TM 2.4.1.5A |
|
Determination of Treatment Transfer |
TM 2.4.1.6 |
|
Adhesion, Polymer Coating |
TM 2.4.12A |
|
Solderability, Edge Dip Method |
TM 2.4.13.1 |
|
Thermal Stress of Laminates |
TM 2.4.13F |
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Solder Float Resistance Flexible Printed Wiring Materials |
TM 2.4.14.2A |
|
Liquid Flux Activity, Wetting Balance Method |
TM 2.4.15A |
|
Surface Finish, Metal Foil |
TM 2.4.16B |
|
Initiation Tear Strength, Flexible Insulating Materials |
TM 2.4.17 |
|
Tear Strength (Propagation) |
TM 2.4.17.1B |
|
Propagation Tear Strength, Flexible Insulating Material |
TM 2.4.18.1A |
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Tensile Strength and Elongation, In-House Plating |
TM 2.4.18.2 |
|
Hot Rupture Strength, Foil |
TM 2.4.18.3 |
|
Tensile Strength, Elongation, and Modulus |
TM 2.4.18B |
|
Tensile Strength and Elongation, Copper Foil |
TM 2.4.19C |
|
Tensile Strength and Elongation, Flexible Printed Wiring Materials |
TM 2.4.1E |
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Adhesion, Tape Testing |
TM 2.4.2.1D |
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Flexural Fatigue and Ductility, Foil |
TM 2.4.21F |
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Land Bond Strength, Unsupported Component Hole |
TM 2.4.22.1C |
|
Bow and Twist-Laminate |
TM 2.4.22.2 |
|
Substrate Curvature: Silicon Wafers with Deposited Dielectrics |
TM 2.4.22C |
|
Bow and Twist (Percentage) |
TM 2.4.23 |
|
Soldering Resistance of Laminate Materials |
TM 2.4.24.1 |
|
Time to Delamination (TMA Method) |
TM 2.4.24.2 |
|
Glass Transition Temperature of Organic Films - DMA Method |
TM 2.4.24.3 |
|
Glass Transition Temperature of Organic Films - TMA Method |
TM 2.4.24.4 |
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Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias -DMA Method |
TM 2.4.24.5 |
|
Glass Transition Temperature and Thermal Expansion of Materials Used In High Density Interconnection (HDI) and Microvias -TMA Method |
TM 2.4.24.6 |
|
Decomposition Temperature (Td) of Laminate Material Using TGA |
TM 2.4.24C |
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Glass Transition Temperature and Z-Axis Thermal Expansion by TMA |
TM 2.4.25D |
|
Glass Transition Temperature and Cure Factor by DSC |
TM 2.4.26 |
|
Tape Test for Additive Printed Boards |
TM 2.4.27.1B |
|
Abrasion (Taber Method) Solder Mask and Conformal Coating |
TM 2.4.28.1F |
|
Solder Mask Adhesion - Tape Test Method |
TM 2.4.29C |
|
Adhesion, Solder Mask, Flexible Circuit |
TM 2.4.2A |
|
Ductility of Copper Foil |
TM 2.4.3.1C |
|
Flexural Fatigue and Ductility, Flexible Printed Wiring |
TM 2.4.3.2C |
|
Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics |
TM 2.4.30 |
|
Impact Resistance, Polymer Film |
TM 2.4.34 |
|
Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose) |
TM 2.4.34.1 |
|
Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centipose) |
TM 2.4.34.2 |
|
Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipose) |
TM 2.4.34.3 |
|
Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipose) |
TM 2.4.34.4 |
|
Paste Flux Viscosity - T-Bar Spindle Method |
TM 2.4.35 |
|
Solder Paste - Slump Test |
TM 2.4.36C |
|
Rework Simulation, Plated-Through Holes for Leaded Components |
TM 2.4.38A |
|
Prepreg Scaled Flow Testing |
TM 2.4.39A |
|
Dimensional Stability, Glass Reinforced Thin Laminates |
TM 2.4.3E |
|
Flexural Endurance, Flexible Printed Wiring Materials |
TM 2.4.4.1A |
|
Flexural Strength of Laminates (at Elevated Temperature) |
TM 2.4.40 |
|
Inner Layer Bond Strength of Multilayer Printed Circuit Boards |
TM 2.4.41 |
|
Coefficient of Linear Thermal Expansion of Electrical Insulating Boards |
TM 2.4.41.1A |
|
Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method |
TM 2.4.41.2A |
|
Coefficient of Thermal Expansion - Strain Gage Method |
TM 2.4.41.3 |
|
In-Plane Coefficient of Thermal Expansion, Organic Films |
TM 2.4.41.4 |
|
Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates |
TM 2.4.42 |
|
Torsional Strength of Chip Adhesives |
TM 2.4.42.1 |
|
High Temperature Mechanical Strength Retention of Adhesives |
TM 2.4.43 |
|
Solder Paste - Solder Ball Test |
TM 2.4.44 |
|
Solder Paste - Tack Test |
TM 2.4.45 |
|
Solder Paste - Wetting Test |
TM 2.4.46A |
|
Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms |
TM 2.4.47 |
|
Flux Residue Dryness |
TM 2.4.48 |
|
Spitting of Flux-Cored Wire Solder |
TM 2.4.49 |
|
Solder Pool Test |
TM 2.4.4B |
|
Flexural Strength of Laminates (at Ambient Temperature) |
TM 2.4.5.1 |
|
Flexibility - Conformal Coating |
TM 2.4.50 |
|
Thermal Conductivity, Polymer Films |
TM 2.4.51 |
|
Self Shimming Thermally Conductive Adhesives |
TM 2.4.52 |
|
Fracture Toughness of Resin Systems for Base Materials |
TM 2.4.53 |
|
Dye and Pull Test Method (Formerly Known as Dye and Pull) |
TM 2.4.6 |
|
Hot Oil |
TM 2.4.7.1 |
|
Solder Mask - Determination of Machineability |
TM 2.4.7A |
|
Machinability, Printed Wiring Materials |
TM 2.4.8.1 |
|
Peel Strength, Metal Foil (Keyhole Method for Thin Laminates) |
TM 2.4.8.2A |
|
Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method) |
TM 2.4.8.3A |
|
Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method) |
TM 2.4.8.4 |
|
Carrier Release, Thin Copper |
TM 2.4.8C |
|
Peel Strength of Metallic Clad Laminates |
TM 2.4.9.1 |
|
Peel Strength of Flexible Circuits |
TM 2.4.9.2 |
|
Bonding Process |
TM 2.4.9E |
|
Peel Strength, Flexible Dielectric Materials |