IPC Status of Standardization

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Status of Standardization

Published Standards
IPC-2223D September 2016 Sectional Design Standard for Flexible Printed Boards
IPC-9252B September 2016 Requirements for Electrical Testing of Unpopulated Printed Boards
Supersedes IPC-9252A:2008
IPC-D-640 September 2016 Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies
IPC-9691B September 2016 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
Supersedes IPC-9691A:2007
IPC-6018C July 2016 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-1601A June 2016 Printed Board Handling and Storage Guidelines
IPC-A-600J June 2016 Acceptability of Printed Boards
IPC-1071B May 2016 Intellectual Property Protection in Printed Board Manufacturing
IPC-6012DA May 2016 Automotive Applications Addendum to IPC-6012D Qualification and Performance Specification for Rigid Printed Boards

IPC-A-600J-FR September 2016 Acceptabilité des Circuits Imprimés (French Language)
IPC-T-50M-CN September 2016 电子电路互连与封装术语及定义 (Chinese)
IPC-6012D-CN July 2016 刚性印制板的鉴定及性能规范
J-STD-001F-KR July 2016 솔더링된 전기 및 전자 어셈블리에 대한 요건들 (Korean Language)
J-STD-001F-PL June 2016 Wymagania dla lutowanych zespołów elektrycznych i elektronicznych (Polish Language)
IPC-A610F-NL June 2016 Acceptatie van geassembleerde printplaten
IPC-A-610F-PL June 2016 Dopuszczalność Zespołów Elektronicznych (Polish Language)
IPC-6012DS-FR June 2016 Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification
IPC-6012D-FR June 2016 Spécification de la Qualification et des Performances des Circuits Imprimés Rigides (French Language)
IPC-A-610F-KR May 2016 전자 어셈블리에 대한 허용 가능성 (Korean Language)
J-STD-001FS-SP April 2016 Adición de dispositivos electrónicos para aplicaciones espaciales del IPC J-STD-001F Requisitos Para Uniones Eléctricas Soldadas y Ensambles Electrónicos (Spanish Language)
J-STD-001F-JP April 2016 はんだ付される電気及び電子組立品に関する要件事項 (Japanese Language)
J-STD-003C-CN-WAM1 April 2016 印制板可焊性测试 (Chinese Language)

Final Draft for Industry Review
J-STD-001FS AM 1 Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-640 Requirements and Acceptance for Optical Fiber Terminations, Cable/Harness Assemblies and Installation
IPC-1755 Am 2 Conflict Minerals Data Exchange Standard
IPC-7711/21C Rework, Modification and Repair of Electronic Assemblies
IPC-9111 Troubleshooting for Printed Board Assembly Processes

Proposed Standard for Ballot
IPC JEDEC ECIA J-STD-046 Customer Notification Standard for Product/Process Changes by Electronic Product Suppliers (revision of JESD46D)
J-STD-609B Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes
IPC-A-610FC IPC-A-610FC Telecom Addendum
IPC-1782 Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-2581B Am1 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-7535CN Solder Dross Reduction in Wave Soldering Process
IPC-9262CN Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment

Working Draft
IPC-HDBK-005A Guide to Solder Paste Assessment
J-STD-006C AM 1 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
IPC-HDBK-620 Cable and Wire Harness Design Guideline
IPC/WHMA-A-620C Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-CC-830C Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies
IPC-2221C Generic Standard on Printed Board Design
IPC-2231 Design for Manufacturing (DFM) Guideline for the Printed Board Design Cycle
IPC/JPCA-4591A Requirements for Printed Electronics Functional Materials
IPC/JPCA-4921A Requirements for Printed Electronics Base Materials
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-6013D Qualification and Performance Specification for Flexible Printed Boards
IPC-7091 Design and Assembly Process Implementation of 3D Components
IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-7095D Design and Assembly Process Implementation for BGAs
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-7530A Guidelines for Temperature Profiling for Mass Soldering Processes (Reflow & Wave)
IPC-7621 Low Pressure Molding Design, Selection, and Application Guidelines

Project Approved
IPC-1072 Am 1 Intellectual Property Protection in Electronic Assembly Manufacturing - Amendment 1
IPC-1754 Materials Declaration Standard for Aerospace and Defense
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292 Sectional Design Standard for Printed Electronics (Additive Circuitry)
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-6902 Qualification and Performance Specifications for Printed Electronics (Additive Circuitry)
IPC-6903A Terms and Definitions for Design, Production and Performance of Printed Electronics
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7094A Design and Assembly Process Implementation for Flip Chip and Die Size Components
IPC-7351C Generic Requirements for Surface Mount Design and Land Pattern Standard


Test Method Proposals

SECTION 2.1 - Visual Test Methods
TM Determining a Weave as Spread Glass

SECTION 2.2 - Dimensional Test Methods
TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM Solder Powder Particle Size Distribution - Measuring Microscope Method
TM Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM Determination of Maximum Solder Powder Particle Size
TM 2.2.20A Solder paste Metal Content by Weight

SECTION 2.3 - Chemical Test Methods
TM 2.3.13 June 2013 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning
TM 2.3.44 August 2015 Determination of Thickness and Phosphorus content in Electroless Nickel (EN) Layers by X-Ray Fluorescence (XRF) Spectrometry

SECTION 2.4 - Mechanical Test Methods
TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A Solder Paste – Slump Test
TM 2.4.43A Solder Paste - Solder Ball Test
TM 2.4.45A Solder Paste – Wetting Test

SECTION 2.5 - Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests

SECTION 2.6 - Environmental Test Methods
TM Surface Insulation Resistance - Fluxes - Telecommunications
TM Surface Insulation Resistance
TM Electrochemical Migration Resistance Test
TM 2.6.15D Corrosion, Flux

Test Methods Approved

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