31FHV task group is looking at high voltage cable applications in the electric mobility industry.

D-25A: High Speed High Frequency Communication Devices Subcommittee
Task group developing requirements for mechanical properties, electrical test conditions, interconnections and plug-in technologies for high-speed connections in high reliability applications, such as automotive.

3:30 pm–5:30 pm
2-19A: Critical Components Traceability Task Group

The 2-19A task group is responsible for the management of IPC-1782, Standard for Manufacturing and Supply Chain Traceability of Electronic Products, which establishes minimum requirements for traceability of items throughout the entire supply chain.

8:00 am-8:45 am | Morning Keynote Session, Port Vell Room Networking Area

9:00 am-10:15 am
5-21H: Bottom Termination Components (BTC) Task Group

The 5-21H task group is maintaining IPC-7093, a companion document to IPC-7094 and IPC-7095 that describes the design and assembly challenges for implementing Bottom Termination Components (BTCs) whose external connections consist of metallized terminations that are an integral part of the component body.

2-12A: Generic Requirements for Digital Twin Task Group
The 2-12A task group is responsible for maintaining IPC-2551, International Standard for Digital Twin Architecture, which stipulates and defines Digital Twin properties, types, complexities and readiness levels.

9:00 am-12:00 pm
5-22A and 7-31B: IPC-J-STD-001 and IPC-A-610 Joint Meeting

The 5-22A task group is responsible for the joint industry soldering standard, J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies.

The 7-31B task group is responsible for maintaining IPC-A-610 Acceptability of Electronic Assemblies.
This task group is developing IPC-9716, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies, which provides requirements for automated inspection systems to define, set up, establish and apply process control for manufacturing printed board assemblies, including general and specific process and equipment conditions.

Smart Plastics Congress
The 9th Smart Plastics Congress will focus on plastronics, printed electronics and surface functionalization and the results of research projects and the latest technological innovations. A visit to EURECAT's plastronics pilot plant is planned as an afternoon activity.

7-25A: Automated Optical Inspection Process Control Standard Task Group
This task group is developing IPC-9716, Requirements for Automated Optical Inspection (AOI) Process Control for Printed Board Assemblies, which provides requirements for automated inspection systems to define, set up, establish and apply process control for manufacturing printed board assemblies, including general and specific process and equipment conditions.

9:00 am-5:30 pm
E-31 Supplier Declaration Subcommittee

The E-31 establishes the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration (sectional standards). The requirements for declaring information about a specific declaration topic are specified in the IPC-175x sectional standards.

10:30 am–12:00 pm
2-12B: Model Based Definition (MBD) for Digital Twins Task Group

The 2-12B task group is responsible for maintaining IPC/DAC -2552, General Electronic Components Model Based Definition (MBD) Standard, a set of specification elements for components and parts as part of a digital model-based standard for digital design of board-level assemblies and to support virtual manufacturing.

10:30 am–5:30 pm
7-31BV: J-STD-001 and IPC-A-610 Automotive Addendum Task Group

This Task Group is responsible for maintaining an addendum to J-STD-001 and IPC-A-610 to enable users to specify a standardized set of acceptance criteria unique to assemblies used in the automotive industry.

12:00 pm-1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:00 pm
5-22AS: Space and Military Electronic Assemblies Task Group

The 5-22AS Task Group is responsible for maintaining an addendum to J-STD-001 to enable users to specify a standardized set of acceptance criteria unique to electronic assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.

1:30 pm–3:15 pm
D-31B: IPC-2221/2222 Task Group

This task group is responsible for the development/update of IPC-2221, Generic Standard on Printed Board Design, and IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards.

2-12C: Cybersecurity Protection Standard Task Group
The 2-12C task group is responsible for maintaining IPC-1792, Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain, which establishes requirements to provide assurance that products have been manufactured in cybersecure environments, ensuring that there has been no risk of impact to the product due to cybersecurity incidents.

1:30 pm–5:30 pm
5-33A: Conformal Coating Task Group

The 5-33A task group is responsible for maintaining IPC-CC-830 Qualification and Performance of Electrical Insulating Compound for Printed Wiring Assemblies and the associated test methods.

3:15 pm–4:15 pm
7-31FS: IPC WHMA-A-620 Space and Military Electronic Assemblies Addendum Task Group

The 7-31FS Task Group is responsible for maintaining an addendum to IPC/WHMA-A-620 to enable users to specify a standardized set of acceptance criteria unique to cable and wire harness assemblies used in the rigorous micro-gravity micro-atmosphere high mechanical stress environments associated with space electronic hardware.

3:30 pm-5:30 pm
D-33-AP: Ultra HDI Subcommittee

The D-33-AP Subcommittee is responsible for developing design and fabrication guidelines for printed boards utilizing conductors and spacings below 50 µm and dielectric spacings below 75 µm (defined as Ultra HDI within the Subcommittee) that are manufactured with semi-additive and modified semi-additive processing.

2-12D: Digital Sustainability Credentials Standard Task Group
The 2-12D task group is responsible for developing IPC-2553 Global Standard for Digital Sustainability Credentials, which establishes the framework, content definition and secure interoperability mechanism that provides the needed ability to exchange factors that influence environmental sustainability, without the risk of IP leakage, in a way that scales from the original source of materials, through to the final product.

4:30 pm–5:30 pm
7-34: Repairability Subcommittee

The 7-34 subcommittee is responsible for the maintenance of IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies.

8:00 am-8:45 | Morning Keynote Session, Port Vell Room Networking Area

9:00 am–12:00 pm
D-33A and 7-31A: Rigid Printed Bd. and IPC-A-600 Task Group Joint Meeting

The D-33A task group is responsible for the maintenance of the IPC-6012, Qualification and Performance Specification for Rigid Printed Boards.

The 7-31A task group is responsible for maintaining the IPC-A-600, Acceptability of Printed Boards, as a visual supporting document to the IPC-6010 specifications for printed board qualification and performance.

D-84A: Plastronics Accelerated Reliability Testing Task Group
The D-84A task group is responsible for the development of IPC-9206 Guidelines for Accelerated Reliability Testing of 3D Plastronics Parts, to enable users to specify a standardized set of testing guidelines to verify the reliability of 3D plastronics end products, such as in-mold electronics and laser surface activated molded integrated devices.

B-10A: Plastic Chip Carrier Cracking Task Group
The B-10A task group was formed based on concerns raised at the Surface Mount Council regarding cracking observed in plastic chip components.

D-70: E-Textiles Committee
Task groups within this committee are responsible for maintaining and developing IPC standards for conductive yarn functionality; printed electronics e-textiles reliability; woven, knitted and braided e-textiles functionality; embroidered e-textiles design; reliability of e-textiles wearables and multiple new IPC Test Methods to support requirements in these standards.

9:00 am–4:30 pm
7-31F: IPC/WHMA-A-620 Task Group

This task group is responsible for maintaining IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies

9:00 am–5:30 pm
E-31 Supplier Declaration Subcommittee

The E-31 establishes the principles necessary for the exchange of declaration information between supply chain partners relating to a product and the purpose of a declaration (sectional standards). The requirements for declaring information about a specific declaration topic are specified in the IPC-175x sectional standards.

12:00 pm–1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–5:30 pm
D-33AA: IPC-6012 Automotive Addendum

The D-33AA task group is chartered with maintaining an addendum to the IPC-6012, Qualification and Performance Specification for Rigid Printed Boards, that will provide specific requirements for printed boards in automotive applications.

1-14: DFX Standards Subcommittee
The 1-14 subcommittee is developing guidelines for the application of industry standards in DFM (design for manufacturing), DFR (design for reliability) DFA (design for assembly), etc.

D-83A: In-Mold Electronics Interconnection Task Group
The D-83A Task Group is responsible for the development of IPC-8411 Guidelines for In-Mold Electronics, to enable users to specify a standardized set of guidelines for the integration of printed electronics and electrical components into injection molded plastics to form 3D plastronic parts.

4:30 pm–5:30 pm
7-31J: IPC-A-630 Task Group

The 7-31J task group is responsible for the maintenance of IPC-A-630 Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures and IPC-HDBK-630 Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures.

8:00 am–9:00 am | Morning Keynote Session, Port Vell Room Networking Area

9:00 am–5:30 pm
V-EUTG: European Training Group

This is the European Training Group/Committee for ALL IPC Training Programs. Meeting open to ALL training committee members, EU and International. V-EUTG is responsible for reviewing course content, including program translations, and providing recommendations for the training and certification programs.

9:00 am–12:00 pm
D-83A: In-Mold Electronics Interconnection Task Group

The D-83A Task Group is responsible for the development of IPC-8411 Guidelines for In-Mold Electronics, to enable users to specify a standardized set of guidelines for the integration of printed electronics and electrical components into injection molded plastics to form 3D plastronic parts.

12:00 pm–1:30 pm | Networking Lunch, Port Vell Room Networking Area

1:30 pm–3:15 pm
5-21JND: Solder Paste Printing Task Group

This task group is responsible for the maintenance of IPC-7527 Requirements for Solder Paste Application.

1:30 pm–5:30 pm
5-33C: Conformal Coating Handbook Task Group

The 5-33C task group is responsible for the maintenance of the IPC-HDBK-830 Guidelines for Design, Selection, and Application of Conformal Coatings.

Event Venue & Hotel Information

Event Venue: World Trade Center Barcelona

Moll de Barcelona S/N
South Building
08039 Barcelona
Spain

World Trade Center Barcelona

World Trade Center Barcelona Website

Hotel Information

Book your Hotel Today!

Please find the current room blocks available for WinterCom below:

  • Catalonia Port - price per night @120 EUR including breakfast - 15 rooms available
  • Eurostars Grand Marina - price per night @217 EUR including breakfast  - 15 rooms available
  • Hotel Serras - price per night @ 312 EUR including breakfast  - 7 rooms available
  • Hotel Serras - price per night @ 372 EUR including breakfast  - 7 rooms available

Check-in and check-out dates can be adjusted until 10 January 2024.

To take advantage of these room blocks, please send an email to andreaturcott@ipc.org before 10 January 2024 including your request for hotel and indicate which hotel you prefer along with check-in and checkout dates. We will send you your confirmation number. 

All rooms are payable at the hotel reception at time of checkin

Important note: Cancellations/modifications are free of charge until 10 January 2024.

World Trade Center Barcelona

Moll de Barcelona S/N
South Building
08039 Barcelona Barcelona
Spain

World Trade Center Barcelona

World Trade Center Barcelona
Moll de Barcelona S/N
Barcelona, Barcelona 08039
Spain