Join the Weak Microvia Interface Open Forum During IPC APEX EXPO

The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed in 2018 to identify the need to identify the risks, causes, and mitigation of failures due to a weak interface between the plated copper at the bottom of a microvia and the underlying copper surface. The subcommittee will hold an open forum during IPC APEX EXPO for industry to discuss this important topic and how industry can come together to address it. Attendees will be invited to share their own issues regarding the weak microvia interface and will learn how to participate on the subcommittee. IPC Weak Microvia Interface Open Forum Wednesday, January 30 10:15 AM to 12:00 PM San Diego Convention Center Room 11A Agenda 10:15-10:20 AM – Introduction and Organization / IPC Solutions Committee Logistics Chris Jorgensen, IPC staff 10:20-10:30 AM – Background: History of the effort, scope of work, status and organization Marc Carter, V-TSL-MVIA Chair 10:30-10:45 AM – Presentation: Current Understanding of the Problem/Mitigation Measures Jerry Magera and J.R. Strickland, Motorola 10:45-11:05 AM – Weak Microvia Interface Project Subteam Reports • Data Collation and Mining on the Issue Happy Holden Using results of tests already conducted by various organizations to establish “knowns” vs. “unknowns” for further study and/or confirmation • FMEA “Fishbone” Presentation on what the group has done so far, the categories and that we need volunteer experts to help fill in that information • Engineering Simulation Marc Carter Initial high-level model debugging Incorporating data collation and Fishbone targets going forward 11:05-11:30 AM – Next Steps and Goals • Near term: o Breakout teams (plan for Thursday working meeting based on Fishbone) Marc Carter o Published literature and public data “mining” effort Mike Carano, V-TSL Committee Chair • Middle term: o Knowns/Unknowns: Can any intermediate conclusions or improved mitigation techniques be communicated in another white paper? o Identify Testing Needed: Gaps and confirmation o Capture suggestions from the floor (continue during Q&A/Discussion) • Long term: Prevention: Can it be accomplished through design, process enhancements, etc.? 11:30AM-12:00PM – Q&A Session and How to Get Involved The IPC V-TSL-MVIA Weak Interface Microvia Failures Technology Solutions Subcommittee formed as a result of work done on IPC-WP-023. Order IPC-WP-023, IPC Technology Solutions White Paper on Performance-Based Printed Board OEM Acceptance Via Chain Continuity Reflow Test: The Hidden Reliability Threat - Weak Microvia Interface from the IPC bookstore. For more information on the IPC V-TSL-MVIA Subcommittee, e-mail me at ChrisJorgensen@ipc.org.