Venue
MIMOS Berhad, Kulim Hi-Tech Park
Program Schedule
8:30 AM | Registration & Networking Tea |
9:00 AM | Welcome Address by Mr. Parameswaran Ayahoo, Director, Industrial Technology Innovation Centre ( ITIC) , MIMOS Berhad |
9:15 AM | Introduction by Dr. Ranee Ramya, Country Manager, IPC Malaysia |
9:30 AM | Technical Session on Fundamentals of Hand Soldering by Mr. Johnson Stephen Muriel, Master IPC Trainer |
12:30 PM | Q & A Session |
12:45 PM | Tour at MIMOS Industrial Technology Innovation Centre (ITIC) Lab |
1:00 PM | Networking Lunch |
INDUSTRY IMPORTANCE
One of the significant processes in printed circuit board assembly is hand soldering. Working on a circuit board, one may have to solder a through-hole component or an SMT component. It is important to know that these solder joints require exact precision. Improper techniques can cause defective solder joints which many times may not be visually detectable. The soldering process varies based on the components being soldered and the specific technique used, but the core of the procedure is largely the same. Adhering to procedures, standards & best practices are the basic concepts for producing high-quality and reliable solder joints.
Who can participate?
Professionals involved with electronics industry manufacturing & repair process. University facilities and students having technical knowledge of hand soldering are welcome
Note: A maximum of two candidates per company is eligible for participation. However, if additional slots are required, please write directly to Dr. Ranee, Country Manager, IPC- Malaysia
Registration : Free
Link for Registration
Have Any Query? Please Share with us
IPC Malaysia ContactDr. Ranee RamyaCountry Manager, IPC- Malaysia | MIMOS ContactParameswaran AyahooDirector, Industrial Technology Innovation Centre (ITIC) |