Artificial Intelligence - Opportunities, Challenges, Possibilities
Tuesday and Thursday 11:00 – 1:00 p.m. Description:In this 4-hour course, you will learn and be updated on the following topics:
PCB Design I
Tuesday and Thursday 6:30 – 8:30 p.m. Description:
Understanding PCB Microsection Preparation and Analysis 101
Microsectional evaluation is a critical tool in determining the acceptability of printed c
Component-to-System Level Packaging - Addressing Integration Challenges for Automotive & Industrial Applications
Sponsorship Packages are available for the workshop on Component-to-System Level Packaging - Addressing Integration Challenges for Automotive and Industrial Applications.
Advanced Packaging to System Integration – Trends and Challenges
Advanced Packaging to System Integration – Trends and Challenges Speaker:Dr. Devan Iyer, Chief Strategist, Advanced Packaging, IPC
Road to Reliability: Design for Manufacturing - a Technology Solutions Webinar Series for e-Mobility Electronics Hardware Reliability
We are delighted to welcome Adrian Harea of Schaeffler and Michael Schleicher of Semikron-Danfoss to lead a discussion on DfM for EV's high-voltage / high-power applications.