IPC Status of Standardization

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Status of Standardization

Published Standards
IPC-6012DS September 2015 Space Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards
IPC-6012D September 2015 Qualification and Performance Specification for Rigid Printed Boards
IPC-1081 August 2015 White Paper on Conflict Minerals Due Diligence Guidance
IPC/JPCA-6901 August 2015 Application Categories for Printed Electronics
IPC/JEDEC-9702-WAM1 August 2015 Monotonic Bend Characterization of Board-Level Interconnects
IPC-4101D-WAM1 August 2015 Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-T-50M June 2015 Terms and Definitions for Interconnecting and Packaging Electronic Circuits
J-STD-048 May 2015 Notification Standard for Product Discontinuance
IPC-1755 Amendment 1 April 2015 Conflict Minerals Data Exchange Standard
IPC-7801 April 2015 Reflow Oven Process Control Standard

IPC-A-610F-DK October 2015 Godkendelseskrav for elektronikprodukter (Danish Language)
IPC-A-610F-RO August 2015 Acceptabilitatea Ansamblurilor Electronice (Romanian Language)
IPC-2222A-FR August 2015 Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides (French Language)
J-STD-001F-DK July 2015 Krav til loddede elektriske og elektroniske produkter (Danish language)
J-STD-001F-RU July 2015 Требования к электрическим и электронным сборкам, изготавливаемым с помощью пайки (Russian language)
IPC-A-610F-RU July 2015 Критерии приемки электронных сборок (Russian Language)
IPC-A-610F-JP July 2015 電子組立部品の許容基準 (Japanese Language)
IPC-A-610F-DE July 2015 Abnahmekriterien für elektronische Baugruppen (German Language)
IPC-2221B-FR July 2015 Norme Générique de Conception du Circuit imprimé (French Language)
IPC-A-610F-SP June 2015 Aceptabilidad de Ensambles Electrónicos (Spanish Language)
IPC-A-610F-VN June 2015 VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử (Vietnamese Language)
IPC-A610F-FR June 2015 Acceptabilité des assemblages électroniques (French Language)
IPC/WHMA-A-620B-VN June 2015 IPC/WHMA-A-620B-VN Yêu Cầu và Tiêu Chuẩn Chấp Nhận cho Các Bộ Dây và Bộ Cáp Dẫn Điện (Vietnames language)
J-STD-001F-SP May 2015 Requisitos de Ensambles Eléctricos y Electrónicos Soldados (Spanish language)
J-STD-001F-FR April 2015 Exigences des Assemblages Électriques et Électroniques Brasés (French language)
J-STD-001F-RO April 2015 Cerințe pentru Ansamblurile Electrice și Electronice Lipite (Romanian language)
IPC-A-610F-CN April 2015 电子组件的可接受性 (Chinese Language)
IPC-WHMA-A-620B-KR April 2015 케이블과 와이어 하네스 어셈블리들에 대한 요건들과 수용 (Korean language)
J-STD-001F-DE April 2015 Anforderungen an gelötete elektrische und elektronische Baugruppen (German language)
IPC-4554-CN April 2015 印制板浸锡规范—含修订本1 (Chinese language

Final Draft for Industry Review
IPC-6012DA Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards
IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-HDBK-001F Handbook and Guide to Supplement J-STD-001
IPC JEDEC ECIA J-STD-046 Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers (revision of JESD46D)
IPC-9121 Troubleshooting for Printed Board Fabrication Processes

Proposed Standard for Ballot
IPC-D-620 Design and Critical Process Requirements for Cable and Wiring Harnesses
J-STD-001F AM1 Requirements for Soldered Electrical and Electronic Assemblies
J-STD-609B Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes
IPC-A-610F AM 1 Acceptability of Electronic Assemblies
IPC-1072 Intellectual Property Protection in Assembly Manufacturing
IPC-HDBK-4691 Handbook on Adhesive Bonding in Electronic Assembly Operations
IPC-6903 Terms and Definitions for Design, Production and Performance of Printed Electronics
IPC-7535CN Solder Dross Reduction in Wave Soldering Process
IPC-9262CN Automatic Optical Inspection Characterization and Verification

Working Draft
IPC-HDBK-005A Guide to Solder Paste Assessment
J-STD-006C AM 1 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-A-600J Acceptability of Printed Boards
IPC-A-610EC IPC-A-610 Telecom Addendum
IPC-HDBK-620 Cable and Wire Harness Design Guideline
IPC-A-640 Design and Acceptance Requirements for Optical Fiber Termination, Cable/Harness Assemblies and Installation
IPC-CC-830C Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
IPC-1782 Standard for Traceability of Critical Items Based On Risk
IPC-2221C Generic Standard on Printed Board Design
IPC-2223D Sectional Design Standard for Flexible Printed Boards
IPC-2231 Design for Manufacturing (DFM) Guideline for the Printed Board Design Cycle
IPC2581B Am1 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC/JPCA-4591A Requirements for Printed Electronics Functional Materials
IPC/JPCA-4921A Requirements for Printed Electronics Base Materials
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-6013D Qualification and Performance Specification for Flexible Printed Boards
IPC-7091 Design and Assembly Process Implementation of 3D Components
IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-7095D Design and Assembly Process Implementation for BGAs
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-7530A Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621 Low Pressure Molding Design, Selection, and Application Guidelines
IPC-9111 Troubleshooting for Printed Board Assembly Processes

Project Approved
J-STD-001FS w/AM 1 Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610FC IPC-A-610Telecom Addendum
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-1754 Materials Declaration Standard for Aerospace and Defense
IPC-7711/21 Rework, Modification and Repair of Electronic Assemblies
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292 Sectional Design Standard for Printed Electronics (Additive Circuitry)
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4556 WAM1 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6902 Qualification and Performance Specifications for Printed Electronics (Additive Circuitry)
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7094A Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC-7351C Generic Requirements for Surface Mount Design and Land Pattern Standard


Test Method Proposals

SECTION 2.1 - Visual Test Methods
TM Determining a Weave as Spread Glass

SECTION 2.2 - Dimensional Test Methods
TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM Solder Powder Particle Size Distribution - Measuring Microscope Method
TM Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM Determination of Maximum Solder Powder Particle Size
TM 2.2.20A Solder paste Metal Content by Weight

SECTION 2.3 - Chemical Test Methods
TM 2.3.13 June 2013 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning
TM 2.3.44 August 2015 Determination of Thickness and Phosphorus content in Electroless Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry

SECTION 2.4 - Mechanical Test Methods
TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A Solder Paste – Slump Test
TM 2.4.43A Solder Paste - Solder Ball Test
TM 2.4.45A Solder Paste – Wetting Test

SECTION 2.5 - Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests

SECTION 2.6 - Environmental Test Methods
TM Surface Insulation Resistance - Fluxes - Telecommunications
TM Surface Insulation Resistance
TM Electrochemical Migration Resistance Test
TM 2.6.15D Corrosion, Flux

Test Methods Approved

SECTION 2.1 - Visual Test Methods
TM 2.1.1F June 2015 Microsectioning, Manual and Semi or Automatic