5-33F Potting and Encapsulation Task Group

Cochair Torrey Clark, Dow Corporation
Cochair Brian Chislea, Dow Corporation
Vice Chair Matthew Eveline, HumiSeal Division of Chase Corporation
Staff Liaison
Committee Charter This task group is responsible for the maintenance of the IPC-HDBK-850 Guidelines for Design, Selection, and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.
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