| J-STD-005A | Requirements for Soldering Pastes |
| J-STD-001E | Requirements for Soldered Electrical and Electronic Assemblies |
| J-STD-029 | Performance and Reliability Test Methods for Flip Chip, Chip Scale, BGA and Other Surface Mount Array Package Applications |
| IPC-CH-65B | Guidelines for Cleaning of Printed Boards and Assemblies |
| J-STD-001DS.1 | Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies |
| IPC-PE-740B | Troubleshooting for Printed Board Manufacture and Assembly |
| IPC-AJ-820A | Assembly & Joining Handbook |
| IPC-HDBK-830A | Guidelines for Design, Selection and Application of Conformal Coatings |
| IPC-1601 | Printed Circuit Board Storage and Handling Guidelines |
| IPC-1756 | Materials Declaration Manufacturing Data Management |
| IPC-2152 | Standard for Determining Current Carrying Capacity in Printed Board Design |
| IPC-2221B | Generic Standard on Printed Board Design |
| IPC-2222A | Sectional Design Standard for Rigid Printed Boards |
| IPC-2611 | Generic Requirements for Electronic Product Documentation |
| IPC-2612 | Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions) |
| IPC-2612-1 | Sectional Requirements for Electronic Diagramming Symbol Generation Methodology |
| IPC-2614 | Sectional Requirements for Board Fabrication Documentation |
| IPC-4202A | Flexible Base Dielectrics for Use in Flexible Printed Circuitry |
| IPC-4203A | Adhesive-Coated Dielectric Film for Use as Cover Material and Bonding Material for Flexible Printed Circuitry |
| IPC-4204A | Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry |
| IPC-5703 | Guidelines for Printed Board Fabricators in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards |
| IPC-6012C | Qualification and Performance Specification for Rigid Printed Boards |
| IPC-6017 | Qualification and Performance Specification for Embedded Passive Printed Boards |
| IPC-6018B | Microwave End Product Board Inspection and Test |
| IPC-A-610E | Acceptability of Electronic Assemblies |
| J-STD-709 | Definition of Maximum Limits on Bromine and Chlorine Used in Materials for Low Halogen Electronic Components and Assemblies |
| IPC-7251 | Generic Requirements for Through-Hole Design and Land Pattern Standard |
| IPC-9252A | Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards |
| IPC-9501A | Assembly Process Simulation for Evaluation of Electronic Components |
| IPC-9592 | Performance Parameters for Power Conversion Devices |
| IPC-9850A | Surface Mount Placement Characterization |