Submit a Standards Improvement Comment 

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IPC Status of Standardization

Contribute to IPC Standards by Submitting Your Comments 

Individuals or companies are invited to submit a comment to IPC on standards improvement via the Standards Improvement form, found on the right. The purpose of this form is to provide the appropriate technical committee of IPC with input from the industry regarding recommendations for published standards or work in progress on new or revisions of standards being worked on. Complete the form on the right and just click on the submit button, a tech staff person will be in touch if there are any questions.

Your technical expertise and comments are critical to the development of IPC standards that cover areas of supply, design, manufacture of boards and finished assemblies. We are continually looking for ways to improve current standards but we are also looking for what might be that next standard the industry. Every idea or comment goes through a rigorous process to meet the criteria for potential standards development for the industry. Once accepted a project is established and the great work of the industry committees starts. 

IPC encourages and welcomes individuals from the global electronics industry to submit their ideas or to request to be added to a ballot group as part of the standards development process. 

If you are located in Asia Pacific Market - 

IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. 

IPC Standardization Procedures - provides processes, structure and ANSI policy in developing standards for the electronics industry 

Status of Standardization

IPC-1791C March 2023 Trusted Electronic Designer, Fabricator and Assembler Requirements
IPC-2591, Version 1.6 March 2023 Connected Factory Exchange (CFX)
J-STD-003D January 2023 Solderability Tests for Printed Boards 
IPC-8952 December 2022 Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles
IPC-1792 November 2022 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain
IPC-8971 November 2022 Requirements for Electrical Testing of Printed Electronics on E-Textiles
IPC-9203A November 2022 Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-HERMES-9852 Version 1.5 November 2022 The Global Standard for Machine-to-Machine Communication in SMT Assembly
IPC/JEDEC J-STD-035A November 2022 Acoustic Microscopy for Nonhermetic Encapsulated Electronics Devices
IPC/JEDEC-J-STD-020F November 2022 Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMD)
IPC-2228 October 2022 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292A October 2022 Design Standard for Printed Electronics on Flexible Substrates
IPC-7092A October 2022 Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-9202A October 2022 Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
J-STD-004C-WAM1 October 2022 Requirements for Soldering Fluxes
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IPC-4922 Requirements for Sintering Materials for Electronics Assembly
IPC-7352 Generic Guideline for Land Pattern Design
IPC-9691C User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
J-STD-005B Requirements for Soldering Pastes
IPC-1782B Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-4105 Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
IPC-6012F Qualification and Performance Specification for Rigid Printed Boards
IPC-9797A Press-fit Standard for Automotive Requirements and other High-Reliability Applications
IPC-A-610J Acceptability of Electronic Assemblies
IPC/WHMA-A-620E-S Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620E.
J-STD-001J Requirements for Soldered Electrical and Electronic Assemblies
IPC-1753A Laboratory Report Standard
IPC-1783 International Standard for Component-Level Authentication (CLA)
IPC-2221C Generic Standard on Printed Board Design
IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly
IPC-7095E Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7530B Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621A Guideline for Design, Material Selection and General Application of Encapsulation of Electronic Circuit Assembly by Low Pressure Molding with Thermoplastics
IPC-8921A Requirements for Woven, Knitted and Braided Electronic Textiles (E-Textiles) Integrated with Conductive Yarns and/or Wires
IPC-8981 Quality and Reliability of E-Textiles Wearables
IPC-9242 Guidelines for Microsection Evaluation
IPC-A-600M Acceptability of Printed Boards
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC/JPCA-8911 Requirements for Conductive Yarns for E-Textiles Applications
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2294 Design Standard for Printed Electronics on Rigid Substrates
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6904 Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes
IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
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