Committee Home Page

Contribute to the IPC Standards Your Company, Competitors, Customers and Suppliers Depend On

Wondering how the standards you rely on get developed? Do you want to help make those standards better? Have you always wanted to find out why a certain criterion was included?

Use your technical expertise to improve IPC standards. Committee participation can take place in meetings, by teleconference, or by e-mail. Distance shouldn’t deter you and, indeed, IPC welcomes global input.

Committee members sharpen their negotiation and presentation skills. You’ll personally benefit from developing a network of experts with similar interests. In addition, committee participation can help build your resume and show potential employers that you’re keeping up with technological changes in the industry.

Find out more about IPC committees from the links below and about the documents currently in development by visiting our Status of Standardization page. IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting James Liu.

If you’re ready to help out, please send an e-mail to Answers@ipc.org. Please reference the committee or technology that interests you and provide your complete contact information, including your address, phone, and fax number. We’ll get in touch on the best way to get involved. Committee communications are conducted through e-mail, so it is mandatory to furnish a working e-mail address.

IMPORTANT INFORMATION
IPC committees are beginning the transition to using the Kavi website for committee collaboration. To help our committee members with this transition, a Basic User Training video has been made available.

1-10 Printed Board Design Committee
2-10 Electronic Product Data Description Committee
2-30 Terms and Definitions Committee
2-40 Electronic Documentation Technology Committee
3-10 Printed Board Base Materials Committee
3-11cn Specification for Base Materials for Rigid and Multilayer Boards
4-10 Fabrication Processes Committee
4-30 Environment, Health & Safety Steering Committee
5-20 Assembly & Joining Committee
5-11c Electronic Assembly Adhesives Task Group
5-21 Component Mounting Subcommittee
5-22 Soldering Subcommittee
5-23 Solderability Subcommittee
5-24 Assembly & Joining Materials
5-20cn Assembly & Joining Committee - China
5-22ain J-STD-001 Task Group - India
5-30 Cleaning and Coating Committee
5-40 Assembly Equipment Committee
6-10 Product Reliability Committee
7-10 Testing Committee
7-20 Process Control Management Committee
7-30 Product Assurance Committee
7-31 Acceptability Subcommittee
7-32 Automatic Inspection Technologies Subcommittee
7-33 Quality Assurance Subcommittee
7-34 Repairability Subcommittee
7-35 Assembly and Joining Handbook Subcommittee
7-30cn Product Assurance Committee - China
7-30de Product Assurance Committee - German language
7-30in Product Assurance Committee - India
7-30nd Product Assurance Committee - Nordic
8-40 Roadmap Executive Committee
8-60 Printed Electronics Technology Roadmap Executive Committee
9-80 OEM Management Council Steering Committee
9-90 IPC Designers Council Executive Board
B-10 Packaged Electronic Components Committee
D-10 Flexible Circuits Committee
D-20 High Speed/High Frequency Committee
D-30 Rigid Printed Board Committee
D-31bcn Generic Standard on Printed Board Design
D-50 Embedded Components Committee
D-55 Embedded Devices Process Implementation Subcommittee
D-60 Printed Electronics Committee
E-10 IPC PV Module Technical Standards Committee
E-20 Intellectual Property Standard Committee
E-30 Conflict Minerals Due Diligence Committee
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