PCB Design for HDI & Advanced Packaging

Jun 6, 2022 - Jul 18, 2022
Monday, Wednesday
11:00 am ~ 01:00 pm America/New_York

Enrollment Period
Dec 16, 2021 - Jun 20, 2022

Description

This course provides the skills necessary to create PWB/PBA designs that require advanced or complex packaging. These include boards with limited board area that must comply with IPC standards and require non-orthogonal placement and routing, non-standard board outline geometry, non-standard board mounting, and advanced board materials.  

Taught by an IPC-certified industry expert with 25+ years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required by circuit board designers. 
This course is ideal for individuals who need further experience with packaging and routing challenges involved with modern high density, reduced board area, and complex geometry designs.

 LEARNING AND PERFORMANCE OBJECTIVES 

This program is designed to provide circuit board designers with a balanced foundation of theoretical knowledge and practical skills in printed circuit board design.

Upon completion, participants will be able to:  

• Compress circuit topology while maintaining circuit performance.
• Understand the trade-off of advanced PCB materials. 
• Define a board stackup that take implements micro-vias. 
• Import and / or define board outline geometry for circular or other non-standard shape.
• Define and implement non-standard (non-orthogonal) parts placement and routing.
• Define non-standard PCB mechanical retention and keep-outs.
• Define and implement non-standard component packaging.