IPC Status of Standardization

Learn about IPC Standards Development Opportunities

Dave Torp

Dave Torp, IPC Vice President of Standards & Technology


ContribContribute to the IPC Standards Your Company, Competitors, Customers and Suppliers Depend On

Wondering how the standards you rely on get developed? Do you want to help make those standards better? Have you always wanted to find out why a certain criterion was included?

Use your technical expertise to improve IPC standards. Committee participation can take place in meetings, by teleconference, or by e-mail. Distance shouldn’t deter you and, indeed, IPC welcomes global input.

Committee members sharpen their negotiation and presentation skills. You’ll personally benefit from developing a network of experts with similar interests. In addition, committee participation can help build your resume and show potential employers that you’re keeping up with technological changes in the industry.

Find out more about IPC committees on our committee home pages and about the documents currently in development in our status of standardization. IPC m. IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting James Liu.

If you’re ready to help out, please send an e-mail to e="mailto:Answers@ipc.org" href="mailto:Answers@ipc.org">Answers@ipc.org. Please reference the committee or technology that interests you and provide your complete contact information, including your address, phone, and fax number. We’ll get in touch on the best way to get involved. Committee communications are conducted through e-mail, so it is mandatory to furnish a working e-mail address.

This report shows the status of IPC documents under development. To ensure due process, all IPC specifications are circulated among IPC member companies for their review. If you would like to obtain a copy of a particular draft, please contact the IPC technical staff at answers@ipc.org.

Once published, the documents are available from our Online Store.

IPC members may request one copy of any new standard within 90 days of publication. Requests should be sent to MemberTechRequest@ipc.org.

Status of Standardization

Published Standards
IPC-1755 April 2014 Conflict Minerals Data Exchange Standard
J-STD-030A March 2014 Selection and Application of Board Level Underfill Materials
IPC-4103A w/Am1 March 2014 Specification for Base Materials for High Speed/High Frequency Applications
Supersedes IPC-4103A:2011
IPC-4204A w/Am1 February 2014 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
Supersedes IPC-4204A:2011
IPC-1752A w/Am1&2 February 2014 Materials Declaration Management
Supersedes IPC-1752A w/Am1:2012
IPC-1753 February 2014 Laboratory Report Standard
IPC/JEDEC-9706 January 2014 Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
IPC-9709 December 2013 Test Guidelines for Acoustic Emission Measurement during Mechanical Test
IPC-6013C December 2013 Qualification and Performance Specification for Flexible Printed Boards
IPC-2581B October 2013 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
J-STD-003C October 2013 Solderability Tests for Printed Boards
IPC-HDBK-830A October 2013 Guidelines for Design, Selection and Application of Conformal Coatings

IPC/WHMA-A-620B-FR April 2014 Exigences et critères d'acceptabilité pour l'interconnexion des faisceaux de fils et de câbles (French Language)
J-STD-006C-CN April 2014 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求 (Chinese Language)
IPC-7530-HU April 2014 Útmutató tömegforrasztási (reflow és hullám) folyamatok hőmérsékleti profiljának kialakításához (Hungarian Language)
IPC/JEDEC-J-STD-033C-CN February 2014 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用 (Chinese Language)
IPC-4204A w/Amend 1-CN February 2014 挠性印制电路用挠性覆金属箔介质材料 (Chinese Language)
IPC-4412B-CN February 2014 印制板用处理“E”玻璃纤维布规范 (Chinese Language)
IPC-7525B-CN February 2014 模板设计指导 (Chinese Language)
IPC-9691A-CN February 2014 IPC-TM-650 测试方法2.6.25 耐导电阳极丝(CAF)测试(电化学迁移测试)用户指南 (Chinese Language)
IPC-6012C-RU January 2014 Требования к жестким печатным платам (Russian language)
IPC-7093-DE January 2014 Einführung des Design- und Verarbeitungsprozess von Bottom Termination Components (German Language)
IPC-4553A-CN November 2013 印制板浸银规范 (Chinese Language)
IPC/WHMA-A-620B-HU November 2013 IPC/WHMA-A-620B 1. módosításokat tartalmazó változat (Hungarian Language)
IPC-7527-DE November 2013 Anforderungen an den Lotpastendruck (German Language)
IPC-9691A-DE November 2013 Richtlinie für die Anwendung der IPC-TM-650, Methode 2.6.25, Leitfähiges Anodisches Faserwachstum, Widerstandstest X-Y-Achse (Conductive Anodic Filament, CAF) (German Language)
IPC-2221B-DE November 2013 Basisrichtlinie für das Design von Leiterplatten (German Language)
IPC-A-610E-VN October 2013 Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử (Vietnamese Language)
IPC-A-610E-TR October 2013 Elektronik Takımların Kabul Edilebilirliği (Turkish Language)
J-STD-001E-FR October 2013 Exigences des Assemblages Electriques et Electroniques Brasés (French Language)
IPC-4202A-CN October 2013 挠性印制电路用挠性基底介质 (Chinese Language)
IPC/WHMA-A-620B-SP October 2013 Requisitos y Aceptabilidad de Cables y Mazos de Cables (Spanish Language)
IPC/WHMA-A-620B-DE October 2013 Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen (German Language)

Final Draft for Industry Review
J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
J-STD-048 Notification Standard for Product Discontinuance
IPC-A-610F Acceptability of Electronic Assemblies
IPC-1072 Best Industry Practices for Intellectual Property Protection in Assembly Manufacturing
IPC-7092 Design and Assembly Process Implementation for Embedded Components

Proposed Standard for Ballot
J-STD-003C AM1 Solderability Tests for Printed Boards
IPC/JEDEC-J-STD-020E Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
IPC-HDBK-630 Guidelines for Design, Manufacture, Inspection, and Testing of Electronic Enclosures
IPC-1081 Conflict Minerals Due Diligence Best Practices Guideline
IPC-8701 Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

Working Draft
IPC-HDBK-005A Guide to Solder Paste Assessment
J-STD-006C AM 1 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-A-610EC IPC-A-610 Telecom Addendum
IPC-HDBK-620 Cable and Wire Harness Design Guideline
IPC-SM-817A General Requirements for Dielectric Surface Mounting Adhesives
IPC-CC-830C Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-7530A Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7801 Reflow Oven Process Control Standard

Test Method Proposals

SECTION 2.3 - Chemical Test Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning

SECTION 2.4 - Mechanical Test Methods
TM 2.4.16B Initiation Tear Strength, Flexible Insulating Materials

SECTION 2.5 - Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests

SECTION 2.6 - Environmental Test Methods
TM 2.6.15D Corrosion, Flux
TM 2.6.26A DC Current Induced Thermal Cycling Test

Test Methods Approved

SECTION 2.4 - Mechanical Test Methods
TM 2.4.52 October 2013 Fracture Toughness of Resin Systems for Base Materials