IPC Status of Standardization

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Status of Standardization


Published Standards
J-STD-003C WAM1 September 2014 Solderability Tests for Printed Boards
J-STD-001F August 2014 Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610F August 2014 Acceptability of Electronic Assemblies
IPC-1071A July 2014 Best Industry Practices for Intellectual Property Protection by Printed Board Manufacturers
IPC-HDBK-630 July 2014 Guidelines for Design, Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-8701 July 2014 Final Acceptance Criteria Standard for PV Modules-Final Module Assembly
IPC-1755 April 2014 Conflict Minerals Data Exchange Standard
IPC-4101D April 2014 Specification for Base Materials for Rigid and Multilayer Printed Boards
J-STD-030A March 2014 Selection and Application of Board Level Underfill Materials
IPC-4103A WAM1 March 2014 Specification for Base Materials for High Speed/High Frequency Applications
Supersedes IPC-4103A:2011


Translations
IPC/WHMA-A-620B-PL August 2014 A-620B-PL: Wymagania i akceptacje dla montażu kabli i wiązek przewodów (Polish language)
IPC-A610E-EE(E)1 July 2014 Elektroonikakoostude vastavusnõuded (Estonian language)
IPC/WHMA-A-620A-DK July 2014 Godkendelseskrav for kabler og for produkter med wire harness (Danish language)
IPC-A600H-JP June 2014 プリント板の受け入れ (Japanese Language)
IPC-CH-65B-CN May 2014 印制板及组件清洗指南 (Chinese Language)
IPC-A-600H-RU May 2014 Критерии приемки печатных плат (Russian Language)
IPC/WHMA-A-620B-FR April 2014 Exigences et critères d'acceptabilité pour l'interconnexion des faisceaux de fils et de câbles (French Language)
J-STD-006C-CN April 2014 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求 (Chinese Language)
IPC-7530-HU April 2014 Útmutató tömegforrasztási (reflow és hullám) folyamatok hőmérsékleti profiljának kialakításához (Hungarian Language)


Final Draft for Industry Review
J-STD-048 Notification Standard for Product Discontinuance
IPC-1072 Best Industry Practices for Intellectual Property Protection in Assembly Manufacturing
IPC-6012D Qualification and Performance Specification for Rigid Printed Boards
IPC-7535CN Solder Dross Reduction in Wave Soldering Process
IPC-9262CN Automatic Optical Inspection Characterization and Verification


Proposed Standard for Ballot
IPC/JEDEC-J-STD-020E Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
IPC-1081 Conflict Minerals Due Diligence Best Practices Guideline
IPC-7092 Design and Assembly Process Implementation for Embedded Components


Working Draft
IPC-HDBK-005A Guide to Solder Paste Assessment
J-STD-006C AM 1 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-T-50M Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-A-600J Acceptability of Printed Boards
IPC-A-610EC IPC-A-610 Telecom Addendum
IPC-HDBK-620 Cable and Wire Harness Design Guideline
IPC-SM-817A General Requirements for Dielectric Surface Mounting Adhesives
IPC-CC-830C Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
IPC-2221C Generic Standard on Printed Board Design
IPC-2223D Sectional Design Standard for Flexible Printed Boards
IPC-2231 Design for Manufacturing (DFM) Guideline for the Printed Board Design Cycle
IPC/JPCA-4591A Requirements for Printed Electronics Functional Materials
IPC-4691 Handbook on Adhesive Bonding in Electronic Assembly Operations
IPC/JPCA-4921A Requirements for Printed Electronics Base Materials
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-6013D Qualification and Performance Specification for Flexible Printed Boards
IPC/JPCA-6901 Performance Requirements for Printed Electronics Assemblies
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-7530A Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7801 Reflow Oven Process Control Standard
IPC-9111 Troubleshooting for Printed Board Assembly Processes
IPC-9121 Troubleshooting for Printed Board Fabrication Processes


Project Approved
J-STD-609B Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-A-640 Requirements and Acceptance for Fiber Optic Cable Assemblies
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4556 WAM1 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7091 Design and Assembly Process Implementation of 3D Components
IPC-7094A Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC-7621 Low Pressure Molding Design, Selection, and Application Guidelines
 


Test Method Proposals


SECTION 2.1 - Visual Test Methods
TM 2.1.7.2 Determining a Weave as Spread Glass


SECTION 2.2 - Dimensional Test Methods
TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM 2.2.14.1A Solder Powder Particle Size Distribution - Measuring Microscope Method
TM 2.2.14.2A Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM 2.2.14.3A Determination of Maximum Solder Powder Particle Size
TM 2.2.20A Solder paste Metal Content by Weight


SECTION 2.3 - Chemical Test Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM 2.3.20.1 Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM 2.3.35.1B Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning


SECTION 2.4 - Mechanical Test Methods
TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM 2.4.34.1A Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM 2.4.34.2A Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM 2.4.34.3A Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A Solder Paste – Slump Test
TM 2.4.43A Solder Paste - Solder Ball Test
TM 2.4.44A Solder Paste - Tack Test
TM 2.4.45A Solder Paste – Wetting Test


SECTION 2.5 - Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests


SECTION 2.6 - Environmental Test Methods
TM 2.6.3.6A Surface Insulation Resistance - Fluxes - Telecommunications
TM 2.6.3.7A Surface Insulation Resistance
TM 2.6.14.1A Electrochemical Migration Resistance Test
TM 2.6.15D Corrosion, Flux


Test Methods Approved


SECTION 2.4 - Mechanical Test Methods
TM 2.4.9E June 2014 Peel Strength, Flexible Dielectric Materials
TM 2.4.16B March 2014 Initiation Tear Strength, Flexible Insulating Materials


SECTION 2.6 - Environmental Test Methods
TM 2.6.26A June 2014 DC Current Induced Thermal Cycling Test
 
Knowledge