IPC Status of Standardization

Learn about IPC Standards Development Opportunities

Dave Torp

Dave Torp, IPC Vice President of Standards & Technology

 

Contribute to the IPC Standards Your Company, Competitors, Customers and Suppliers Depend Onn

Wondering how the standards you rely on get developed? Do you want to help make those standards better? Have you always wanted to find out why a certain criterion was included?

Use your technical expertise to improve IPC standards. Committee participation can take place in meetings, by teleconference, or by e-mail. Distance shouldn’t deter you and, indeed, IPC welcomes global input.

Committee members sharpen their negotiation and presentation skills. You’ll personally benefit from developing a network of experts with similar interests. In addition, committee participation can help build your resume and show potential employers that you’re keeping up with technological changes in the industry.

Find out more about IPC committees on our committee home pages and about the documents currently in development in our status of standardization. IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting Leesha Peng or Sandy Xiao in our Shanghai office.

If you’re ready to help out, please send an e-mail to Answers@ipc.org. Please reference the committee or technology that interests you and provide your complete contact information, including your address, phone, and fax number. We’ll get in touch on the best way to get involved. Committee communications are conducted through e-mail, so it is mandatory to furnish a working e-mail address.

This report shows the status of IPC documents under development. To ensure due process, all IPC specifications are circulated among IPC member companies for their review. If you would like to obtain a copy of a particular draft, please contact the IPC technical staff at answers@ipc.org.

Once published, the documents are available from our Online Store.

IPC members may request one copy of any new standard within 90 days of publication. Requests should be sent to MemberTechRequest@ipc.org.

Status of Standardization


Published Standards
IPC-5703 May 2013 Cleanliness Guidelines for Printed Board Fabricators
IPC-4203A January 2013 Cover and Bonding Material for Flexible Printed Circuitry
Supersedes: IPC-4203:2002
IPC-4556 January 2013 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
IPC-7095C January 2013 Design and Assembly Process Implementation for BGAs
Supersedes: IPC-7095B:2008
IPC-9592B January 2013 Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
Supersedes: IPC-9592A:2010
IPC-1751A w/Amend 1 December 2012 Generic Requirements for Declaration Process Management - Includes Amendment 1
Supersedes IPC-1751A:2010
IPC-1752A w/Amend 1 December 2012 Materials Declaration Management - Includes Amendment 1
Supersedes IPC-1752A:2010
IPC/JPCA-4591 December 2012 Requirements for Printed Electronics Functional Conductive Materials
IPC-2221B November 2012 Generic Standard on Printed Board Design
Supersedes IPC-2221A:2003


Translations
J-STD-001E-TR May 2013 Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri (Turkish Language)
J-STD-001E-PL April 2013 Wymagania dla lutowanych zespołów elektrycznych i elektronicznych - Polish language
IPC-A-600H-FR April 2013 Acceptabilité des Circuits Imprimés(French language)
IPC-A-600H-PL April 2013 Kryteria Dopuszczenia Płyt Drukowanych (Polish language)
IPC-7525B-DE April 2013 Designrichtlinie für Druckschablonen (German language)
IPC-9631-DE April 2013 Richtlinie für die Anwendung der IPC-TM-650, Methode 2.6.27, Thermischer Stress, Simulation des Konvektions-Reflow-Löten (German language)
J-STD-033C-DE April 2013 Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile (German language)
IPC-2223C-DE April 2013 Design-Richtlinie für flexible Leiterplatten (German language)
J-STD-005A-CN March 2013 焊膏要求 (Chinese language)
J-STD-033C-HU February 2013 A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata (Hungarian language)
IPC-7711/21B-FR February 2013 Reprise, Modification et Réparation des Assemblages Electroniques (7711/21) (French language)
IPC-6012C-FR December 2012 Définitions et Spécification des propriétés des circuits imprimés rigides (French Language)
IPC-7711/21B-DK December 2012 Rework, modifikation og reparation af elektronikprodukter (Danish Language)
J-STD-005A-RU November 2012 Требования к паяльным пастам (Russian Language)
IPC-A-610E-IT November 2012 Accettabilità degli Assemblaggi Elettronici (Italian Language)


Final Draft for Industry Review
J-STD-030A Design, Selection and Process Implementation for Underfill Materials
IPC-A-630 Requirements and Acceptance Criteria for Box Builds for Military and Aerospace
IPC-1072 Best Industry Practices for Intellectual Property Protection in Assembly Manufacturing
IPC-1755 Conflict Minerals Data Exchange Standard
IPC-2291 Design Guideline for Printed Electronics
IPC-2581B Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-6013C Qualification and Performance Specification for Flexible Printed Boards
IPC-9709 Test Guidelines for Acoustic Emission Measurement during Mechanical Test


Proposed Standard for Ballot
J-STD-003C Solderability Tests for Printed Boards
J-STD-006C Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-HDBK-630 Guidelines for Design, Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-HDBK-830A Guidelines for Design, Selection and Application of Conformal Coatings
IPC-1081 Conflict Minerals Due Diligence Best Practices Guideline
IPC-9641 High Temperature Printed Board Flatness Guideline


Working Draft
J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-A-610EC IPC-A-610 Telecom Addendum
IPC-A-610F Acceptability of Electronic Assemblies
IPC-HDBK-620 Cable and Wire Harness Design Guideline
IPC/WHMA-A-620BS Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620B
IPC-SM-817A General Requirements for Dielectric Surface Mounting Adhesives
IPC-CC-830C Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
IPC-1753 Laboratory Report Standard
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-7092 Design and Assembly Process Implementation for Embedded Components
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-7530A Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
 


Test Method Proposals


SECTION 2.3 - Chemical Test Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM 2.3.20.1 Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM 2.3.35.1B Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning


SECTION 2.4 - Mechanical Test Methods
TM 2.4.16B Initiation Tear Strength, Flexible Insulating Materials


SECTION 2.5 - Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests


SECTION 2.6 - Environmental Test Methods
TM 2.6.15D Corrosion, Flux
TM 2.6.26A DC Current Induced Thermal Cycling Test


Test Methods Approved


SECTION 2.3 - Chemical Test Methods
TM 2.3.25D November 2012 Detection and Measurement of Ionizable Surface Contaminations by Resistivity of Solvent Extract (ROSE)
TM 2.3.28B November 2012 Ionic Analysis of Circuit Boards, Ion Chromatography Method


SECTION 2.4 - Mechanical Test Methods
TM 2.4.17.1B February 2013 Propagation Tear Strength, Flexible Insulating Material