IPC Status of Standardization

Learn about IPC Standards Development Opportunities
Dave Torp

Dave Torp, IPC Vice President of Standards & Technology
 

Contribute to the IPC Standards Your Company, Competitors, Customers and Suppliers Depend Onn

Wondering how the standards you rely on get developed? Do you want to help make those standards better? Have you always wanted to find out why a certain criterion was included?

Use your technical expertise to improve IPC standards. Committee participation can take place in meetings, by teleconference, or by e-mail. Distance shouldn’t deter you and, indeed, IPC welcomes global input.

Committee members sharpen their negotiation and presentation skills. You’ll personally benefit from developing a network of experts with similar interests. In addition, committee participation can help build your resume and show potential employers that you’re keeping up with technological changes in the industry.

Find out more about IPC committees on our committee home pages and about the documents currently in development in our status of standardization. IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting Leesha Peng or Charlotte Hao in our Shanghai office.

If you’re ready to help out, please send an e-mail to Answers@ipc.org. Please reference the committee or technology that interests you and provide your complete contact information, including your address, phone, and fax number. We’ll get in touch on the best way to get involved. Committee communications are conducted through e-mail, so it is mandatory to furnish a working e-mail address.

This report shows the status of IPC documents under development. To ensure due process, all IPC specifications are circulated among IPC member companies for their review. If you would like to obtain a copy of a particular draft, please contact the IPC technical staff at answers@ipc.org.

Once published, the documents are available from our Online Store.
Status of Standardization
Published Standards
IPC-7351BJuly 2010Generic Requirements for Surface Mount Design and Land Pattern Standard
IPC-9592AMay 2010Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
J-STD-001EApril 2010Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-600HApril 2010Acceptability of Printed Boards
IPC-A-610EApril 2010Acceptability of Electronic Assemblies
IPC-2611April 2010Generic Requirements for Electronic Product Documentation
IPC-2612April 2010Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1April 2010Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-2614April 2010Sectional Requirements for Board Fabrication Documentation
IPC-4202AApril 2010Flexible Base Dielectrics for Use in Flexible Printed Circuitry
J-STD-609AMarch 2010Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-Free) and Other Attributes
IPC-1756March 2010Manufacturing Process Data Management
IPC-6012CMarch 2010Qualification and Performance Specification for Rigid Printed Boards
IPC-1751AFebruary 2010Generic Requirements for Declaration Process Management - version 2.0 schema
IPC-1752AFebruary 2010Materials Declaration Management - version 2.0 schema
New Translations
J-STD-033B-RUJuly 2010Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices - Russian
IPC-7711-21B-PLJune 2010Rework, Modification and Repair of Electronic Assemblies - Polish
J-STD-033B-1-CNMay 2010Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices (includes Amendment 1) - Chinese
IPC-2152-DEMay 2010Standard for Determining Current Carrying Capacity in Printed Board Design - German
J-STD-020D-CNJanuary 2010IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices - Chinese
Final Draft for Industry Review
IPC-CH-65B Guidelines for Cleaning of Printed Boards and Assemblies
IPC-AJ-820A Assembly & Joining Handbook
IPC-SM-840E Qualification and Performance Specification for Permanent Solder Mask and Flexible Cover Materials
IPC-1071 Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing
IPC-1601 Printed Circuit Board Storage and Handling Guidelines
IPC-2222A Sectional Design Standard for Rigid Printed Boards
IPC-6018B Microwave End Product Board Inspection and Test
Proposed Standard for Ballot
J-STD-001ES Space Applications Electronic Hardware Addendum to J-STD-001E
IPC-WHMA-A-620AS IPC/WHMA-A-620A Space Applications Electronic Hardware Addendum
IPC-4821 - Amendment 1 Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards
IPC-7093 Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-9707 Spherical Bend Test Method For Characterization of Board Level Interconnects
Working Draft
J-STD-005A Requirements for Soldering Pastes
IPC-PE-740B Troubleshooting for Printed Board Manufacture and Assembly
IPC-HDBK-830A Guidelines for Design, Selection and Application of Conformal Coatings
IPC-2221B Generic Standard on Printed Board Design
IPC-4203A Adhesive-Coated Dielectric Film for Use as Cover Material and Bonding Material for Flexible Printed Circuitry
IPC-4204A Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
IPC-5703 Guidelines for Printed Board Fabricators in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards
IPC-6013C Qualification and Performance Specification for Flexible Printed Boards
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-9850A Surface Mount Placement Characterization
Test Method Proposals
There are no test method proposals at this time
Test Methods Approved
2.3.28.2December 2009Bare Printed Board Cleanliness by Ion Chromatography
2.6.21AJune 2010Service Temperature for Flexible Printed Wiring