IPC Status of Standardization

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Status of Standardization


Published Standards
IPC-6012DA May 2016 Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards
IPC-4562A-WAM1 March 2016 Metal Foil for Printed Board Applications
IPC-9121 March 2016 Troubleshooting for Printed Board Fabrication Processes
IPC-HDBK-001F February 2016 Handbook and Guide to Supplement J-STD-001
IPC-1072 February 2016 Intellectual Property Protection in Assembly Manufacturing
IPC-D-620 February 2016 Design and Critical Process Requirements for Cable and Wiring Harnesses
IPC-4556 AM1 February 2016 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
IPC-HDBK-4691 January 2016 Handbook on Adhesive Bonding in Electronic Assembly Operations
IPC-A-610F AM 1 December 2015 Acceptability of Electronic Assemblies - Amendment 1
IPC-4103 WAM1 - AM2 December 2015 Amendment 2 to Specification for Base Materials for High Speed/High Frequency Applications
J-STD-001F AM1 December 2015 Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1


Translations
IPC-A-610F-KR May 2016 전자 어셈블리에 대한 허용 가능성 (Korean Language)
J-STD-001FS-SP April 2016 Adición de dispositivos electrónicos para aplicaciones espaciales del IPC J-STD-001F Requisitos Para Uniones Eléctricas Soldadas y Ensambles Electrónicos (Spanish Language)
J-STD-001F-JP April 2016 はんだ付される電気及び電子組立品に関する要件事項 (Japanese Language)
J-STD-003C-CN-WAM1 April 2016 印制板可焊性测试 (Chinese Language)
J-STD-001F-IT March 2016 Requisiti per la Brasatura degli Assemblaggi Elettrici ed Elettronici (Italian Language)
JSTD001F-IT-WAM1 March 2016 Requisiti per la Brasatura degli Assemblaggi Elettrici ed Elettronici (Italian Language)
IPC-A-610F-IL January 2016 A-610F-IL-HEBREW: קבלה של הרכבות אלקטרוניות (Hebrew Language)
IPC-6012DS-DE December 2015 Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen (German Language)
IPC-A-610F-SE November 2015 Acceptanskrav för kretskort (Swedish Language)
IPC-T-50M-FR November 2015 Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés (French Language)
IPC-SM-817A-CN November 2015 表面贴装用绝缘粘合剂通用规范 (Chinese Language)
IPC-6012D-DE November 2015 Qualifikation und Leistungsspezifikation für starre Leiterplatten (German Language)


Final Draft for Industry Review
J-STD-001FS AM 1 Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
IPC JEDEC ECIA J-STD-046 Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers (revision of JESD46D)
IPC2581B Am1 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards


Proposed Standard for Ballot
J-STD-609B Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes
IPC-D-640 Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
IPC-1071B Intellectual Property Protection in Printed Board Manufacturing
IPC-7535CN Solder Dross Reduction in Wave Soldering Process
IPC-9262CN Automatic Optical Inspection Characterization and Verification


Working Draft
IPC-HDBK-005A Guide to Solder Paste Assessment
J-STD-006C AM 1 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-A-600J Acceptability of Printed Boards
IPC-A-610EC IPC-A-610 Telecom Addendum
IPC-HDBK-620 Cable and Wire Harness Design Guideline
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-A-640 Requirements and Acceptance for Optical Fiber Terminations, Cable/Harness Assemblies and Installation
IPC-CC-830C Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
IPC-1782 Standard for Traceability of Critical Items Based On Risk
IPC-2221C Generic Standard on Printed Board Design
IPC-2223D Sectional Design Standard for Flexible Printed Boards
IPC-2231 Design for Manufacturing (DFM) Guideline for the Printed Board Design Cycle
IPC/JPCA-4591A Requirements for Printed Electronics Functional Materials
IPC/JPCA-4921A Requirements for Printed Electronics Base Materials
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-6013D Qualification and Performance Specification for Flexible Printed Boards
IPC-7091 Design and Assembly Process Implementation of 3D Components
IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-7095D Design and Assembly Process Implementation for BGAs
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-7530A Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621 Low Pressure Molding Design, Selection, and Application Guidelines
IPC-9111 Troubleshooting for Printed Board Assembly Processes


Project Approved
IPC-A-610FC IPC-A-610 Telecom Addendum
IPC-1754 Materials Declaration Standard for Aerospace and Defense
IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292 Sectional Design Standard for Printed Electronics (Additive Circuitry)
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6902 Qualification and Performance Specifications for Printed Electronics (Additive Circuitry)
IPC-6903A Terms and Defintions for Design, Production and Performance of Printed Electronics
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7094A Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC-7351C Generic Requirements for Surface Mount Design and Land Pattern Standard


Withdrawn
 


Test Method Proposals


SECTION 2.1 - Visual Test Methods
TM 2.1.7.2 Determining a Weave as Spread Glass


SECTION 2.2 - Dimensional Test Methods
TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM 2.2.14.1A Solder Powder Particle Size Distribution - Measuring Microscope Method
TM 2.2.14.2A Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM 2.2.14.3A Determination of Maximum Solder Powder Particle Size
TM 2.2.20A Solder paste Metal Content by Weight


SECTION 2.3 - Chemical Test Methods
TM 2.3.13 June 2013 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM 2.3.20.1 Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM 2.3.35.1B Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning
TM 2.3.44 August 2015 Determination of Thickness and Phosphorus content in Electroless Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry


SECTION 2.4 - Mechanical Test Methods
TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM 2.4.34.1A Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM 2.4.34.2A Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM 2.4.34.3A Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A Solder Paste – Slump Test
TM 2.4.43A Solder Paste - Solder Ball Test
TM 2.4.45A Solder Paste – Wetting Test


SECTION 2.5 - Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests


SECTION 2.6 - Environmental Test Methods
TM 2.6.3.6A Surface Insulation Resistance - Fluxes - Telecommunications
TM 2.6.3.7A Surface Insulation Resistance
TM 2.6.14.1A Electrochemical Migration Resistance Test
TM 2.6.15D Corrosion, Flux


Test Methods Approved
 
 
Knowledge

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