Venue
Setia SPICE Convention Centre, Penang, Function Room 1
Program Schedule
2:00 PM | Welcome Address & Introduction by IPC- Dr. Ranee Ramya, Country Manager, Malaysia |
2:10 PM | Presentation on Surface Mount Technology by Master IPC Trainer |
3:40 PM | Q & A Session |
Surface Mount Technology (SMT)
Surface Mount Technology (SMT) is a pivotal process in electronics manufacturing, enabling the efficient placement of components directly onto the surface of printed circuit boards (PCBs). However, without adherence to best practices, SMT can encounter defects such as tombstoning, solder bridging, and non-wetting, which can compromise the functionality and reliability of electronic assemblies.
This session delves into the common challenges faced during SMT assembly and provides insights into effective strategies to mitigate these issues. Participants will gain a comprehensive understanding of defect causes and learn best practices to enhance process efficiency and product quality.
Who can participate ?
This session is ideal for electronics manufacturing professionals—process engineers, quality assurance specialists, and technicians—working in SMT assembly
Note : IPC Member can nominate 3-4 candidates. IPC Non-member can nominate 2 candidates. For any enquiry on membership status please connect with Ranee Ramya, Malaysia Country Manager raneeramya@ipc.org
Registration : Free
Link for Registration