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IPC Status of Standardization

Contribute to IPC Standards by Submitting Your Comments 

Individuals or companies are invited to submit a comment to IPC on standards improvement via the Standards Improvement form, found on the right. The purpose of this form is to provide the appropriate technical committee of IPC with input from the industry regarding recommendations for published standards or work in progress on new or revisions of standards being worked on. Complete the form on the right and just click on the submit button, a tech staff person will be in touch if there are any questions.

Your technical expertise and comments are critical to the development of IPC standards that cover areas of supply, design, manufacture of boards and finished assemblies. We are continually looking for ways to improve current standards but we are also looking for what might be that next standard the industry. Every idea or comment goes through a rigorous process to meet the criteria for potential standards development for the industry. Once accepted a project is established and the great work of the industry committees starts. 

IPC encourages and welcomes individuals from the global electronics industry to submit their ideas and comments for standards improvement as part of the standards development process. 

If you are located in Asia Pacific Market - 

IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting Harryhan@ipc.org  Harry will contact you and review your comments to understand your interest and follow through with next steps. 

IPC Standardization Procedures - provides processes, structure and ANSI policy in developing standards for the electronics industry 

Status of Standardization

IPC-2222B October 2020 Sectional Design Standard for Rigid Organic Printed Boards
IPC-2591 Version 1.2 September 2020 Connected Factory Exchange (CFX), Version 1.2
IPC-A-610H September 2020 Acceptability of Electronic Assemblies
IPC-J-STD-001H-Redline September 2020 Requirements for Soldered Electrical and Electronic Assemblies - Redline
IPC-WP-019B September 2020 An Overview on Global Change in Ionic Cleanliness Requirements
IPC/WHMA-A-620D-S September 2020 Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620D.
J-STD-001H September 2020 Requirements for Soldered Electrical and Electronic Assemblies
IPC-6012EM August 2020 Medical Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
IPC-7711/21C Am1 July 2020 Rework, Modification and Repair of Electronic Assemblies - Amendment 1
IPC-TR-587 July 2020 Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment Report
IPC-1752B July 2020 Materials Declaration Management
IPC-A-600K July 2020 Acceptability of Printed Boards
IPC-1754 Am2 June 2020 Materials and Substances Declaration for Aerospace, Defense, and Other Industries
IPC-A-600K-CN July 2020 印制板的可接受性 (Chinese language)
IPC-7095D-WAM1-JP June 2020 ボールグリッドアレイ(BGA)の設計および組立プロセスの実施 – 改訂版1 (Japanese language)
IPC-1782A Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-2551 International Standard for Digital Twins
IPC-2581C Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-4552B Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials
IPC-6902 Qualification and Performance Specifications for Printed Electronics on Flexible Substrates
IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-9257 Requirements for Electrical Testing of Flexible Printed Electronics
J-STD-001HS Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
IPC-6017A Qualification and Performance Specification for Printed Boards Containing Embedded Passive and/or Active Components
IPC-9709A Guidelines for Acoustic Emission Measurement Method During Mechanical Testing
2.5.5.14 Measuring High Frequency Signal Loss and Propogation on Printed Boards
2.6.2.7A Thermal Stress, Convection Reflow Assembly Simulation
2.6.7.2C Thermal Shock, Continuity and Microsection, Printed Board
IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-5262 Design, Critical Process and Acceptance Requirements for Polymeric Applications
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-6013DM Medical Applications Addendum to IPC-6013D Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-7091A Design and Assembly Process Implementation of 3-D Components
IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-8941 Guideline on Connections for E-Textiles
IPC-8952 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9121A Troubleshooting Printed Board Fabrication Processes
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9242 Guidelines for Microsection Evaluation
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-HDBK-9797 Handbook and Guide to Supplement IPC-9797
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-T-50N Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4412B Am 3 Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards - Amendment 3
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7352 Generic Guideline for Land Pattern Design
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
SECTION 1.0 - 1.0 Reporting and Measurement Analysis Methods
No entries available.
SECTION 2.1 - 2.1 Visual Test Methods
TM 2.1.7.2 Determining a Weave as Spread Glass
SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.14.1A Solder Powder Particle Size Distribution - Measuring Microscope Method
TM 2.2.14.2A Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM 2.2.14.3A Determination of Maximum Solder Powder Particle Size
TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM 2.2.20A Solder paste Metal Content by Weight
SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.13 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM 2.3.20.1 Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33 Presence of Halides in Flux, Silver Chromate Method
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM 2.3.34 Solids Content, Flux
TM 2.3.35.1 Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.35.1B Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning
SECTION 2.4 - 2.4 Mechanical Test Methods
TM 2.4.14.2 Liquid Flux Activity, Wetting Balance Method
TM 2.4.34.1A Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM 2.4.34.2A Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM 2.4.34.3A Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM 2.4.35A Solder Paste – Slump Test
TM 2.4.43A Solder Paste - Solder Ball Test
TM 2.4.45A Solder Paste – Wetting Test
TM 2.4.46 Spread Test, Liquid, Paste or Solid Flux, or Flux Extracted from Solder Paste, Cored Wires or Preforms
SECTION 2.5 - 2.5 Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests
SECTION 2.6 - 2.6 Environmental Test Methods
TM 2.6.1 Fungus Resistance of Printed Board Materials
TM 2.6.14.1A Electrochemical Migration Resistance Test
TM 2.6.15 Corrosion, Flux
TM 2.6.15D Corrosion, Flux
TM 2.6.3.6A Surface Insulation Resistance - Fluxes - Telecommunications
TM 2.6.3.7A Surface Insulation Resistance
SECTION 3.0 - 3.0 Connector Test Methods
No entries available.
SECTION 1.0 - 1.0 Reporting and Measurement Analysis Methods
TM 1.1C Introduction
TM 1.2A Calibration
TM 1.3A Ambient Conditions
TM 1.4A Reporting, General
TM 1.5A Reporting, Format
TM 1.6A Numerical Reporting
TM 1.7A Reporting, Invalid Test Results
TM 1.8A Measurement Precision Estimation for Binary Data
TM 1.9A Measurement Precision Estimation for Variables Data
SECTION 2.1 - 2.1 Visual Test Methods
TM 2.1.10A Visual Inspection for Undissolved Dicyandiamide
TM 2.1.13B Inspection for Voids in Flexible Printed Board Materials
TM 2.1.1F Microsectioning, Manual and Semi or Automatic
TM 2.1.2A Pinhole Evaluation, Dye Penetration Method
TM 2.1.3A Plated-Through Hole Structure Evaluation
TM 2.1.5A Surface Examination, Unclad and Metal-Clad Material
TM 2.1.6.1 Weight of Fabric Reinforcements
TM 2.1.6B Thickness of Glass Fabric
TM 2.1.7.1 Thread Count, Organic Fibers
TM 2.1.7C Thread Count of Glass Fabric
TM 2.1.8B Workmanship
TM 2.1.9 Surface Scratch Examination Metal-Clad Foil
SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.12.1 Overall Thickness and Profile Factor of Copper Foils Treated and Untreated
TM 2.2.12.2 Weight and Thickness of Copper Foils with Releasable Carriers
TM 2.2.12.3 Weight and Thickness Determination of Copper Foils With Etchable Carriers
TM 2.2.12A Thickness of Copper by Weight
TM 2.2.13.1A Thickness, Plating in Holes, Microhm Method
TM 2.2.14 Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM 2.2.14.1 Solder Powder Particle Size Distribution - Measuring Microscope Method
TM 2.2.14.2 Solder Powder Particle Size Distribution - Optical Image Analyzer Method
TM 2.2.14.3 Determination of Maximum Solder Powder Particle Size
TM 2.2.17A Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique)
TM 2.2.18 Determination of Thickness of Laminates by Mechanical Measurement
TM 2.2.18.1 Determination of Thickness of Metallic Clad Laminates, Cross-sectional
TM 2.2.19.1 Length, Width and Perpendicularity of Laminate and Prepreg Panels
TM 2.2.1A Mechanical Dimensional Verification
TM 2.2.20 Solder Paste Metal Content by Weight
TM 2.2.21 Planarity of Dielectrics for High Density Interconnection (HDI)/Microvia Technology
TM 2.2.22 Noncontact Metallic Foil Surface Topography/Texture
TM 2.2.2B Optical Dimensional Verification
TM 2.2.4C Dimensional Stability, Flexible Dielectric Materials
TM 2.2.5A Dimensional Inspections Using Microsections
TM 2.2.6A Hole Size Measurement, Drilled
TM 2.2.7A Hole Size Measurement, Plated
SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.1 Chemical Processing, Suitable Processing Material
TM 2.3.1.1B Chemical Cleaning of Metal-Clad Laminate
TM 2.3.10.1 Flammability of Soldermask on Printed Wiring Laminate
TM 2.3.10B Flammability of Laminate
TM 2.3.11 Glass Fabric Construction
TM 2.3.13A Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods
TM 2.3.14 Print, Etch, and Plate Test
TM 2.3.15D Purity, Copper Foil or Plating
TM 2.3.16.1C Resin Content of Prepreg, by Treated Weight
TM 2.3.16.2 Treated Weight of Prepreg
TM 2.3.16B Resin Content of Prepreg, by Burn-off
TM 2.3.17.1B Resin Flow of Adhesive Coated Films and Unsupported Adhesive Films
TM 2.3.17.2B Resin Flow of "No Flow" Prepreg
TM 2.3.17D Resin Flow Percent of Prepreg
TM 2.3.18A Gel Time, Prepreg Materials
TM 2.3.19C Volatile Content of Prepreg
TM 2.3.21A Plating Quality Hull Cell Method
TM 2.3.22 Copper Protective Coating Quality
TM 2.3.24 Porosity of Gold Plating
TM 2.3.24.1 Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method
TM 2.3.24.2A Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid Vapor Test)
TM 2.3.25.1 Ionic Cleanliness Testing of Bare PWBs
TM 2.3.25D Detection and Measurement of Ionizable Surface Contaminations by Resistivity of Solvent Extract (ROSE)
TM 2.3.28.1 Halide Content of Soldering Fluxes and Pastes
TM 2.3.28.2 Bare Printed Board Cleanliness by Ion Chromatography
TM 2.3.28B Ionic Analysis of Circuit Boards, Ion Chromatography Method
TM 2.3.2G Chemical Resistance of Flexible Printed Board Materials
TM 2.3.30A Solvent pH Determination in Anhydrous Fluorocarbon Solvents
TM 2.3.32D Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33D Presence of Halides in Flux, Silver Chromate Method
TM 2.3.34.1B Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder
TM 2.3.34C Solids Content, Flux
TM 2.3.35.1A Fluorides by Spot Test, Fluxes - Qualitative
TM 2.3.35.2A Fluoride Concentration, Fluxes - Quantitative
TM 2.3.35C Halide Content, Quantitative (Chloride and Bromide)
TM 2.3.36 Acid Acceptance of Chlorinated Solvents
TM 2.3.37B Volatile Content of Adhesive Coated Dielectric Films
TM 2.3.4.2A Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure
TM 2.3.4.3 Chemical Resistance of Core Materials to Methylene Chloride
TM 2.3.40 Thermal Stability
TM 2.3.41 Test Method for Total Halogen Content in Base Materials
TM 2.3.42 Solder Mask - Resistance to Solvents and Cleaning Agents
TM 2.3.44 Determination of Thickness and Phosphorus Content in Electroless Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry
TM 2.3.4B Chemical Resistance, Marking Paints and Inks
TM 2.3.6A Etching Ammonium Persulfate Method
TM 2.3.7.1A Cupric Chloride Etching Method
TM 2.3.7.2A Alkaline Etching Method
TM 2.3.7A Etching, Ferric Chloride Method
TM 2.3.9D Flammability of Prepreg and Thin Laminate
SECTION 2.4 - 2.4 Mechanical Test Methods
TM 2.4.1.5A Determination of Treatment Transfer
TM 2.4.1.6 Adhesion, Polymer Coating
TM 2.4.12A Solderability, Edge Dip Method
TM 2.4.13.1 Thermal Stress of Laminates
TM 2.4.13F Solder Float Resistance Flexible Printed Wiring Materials
TM 2.4.14.2A Liquid Flux Activity, Wetting Balance Method
TM 2.4.15A Surface Finish, Metal Foil
TM 2.4.16B Initiation Tear Strength, Flexible Insulating Materials
TM 2.4.17 Tear Strength (Propagation)
TM 2.4.17.1B Propagation Tear Strength, Flexible Insulating Material
TM 2.4.18.1A Tensile Strength and Elongation, In-House Plating
TM 2.4.18.2 Hot Rupture Strength, Foil
TM 2.4.18.3 Tensile Strength, Elongation, and Modulus
TM 2.4.18B Tensile Strength and Elongation, Copper Foil
TM 2.4.19C Tensile Strength and Elongation, Flexible Printed Wiring Materials
TM 2.4.1E Adhesion, Tape Testing
TM 2.4.2.1D Flexural Fatigue and Ductility, Foil
TM 2.4.21F Land Bond Strength, Unsupported Component Hole
TM 2.4.22.1C Bow and Twist-Laminate
TM 2.4.22.2 Substrate Curvature: Silicon Wafers with Deposited Dielectrics
TM 2.4.22C Bow and Twist (Percentage)
TM 2.4.23 Soldering Resistance of Laminate Materials
TM 2.4.24.1 Time to Delamination (TMA Method)
TM 2.4.24.2 Glass Transition Temperature of Organic Films - DMA Method
TM 2.4.24.3 Glass Transition Temperature of Organic Films - TMA Method
TM 2.4.24.4 Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias -DMA Method
TM 2.4.24.5 Glass Transition Temperature and Thermal Expansion of Materials Used In High Density Interconnection (HDI) and Microvias -TMA Method
TM 2.4.24.6 Decomposition Temperature (Td) of Laminate Material Using TGA
TM 2.4.24C Glass Transition Temperature and Z-Axis Thermal Expansion by TMA
TM 2.4.25D Glass Transition Temperature and Cure Factor by DSC
TM 2.4.26 Tape Test for Additive Printed Boards
TM 2.4.27.1B Abrasion (Taber Method) Solder Mask and Conformal Coating
TM 2.4.28.1F Solder Mask Adhesion - Tape Test Method
TM 2.4.29C Adhesion, Solder Mask, Flexible Circuit
TM 2.4.2A Ductility of Copper Foil
TM 2.4.3.1C Flexural Fatigue and Ductility, Flexible Printed Wiring
TM 2.4.3.2C Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics
TM 2.4.30 Impact Resistance, Polymer Film
TM 2.4.34 Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM 2.4.34.1 Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centipose)
TM 2.4.34.2 Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipose)
TM 2.4.34.3 Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipose)
TM 2.4.34.4 Paste Flux Viscosity - T-Bar Spindle Method
TM 2.4.35 Solder Paste - Slump Test
TM 2.4.36C Rework Simulation, Plated-Through Holes for Leaded Components
TM 2.4.38A Prepreg Scaled Flow Testing
TM 2.4.39A Dimensional Stability, Glass Reinforced Thin Laminates
TM 2.4.3E Flexural Endurance, Flexible Printed Wiring Materials
TM 2.4.4.1A Flexural Strength of Laminates (at Elevated Temperature)
TM 2.4.40 Inner Layer Bond Strength of Multilayer Printed Circuit Boards
TM 2.4.41 Coefficient of Linear Thermal Expansion of Electrical Insulating Boards
TM 2.4.41.1A Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method
TM 2.4.41.2A Coefficient of Thermal Expansion - Strain Gage Method
TM 2.4.41.3 In-Plane Coefficient of Thermal Expansion, Organic Films
TM 2.4.41.4 Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates
TM 2.4.42 Torsional Strength of Chip Adhesives
TM 2.4.42.1 High Temperature Mechanical Strength Retention of Adhesives
TM 2.4.43 Solder Paste - Solder Ball Test
TM 2.4.44 Solder Paste - Tack Test
TM 2.4.45 Solder Paste - Wetting Test
TM 2.4.46A Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms
TM 2.4.47 Flux Residue Dryness
TM 2.4.48 Spitting of Flux-Cored Wire Solder
TM 2.4.49 Solder Pool Test
TM 2.4.4B Flexural Strength of Laminates (at Ambient Temperature)
TM 2.4.5.1 Flexibility - Conformal Coating
TM 2.4.50 Thermal Conductivity, Polymer Films
TM 2.4.51 Self Shimming Thermally Conductive Adhesives
TM 2.4.52 Fracture Toughness of Resin Systems for Base Materials
TM 2.4.53 Dye and Pull Test Method (Formerly Known as Dye and Pull)
TM 2.4.6 Hot Oil
TM 2.4.7.1 Solder Mask - Determination of Machineability
TM 2.4.7A Machinability, Printed Wiring Materials
TM 2.4.8.1 Peel Strength, Metal Foil (Keyhole Method for Thin Laminates)
TM 2.4.8.2A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method)
TM 2.4.8.3A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method)
TM 2.4.8.4 Carrier Release, Thin Copper
TM 2.4.8C Peel Strength of Metallic Clad Laminates
TM 2.4.9.1 Peel Strength of Flexible Circuits
TM 2.4.9.2 Bonding Process
TM 2.4.9E Peel Strength, Flexible Dielectric Materials
SECTION 2.5 - 2.5 Electrical Test Methods
TM 2.5.10.1 Insulation Resistivity for Adhesive Interconnection Bonds
TM 2.5.12 Interconnection Resistance, Multilayer Printed Wiring
TM 2.5.13A Resistance of Copper Foil
TM 2.5.14A Resistivity of Copper Foil
TM 2.5.15A Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable
TM 2.5.17.1A Volume and Surface Resistivity of Dielectric Materials
TM 2.5.17.2 Volume Resistivity of Conductive Materials Used in High Density Interconnection (HDI) and Microvias, Two-Wire Method
TM 2.5.17E Volume Resistivity and Surface Resistance of Printed Wiring Materials
TM 2.5.18B Characteristic Impedance Flat Cables (Unbalanced)
TM 2.5.19.1A Propagation Delay of Flat Cables Using Dual Trace Oscilloscope
TM 2.5.19A Propagation Delay of Flat Cables Using Time Domain Reflectometer
TM 2.5.1B Arc Resistance of Printed Wiring Material
TM 2.5.21A Digital Unbalanced Crosstalk, Flat Cable
TM 2.5.27 Surface Insulation Resistance of Raw Printed Wiring Board Material
TM 2.5.2A Capacitance of Insulating Materials
TM 2.5.30 Balanced and Unbalanced Cable Attenuation Measurements
TM 2.5.33 Measurement of Electrical Overstress from Soldering Hand Tools
TM 2.5.33.1 Measurement of Electrical Overstress from Soldering Hand Tools - Ground Measurements
TM 2.5.33.2 Measurement of Electrical Overstress from Soldering Hand Tools - Transient Measurements
TM 2.5.33.3 Measurement of Electrical Overstress from Soldering Hand Tools - Current Leakage Measurements
TM 2.5.33.4 Measurement of Electrical Overstress from Soldering Hand Tools - Shielded Enclosure
TM 2.5.34 Power Density Rating for Embedded Resistors
TM 2.5.3B Current Breakdown, Plated Through-Holes
TM 2.5.4.1A Conductor Temperature Rise Due to Current Changes in Conductors
TM 2.5.5.10 High Frequency Testing to Determine Permittivity and Loss Tangent of Embedded Passive Materials
TM 2.5.5.11 Propagation Delay of Lines on Printed Boards by TDR
TM 2.5.5.12A Test Methods to Determine the Amount of Signal Loss on Printed Boards
TM 2.5.5.13 Relative Permittivity and Loss Tangent Using a Split-Cylinder Resonator
TM 2.5.5.2A Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method
TM 2.5.5.3C Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method)
TM 2.5.5.5.1 Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ
TM 2.5.5.5C Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band
TM 2.5.5.7A Characteristic Impedance Lines on Printed Boards by TDR
TM 2.5.5.9 Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz
TM 2.5.6.1B Solder Mask - Dielectric Strength
TM 2.5.6.2A Electric Strength of Printed Wiring Material
TM 2.5.6.3 Dielectric Breakdown Voltage and Dielectric Strength
TM 2.5.6B Dielectric Breakdown of Rigid Printed Wiring Material
TM 2.5.7.1 Dielectric Withstanding Voltage - Polymeric Conformal Coating
TM 2.5.7.2A Dielectric Withstanding Voltage (HiPot Method) - Thin Dielectric Layers for Printed Boards
TM 2.5.7D Dielectric Withstanding Voltage, PWB
SECTION 2.6 - 2.6 Environmental Test Methods
TM 2.6.1.1 Fungus Resistance – Conformal Coating
TM 2.6.10A X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods
TM 2.6.11.1 Hydrolytic Stability - Conformal Coating
TM 2.6.11D Solder Mask - Hydrolytic Stability
TM 2.6.13 Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring
TM 2.6.14.1 Electrochemical Migration Resistance Test
TM 2.6.14D Solder Mask - Resistance to Electrochemical Migration
TM 2.6.15C Corrosion, Flux
TM 2.6.16 Pressure Vessel Method for Glass Epoxy Laminate Integrity
TM 2.6.16.1 Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel)
TM 2.6.18A Low Temperature Flexibility, Flexible Printed Wiring Materials
TM 2.6.1G Fungus Resistance Printed Wiring Materials
TM 2.6.2.1A Water Absorption, Metal Clad Plastic Laminates
TM 2.6.21B Service Temperature of Metal-Clad Flexible Laminate, Cover Material and Adhesive Bonding Films
TM 2.6.23 Test Procedure for Steam Ager Temperature Repeatability
TM 2.6.24 Junction Stability Under Environmental Conditions
TM 2.6.25B Conductive Anodic Filament (CAF) Resistance Test: X-Y Axis
TM 2.6.26A DC Current Induced Thermal Cycling Test
TM 2.6.27B Thermal Stress, Convection Reflow Assembly Simulation
TM 2.6.28 Moisture Content and/or Moisture Absorption Rate, (Bulk) Printed Board
TM 2.6.2D Moisture Absorption, Flexible Printed Wiring
TM 2.6.3.1E Solder Mask - Moisture and Insulation Resistance
TM 2.6.3.2C Surface Insulation and Moisture Resistance, Copper Clad Flexible Dielectric Material
TM 2.6.3.3B Surface Insulation Resistance, Fluxes
TM 2.6.3.4A Moisture and Insulation Resistance – Conformal Coating
TM 2.6.3.5 Bare Board Cleanliness by Surface Insulation Resistance
TM 2.6.3.6 Surface Insulation Resistance - Fluxes - Telecommunications
TM 2.6.3.7 Surface Insulation Resistance
TM 2.6.3F Moisture and Insulation Resistance, Printed Boards
TM 2.6.4B Outgassing, Printed Boards
TM 2.6.5D Physical Shock, Multilayer Printed Wiring
TM 2.6.7.1A Thermal Shock - Conformal Coating
TM 2.6.7.2C Thermal Shock, Continuity and Microsection, Printed Board
TM 2.6.7.3 Thermal Shock - Solder Mask
TM 2.6.8.1 Thermal Stress, Laminate
TM 2.6.8E Thermal Stress, Plated-Through Holes
TM 2.6.9.1 Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy
TM 2.6.9.2 Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy
TM 2.6.9B Vibration, Rigid Printed Wiring
SECTION 3.0 - 3.0 Connector Test Methods
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