Technical Articles
Importance of Step up stencil
Mr. Kannan. E – HOD Quality Assurance, M/s. Kaynes Technology India private limited, Mysore
Importance of lead thickness termination height while making a stencil design for Surface mount technology. This document is limited to the stencil design with respect to the lead/termination height to get sufficient solder paste height while the solder paste printing process.
Press Fit Connection Advantages and Limitations
Mr. Amba Prasad – Product Architect, M/s. Tejas Networks, Bengaluru
Printed wiring board Integration at the system level includes utilization of various types of connector IO and Power Terminations. Press Fit Pin Termination technology though introduced in the late 1980s has come a long way in replacing conventional Solderable connection applications.
Criteria for selection of SMT Assembly Equipment (Part-3)
Mr. B J Srinivas – Director, Kreative Technologies, Bengaluru.
A reflow oven is a machine used primarily for reflow soldering of surface mount electronic components to printed circuit boards (PCB). The basic requirement of any reflow oven is to be able to consistently reflow the product at the required speed to meet production needs.
Effect of FOD on Solderability
Mr. Kannan. E – HOD Quality Assurance, M/s. Kaynes Technology India private limited, Mysore
This document explains the different types of FOD (Foreign Object Debris) and how it can impact the solderability in a PCB Assembly.