| Chair |
James Monarchio, TTM Technologies |
| Vice Chair |
Jerry Magera, Motorola Solutions |
| Vice Chair |
Jose Rios, Raytheon |
| Staff Liaison |
John Perry |
| Committee Charter |
This subcommittee is responsible for developing and maintaining test protocols for assessing the reliability and material/design robustness of test coupons/vehicles through the use of thermal profiles. This will aid in establishing the acceptability of a printed board exposed to multiple thermal cycles in both tin-lead and lead-free processing environments. |
