IPC Status of Standardization

Learn about IPC Standards Development Opportunities

Dave Torp

Dave Torp, IPC Vice President of Standards & Technology

 

Contribute to the IPC Standards Your Company, Competitors, Customers and Suppliers Depend Onn

Wondering how the standards you rely on get developed? Do you want to help make those standards better? Have you always wanted to find out why a certain criterion was included?

Use your technical expertise to improve IPC standards. Committee participation can take place in meetings, by teleconference, or by e-mail. Distance shouldn’t deter you and, indeed, IPC welcomes global input.

Committee members sharpen their negotiation and presentation skills. You’ll personally benefit from developing a network of experts with similar interests. In addition, committee participation can help build your resume and show potential employers that you’re keeping up with technological changes in the industry.

Find out more about IPC committees on our committee home pages and about the documents currently in development in our status of standardization. IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting Leesha Peng or Charlotte Hao in our Shanghai office.

If you’re ready to help out, please send an e-mail to Answers@ipc.org. Please reference the committee or technology that interests you and provide your complete contact information, including your address, phone, and fax number. We’ll get in touch on the best way to get involved. Committee communications are conducted through e-mail, so it is mandatory to furnish a working e-mail address.

This report shows the status of IPC documents under development. To ensure due process, all IPC specifications are circulated among IPC member companies for their review. If you would like to obtain a copy of a particular draft, please contact the IPC technical staff at answers@ipc.org.

Once published, the documents are available from our Online Store.

IPC members may request one copy of any new standard within 90 days of publication. Requests should be sent to MemberTechRequest@ipc.org.

Status of Standardization
Published Standards
J-STD-033CFebruary 2012Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
IPC-9704AFebruary 2012Printed Circuit Assembly Strain Gage Test Guideline
IPC-2223CDecember 2011Sectional Design Standard for Flexible Printed Boards
IPC-4103ADecember 2011Specification for Base Materials for High Speed/High Frequency Applications
IPC-6018BDecember 2011Microwave End Product Board Inspection and Test
IPC-4204ANovember 2011Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
IPC-9850ANovember 2011Surface Mount Placement Characterization
IPC-T-50JOctober 2011Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-7525BOctober 2011Stencil Design Guidelines
IPC-9202October 2011Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9707September 2011Spherical Bend Test Method For Characterization of Board Level Interconnects
IPC-CH-65BJuly 2011Guidelines for Cleaning of Printed Boards and Assemblies
IPC-4412A incl. Am 1,2,3July 2011Specification for Finished Fabric Woven from "E" Glass for Printed Boards - includes Amendments 1, 2 & 3
IPC-7093March 2011Design and Assembly Process Implementation for Bottom Termination SMT Components
J-STD-004B Amendment 1 Requirements for Solder Fluxes (Amendment 1 Free Download)
IPC-4821 - Amendment 1  Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
New Translations
IPC-A-610E-CZDecember 2011Kritéria přijatelnosti elektronických sestav (Czech language)
IPC-A-610E-FRNovember 2011Acceptabilité des assemblages électroniques (French Language)
IPC-6011-CNNovember 2011印制板通用性能规范 (Chinese Language)
IPC-6013B-CNNovember 2011挠性印制板的鉴定及性能规范 (Chinese Language)
J-STD-006B-RUOctober 2011Требования к припойным сплавам для электроники и твердым припоям с флюсом и без флюса для применения при пайке электроники (Russian Language)
IPC-1601-DEOctober 2011Handhabung und Lagerung von Leiterplatten (German Language)
IPC-2223B-DEOctober 2011Design-Richtlinie für flexible Leiterplatten (German Language)
IPC-7351B-DEOctober 2011Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie (German Language)
IPC-7711-21B-CZOctober 2011Přepracování, modifikace a opravy elektronických sestav (7711/21) (Czech language)
IPC-A-610E-HUAugust 2011Elektronikai szerelvények elfogadhatósága (Hungarian Language)
IPC-A-610E-HIAugust 2011इलेक्ट्रोनिक असेम्बलीज की स्वीकार्यता (Hindi Language)
IPC-9702-CNAugust 2011板极互连的单向弯曲特性描述 (Chinese Language)
IPC-A-610E-RUJune 2011Критерии приемки электронных сборок (Russian Language)
J-STD-001E-SEMay 2011Krav för lödda elektriska och elektroniska kretskort (Swedish Language)
J-STD-001E-DKMay 2011Krav til elektriske og elektroniske produkter (Danish Language)
J-STD-609A-CNMay 2011元器件、印制电路板和印制电路板组件的 有铅、无铅及其它属性的标记和标签 (Chinese Language)
IPC-A-610E-ROMay 2011Acceptabilitatea Ansamblurilor Electronice (Romanian Language)
IPC-1601-CNMay 2011印制板操作和贮存指南 (Chinese Language)
IPC-6012C-PLMay 2011Specyfikacja Zdolności i Osiągów dla Sztywnych Płyt Drukowanych (Polish Language)
IPC-6012C-DEMay 2011Qualifikation und Leistungsspezifikation für starre Leiterplatten (German Language)
Final Draft for Industry Review
IPC-WHMA-A-620B Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-HDBK-850 Guidelines for Design, Selection and Application of Potting and Encapsulation Materials Used for Electronics Printed Circuit Board Assembly
IPC-2221B Generic Standard on Printed Board Design
IPC-7527 Solder Paste Printing Acceptance Guide
Proposed Standard for Ballot
IPC-HDBK-001 IPC-HDBK-001E
J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
J-STD-005A Requirements for Soldering Pastes
IPC/WHMA-A-620AS-Am1 Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Amendment 1
IPC-AJ-820A Assembly & Joining Handbook
IPC-1758 Declaration Requirements for Shipping, Packing and Packaging Materials
IPC-2581A Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-7095C Design and Assembly Process Implementation for BGAs
Working Draft
J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
J-STD-003 Solderability Tests for Printed Boards
IPC-A-610F Acceptability of Electronic Assemblies
IPC-A-610EC IPC-A-610 Telecom Addendum
IPC-HDBK-620 IPC-WHMA-A-620 Handbook
IPC-A-630 Guidelines for Design, Selection and Application of Electronic Enclosures
IPC-HDBK-830A Guidelines for Design, Selection and Application of Conformal Coatings
IPC-4203A Adhesive-Coated Dielectric Film for Use as Cover Material and Bonding Material for Flexible Printed Circuitry
IPC-4903 A Guideline for Defining "Low-Halogen" Electronic Products
IPC-5703 Guidelines for Printed Board Fabricators in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards
IPC-6013C Qualification and Performance Specification for Flexible Printed Boards
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-9203 User Guide for the IPC-B-52 Process Qualification Test Vehicle
Test Method Proposals
TM 2.5.34 Power Density Rating for Embedded Resistors
Test Methods Approved
TM 2.4.3EJune 2011Flexural Fatigue, Flexible Printed Wiring Materials
TM 2.6.21BJune 2011Service Temperature of Metal-Clad Flexible Laminate, Cover Material and Adhesive Bonding Films