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IPC Status of Standardization

Contribute to the IPC Standards Your Company, Competitors, Customers and Suppliers Depend On

Wondering how the standards you rely on get developed? Do you want to help make those standards better? Have you always wanted to find out why a certain criterion was included?

Use your technical expertise to improve IPC standards. Committee participation can take place in meetings, by teleconference, or by e-mail. Distance shouldn’t deter you and, indeed, IPC welcomes global input.

Committee members sharpen their negotiation and presentation skills. You’ll personally benefit from developing a network of experts with similar interests. In addition, committee participation can help build your resume and show potential employers that you’re keeping up with technological changes in the industry.

Find out more about IPC committees on our committee home pages and about the documents currently in development in our status of standardization. IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting Leesha Peng or Charlotte Hao in our Shanghai office.

If you’re ready to help out, please send an e-mail to Answers@ipc.org. Please reference the committee or technology that interests you and provide your complete contact information, including your address, phone, and fax number. We’ll get in touch on the best way to get involved. Committee communications are conducted through e-mail, so it is mandatory to furnish a working e-mail address.

This report shows the status of IPC documents under development. To ensure due process, all IPC specifications are circulated among IPC member companies for their review. If you would like to obtain a copy of a particular draft, please contact the IPC technical staff at answers@ipc.org.

Once published, the documents are available from our Online Store.
Status of Standardization
Published Standards
IPC-T-50H
 		Terms and Definitions for Interconnecting and Packaging Electronic Circuits
J-STD-075
August 2008		Classification of Non-IC Electronic Components for Assembly Processes
IPC-2223B
May 2008		Sectional Design Standard for Flexible Printed Boards
IPC-4562A
April 2008		IPC-4562A Metal Foil for Printed Board Applications
IPC-4563
February 2008		Resin-Coated Metal Foil for Printed Boards
IPC-4781
May 2008		Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks
IPC-4811
April 2008		Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
IPC-7095B
March 2008		Design and Assembly Process Implementation for BGAs
IPC-7711/21B
January 2008		Rework, Modification and Repair of Electronic Assemblies
Final Draft for Industry Review
J-STD-004BRequirements for Soldering Fluxes
IPC-A-610DCIPC-A-610DC Telecommunications Applications Electronic Hardware Addendum
IPC/WHMA-A-620ASIPC/WHMA-A-620A Space Applications Electronic Hardware Addendum
IPC-6013BQualification and Performance Specification for Flexible Printed Boards
Proposed Standard for Ballot
IPC-2577Sectional Requirements for Supply Chain Communications of Manufacturing Quality Assessment — Product Data eXchange (PDX)
IPC-7094Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC/JEDEC-9703Mechanical Shock Test Methods and Qualification Requirements for Surface Mount Solder Attachments
Working Draft
J-STD-005ARequirements for Soldering Pastes
J-STD-001ERequirements for Soldered Electrical and Electronic Assemblies
J-STD-029Performance and Reliability Test Methods for Flip Chip, Chip Scale, BGA and Other Surface Mount Array Package Applications
IPC-CH-65BGuidelines for Cleaning of Printed Boards and Assemblies
J-STD-001DS.1Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies
IPC-PE-740BTroubleshooting for Printed Board Manufacture and Assembly
IPC-AJ-820AAssembly & Joining Handbook
IPC-HDBK-830AGuidelines for Design, Selection and Application of Conformal Coatings
IPC-1601Printed Circuit Board Storage and Handling Guidelines
IPC-1756Materials Declaration Manufacturing Data Management
IPC-2152Standard for Determining Current Carrying Capacity in Printed Board Design
IPC-2221BGeneric Standard on Printed Board Design
IPC-2222ASectional Design Standard for Rigid Printed Boards
IPC-2611Generic Requirements for Electronic Product Documentation
IPC-2612Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2614Sectional Requirements for Board Fabrication Documentation
IPC-4202AFlexible Base Dielectrics for Use in Flexible Printed Circuitry
IPC-4203AAdhesive-Coated Dielectric Film for Use as Cover Material and Bonding Material for Flexible Printed Circuitry
IPC-4204AFlexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
IPC-5703Guidelines for Printed Board Fabricators in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards
IPC-6012CQualification and Performance Specification for Rigid Printed Boards
IPC-6017Qualification and Performance Specification for Embedded Passive Printed Boards
IPC-6018BMicrowave End Product Board Inspection and Test
IPC-A-610EAcceptability of Electronic Assemblies
J-STD-709Definition of Maximum Limits on Bromine and Chlorine Used in Materials for Low Halogen Electronic Components and Assemblies
IPC-7251Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-9252AGuidelines and Requirements for Electrical Testing of Unpopulated Printed Boards
IPC-9501AAssembly Process Simulation for Evaluation of Electronic Components
IPC-9592Performance Parameters for Power Conversion Devices
IPC-9850ASurface Mount Placement Characterization
Test Method Proposals
There are no test method proposals at this time
Test Methods Approved
There are no new test method approved at this time