Venue
Hosur Industries Association Plot No: 159/A, SIPCOT Industrial Complex,
Hosur - 635126. Dist.: Krishnagiri. TN
Program Schedule
9:30 AM | Registration & Networking Tea |
10:00 AM | Introduction by Mr. Prabhu Vetri, Regional Manager, IPC South India |
10:15 AM | Special Address by Guest of Honor |
10:30 AM | Presentation on ESD Best Practices in Electronics by Mr. B J Srinivas, Master IPC Trainer |
12:00 PM | Q & A Session |
12:15 PM | Lunch Break |
1:45 PM | Presentation on Surface Mount Technology in Electronics by Mr. B J Srinivas, Master IPC Trainer |
3:15 PM | Q & A Session |
3:30 PM | Presentation by Industry Expert - Mr. Mounesh Achar, Business Development- Electronics segment & CMM products, Industrial Quality Solutions, Carl Zeiss India |
3:45 PM | Vote of Thanks |
4:00 PM | Networking High-Tea |
Electrostatic Discharge (ESD)
Electrostatic discharge (ESD) is a common cause of damage to electronic components, especially sensitive ones like integrated circuits, transistors, and diodes. ESD occurs when a sudden flow of electricity between two objects with different electric potentials, such as a human body and a circuit board, creates a spark or shock. ESD can degrade, destroy, or alter the performance of electronic components, leading to failures, defect or reduced reliability. Therefore managing ESD risks and preventing damage to electronic components is a crucial aspect of electronics manufacturing
This session introduce participants to the causes of ESD and steps taken to mitigate its effects when handling, storage or transporting ESD-sensitive components in a manufacturing facility. You will learn basic principles and best practices for ESD control and protection.
Surface Mount Technology (SMT)
Surface Mount Technology (SMT) is a pivotal process in electronics manufacturing, enabling the efficient placement of components directly onto the surface of printed circuit boards (PCBs). However, without adherence to best practices, SMT can encounter defects such as tombstoning, solder bridging, and non-wetting, which can compromise the functionality and reliability of electronic assemblies.
This session delves into the common challenges faced during SMT assembly and provides insights into effective strategies to mitigate these issues. Participants will gain a comprehensive understanding of defect causes and learn best practices to enhance process efficiency and product quality.
Who can participate?
This session is ideal for electronics manufacturing professionals—process engineers, quality assurance specialists, and technicians—working with ESD control and SMT assembly. Gain practical insights to boost product reliability and streamline your processes.
Note : A maximum 3 Candidates Per Company is eligible for participation
Registration : Free
Link for Registration
Have Any Query? Please Share with us
Prabhu Vetri
Regional Manager - South India
Prabhuv@ipc.org
+91-8904411449