IPC Document Revision Table

Product ID

Document Name

Responsible Committee

Status

ANSI

DoD

J-STD-001

Requirements for Soldered Electrical and Electronic Assemblies

5-22a

• Rev. E  4/10
• Rev D Amend 1  04/08
• Rev D 2/05
• Rev. C 3/00
• Rev. B 10/96
• Rev. A 1/95
• Orig. 4/92; Supersedes IPC-S-815

04/05

07/01

J-STD-001xS Space Hardware Addendum

Space Applications Electronic Hardware Addendum for J-STD-001. The addendum MUST be used with the same version of the standard; e.g. 001CS with 001C, 001DS with 001D, 001ES with 001D

5-22as

• ES 12/10
• DS Amend 1 09/09
• DS 11/06
• CS 1/04

IPC-HDBK-001

Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies

5-22f

• Rev E 2/12
• Amend 2  10/05
• Amend. 1  12/00
• Orig. 3/98

07/01

SMC-TR-001

An Introduction to Tape Automated Bonding Fine Pitch Technology

• Orig. 1/89

IT-WP-001

Myths of E-Commerce

• Orig. 9/00

SMC-WP-001

Soldering Capability White Paper Report

• Orig. 8/91

SMEMA 1.2

Mechanical Equipment Interface Standard

• Update IPC-SMEMA-9851

JP002

Current Tin Whiskers Theory and Mitigation Practices Guideline

5-23e

• Orig.  3/06

J-STD-002

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

5-23b

• Rev. C Amend. 1 10/08
• Rev. C 12/07
• Rev. B  2/03
• Rev. A 10/98
• Orig. 4/92; Supersedes IPC-S-805

10/08

05/95

SMC-WP-002

An Assessment of the Use of Lead in Electronic Assembly

• Orig. 8/92

J-STD-003

Solderability Tests for Printed Boards

5-23a

• Rev. B  2/07
• Rev. A  2/03
• Original 4/92; Supersedes IPC-S-804

02/93

SMC-WP-003

Chip Mounting Technology

• Orig. 8/93

SMEMA 3.1

Fiducial Mark Standard

J-STD-004

Requirements for Soldering Fluxes

5-24a

• Rev B. Amend. 1 – 10/11
• Rev. B 12/08
• Rev. A  1/04
• Orig. 1/95; Supersedes IPC-SF-818

05/95

SMC-WP-004

Design for Success

• Orig. 4/97

SMEMA 4

Reflow Terms and Definitions

• Orig.

J-STD-005

Requirements for Soldering Pastes

5-24b

• Rev A 2/12
• Amend. 1  6/96
• Orig. 1/95; Supersedes IPC-SP-819

05/95

SMC-WP-005

PWB Surface Finishes

• Orig. 4/97

IPC-HDBK-005

Guide to Solder Paste Assessment

5-24b

• Orig. 1/06

SMEMA 5

Screen Printing Terms and Definitions

• Orig.

J-STD-006

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

5-24c

• Rev. B Amends 1 & 2 10/09
• Rev. B Amend. 1  6/08
• Rev. B  1/06
• Rev. A  5/01
• Orig. 1/95

05/95

SMEMA 6

Electronics Cleaning Terms and Definitions

• Orig.

SMEMA 7

Fluid Dispensing Terms and Definitions

• Orig.

WP-008

Setting up Ion Chromatography Capability

• Orig. 12/05

J-STD-012

Implementation of Flip Chip and Chip Scale Technology

5-21g

• Orig. 1/96

Y

J-STD-013

Implementation of Ball Grid Array and Other High Density Technology

5-21f

• Orig. 7/96

Y

IPC-DRM-18

Component Identification Desk Reference Manual

• Rev. H 11/07
• Rev. G 9/03
• Rev. F 8/01
• Rev. E 8/00
• Rev. D 7/99
• Rev. C 7/98
• Rev. B 2/97
• Rev. A 4/96
• Orig. 9/95

J-STD-020

Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices

B-10a

• Rev D Amend 1  3/08
• Rev D  8/07
• Rev. C 7/04
• Rev. B 7/02
• Rev. A 4/99
• Orig. 10/96

J-STD-026

Semiconductor Design Standard for Flip Chip Applications

5-21g

• Orig. 8/99

J-STD-027

Mechanical Outline Standard for Flip Chip or Chip Scale Configurations

5-21g

• Orig.  2/03

J-STD-028

Performance Standard for Flip Chip Scale Bumps

5-21g

• Orig. 8/99

J-STD-030

Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages

5-24f

• Orig. 9/05

J-STD-032

Performance Standard for Ball Grid Array Bumps and Columns

5-21f

• Orig. 6/02

J-STD-033

Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices

B-10a

• Rev C 2/12
• Rev B Amend 1  1/07
• Rev B 10/05
• Rev. A 7/02
• Orig. 4/99

J-STD-035

Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

B-10a

• Orig. 4/99

IPC-0040

Optoelectronic Assembly and Packaging Technology  

5-25

• Orig. 5/03

07/03

IPC-DRM-40
IPC-DRM-PTH

Through-Hole Solder Joint Evaluation Desk Reference Manual

• Rev D 11/05
• Renamed to DRM-PTH
• Rev. E 2/02
• Rev. D 7/00
• Rev. C 9/99
• Rev. B 1/99
• Rev. A 8/97
• Orig. 5/97

IPC-T-50

Terms and Definitions Interconnecting and Packaging Electronic Circuits

2-30

• Rev. J 10/11
• Rev. I Skipped Due to Conflict with “L” and “1”
• Rev. H  7/08
• Rev. G 12/03
• Rev. F 6/96
• Rev. E 7/92
• Rev. D 11/88
• Rev. C 3/85
• Rev. B 6/80
• Rev. A 8/76
• Orig. 8/75

09/80

IPC-DRM-53

Introduction to Electronics Assembly

• Orig. 6/00

IPC-DRM-56

IPC-DRM-WHA

Wire Preparation & Crimping

• Rev A 11/06
• Renamed DRM-WHA
• Orig.  7/02

IPC-SC-60

Post Solder Solvent Cleaning Handbook

5-31a

• Superseded and combined into CH-65B 5/11
• Rev. A 8/99
• Orig. 4/87

10/99

IPC-SA-61

Post-Solder Semi-Aqueous Cleaning Handbook

5-31b

• Superseded and combined into CH-65B 5/11
• Rev. A 6/02
• Orig. 7/95

IPC-AC-62

Post Solder Aqueous Cleaning Handbook

5-31b

• Superseded and combined into CH-65B 5/11
• Rev. A 1/96
• Orig. 12/86

IPC-CH-65

Guidelines for Cleaning of Printed Boards and Assemblies

5-31d

• Rev. B 7/11
• Rev. A 9/99
• Orig. 12/90

10/99

IPC-CS-70

Guidelines for Chemical Handling Safety in Printed Board Manufacturing

• Orig. 8/88 Obsolete without replacement

J-STD-075

Classification of Non-IC Electronic Components for Assembly Processes

B-10a

• Orig. 08/08

IPC-CM-78

Guidelines for Surface Mounting and Interconnecting Chip Carriers

• Superseded by IPC-SM-780
• Rev. C - 3/88
• Orig. 11/83

IPC-MP-83

IPC Policy on Metrication

• Orig. 8/85 Obsolete without replacement

IPC-PC-90

General Requirements for Implementation of Statistical Process Control

7-22

• Superseded by IPC-9191
  Orig. 10/90

IPC-QS-95

General Requirements for Implementation of ISO 9000 Quality Systems

7-22

• Obsolete without replacement
• Orig. 4/93

IPC-L-108

Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards

3-11

• Superseded by IPC-4101
• Rev. B  6/90
• Rev. A 10/80
• Orig. 3/76

IPC-L-109

Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards

3-11*

• Superseded by IPC-4101
• Rev. B  7/92
• Rev. A 10/80
• Orig. 3/76

IPC-L-110

Preimpregnated, B-Stage Epoxy-Glass Cloth for Multilayer Printed Circuit Boards

3-11

• Rev. A Superseded by IPC-L-109 and IPC-4101

IPC-CC-110

Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications

3-11c

• Superseded by IPC-4121
• Rev. A 12/97
• Orig. 1/94

IPC-L-112

Specification for Composite Metal Clad Base materials for Printed Boards

3-11

• Superseded by IPC-4101
• Rev. A 6/92
• Orig. 7/81

IPC-L-115

Specification for Rigid Metal Clad Base Materials for Printed Boards

3-11

• Superseded by IPC-4101
• Rev. B 4/90
• Rev. A 10/80
• Orig. 3/77

IPC-L-120

Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates

• Obsolete without replacement

IPC-L-125

Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections

D-23

• Superseded by IPC-4103
• Rev. A 7/92
• Orig. 8/83

IPC-L-130

Specifications for Thin Laminates, Metal Clad, Primarily for General-Purpose Multilayer Printed Boards

3-11

• Superseded by IPC-L-108 and IPC-4101
• Orig. 1/77

IPC-DD-135

Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

• Obsolete without replacement

IPC-EG-140

Specification for Finished Fabric Woven from "E" Glass for Printed Boards

3-12d

• Superseded by IPC-4412
• Amend. 1 & 2 6/97
• Orig. 3/88

IPC-SG-141

Specification for Finished Fabric Woven from "S" Glass for Printed Boards

3-12d

• Orig. 2/92

07/93

IPC-A-142

Specification for Finished Fabric Woven from Aramid for Printed Boards

3-12

• Orig. 6/90

03/92

03/92

IPC-QF-143

General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

3-12d

• Orig. 2/92

03/93

IPC-CF-148

Resin Coated Metal for Printed Boards

3-12c

• Superseded by IPC-4563
• Rev. A 9/98
• Orig. 6/90

10/98

IPC-MF-150

Metal Foil for Printed Wiring Applications

3-12a

• Superseded by IPC-4562
• Rev. F 10/91 Changed from CF-150 to MF-150
• Rev. E 5/81
• Rev. D 3/76
• Rev. C 8/74
• Rev. B 2/71
• Rev. A 9/67
• Orig. 8/66

IPC-CF-152

Composite Metallic Material Specification for Printed Wiring Boards

3-12h

• B 12/97
• A 1/94
• Orig. 6/90

IPC-FC-203

Specification for Flat Cable, Round Conductor, Ground Plane

D-13

• Obsolete 7/96
• Orig. 7/85

IPC-FC-210

Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC)

D-13

• Obsolete 7/96
• Orig. 9/85

IPC-FC-213

Performance Specification for Flat Undercarpet Telephone Cable

D-13*

• Obsolete 7/96
• Orig. 9/84

IPC-FC-217

General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable

D-13

• Obsolete 7/96
• Reaffirmed 4/90
• Orig. 8/82

IPC-FC-218B/EIA-RS-429

General Specification for Connectors, Electrical Flat Cable Type

D-13

• Obsolete 7/96
• Reaffirmed 05/91
• Reaffirmed 11/81
• Orig. 7/76

IPC-FC-219

Environment Sealed Flat Cable Connectors for use in Aerospace Applications

D-13

• Obsolete 7/96
• Orig. 5/84

IPC-FC-220

Specification for Flat Cable, Flat Conductor, Unshielded

D-13

• Obsolete 7/96
• Rev. C 7/85
• Rev. B 8/75
• Rev. A 1/74
• Orig. 5/70

IPC-FC-221

Specification for Flat-Copper Conductors for Flat Cables

D-13

• Obsolete 7/96
• Rev. A 5/84
• Orig. 8/75

IPC-FC-222

Specification of Flat Cable Round Conductor, Unshielded

D-13

• Obsolete 7/96
• Reaffirmed 5/91
• Orig. 6/80

IPC-FC-225

Flat Cable Design Guide

• Obsolete (date)
• Reaffirmed 10/85
• Orig. 8/75

IPC-FC-231

Flexible Base Dielectrics for Use in Flexible Printed Wiring

D-13

• Superseded by IPC-4202
• Amend. 10/95
• Rev. C 4/92
• Rev. B 2/86
• Rev. A 5/83
• Orig. 7/74

IPC-FC-232

Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films

D-13

• Superseded by 4203
• Amend. 10/95
• Rev. C 6/94
• Rev. B 2/86
• Rev. A 5/83
• Orig. 7/74

IPC-FC-233

Flexible Adhesive Bonding Films

D-13

• Incorporated into IPC-FC-232B

IPC-FC-234

PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits

D-1

• Orig. 12/97

IPC-FC-240

Single sided flex

D-12

• Superseded by IPC-6013
• Incorporated into FC-250
• Rev. B 1/74
• Rev. A 5/69
• Orig. 12/65

IPC-FC-241

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring

D-13*

• Superseded by IPC-4204
• Amend. 10/95
• Rev. C 4/92
• Rev. B 2/86
• Rev. A 5/83
• Orig. 7/74

IPC-RF-245

Performance Specification for Rigid-Flex Printed Boards

D-12

• Superseded by IPC-6013
• Orig. 4/87

IPC-D-249

Design Standard for Flexible Single-and Double-Sided Printed Boards

D-11

• Superseded by IPC-2223
• Orig. 1/87

IPC-FC-250A

Specification for Single - and Double-Sided Flexible Printed Wiring

D-12

• Superseded by IPC-6013
• Rev. A 9/86
• Orig. 9/86

IPC-FA-251

Guidelines for Single and Double Sided Flex Circuits

D-12

• Orig. 2/92

IPC-D-275

Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies

D-31b

• Superseded by IPC-2221 and 2222
• Supersedes IPC-D-319 and IPC-D-949
• Amendment 1  4/96
• Orig. 9/91

IPC-RB-276

Qualification and Performance Specification for Rigid Printed Boards

D-33a

• Superseded by IPC-6011 and IPC-6012
• Orig. 3/92; Supersedes IPC-SC-320B and IPC-ML-950C

IPC-D-279

Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

6-10b

• Orig. 7/96

IPC-D-300

Printed Board Dimensions and Tolerances

1-10a

• Superseded by IPC-2615
• Rev. G 1/84
• Rev. F 11/74
• Rev. E 10/70
• Rev. D 1/70
• Rev. C 10/65
• Rev. B 1/64
• Rev. A 7/61
• Orig. 8/60

IPC-D-310

Guidelines for Phototool Generation and Measurement Techniques

• Rev. C  6/91
• Rev. B 12/85
• Rev. A 12/77
• Orig. 9/69

IPC-A-311

Process Control Guidelines for Phototool Generation and Use

• Orig. 3/96

IPC-D-316

Design Guide for Microwave Circuit Boards Utilizing Soft Substrates

D-21b

• Superseded by IPC-2252
• Orig. 5/95

IPC-D-317

Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques

D-21a

• Superseded by IPC-2251
• Rev. A 1/95
• Orig. 4/90

IPC-HF-318

Microwave End Product Board Inspection and Test

D-22

• Superseded by IPC-6018
• Rev. A 12/91
• Orig. 6/85

IPC-D-319

Design Standard for Rigid Single-and Double-Sided Printed Boards

D-31b

• Superseded by IPC-D-275, then by IPC-2221/2222
• Orig. 1/87

IPC-SD-320

Performance Specification for Rigid Single- and Double-Sided Printed Boards

D-33a

• Superseded by IPC-RB-276
• Supersedes IPC-TC-500
• Rev. B 11/86
• Rev. A 3/81
• Orig. 1/77

IPC-D-322

Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes

• Reaffirmed 9/91
• Orig. 8/84

10/94

IPC-MC-324

Performance Specifications for Metal Core Boards

D-33a

• Superseded by IPC-6011 and IPC-6012
• Orig. 10/88

IPC-D-325

Documentation Requirements for Printed Boards, Assemblies and Support Drawings

2-40

• Rev. A 5/95
• Orig. 1/87

IPC-D-326

Information Requirements for Manufacturing Printed Board Assemblies

2-11a

• Rev. A 1/04
• Orig. 4/91

IPC-D-330

Design Guide Manual

• Orig. 1/92

IPC-PD-335

Electronic Packaging Handbook

• Orig. 12/89

IPC-NC-349

Computer Numerical Control Formatting for Drillers and Routers

• Orig. 8/85

10/85

IPC-D-350

Printed Board Description in Digital Form; Technical Content Identical to IEC-61182-1

2-11

• Rev. D 7/92
• Rev. C 10/85
• Rev. B 8/77
• Rev. A 2/75
• Orig. 8/72

07/78

IPC-D-351

Printed Board Drawings in Digital Form

• Orig. 8/85

09/85

IPC-D-352

Electronic Design Data Description for Printed Boards in Digital Form

• Orig. 8/85

09/85

IPC-D-354

Library Format Description for Printed Boards in Digital Form

• Orig. 2/87

IPC-D-355

Printed Board Assembly Description in Digital Form

• Orig. 1/95

IPC-D-356

Bare Board Electrical Test Information in Digital Form

2-11c

• Rev. B 10/02
• Rev. A 1/98
• Orig. 3/92

08/92

IPC-AM-361

Specification for Rigid Substrates for Additive Process Printed Boards

• Superseded by IPC-4101
• Orig. 1/82

IPC-MB-380

Guidelines for Molded Interconnection Devices

• Orig. 10/90

IPC-D-390

Automated Design Guidelines

• Rev. A 2/88
• Orig. 7/74

IPC-C-406

Design and Application Guidelines for Surface Mount Connectors

• Orig. 1/90

IPC-CI-408

Design and Application Guidelines for the Use of Solderless Surface Mount Connectors

• Orig. 1/94

IPC-BP-421

General Specification for Rigid Printed Board Backplanes with Press Fit Contacts

• Obsolete without replacement
• Reaffirmed 4/90
• Orig. 10/80

IPC-D-422

Design Guide for Press Fit Rigid Printed Board Backplanes

• Orig. 9/82

IPC-DW-424

General Specification for Encapsulated Discrete Wire Interconnection Boards

• Orig. 1/95

IPC-DW-425

Design and End Product Requirements for Discrete Wiring Boards

• Rev. A 5/90
• Orig. 9/82

03/94

IPC-DW-426

Specifications for Assembly of Discrete Wiring

• Orig. 12/87

IPC-TR-460

Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards

• Rev. A 2/84
• Orig. 1973

IPC-TR-461

Solderability Evaluation of Thick and Thin Fused Coatings

• Orig. 3/79

IPC-TR-462

Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage

• Orig. 10/87

IPC-TR-464

Accelerated Aging for Solderability Evaluations

5-23b

• Rev. A 12/87
• Orig. Pub.4/84

IPC-TR-465-1

Round Robin Test on Steam Ager Temperature Control Stability

• Orig. 1993

IPC-TR-465-2

The Effect of Steam Aging Time and Temperature on Solderability Test Results

• Orig. 1993

IPC-TR-465-3

Evaluation of Steam Aging on Alternative Finishes, Phase IIA

• Orig. 7/96

IPC-TR-466

Wetting Balance Standard Weight Comparison Test

• Orig. 4/95

IPC-TR-467

Supporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D

• Orig. 10/96

IPC-TR-468

Factors Affecting Insulation Resistance Performance of Printed Boards

• Orig. 3/79

IPC-TR-470

Thermal Characteristics of Multilayer Interconnection Boards

• Orig. 1/74

IPC-TR-474

An Overview of Discrete Wiring Techniques

• Obsolete without replacement
• Reprint 1984
• Orig. 3/79

IPC-TR-476

How to Avoid Metallic Growth Problems on Electronic Hardware
Rev. A Electrochemical Migration Electrically Induced Failures In Printed Assembles

• Rev. A 6/84 (new title)
• Orig. 9/77

IPC-TR-480

Results of Multilayer Test Program Round Robin IV Phase I

• Obsolete without replacement
• Orig. 9/75

IPC-TR-481

Results of Multilayer Test Program Round Robin V

• Orig. 4/81

IPC-TR-482

New Developments in Thin Copper Foils

• Orig. 1/76

IPC-TR-483

Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program

• Rev. A 3/91
• Addendums 10/87
• Orig. 4/84

IPC-TR-484

Results of IPC Cooper Foil Ductility Round Robin Study

• Orig. 4/86

IPC-TR-485

Results of Cooper Foil Rupture Strength Test Round Robin Study

• Orig. 3/85

IPC-TR-486

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

• Orig. 7/01

IPC-TR-549

Measles in Printed Wiring Boards

• Orig. 11/78

IPC-TR-551

Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components

• Orig. 7/93

IPC-DR-570

General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards

4-12

• Obsolete without replacement
• Rev. A 4/84
• Orig. 1/79

IPC-DR-572

Drilling Guidelines for Printed Boards

4-12

• Rev A  3/07
• Orig. 4/88

IPC-TR-576

Additive Process Evaluation

• Obsolete without replacement
• Orig. 9/77

IPC-TR-578

Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards

• Orig. 9/84

IPC-TR-579

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards

• Orig. 9/88

IPC-TR-580

Cleaning and Cleanliness Test Program Phase 1 Test Results

• Orig. 10/89

IPC-TR-581

IPC Phase 3 Controlled Atmosphere Soldering Study

• Orig. 8/94

IPC-TR-582

IPC Phase 3 No-Clean Flux Study

• Orig. 11/94

IPC-TR-583

An In-Depth Look At Ionic Cleanliness Testing

• Orig. 7/02

IPC-WP/TR-584

IPC White Paper and Technical Report on Halogen-Free Materials used for Printed Circuit Boards and Assemblies

4-33

• Rev A  8-07
• Orig.  4/03

IPC-TR-585

Time, Temperature and Humidity Stress of Final Board Finish Solderability

• Orig.  5/06

IPC-TR-586

Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium (supports IPC-4553A)

4-14

• Orig. 5/09

IPC-A-600

Acceptability of Printed Boards

7-31a &
D-33a

• Rev. H  4/10
• Amend. 1 01/08
• Rev. G  7/04
• Rev. F 11/99
• Rev. E 8/95
• Rev. D '89
• Rev. C '78
• Rev. B '74
• Rev. A '70
• Orig. '64

IPC-SS-605

Printed Board Quality Evaluation Slide Set

• Obsolete without replacement

IPC-QE-605

Printed Board Quality Evaluation Handbook

• Rev. A 2/99

J-STD-609

Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices

4-34b

• Rev. A  2/10
• Orig. 5/07; Supersedes IPC-1066

07/08

01/08

IPC-A-610

Acceptability of Electronic Assemblies

7-31

• Rev E  4/10
• Rev D Amend 1 4/08
• Rev. D 2/05
• Rev. C 1/00
• Rev. B 12/94
• Rev. A 3/90
• Orig. 8/83

04/05

02/02

IPC-A-610DC

IPC-A-610D Telecom Addendum

• Orig. 8/09

IPC-HDBK-610

Handbook and Guide to IPC-A-610 (Includes B-C-D comparison)

• Amend 1  10/05
• Orig. 9/02

IPC-QE-615

Assembly Quality Evaluation Handbook

• Obsolete without replacement

IPC/WHMA-A-620

Acceptability of Electronic Wire Harnesses and Cables

7-31f

• Rev A 7/06
• Orig. 1/02

03/02

IPC/WHMA-A-620xS Space Hardware Addendum

Space Applications Electronic Hardware Addendum for IPC/WHMA-A-620. The addendum MUST be used with the same version of the standard; e.g. 620AS with 620A

7-31fs

• AS 1/11

IPC-AI-640

User's Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates

• Obsolete without replacement
• Orig. 1/87

IPC-AI-641

User's Guidelines for Automated Solder Joint Inspection

• Obsolete without replacement
• Orig. 1/87

IPC-AI-642

User's Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB's

• Obsolete without replacement
• Orig. 10/88

IPC-OI-645

Standard for Visual Optical Inspection Aids

• Orig. 10/93

IPC-TM-650

Test Methods Manual

• Updated per test method

IPC-ET-652

Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards

• Superseded by IPC-9252
• Orig. 10/90

IPC-QL-653

Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material

• Rev. A 11/97
• Orig. 8/88

07/89

IPC-MI-660

Incoming Inspection of Raw Materials Manual

• Orig. 2/84

IPC-R-700

Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies

• Superseded by IPC-7711A/7721A
• Rev. C 1/88
• Rev. B 9/77
• Rev. A 12/71
• Orig. 9/67

IPC-TA-720

Technology Assessment Handbook on Laminates

• Orig. '86

IPC-TA-721

Technology Assessment Handbook on Multilayer Boards

• Orig. '88

IPC-TA-722

Technology Assessment of Soldering

• Orig. '90

IPC-TA-723

Technology Assessment Handbook on Surface Mounting

• Orig. '91

IPC-TA-724

Technology Assessment Series on Cleanrooms

• Orig. 4/98

IPC-PE-740

Troubleshooting Guide for Printed Board Manufacture and Assembly

7-23

• Rev. A 12/97
• Orig. 1/85

IPC-CM-770

Printed Board Component Mounting

• Rev. E 1/04
• Rev. D 1/96
• Rev. C 1/87
• Rev. B 10/80
• Rev. A 3/76
• Orig. 9/68

IPC-SM-780

Component Packaging and Interconnecting with Emphasis on Surface Mounting

• Orig. 3/88

IPC-SM-782

Surface Mount Design and Land Pattern Standard

1-13

• Superseded by IPC-7351
• Amend. 2  4/99
• Amend. 1  10/96
• Rev. A 8/93
• Orig. 3/87

IPC-SM-784

Guidelines for Chip-on-Board Technology Implementation

• Orig. 11/90

IPC-SM-785

Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments

• Orig. 11/92

IPC-SM-786

Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive ICs

• Superseded by J-STD-020 and J-STD-033
• Rev. A 1/95
• Orig. 12/90

IPC-MC-790

Guidelines for Multichip Module Technology Utilization

• Orig. 8/92

IPC-S-801

5-23a

• Superseded by IPC-804 and J-STD-003

IPC-S-803

5-23a

• Superseded by IPC-804 and J-STD-003

IPC-S-804

Solderability Test Methods for Printed Wiring Boards

5-23a

• Superseded by J-STD-003
• Rev. A 1/87
• Orig. 1/82

IPC-S-805

Solderability Tests for Component Leads and Terminations

5-23b

• Superseded by
  J-STD-002
• Orig. 1/85

IPC-MS-810

Guidelines for High Volume Microsection

• Orig. 10/93

IPC-S-815

General Requirements for Soldering Electronic Interconnections

• Superseded byJ-STD-001
• Rev. B 12/87
• Rev. A 6/81
• Orig. 11/77

IPC-S-816

SMT Process Guideline and Checklist

• Orig. 7/93

IPC-SM-817

General Requirements for Dielectric Surface Mounting Adhesives

• Orig. 11/89

IPC-SF-818

General Requirement for Electronic Soldering Fluxes

5-24a

• Superseded by J-STD-004
• Rev. 12/91
• Orig. 2/88

IPC-SP-819

General Requirements and Test Methods for Electronic Grade Solder Paste

5-24b

• Superseded by J-STD-005
• Orig. 10/88

IPC-AJ-820

Assembly and Joining Manual

• Rev A 2/12
• Orig. 8/96

IPC-CA-821

General Requirements for Thermally Conductive Adhesives

• Orig. 1/95

IPC-CC-830

Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies

• Amend. 1 10/08
• Rev B 08/02
• Amend. 1 7/99
• Rev. A 10/98
• Orig. 1/84

08/02

IPC-HDBK-830

Conformal Coating Handbook

• Orig. 10/02

IPC-SM-839

Pre and Post Solder Mask Application Cleaning Guidelines

• Orig. 4/90

IPC-SM-840

Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards

5-33b

• Rev. E 12/10
• Rev. D 4/07
• Amend. 1 6/00
• Rev. C 1/96
• Rev. B 5/88
• Rev. A 7/83
• Orig. 11/77

8/00

IPC-HDBK-840

Solder Mask Handbook

• Orig. 09/06

IPC-H-855

Hybrid Microcircuit Design Guide

• Obsolete without replacement
• Orig. 10/82

IPC-D-859

Design Standard for Thick Film Multilayer Hybrid Circuits

• Orig. 12/89

Y

IPC-HM-860

Specification for Multilayer Hybrid Circuits

• Orig. 1/87

Y

IPC-TF-870

Qualification and Performance of Polymer Thick Film Printed Boards

• Orig. 11/89

Y

IPC-ML-910

Design and End Production Specification for Rigid Multilayer Printed Boards

D-31b &
D-33a

• Superseded by IPC-D-949, IPC-D-275, and subsequently IPC-2221 for Design and IPC-ML-950, IPC-RB-276, and subsequently IIPC-6011 for End Product Specification
• Rev. A  8/76
• Orig.  6/68

IPC-D-949

Design Standard for Rigid Multilayer Printed Boards

D-31b

• Superseded by IPC-D-275 and subsequently by IPC-2221/2222
• Orig. 1/87

IPC-ML-950

Performance Specification for Rigid Multilayer Printed Boards

D-33a

• Superseded by IPC-RB-276 and subsequently IPC-6011/6012
• Rev. C 11/8
• Rev. B 12/77
• Rev. A 9/70
• Orig. 1/66

IPC-ML-960

Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards

• Orig. 7/94

Y

IPC-ML-975

End Product Documentation Specification for Multilayer Printed Wiring Boards

• Superseded by IPC-D-325
• Orig. 9/69

IPC-ML-990

Performance Specification for Flexible Multilayer Wiring

D-33a

• Superseded by IPC-6011
• Orig. 9/72

IPC-1043

Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1

• Orig. 8/92

IPC-1044

Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2

• Orig. 10/92

IPC-1065

Material Declaration Handbook

4-34a

• Orig. 1/05

IPC-1066

Labeling of PCBs and Assemblies

4-34b

• Superseded by J-STD-609
• Orig. 12/04

IPC-1071

Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing

E-20

• Orig.  1/11

IPC-TP-1090

The Layman's Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002

• Orig. 7/96

IPC-TP-1103

Manufacturing Concerns When Soldering with Gold Plated Component Leads or Circuit Board Pads

• Obsolete without replacement

IPC-TP-1114

The Layman's Guide to Qualifying a Process to J-STD-001B

• Orig. 1/98

IPC-TP-1115

Selection and Implementation Strategy for A Low-Residue No-Clean Process

• Orig. 12/98

IPC-1131

IT Guidelines for PWB Manufacturers

• Orig. 4/00

IPC-1331

Voluntary Safety Standard for Electrically Heated Process Equipment

• Orig. 3/00

IPC-1601

Printed Board Handling and Storage Guidelines

D-35

• Orig. 8/10

IPC-1710

OEM Standard for Printed Board Manufacturers' Qualification Profile (MQP)

• Rev. A 7/04
  12/97 updated
• Orig. 2/94

IPC-1720

Assembly Qualification Profile (AQP)

• Rev. A 7/04
• Orig. 7/96

IPC-1730

Laminator Qualification Profile (LQP)

• Rev. A 6/00
• Orig. 1/98

IPC-1731

Strategic Raw Materials Supplier Qualification Profile

3-12i

• Orig. Pub. 6/00

IPC-1751

Generic Requirements for Declaration Process Management

2-18

• Rev. A  2/10
• Vers. 1.1  3/07
• Orig. Pub.  3/06

IPC-1752

Materials Declaration Management (Includes 2 PDF forms)

2-18b

• Rev. A 2/10
• Vers. 1.1 3/07
• Orig. Pub. 3/06

IPC-1756

Manufacturing Process Data Management

2-18a

• Orig. 4/10

IPC-2141

Controlled Impedance Circuit Boards and High Speed Logic Design

D-21c

• Rev. A 3/04
• Orig. 4/96

12/09

IPC-2152

Standard for Determining Current Carrying Capacity in Printed Board Design

1-10b

• Orig. 8/09

02/11

IPC-2221

Generic Standard on Printed Board Design

D-31b

• Rev. A 5/03
• Amend. 1 01/00
• Orig. 2/98; Supersedes IPC-D-275

09/99

IPC-2222

Sectional Design Standard for Rigid Organic Printed Boards

D-31b

• Rev. A 12/10
• Orig. 2/98; Supersedes IPC-D-275

IPC-2223

Sectional Design Standard for Flexible Printed Boards

D-11

• Rev. C 11/11
• Rev. B 5/08
• Rev. A 6/04
• Orig. 11/98; Supersedes IPC-D-249

09/99

IPC-2224

Sectional Standard for Design of PWBs for PC Cards

• Orig. 1/98

IPC-2225

Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

• Orig. 5/98

IPC-2226

Design Standard for High-Density Array or Peripheral Leaded Component Mounting Structures

1-10

• Orig. 4/03

03/09

IPC-2251

Design Guidelines for Electronic Packaging Utilizing High Speed Techniques

D-21a

• Orig. 12/03

08/09

IPC-2252

Design and Manufacturing Guide for RF/Microwave Circuit Boards

D-21b

• Orig. 7/02

IPC/JPCA-2315

Design Guide for High Density Interconnects (HDI) and Microvia

D-41a

• Orig. 6/00

IPC-2316

Design Guide for Embedded Passive Device Printed Boards

D-37a

• Orig. 3/07

IPC-2501

Definition for Web-based Exchange of XML Data

2-50

• Orig. 7/03

08/03

IPC-2511

Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology

2-11

• Rev. B  1/02
• Rev A  1/00
• Orig. 1 1/98

02/02

IPC-2512

Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description

2-11

• Rev A 11/00
• Orig. 11/98

IPC-2513

Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description

2-11h

• Rev A 11/00

IPC-2514

Sectional Requirements for Implementation of Printed Board Manufacturing Data Description

2-11

• Rev A 11/00

IPC-2515

Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description

2-11

• Rev A 11/00

IPC-2516

Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description

2-11e

• Rev A 11/00

IPC-2517

Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description

2-11g

• Rev A 11/00

IPC-2518

Sectional Requirements for Implementation of Part List Product Data Description

2-11

• Rev A 11/00

IPC-2524

PWB Fabrication Data Quality Rating System

2-10

• Orig. 2/99

IPC-2531

Standard Recipe File Format Specification

2-12

• Orig. 3/99

IPC-2541

Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication

2-13a

• Orig. 10/01

Y

IPC-2546

Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication

2-13b

• Amend. 1  01/03
• Amend. 2  01/05
• Orig. 10/01

Y

IPC-2547

Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication

2-13c

• 1/02

Y

IPC-2571

Generic Requirements for Electronic Manufacturing Supply Chain Communication-Product Data Exchange (PDX)

2-15a

• 11/01

Y

IPC-2576

Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Exchange (PDX)

2-15c

• 11/01

Y

IPC-2578

Sectional Requirements for Supply Chain Communication of Bill of material and Product Design Configuration Data-Product Data Exchange (PDX)

2-15e

• 11/01

Y

IPC-2581

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology (Offspring)

2-17

• Amend 1  5/07
• Orig. 3/04

05/04

IPC-2582

Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description

2-17

• Orig. 5/07

IPC-2583

Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description

2-17

• Orig. 5/07

IPC-2584

Sectional Requirements for Implementation of Printed Board Fabrication Data Description

2-17

• Orig. 5/07

IPC-2588

Sectional Requirements for Implementation of Part List Product Data Description

2-17

• Orig. 5/07

IPC-2611

Generic Requirements for Electronic Product Documentation

2-40

• Orig. 4/10

IPC-2612

Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)

2-40

• Orig. 4/10

IPC-2612-1

Sectional Requirements for Electronic Diagramming Symbol Generation Methodology

2-40

• Orig. 4/10

IPC-2614

Sectional Requirements for Board Fabrication Documentation

2-40

• Orig. 4/10

IPC-2615

Printed Board Dimensions and Tolerances

• Orig. 6/00; Supersedes IPC-D-300

Y

11/10

IPC-3406

Guidelines for Electrically Conductive Surface Mount Adhesives

• Orig. 7/96

IPC-3408

General Requirements for Anistropically Conductive Adhesive Films

• Orig. 11/96

IPC-4101

Specification for Base Materials for Rigid and Multilayer Boards

3-11

• Rev. C 8/09
• Rev. B Amends 1&2  4/07
• Rev. B Amend 1  2/07
• Rev. B  6/06
• Rev. A Amend 1 6/02
• Rev. A 6/02
• Supersedes IPC-L-108, IPC-L-109, IPC-L-112, IPC-L-115
• Orig. 12/97

IPC-4103

Specification for Plastic Substrates, Clad or Unclad, for High Speed/High Frequency Interconnection

D-23

• Rev. A 12/11
• Orig. 01/02;
  Supersedes IPC-L-125

IPC/JPCA-4104

Specification for High Density Interconnect (HDI) and Microvia Materials

3-10

• Orig. 5/99

05/99

IPC-4110

Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards

3-12*

• Orig. 8/98

10/98

IPC-4121

Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications

3-11c

• Orig. 1/00; Supersedes IPC-CC-110ª

IPC-4130

Specification and Characterization Methods for Nonwoven “E” Glass Mat

3-12f

• Orig. 9/98

12/99

IPC-4202

Flexible Base Dielectrics for Use in Flexible Printed Wiring

D-13

• Rev. A  4/10
• Orig. 5/02; Supersedes IPC-FC-231C

06/02

02/03

IPC-4203

Adhesive Coated Dielectric Films for Use as Cover Sheets

D-13

• Orig. 5/02; Supersedes IPC-FC-232C

06/02

02/03

IPC-4204

Flexible Metal-Clad Dielectrics for Use in Fabrication of

D-13

• Rev. A 10/11
• Orig. 5/02; Supersedes IPC-FC-241C

06/02

02/03

IPC-4411

Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

3-12*

• Rev. A 11/03
• Orig. 4/99

IPC-4412

Specification for Finished Fabric Woven form “E” Glass for Printed Boards

3-12d

• Rev. A w/Amends 1, 2 & 3 07/11
• Rev A Amend 3 12/10
• Rev. A Amend 2  5/09
• Rev. A Amend 1  3/08
• Rev. A 1/06
• Orig. 6/02; Supersedes IPC-EG-140ª

12/10

02/03

IPC-4552

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

4-14

• Orig. 10/02

11/02

IPC-4553

Specification for Immersion Silver Plating for Printed Circuit Boards

4-14

• Rev. A 5/09
• Orig. 6/05

09/05

IPC-4554

Specification for Immersion Tin Plating for Printed Circuit Boards

4-14

• Orig. Amend 1 09/11
• Orig. 2/07

IPC-4562

Metal Foil for Printed Wiring Applications

3-12a

• Rev. A 4/08
• Amend. 1  5/05
• Orig. 5/00; Supersedes IPC-MF-150F

02/03

IPC-4563

Resin Coated Copper Foil for Printed Boards Guideline

3-12c

• Orig. (replaces CF-148A) 11/07

IPC-4761

Design Guide for Protection of Printed Board Via Structures

• Orig. 7/06

IPC-4781

Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks

5-33e

• Orig. 5/08

IPC-4811

Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

D-52

• Orig. 4/08

IPC-4821

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

D-52

• Amend. 1  4/10
• Orig. 5/06

IPC-5701

Users Guide for Cleanliness of Unpopulated Printed Boards

• Orig. 7/03

IPC-5702

Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards

5-32c

• Orig. 6/07

IPC-5704

Cleanliness Requirements for Unpopulated Printed Boards

5-32c

• Orig. 12/09

IPC-6011

Generic Performance Specification for Printed Boards

D-33a

• Orig. 7/96

IPC-6012

Qualification and Performance Specification for Rigid Printed Boards

D-33a

• Rev. C  4/10
• Amend. 2  3/08
• Rev. B with Amend 1  2/07
• Rev. B 8/04
• Amend. 1  7/00
• Rev. A  10/99
• Orig.  7/96

IPC-6013

Qualification and Performance Specification for Flexible Printed Boards

D-12

• Rev B.  1/09
• Rev. A with Amend. 2  4/06
• Amend. 1  1/05
• Rev. A  11/03
• Supersedes IPC-RF-245 and IPC-FC-250
• Amend. 1  4/00
• Orig. 11/98

IPC-6015

Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures

N/A

• Orig. 2/98

IPC-6016

Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards

D-10

• Orig. 5/99

8/99

IPC-6017

Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

D-53

• Orig. 3/09

IPC-6018

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

D-22

• Rev. B 11/11
• Rev. A  1/02
• Orig. 1/98

IPC/JPCA-6202

Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards

D-12*

• Orig. 2/99

IPC/JPCA-6801

Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection

N/A

• Orig. 1/00

IPC-7093

Design and Assembly Process Implementation for Bottom Termination SMT Components

5-21h

• Orig. 3/11

IPC-7094

Design and Assembly Process Implementation for Flip Chip and Die Size Components

5-21g

• Orig. 1/09

IPC-7095

Design and Assembly Process Implementation for BGAs

5-21f

• Rev. B  3/08
• Rev. A 11/04
• Orig. 8/00

07/08

IPC-7351

Generic Requirements for Surface Mount Design and Land Pattern Standard

1-13

• Rev. B 6/10
• Rev. A  2/07
• Supersedes IPC-SM-782A with Amendments 1 & 2
• Orig.  2/05

IPC-7525

Guidelines for Stencil Design

7-21e

• Rev. B 10/11
• Rev. A  2/07
• Orig.  5/00

06/00

IPC-7526

Stencil and Misprinted Board Cleaning Handbook

5-21jND

• Orig.  2/07

IPC-7530

Guidelines for Temperature Profiling for Mass Soldering (Wave and Reflow) Processes

5-20/5-22

• Orig.  5/01

IPC-7711/7721

Rev B renamed to:
Rework, Repair and Modification of Electronic Assemblies

5-31h

• Rev B  11/07
• Rev A  10/03
• Orig.  4/98; Supersedes IPC-R-700C

IPC-7912

Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies

5-22g

• Rev. A  1/04
• Orig.  7/00

01/04

IPC-8413-1

Specification for Manufacturing Process Carriers for Handling Optical Fiber

5-25a

• Orig.  4/03

IPC-8497-1

Cleaning Methods and Contamination Assessment for Optical Assembly

5-25e

• Orig. 12/05

IPC-9151

Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database

D-36

• Rev. C 5/10
• Rev. B  2/07
• Rev. A 5/03
• Orig.  6/02

IPC-9191

General Guideline for implementation of Statistical Process Control (SPC)

7-22

• Supersedes IPC-PC-90
• Orig. 11/99

02/03

IPC-9194

Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

7-22

• Orig.  9/04

IPC-9199

SPC Quality Rating

7-22

• Orig.  9/02

IPC-9201

Surface Insulation Resistance Handbook

5-32b

• Rev A  8/07
• Orig.  7/96

IPC-9202

Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

5-32b

• Orig. 10/11

IPC-9251

Test Vehicles for Evaluating Fine Line Capability

• Orig.  7/00

IPC-9252

Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards

7-32c

• Rev. A  11/08
• Orig. 02/01; Supersedes IPC-ET-652A

04/09

IPC-9261

In-Process DPMO and Estimated Yield for PWAs

5-22g

• Rev. A 10/06
• Orig. 3/02

03/02

IPC-9501

PWB Assembly Process Simulation for Evaluation of Electronic Components

5-21c

• Orig. 7/95

IPC-9502

PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components

• Orig. 4/99

IPC-9503

Moisture Sensitivity Classification for Non-IC Components

• Superseded by J-STD-075 08/08
• Orig. 4/99

IPC-9504

Assembly Process Simulation for Evaluation of Non-IC Components

• Orig. 6/98

10/98

IPC-9591

Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

9-81

• Orig.  4/06

IPC-9592

Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

9-82

• Rev. A  5/10
• Orig.  9/08

IPC-9631

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

D-32

• Orig. 12/10

IPC-9691

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)

5-32e

• Rev A  8/07
• Orig. 10/05

IPC-9701

Qualification and Performance Test Methods for Surface Mount Solder Attachments

6-10d

• Rev. A  2/06
• Orig.  1/02

Y

IPC/JEDEC-9702

Monotonic Bend Characterization of Board-Level Interconnects

6-10d

• Orig.  6/04

IPC/JEDEC-9703

Mechanical Shock Test Guidelines for Solder Joint Reliability

6-10d

• Orig.  3/09

IPC/JEDEC-9704

Printed Wiring Board Strain Gage Test Guideline

6-10d

• Orig.  6/05

IPC/JEDEC-9707

Spherical Bend Test Method for Characterization of Board Level Interconnects

6-10d

• Orig. 9/11

IPC-9708

Test Methods for Characterization of Printed Board Assembly Pad Cratering

6-10d

• Orig. 12/10

IPC-9850

Surface Mount Equipment Performance Characterization

• Rev A 11/11
• Orig.  7/02

09/02

IPC-SMEMA-9851

Equipment Interface Specification

• Orig. 11/04

IPC-DRM-SMT

Surface Mount Solder Joint Evaluation Desk Reference Manual

• Rev. C 11/05
• Rev. B 4/00
• Rev. A 3/99
• Orig. 7/98

IPC-EMSI-TC

IPC Sample Master Ordering Agreement for EMS Companies and OEMs

• Orig.  3/02

Roadmap

International Technology Roadmap for Electronic Interconnections

8-40

• Updated 2009
• Updated 2007
• Updated 2005
• Updated 2003
• Updated 2001
• Updated 9/97
• Orig. 6/95