IPC Status of Standardization

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Status of Standardization

Published Standards
J-STD-048 May 2015 Notification Standard for Product Discontinuance
IPC-1755 Amendment 1 April 2015 Conflict Minerals Data Exchange Standard
IPC-7801 April 2015 Reflow Oven Process Control Standard
IPC-7092 February 2015 Design and Assembly Process Implementation for Embedded Components
J-STD-001FS February 2015 Space Applications Electronic Hardware Addendum for J-STD-001
IPC/JEDEC-J-STD-020E February 2015 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
IPC-FC-234A December 2014 Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

J-STD-001F-SP May 2015 Requisitos de Ensambles Eléctricos y Electrónicos Soldados (Spanish language)
J-STD-001F-FR April 2015 Exigences des Assemblages Électriques et Électroniques Brasés (French language)
J-STD-001F-RO April 2015 Cerințe pentru Ansamblurile Electrice și Electronice Lipite (Romanian language)
IPC-A-610F-CN April 2015 电子组件的可接受性 (Chinese Language)
IPC-WHMA-A-620B-KR April 2015 케이블과 와이어 하네스 어셈블리들에 대한 요건들과 수용 (Korean language)
J-STD-001F-DE April 2015 Anforderungen an gelötete elektrische und elektronische Baugruppen (German language)
IPC-4554-CN April 2015 印制板浸锡规范—含修订本1 (Chinese language
IPC-6018B-CN February 2015 6018B-CN: 高频(微波)印制板的鉴定及性能规范 (Chinese language)
J-STD-001F CN February 2015 焊接的电气和电子组件要求 (Chinese language)
IPC-2223C-CN February 2015 挠性印制板设计分标准 (Chinese language)
IPC-T-50K-DE February 2015 Begriffe und Definitionen für die Leiterplatten- und Baugruppenindustrie
IPC-7711/21B-TR November 2014 7711/221B-TR: Elektronik Takımlarda Yeniden İşlem, Modifikasyon ve Onarım (Turkish language)
IPC/WHMA-A-620B-IL November 2014 A-620B-IL-Hebrew: דרישות וקבלה של הרכבות כבלים ורתמות חוטים (Hebrew Language)
IPC-A-630-CN November 2014 A-630-CN: 电子产品整机的制造、检验和测试的可接受性标准 (Chinese language)

Final Draft for Industry Review
IPC-D-620 Design and Critical Process Requirements for Cable and Wiring Harnesses
IPC-HDBK-001F Handbook and Guide to Supplement J-STD-001
J-STD-001F AM1 Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-610F AM 1 Acceptability of Electronic Assemblies
IPC-1072 Intellectual Property Protection in Assembly Manufacturing
IPC-HDBK-4691 Handbook on Adhesive Bonding in Electronic Assembly Operations

Proposed Standard for Ballot
IPC-1081 Conflict Minerals Due Diligence Best Practices Guideline
IPC-6012D Qualification and Performance Specification for Rigid Printed Boards
IPC/JPCA-6901 Application Categories for Printed Electronics
IPC-7535CN Solder Dross Reduction in Wave Soldering Process
IPC-9262CN Automatic Optical Inspection Characterization and Verification

Working Draft
IPC-HDBK-005A Guide to Solder Paste Assessment
J-STD-006C AM 1 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC JEDEC ECIA J-STD-046 Customer Notification of Product/Process Changes by Solid-State Suppliers to IPC/JEDEC/ECIA J-STD-046 (Revision of JESD46D)
IPC-T-50M Terms and Definitions for Interconnecting and Packaging Electronic Circuits
IPC-A-600J Acceptability of Printed Boards
IPC-A-610EC IPC-A-610 Telecom Addendum
IPC-HDBK-620 Cable and Wire Harness Design Guideline
IPC-A-640 Requirements and Acceptance for Fiber Optic Cable Assemblies
IPC-CC-830C Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
IPC-2221C Generic Standard on Printed Board Design
IPC-2223D Sectional Design Standard for Flexible Printed Boards
IPC-2231 Design for Manufacturing (DFM) Guideline for the Printed Board Design Cycle
IPC/JPCA-4591A Requirements for Printed Electronics Functional Materials
IPC/JPCA-4921A Requirements for Printed Electronics Base Materials
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-6013D Qualification and Performance Specification for Flexible Printed Boards
IPC-7091 Design and Assembly Process Implementation of 3D Components
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-7530A Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621 Low Pressure Molding Design, Selection, and Application Guidelines
IPC-9111 Troubleshooting for Printed Board Assembly Processes
IPC-9121 Troubleshooting for Printed Board Fabrication Processes

Project Approved
J-STD-001FS w/AM 1 Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
J-STD-609B Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes
IPC-A-610FC IPC-A-610Telecom Addendum
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4556 WAM1 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7094A Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC7351C Generic Requirements for Surface Mount Design and Land Pattern Standard


Test Method Proposals

SECTION 2.1 - Visual Test Methods
TM Determining a Weave as Spread Glass

SECTION 2.2 - Dimensional Test Methods
TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM Solder Powder Particle Size Distribution - Measuring Microscope Method
TM Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM Determination of Maximum Solder Powder Particle Size
TM 2.2.20A Solder paste Metal Content by Weight

SECTION 2.3 - Chemical Test Methods
TM 2.3.13 June 2013 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning

SECTION 2.4 - Mechanical Test Methods
TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A Solder Paste – Slump Test
TM 2.4.43A Solder Paste - Solder Ball Test
TM 2.4.44A Solder Paste - Tack Test
TM 2.4.45A Solder Paste – Wetting Test

SECTION 2.5 - Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests

SECTION 2.6 - Environmental Test Methods
TM Surface Insulation Resistance - Fluxes - Telecommunications
TM Surface Insulation Resistance
TM Electrochemical Migration Resistance Test
TM 2.6.15D Corrosion, Flux

Test Methods Approved

SECTION 2.1 - Visual Test Methods
TM 2.1.1F June 2015 Microsectioning, Manual and Semi or Automatic