IPC TM-650 Test Methods Manual

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Test Methods Approved

SECTION 1.0 - Reporting and Measurement Analysis Methods
TM 1.1C Introduction - 1/03
TM 1.2A Calibration - 1/03
TM 1.3A Ambient Conditions - 1/03
TM 1.4A Reporting, General - 1/03
TM 1.5A Reporting, Format - 1/03
TM 1.6A Numerical Reporting - 1/03
TM 1.7A Reporting, Invalid Test Results - 1/03
TM 1.8A Measurement Precision Estimation for Binary Data - 1/03
Includes Calculator and User Guide
TM 1.9A Measurement Precision Estimation for Variables Data - 1/03
Includes Calculator and User Guide


SECTION 2.1 - Visual Test Methods
TM 2.1.1F Microsectioning, Manual and Semi or Automatic - 6/15
TM 2.1.2A Pinhole Evaluation, Dye Penetration Method - 3/76
TM 2.1.3A Plated-Through Hole Structure Evaluation - 8/76
TM 2.1.5A Surface Examination, Unclad and Metal-Clad Material - 12/82
TM 2.1.6B Thickness of Glass Fabric - 12/94
TM 2.1.6.1 Weight of Fabric Reinforcements - 12/94
renumbered from 2.3.12
TM 2.1.7C Thread Count of Glass Fabric - 12/94
TM 2.1.7.1 Thread Count, Organic Fibers - 12/87
TM 2.1.8B Workmanship - 12/94
TM 2.1.9 Surface Scratch Examination Metal-Clad Foil - 5/86
TM 2.1.10A Visual Inspection for Undissolved Dicyandiamide - 12/94
TM 2.1.13B Inspection for Voids in Flexible Printed Board Materials - 5/12


SECTION 2.2 - Dimensional Test Methods
TM 2.2.1A Mechanical Dimensional Verification - 8/97
TM 2.2.2B Optical Dimensional Verification - 8/97
TM 2.2.4C Dimensional Stability, Flexible Dielectric Materials - 5/98
TM 2.2.5A Dimensional Inspections Using Mircosections - 8/97
TM 2.2.6A Hole Size Measurement, Drilled - 8/97
TM 2.2.7A Hole Size Measurement, Plated - 5/86
TM 2.2.12A Thickness of Copper by Weight - 3/76
TM 2.2.12.1 Overall Thickness and Profile Factor of Copper Foils Treated and Untreated - 9/87
TM 2.2.12.2 Weight and Thickness of Copper Foils with Releasable Carriers - 7/89
TM 2.2.12.3 Weight and Thickness Determination of Copper Foils With Etchable Carriers - 7/89
TM 2.2.13.1A Thickness, Plating in Holes, Microhm Method - 1/83
TM 2.2.14 Solder Powder Particle Size Distribution - Screen Method for Types 1-4 - 1/95
TM 2.2.14.1 Solder Powder Particle Size Distribution - Measuring Microscope Method - 1/95
TM 2.2.14.2 Solder Powder Particle Size Distribution - Optical Image Analyzer Method - 1/95
TM 2.2.14.3 Determination of Maximum Solder Powder Particle Size - 1/95
TM 2.2.17A Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique) - 2/01
TM 2.2.18 Determination of Thickness of Laminates by Mechanical Measurement - 12/94
TM 2.2.18.1 Determination of Thickness of Metallic Clad Laminates, Cross-sectional - 12/94
TM 2.2.19.1 Length, Width and Perpendicularity of Laminate and Prepreg Panels - 12/94
TM 2.2.20 Solder Paste Metal Content by Weight - 1/95
TM 2.2.21 Planarity of Dielectrics for High Density Interconnection (HDI)/Microvia Technology - 11/98


SECTION 2.3 - Chemical Test Methods
TM 2.3.1 Chemical Processing, Suitable Processing Material - 4/73
TM 2.3.1.1B Chemical Cleaning of Metal-Clad Laminate - 5/86
TM 2.3.2G Chemical Resistance of Flexible Printed Board Materials - 12/07
TM 2.3.4B Chemical Resistance, Marking Paints and Inks - 8/87
TM 2.3.4.2A Chemical Resistance of Laminates, Prepreg, and Coated Foil Products, by Solvent Exposure - 12/94
TM 2.3.4.3 Chemical Resistance of Core Materials to Methylene Chloride - 5/86
TM 2.3.6A Etching Ammonium Persulfate Method - 7/75
TM 2.3.7A Etching, Ferric Chloride Method - 7/75
TM 2.3.7.1A Cupric Chloride Etching Method - 12/94
TM 2.3.7.2A Alkaline Etching Method - 12/94
TM 2.3.9D Flammability of Prepreg and Thin Laminate - 8/97
TM 2.3.10B Flammability of Laminate - 12/94
TM 2.3.10.1 Flammability of Soldermask on Printed Wiring Laminate - 8/98
TM 2.3.11 Glass Fabric Construction - 4/73
TM 2.3.13A Determination of Acid Value of Liquid Solder Flux- Potentiometric and Visual Titration Methods - 6/04
TM 2.3.14 Print, Etch, and Plate Test - 4/73
TM 2.3.15D Purity, Copper Foil or Plating - 5/04
TM 2.3.16B Resin Content of Prepreg, by Burn-off - 12/94
TM 2.3.16.1C Resin Content of Prepeg, by Treated Weight - 12/94
TM 2.3.16.2 Treated Weight of Prepreg - 12/94
TM 2.3.17D Resin Flow Percent of Prepreg - 8/97
TM 2.3.17.2B Resin Flow of "No Flow" Prepreg - 8/97
TM 2.3.18A Gel Time, Prepreg Materials - 4/86
TM 2.3.19C Volatile Content of Prepreg - 12/94
TM 2.3.21 Plating Quality Hull Cell Method - 8/97
TM 2.3.22 Copper Protective Coating Quality - 2/78
TM 2.3.24 Porosity of Gold Plating - 2/78
TM 2.3.24.1 Porosity Testing of Gold Electrodeposited on a Nickel Plated Copper Substrate Electrographic Method - 10/85
TM 2.3.24.2A Porosity of Metallic Coatings on Copper-Based Alloys and Nickel (Nitric Acid Vapor Test) - 8/97
TM 2.3.25D Detection and Measurement of Ionizable Surface Contaminations by Resistivity of Solvent Extract (ROSE) - 11/12
TM 2.3.25.1 Ionic Cleanliness Testing of Bare PWBs - 10/00
TM 2.3.28B Ionic Analysis of Circuit Boards, Ion Chromatography Method - 11/12
TM 2.3.28.1 Halide Content of Soldering Fluxes and Pastes - 6/04
TM 2.3.28.2 Bare Printed Board Cleanliness by Ion Chromatography - 12/09
TM 2.3.30A Solvent pH Determination in Anhydrous Flourocarbon Solvents - 11/81
TM 2.3.32D Flux Induced Corrosion (Copper Mirror Method) - 6/04
TM 2.3.33D Presence of Halides in Flux, Silver Chromate Method - 6/04
TM 2.3.34C Solids Content, Flux - 6/04
TM 2.3.34.1B Percentage of Flux on/in Flux-Coated and/or Flux-Cored Solder - 1/95
TM 2.3.35C Halide Content, Quantitative (Chloride and Bromide) - 6/04
TM 2.3.35.1A Fluorides by Spot Test, Fluxes - Qualitative - 6/04
TM 2.3.35.2A Fluoride Concentration, Fluxes - Quantitative - 6/04
TM 2.3.36 Acid Acceptance of Chlorinated Solvents - 10/85
TM 2.3.37B Volatile Content of Adhesive Coated Dielectric Films - 5/98
TM 2.3.40 Thermal Stability - 7/95
TM 2.3.41 Test Method for Total Halogen Content in Base Materials - 4/06
TM 2.3.42 Solder Mask - Resistance to Solvents and Cleaning Agents - 3/07


SECTION 2.4 - Mechanical Test Methods
TM 2.4.1E Adhesion, Tape Testing - 5/04
TM 2.4.1.5A Determination of Treatment Transfer - 5/95
TM 2.4.1.6 Adhesion, Polymer Coating - 7/95
TM 2.4.2A Ductility of Copper Foil - 3/76
TM 2.4.2.1D Flexural Fatigue and Ductility, Foil - 3/91
TM 2.4.3E Flexural Fatigue, Flexible Printed Wiring Materials - 6/11
TM 2.4.3.1C Flexural Fatigue and Ductility, Flexible Printed Wiring - 3/91
TM 2.4.3.2C Flexural Fatigue and Ductility, Flexible Metal-Clad Dielectrics - 3/91
TM 2.4.4B Flexural Strength of Laminates (at Ambient Temperature) - 12/94
TM 2.4.4.1A Flexural Strength of Laminates (at Elevated Temperature) - 12/94
TM 2.4.5.1 Flexibility - Conformal Coating - 7/00
TM 2.4.6 Hot Oil - 4/73
TM 2.4.7A Machinability, Printed Wiring Materials - 7/75
TM 2.4.7.1 Solder Mask - Determination of Machineability - 3/07
TM 2.4.8C Peel Strength of Metallic Clad Laminates - 12/94
TM 2.4.8.1 Peel Strength, Metal Foil (Keyhole Method for Thin Laminates) - 1/86
TM 2.4.8.2A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Fluid Method) - 12/94
TM 2.4.8.3A Peel Strength of Metallic Clad Laminates at Elevated Temperature (Hot Air Method) - 12/94
TM 2.4.8.4 Carrier Release, Thin Copper - 1/90
TM 2.4.9E Peel Strength, Flexible Dielectric Materials - 6/14
TM 2.4.9.1 Peel Strength of Flexible Circuits - 11/98
TM 2.4.9.2 Bonding Process - 11/98
TM 2.4.12A Solderability, Edge Dip Method - 6/91
TM 2.4.13F Solder Float Resistance Flexible Printed Wiring Materials - 5/98
TM 2.4.13.1 Thermal Stress of Laminates - 12/94
TM 2.4.14.2A Liquid Flux Activity, Wetting Balance Method - 6/04
TM 2.4.15A Surface Finish, Metal Foil - 3/76
TM 2.4.16B Initiation Tear Strength, Flexible Insulating Materials - 3/14
TM 2.4.17 Tear Strength (Propagation) - 4/73
TM 2.4.17.1B Propagation Tear Strength, Flexible Insulating Material - 2/13
TM 2.4.18B Tensile Strength and Elongation, Copper Foil - 8/80
TM 2.4.18.1A Tensile Strength and Elongation, In-House Plating - 5/04
TM 2.4.18.2 Hot Rupture Strength, Foil - 7/89
TM 2.4.18.3 Tensile Strength, Elongation, and Modulus - 7/95
TM 2.4.19C Tensile Strength and Elongation, Flexible Printed Wiring Materials - 5/98
TM 2.4.21E Land Bond Strength, Unsupported Component Hole - 5/04
TM 2.4.22C Bow and Twist (Percentage) - 6/99
TM 2.4.22.1C Bow and Twist-Laminate - 5/93
TM 2.4.22.2 Substrate Curvature: Silicon Wafers with Deposited Dielectrics - 7/95
TM 2.4.23 Soldering Resistance of Laminate Materials - 3/79
TM 2.4.24C Glass Transition Temperature and Z-Axis Thermal Expansion by TMA - 12/94
TM 2.4.24.1 Time to Delamination (TMA Method) - 12/94
TM 2.4.24.2 Glass Transition Temperature of Organic Films - DMA Method - 7/95
TM 2.4.24.3 Glass Transition Temperature of Organic Films - TMA Method - 7/95
TM 2.4.24.4 Glass Transition and Modulus of Materials Used in High Density Interconnection (HDI) and Microvias -DMA Method - 11/98
TM 2.4.24.5 Glass Transition Temperature and Thermal Expansion of Materials Used In High Density Interconnection (HDI) and Microvias -TMA Method - 11/98
TM 2.4.24.6 Decomposition Temperature (Td) of Laminate Material Using TGA - 4/06
TM 2.4.25C Glass Transition Temperature and Cure Factor by DSC - 12/94
TM 2.4.26 Tape Test for Additive Printed Boards - 3/79
TM 2.4.27.1B Abrasion (Taber Method) Solder Mask and Conformal Coating - 1/95
TM 2.4.28.1F Solder Mask Adhesion - Tape Test Method - 3/07
TM 2.4.29C Adhesion, Solder Mask, Flexible Circuit - 3/07
TM 2.4.30 Impact Resistance, Polymer Film - 10/86
TM 2.4.34 Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose) - 1/95
TM 2.4.34.1 Solder Paste Viscosity - T-Bar Spindle Method (Applicable at Less Than 300,000 Centipose) - 1/95
TM 2.4.34.2 Solder Paste Viscosity - Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipose) - 1/95
TM 2.4.34.3 Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipose) - 1/95
TM 2.4.34.4 Paste Flux Viscosity - T-Bar Spindle Method - 1/95
TM 2.4.35 Solder Paste - Slump Test - 1/95
TM 2.4.36C Rework Simulation, Plated-Through Holes for Leaded Components - 5/04
TM 2.4.38A Prepeg Scaled Flow Testing - 6/91
TM 2.4.39A Dimensional Stability, Glass Reinforced Thin Laminates - 2/86
TM 2.4.40 Inner Layer Bond Strength of Multilayer Printed Circuit Boards - 10/87
TM 2.4.41 Coefficient of Lintear Thermal Expansion of Electrical Insulating Boards - 3/86
TM 2.4.41.1A Coefficient of Thermal Expansion by the Vitreous Silica (Quartz) Dilatometer Method - 8/97
TM 2.4.41.2A Coefficient of Thermal Expansion - Strain Gage Method - 5/04
TM 2.4.41.3 In-Plane Coefficient of Thermal Expansion, Organic Films - 7/95
TM 2.4.41.4 Volumetric Thermal Expansion Polymer Coatings on Inorganic Substrates - 7/95
TM 2.4.42 Torsional Strength of Chip Adhesives - 2/88
TM 2.4.42.1 High Tempreature Mechanical Strength Retention of Adhesives - 3/88
TM 2.4.42.2 Die Shear Strength - 2/98
TM 2.4.42.3 Wire Bond Pull Strength - 2/98
TM 2.4.43 Solder Paste - Solder Ball Test - 1/95
TM 2.4.44 Solder Paste - Tack Test - 3/98
TM 2.4.45 Solder Paste - Wetting Test - 1/95
TM 2.4.46A Spread Test, Liquid or Extracted Solder Flux, Solder Paste and Extracted Cored Wires or Preforms - 6/04
TM 2.4.47 Flux Residue Dryness - 1/95
TM 2.4.48 Spitting of Flux-Cored Wire Solder - 1/95
TM 2.4.49 Solder Pool Test - 1/95
TM 2.4.50 Thermal Conductivity, Polymer Films - 7/95
TM 2.4.51 Self Shimming Thermally Conductive Adhesives - 1/95
TM 2.4.52 Fracture Toughness of Resin Systems for Base Materials - 10/13


SECTION 2.5 - Electrical Test Methods
TM 2.5.1B Arc Resistance of Printed Wiring Material - 5/86
TM 2.5.2A Capacitance of Insulating Materials - 7/75
TM 2.5.3B Current Breakdown, Plated Through-Holes - 8/97
TM 2.5.4.1A Conductor Temperature Rise Due to Current Changes in Conductors - 8/97
TM 2.5.5.2A Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Clip Method - 12/87
TM 2.5.5.3C Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Materials (Two Fluid Cell Method) - 12/87
TM 2.5.5.5C Stripline Test for Permittivity and Loss Tangent (Dielectric Constant and Dissipation Factor) at X-Band - 3/98
TM 2.5.5.5.1 Stripline Test for Complex Relative Permittivity of Circuit Board Materials to 14 GHZ - 3/98
TM 2.5.5.6 Non-Destructive Full Sheet Resonance Test for Permittivity of Clad Laminates - 5/89
TM 2.5.5.7A Characteristic Impedance Lines on Printed Boards by TDR - 3/04
TM 2.5.5.9 Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz - 11/98
TM 2.5.5.10 High Frequency Testing to Determine Permittivity and Loss Tangent of Embedded Passive Materials - 7/05
TM 2.5.5.11 Propagation Delay of Lines on Printed Boards by TDR - 4/09
TM 2.5.5.12A Test Methods to Determine the Amount of Signal Loss on Printed Boards - 7/12
TM 2.5.5.13 Relative Permittivity and Loss Tangent Using a Split-Cylinder Resonator - 1/07
TM 2.5.6B Dielectric Breakdown of Rigid Printed Wiring Material - 5/86
TM 2.5.6.1B Solder Mask - Dielectric Strength - 3/07
TM 2.5.6.2A Electric Strength of Printed Wiring Material - 3/98
TM 2.5.6.3 Dielectric Breakdown Voltage and Dielectric Strength - 10/86
TM 2.5.7D Dielectric Withstanding Voltage, PWB - 5/04
TM 2.5.7.1 Dielectric Withstanding Voltage - Polymeric Conformal Coating - 7/00
TM 2.5.7.2A Dielectric Withstanding Voltage (HiPot Method) - Thin Dielectric Layers for Printed Boards - 11/09
TM 2.5.10.1 Insulation Resistivity for Adhesive Interconnection Bonds - 11/98
TM 2.5.12 Interconnection Resistance, Multilayer Printed Wiring - 4/73
TM 2.5.13A Resistance of Copper Foil - 3/76
TM 2.5.14A Resistivity of Copper Foil - 8/76
TM 2.5.15A Guidelines and Test Methods for RFI-EMI Shielding of Flat Cable - 10/86
TM 2.5.17E Volume Resistivity and Surface Resistance of Printed Wiring Materials - 5/98
TM 2.5.17.1A Volume and Surface Resistivity of Dielectric Materials - 12/94
TM 2.5.17.2 Volume Resistivity of Conductive Materials Used in High Dentisty Interconnection (HDI) and Microvias, Two-Wire Method - 11/98
TM 2.5.18B Characteristic Impedance Flat Cables (Unbalanced) - 7/84
TM 2.5.19.1A Propagation Delay of Flat Cables Using Dual Trace Oscilloscope - 7/84
TM 2.5.21A Digital Unbalanced Crosstalk, Flat Cable - 3/84
TM 2.5.27 Surface Insulation Resistance of Raw Printed Wiring Board Material - 3/79
TM 2.5.30 Balanced and Unbalanced Cable Attenuation Measurements - 12/87
TM 2.5.31 Current Leakage (Through Overglaze Films) - 12/87
TM 2.5.32 Resistance Test, Plated Through-Holes - 12/87
TM 2.5.33 Measurement of Electrical Overstress from Soldering Hand Tools - 11/98
TM 2.5.33.1 Measurement of Electrical Overstress from Soldering Hand Tools - Ground Measurements - 11/98
TM 2.5.33.2 Measurement of Electrical Overstress from Soldering Hand Tools - Transient Measurements - 11/98
TM 2.5.33.3 Measurement of Electrical Overstress from Soldering Hand Tools - Current Leakage Measurements - 11/98
TM 2.5.33.4 Measurement of Electrical Overstress from Soldering Hand Tools - Shielded Enclosure - 11/98
TM 2.5.34 Power Density Rating for Embedded Resistors - 7/12


SECTION 2.6 - Environmental Test Methods
TM 2.6.1G Fungus Resistance Printed Wiring Materials - 3/07
TM 2.6.1.1 Fungus Resistance – Conformal Coating - 7/00
TM 2.6.2D Moisture Absorption, Flexible Printed Wiring - 2/12
TM 2.6.2.1A Water Absorption, Metal Clad Plastic Laminates - 5/86
TM 2.6.3F Moisture and Insulation Resistance, Printed Boards - 5/04
TM 2.6.3.1E Solder Mask - Moisture and Insulation Resistance - 3/07
TM 2.6.3.2B Insulation and Moisture Resistance, Flexible Base Dielectric - 5/88
TM 2.6.3.3B Surface Insulation Resistance, Fluxes - 6/04
TM 2.6.3.4A Moisture and Insulation Resistance – Conformal Coating - 7/03
Supersedes 2.6.3.4 and 2.6.3.1C for Conformal Coating Test
TM 2.6.3.5 Bare Board Cleanliness by Surface Insulation Resistance - 1/04
TM 2.6.3.6 Surface Insulation Resistance - Fluxes - Telecommunications - 1/04
TM 2.6.3.7 Surface Insulation Resistance - 3/07
TM 2.6.4B Outgassing, Printed Boards - 5/04
TM 2.6.5D Physical Shock, Multilayer Printed Wiring - 5/04
TM 2.6.6B Temperature Cycling, Printed Wiring Board - 12/87
TM 2.6.7A Thermal Shock and Continuity, Printed Board - 8/97
TM 2.6.7.1A Thermal Shock - Conformal Coating - 7/00
Supersedes 2.6.7.1 for Conformal Coating Tests
TM 2.6.7.2B Thermal Shock, Continuity and Microsection, Printed Board - 5/04
TM 2.6.7.3 Thermal Shock - Solder Mask - 7/00
Supersedes 2.6.7.1 for Solder Mask Test
TM 2.6.8E Thermal Stress, Plated-Through Holes - 5/04
TM 2.6.8.1 Thermal Stress, Laminate - 9/91
TM 2.6.9B Vibration, Rigid Printed Wiring - 5/04
TM 2.6.9.1 Test to Determine Sensitivity of Electronic Assemblies to Ultrasonic Energy - 1/95
TM 2.6.9.2 Test to Determine Sensitivity of Electronic Components to Ultrasonic Energy - 1/95
TM 2.6.10A X-Ray (Radiography), Multilayer Printed Wiring Board Test Methods - 8/97
TM 2.6.11D Solder Mask - Hydrolytic Stability - 3/07
TM 2.6.11.1 Hydrolytic Stability - Conformal Coating - 7/00
Supersedes 2.6.11B for Conformal Coating Test
TM 2.6.13 Assessment of Susceptibility to Metallic Dendritic Growth: Uncoated Printed Wiring - 10/85
TM 2.6.14D Solder Mask - Resistance to Electrochemical Migration - 3/07
TM 2.6.14.1 Electrochemical Migration Resistance Test - 9/00
TM 2.6.15C Corrosion, Flux - 6/04
TM 2.6.16 Pressure Vessel Method for Glass Epoxy Laminate Integrity - 7/85
TM 2.6.16.1 Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel) - 8/98
TM 2.6.18A Low Temperature Flexibility, Flexible Printed Wiring Materials - 7/85
TM 2.6.21B Service Temperature of Metal-Clad Flexible Laminate, Cover Material and Adhesive Bonding Films - 6/11
TM 2.6.23 Test Procedure for Steam Ager Temperature Repeatability - 7/93
TM 2.6.24 Junction Stability Under Environmental Conditions - 11/98
TM 2.6.25A Conductive Anodic Filament (CAF) Resistance Test: X-Y Axis - 5/12
TM 2.6.26A DC Current Induced Thermal Cycling Test - 6/14
TM 2.6.27 Thermal Stress, Convection Reflow Assembly Simulation - 5/09
TM 2.6.28 Moisture Content and/or Moisture Absorption Rate, (Bulk) Printed Board - 8/10


Old

SECTION 3.0 - Connector Test Methods
TM 3.1A Contact Resistance, Connectors - 7/75
TM 3.2A Contact Retention, Connectors - 7/75
TM 3.3A Crimp Tensil Strength, Connectors - 7/75
TM 3.4B Durability, Connectors - 1/83
TM 3.5A Humidity, Connectors - 7/75
TM 3.6A Insulation Resistance, Connectors - 7/75
TM 3.7A Low Level Circuit Connectors - 7/75
TM 3.8A Mechanical Shock, Connectors - 7/75
TM 3.9A Salt Spray, Connectors - 7/75
TM 3.10A Solderability, Connectors - 7/75
TM 3.11A Thermal Shock, Connectors - 7/75
TM 3.12A Vibration, Connectors - 7/75
TM 3.13A Withstanding Voltage, Connectors - 7/75
TM 3.14 High Temperature Life, Connectors - 7/75
TM 3.15 Fungus Resistance, Connectors - 7/79
TM 3.16 Fretting Corrosion, Connectors - 2/78
TM 3.17 Industrial Gas Test (Battelle Method), Connectors - 2/78
TM 3.18 Mating and Unmating Force, Connectors - 1/83


Cancelled

SECTION -


SECTION 2.1 - Visual Test Methods
TM 2.1.1.1 Microsectioning, Ceramic Substrate - 12/87
TM 2.1.1.2A Microsectioning—Semi or Automatic Technique Microsection Equipment (Alternate) - 5/04
Superceded by 2.1.1F


SECTION 2.2 - Dimensional Test Methods
TM 2.2.8 Location of Holes - 4/73
TM 2.2.10A Hole Location and Conductor Location - 12/83
TM 2.2.15 Cable Dimensions (Flat Cable) - 6/79
TM 2.2.16 Artwork Master Evaluation by Use of a Drilled Panel - 12/87
TM 2.2.16.1 Artwork Master Evaluation by Overlay - 12/87
TM 2.2.17 Surface Roughness and Profile of Metallic Foils (Contacting Stylus Technique) - 3/90
TM 2.2.19 Measuring Hole Pattern Location - 12/87


SECTION 2.3 - Chemical Test Methods
TM 2.3.3A Chemical Resistance of Insulating Materials - 2/78
TM 2.3.5B Density, Insulating Material - 8/97
TM 2.3.8.1 Flammability of Flexible Printed Wiring - 12/88
TM 2.3.23B Cure (Permanency) Thermally Cured Solder Mask - 2/88
TM 2.3.23.1A Cure (Permanency) UV Initiated Dry Film Solder Mask - 2/88
TM 2.3.25B Detection and Measurement of Ionizable Surface Contaminants - 8/97
Supersedes 2.3.26 and 2.3.26.1
TM 2.3.26A Superseded by Test Method 2.3.25 - 2/88
Superseded by Test Method 2.3.25
TM 2.3.26.1 Superseded by Test Method 2.3.25 - 2/88
Superseded by Test Method 2.3.25
TM 2.3.26.2 Mobile Ion Content of Polymer Films - 7/95
TM 2.3.27 Cleanliness Test - Residual Rosin - 1/95
TM 2.3.27.1 Rosin Flux Residue Analysis-HPLC Method - 1/95
TM 2.3.29 Flammability, Flexible Flat Cable - 11/88
TM 2.3.31 Relative Degree of Cure of U.V. Curable Material - 2/88
Reaffirmed
TM 2.3.38C Surface Organic Contaminant Detection Test - 5/04
TM 2.3.39C Surface Organic Contaminant Identification Test (Infrared Analytical Method) - 5/04


SECTION 2.4 - Mechanical Test Methods
TM 2.4.1.1B Adhesion, Marking Paints and Inks - 11/88
TM 2.4.1.2 Adhesion of Conductors on Hybrid Substrates - 12/87
TM 2.4.1.3 Adhesion, Resistors (Hybrid Circuits) - 12/87
TM 2.4.1.4 Adhesion, Overglaze (Hybrid Circuits) - 12/87
TM 2.4.5 Folding Endurance, Flexible Printed Wiring Materials - 4/73
TM 2.4.9D Peel Strength, Flexible Dielectric Materials - 10/88
TM 2.4.10 Plating Adhesion - 4/73
TM 2.4.11 Shear Strength Flexible Dielectric Materials - 4/73
TM 2.4.14 Solderability of Metallic Surfaces - 4/73
TM 2.4.14.1 Solderability, Wave Solder Method - 3/79
TM 2.4.20 Terminal Bond Strength, Flexible Printed Wiring - 4/73
TM 2.4.27.2A Solder Mask Abrasion (Pencil Method) - 2/88
Reaffirmed
TM 2.4.28B Adhesion, Solder Mask (Non-Melting Metals) - 8/97
TM 2.4.31A Folding, Flexible Flat Cable - 4/86
TM 2.4.32A Fold Temperature Testing, Flexible Flat Cable - 4/86
TM 2.4.33C Flexural Fatigue and Ductility, Flat Cable - 3/91
TM 2.4.37A Evaluation of Hand Soldering Tools for Terminal Connections - 7/91
TM 2.4.37.1A Evaluation of Hand Soldering Tools for Printed Wiring Board Applications - 7/91
TM 2.4.37.2 Evaluation of Hand Soldering Tools on Heavy Thermal Loads - 7/93


SECTION 2.5 - Electrical Test Methods
TM 2.5.4 Current Carrying Capacity, Multilayer Printed Wring - 4/73
TM 2.5.5A Dielectric Constant of Printed Wiring Materials - 7/75
TM 2.5.5.1B Permittivity (Dielectric Constant) and Loss Tangent (Dissipation Factor) of Insulating Material at 1MHz (Contacting Electrode Systems) - 5/86
TM 2.5.5.4 Dielectric Constant and Dissipation Factor of Printed Wiring Board Material--Micrometer Method - 10/85
TM 2.5.7.2 Dielectric Withstanding Voltage (HiPot Method) - Thin Dielectric Layers for Printed Circuit Boards (PCBs) - 12/07
TM 2.5.8A Dissipation Factor of Flexible Printed Wiring Material - 7/75
TM 2.5.11 Insulation Resistance, Multilayer Printed Wiring (Within a Layer) - 4/73
TM 2.5.16A Shorts, Internal on Multilayer Printed Wiring - 11/88
TM 2.5.24 Conductor Resistance, Flexible Flat Cable - 6/79
TM 2.5.25A Dielectric Withstand Voltage Flexible Fat Cable - 11/85
TM 2.5.26A Insulation Resistance Flexible Flat Cable - 11/85
TM 2.5.28A Q Resonance, Flexible Printed Wiring Materials - 4/88


SECTION 2.6 - Environmental Test Methods
TM 2.6.7.1 Thermal Shock - Conformal Coating - 7/00
Supersedes 2.6.7.1 for Conformal Coating Tests
TM 2.6.12 Temperature Testing, Flexible Flat Cable - 6/79
TM 2.6.17 Hydrolitic Stability, Flexible Printed Wiring Material - 12/82
TM 2.6.19 Environmental and Insulation Resistance Test of Hybrid Ceramic Multilayer Substrate Boards - 12/87
TM 2.6.20A 2.6.20A - 1/95
Superseded by J-STD-020A
TM 2.6.22 2.6.22 - 1/95
Superseded by J-STD-035


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