Venue
Setia SPICE Convention Centre, Penang, Function Room 2
Program Schedule
10:00 AM | Registration & Networking |
10:30 AM | Welcome Address & Presentation on Validate your process through IPC Standard by David Bergman |
11:00 AM | Presentation on Advanced Packaging by Dr. Bernard Lim |
12:30 PM | Q & A Session |
Advanced Packaging
Advanced packaging refers to innovative techniques that assemble semiconductor chips into compact, high-performance packages- using methods like system-in-package (SiP), 3D/2.5D ICs, heterogeneous integration, and fan-out wafer-level packaging. It enables the integration of multiple chips or functions in a single package, supporting technologies like AI, 5G, and IoT. Advanced packaging is now seen as the key driver of semiconductor innovation, surpassing traditional silicon scaling
Who can participate?
This session is ideal for electronics manufacturing professionals—process engineers, quality assurance specialists, and technicians from Semiconductor, E&E, and OSAT sectors
Note : IPC Member can nominate 3-4 candidates. IPC Non-member can nominate 2 candidates. For any enquiry on membership status please connect with Ranee Ramya, Malaysia Country Manager raneeramya@ipc.org
Registration : Free
Link for Registration