IPC Status of Standardization

Contribute to the IPC Standards Your Company, Competitors, Customers and Suppliers Depend On

Wondering how the standards you rely on get developed? Do you want to help make those standards better? Have you always wanted to find out why a certain criterion was included?

Use your technical expertise to improve IPC standards. Committee participation can take place in meetings, by teleconference, or by e-mail. Distance shouldn’t deter you and, indeed, IPC welcomes global input.

Committee members sharpen their negotiation and presentation skills. You’ll personally benefit from developing a network of experts with similar interests. In addition, committee participation can help build your resume and show potential employers that you’re keeping up with technological changes in the industry. Find out more about IPC committees on our committee home pages and about the documents currently in development in our status of standardization. IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting James Liu.

If you’re ready to help out, please send an e-mail to Answers@ipc.org. Please reference the committee or technology that interests you and provide your complete contact information, including your address, phone, and fax number. We’ll get in touch on the best way to get involved. Committee communications are conducted through e-mail, so it is mandatory to furnish a working e-mail address.

This report shows the status of IPC documents under development. To ensure due process, all IPC specifications are circulated among IPC member companies for their review. If you would like to obtain a copy of a particular draft, please contact the IPC technical staff at answers@ipc.org.

Once published, the documents are available from our Online Store.

IPC members may request one copy of any new standard within 90 days of publication. Requests should be sent to MemberTechRequest@ipc.org.

Status of Standardization


Published Standards
J-STD-046 November 2018 Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers (revision of JESD46D)
Joint JEDEC/IPC/ECIA
J-STD-609B November 2016 Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes
IPC-1782 November 2016 Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-2223D September 2016 Sectional Design Standard for Flexible Printed Boards
IPC-9252B September 2016 Requirements for Electrical Testing of Unpopulated Printed Boards
Supersedes IPC-9252A:2008
IPC-D-640 September 2016 Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
IPC-9691B September 2016 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
Supersedes IPC-9691A:2007
IPC-6018C July 2016 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-1601A June 2016 Printed Board Handling and Storage Guidelines
IPC-A-600J June 2016 Acceptability of Printed Boards


Translations
J-STD-001F-AM1-RO November 2016 Cerințe pentru Ansamblurile Electrice și Electronice Lipite (Romanian Language)
IPC-A-610F-AM1-RO November 2016 Acceptabilitatea Ansamblurilor Electronice Amendament 1 (Romanian language)
J-STD-001FS-CN November 2016 焊接的电气和电子组件要求航天应用电子部件补充标准 (Chinese language)
IPC-A-610F-AM1-CN November 2016 电子组件的可接受性 修订本1 (Chinese language)
IPC-6012DA-CN November 2016 刚性印制板的鉴定及性能规范汽车要求附件 (Chinese Language)
IPC-6012DS-SP November 2016 Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de rendimiento para los tableros impresos rígidos. (Spanish Language)
IPC-7530-CN November 2016 群焊工艺温度曲线指南(再流焊和波峰焊 (Chinese)
J-STD-001F-TR November 2016 Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri (Turkish Language)
IPC-A-610F-TR November 2016 Ek1'i içerir (Turkish Language)
IPC-A-600J-CN November 2016 印制板的可接受性 (Chinese language)
IPC-A-600J-FR September 2016 Acceptabilité des Circuits Imprimés (French Language)
IPC-T-50M-CN September 2016 电子电路互连与封装术语及定义 (Chinese)
IPC-6012D-CN July 2016 刚性印制板的鉴定及性能规范
J-STD-001F-KR July 2016 솔더링된 전기 및 전자 어셈블리에 대한 요건들 (Korean Language)
J-STD-001F-PL June 2016 Wymagania dla lutowanych zespołów elektrycznych i elektronicznych (Polish Language)
IPC-A610F-NL June 2016 Acceptatie van geassembleerde printplaten
IPC-A-610F-PL June 2016 Dopuszczalność Zespołów Elektronicznych (Polish Language)
IPC-6012DS-FR June 2016 Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification
IPC-6012D-FR June 2016 Spécification de la Qualification et des Performances des Circuits Imprimés Rigides (French Language)


Final Draft for Industry Review
J-STD-001FS AM 1 Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-640 Requirements and Acceptance for Optical Fiber Terminations, Cable/Harness Assemblies and Installation
IPC-1401 Corporate Social Responsibility and Sustainability Protocols for Electronic Manufacturing Industry
IPC-1755 Am 2 Conflict Minerals Data Exchange Standard
IPC-7091 Design and Assembly Process Implementation of 3D Components
IPC-7530A Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7711/21C Rework, Modification and Repair of Electronic Assemblies
IPC-9111 Troubleshooting for Printed Board Assembly Processes


Proposed Standard for Ballot
IPC-A-610FC IPC-A-610FC Telecom Addendum
IPC-1072 Am 1 Intellectual Property Protection in Electronic Assembly Manufacturing - Amendment 1
IPC-2581B Am1 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-7535CN Solder Dross Reduction in Wave Soldering Process
IPC-9204 Guideline on Test Methods for Printed Electronics
IPC-9262CN Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment


Working Draft
J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
J-STD-006C AM 1 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-A-610G Acceptability of Electronic Assemblies
IPC-HDBK-620 Cable and Wire Harness Design Guideline
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-CC-830C Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
IPC-2221C Generic Standard on Printed Board Design
IPC-2231 Design for Manufacturing (DFM) Guideline for the Printed Board Design Cycle
IPC/JPCA-4591A Requirements for Printed Electronics Functional Materials
IPC/JPCA-4921A Requirements for Printed Electronics Base Materials
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-6013D Qualification and Performance Specification for Flexible Printed Boards
IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-7095D Design and Assembly Process Implementation for BGAs
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-7621 Low Pressure Molding Design, Selection, and Application Guidelines


Project Approved
IPC-1754 Materials Declaration Standard for Aerospace and Defense
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292 Sectional Design Standard for Printed Electronics (Additive Circuitry)
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC/SGIA-5222 Process Guideline for Screen Printing for Printed Electronics (Additive Manufacturing)
IPC-6902 Qualification and Performance Specifications for Printed Electronics (Additive Circuitry)
IPC-6903A Terms and Definitions for Design, Production and Performance of Printed Electronics
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7094A Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC-7351C Generic Requirements for Surface Mount Design and Land Pattern Standard
IPC/JEDEC-9301 Reliability and Design Finite Element Analysis Standard


Withdrawn
 


Test Method Proposals


SECTION 2.1 - Visual Test Methods
TM 2.1.7.2 Determining a Weave as Spread Glass


SECTION 2.2 - Dimensional Test Methods
TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM 2.2.14.1A Solder Powder Particle Size Distribution - Measuring Microscope Method
TM 2.2.14.2A Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM 2.2.14.3A Determination of Maximum Solder Powder Particle Size
TM 2.2.20A Solder paste Metal Content by Weight


SECTION 2.3 - Chemical Test Methods
TM 2.3.13 June 2013 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM 2.3.20.1 Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM 2.3.35.1B Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning
TM 2.3.44 August 2015 Determination of Thickness and Phosphorus content in Electroless Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry


SECTION 2.4 - Mechanical Test Methods
TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM 2.4.34.1A Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM 2.4.34.2A Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM 2.4.34.3A Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A Solder Paste – Slump Test
TM 2.4.43A Solder Paste - Solder Ball Test
TM 2.4.45A Solder Paste – Wetting Test


SECTION 2.5 - Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests


SECTION 2.6 - Environmental Test Methods
TM 2.6.3.6A Surface Insulation Resistance - Fluxes - Telecommunications
TM 2.6.3.7A Surface Insulation Resistance
TM 2.6.14.1A Electrochemical Migration Resistance Test
TM 2.6.15D Corrosion, Flux


Test Methods Approved
 
 
Knowledge

TechNetFacebookYouTubeLinkedInTwitterFlickrGoogle+IPC BlogRSS Feeds