Fabrication and Assembly Challenges to be Covered at the Executive Forum for Advancing Automotive Electronics at IPC APEX EXPO 2019
Are you building military boards or circuits for 5G? If so, reliability is of paramount importance and you should consider attending IPC’s Executive Forum for Advancing Automotive Electronics and learn what is being done to improve reliability, what high voltage tests are being conducted, and what new materials and process chemicals have been developed to produce fine lines and dissipate heat.
Tier 1 providers will discuss what is expected and what they are doing to improve reliability. Industry icons from Asia and Europe will join American leaders to provide information to help you meet tomorrow’s fabrication and assembly challenges. This not-to-be-missed event will be held at IPC APEX EXPO 2019 on January 28 in San Diego.
Registration information for the Executive Forum on Advancing Automotive Electronics is available online at www.ipcapexexpo.org.
For further information, contact Forum Chairman Gene Weiner at gene@weiner-intl.com or Tracy Riggan, senior director, IPC Member Support at TracyRiggan@ipc.org.
Tier 1 providers will discuss what is expected and what they are doing to improve reliability. Industry icons from Asia and Europe will join American leaders to provide information to help you meet tomorrow’s fabrication and assembly challenges. This not-to-be-missed event will be held at IPC APEX EXPO 2019 on January 28 in San Diego.
Registration information for the Executive Forum on Advancing Automotive Electronics is available online at www.ipcapexexpo.org.
For further information, contact Forum Chairman Gene Weiner at gene@weiner-intl.com or Tracy Riggan, senior director, IPC Member Support at TracyRiggan@ipc.org.