| Product ID |
Document Name |
Responsible Committee |
Status |
ANSI |
DoD |
| J-STD-001 |
Requirements for Soldered Electrical and Electronic Assemblies |
5-22a |
- Rev. E 4/10
- Rev. D Amend. 1 4/08
- Rev. D 2/05
- Rev. C 3/00
- Rev. B 10/96
- Rev. A 1/95
- Orig. 4/92; Supersedes IPC-S-815
|
04/05 |
07/01 |
| J-STD-001xS Space Hardware Addendum |
Space Applications Electronic Hardware Addendum for J-STD-001. The addendum MUST be used with the same version of the standard; e.g. 001CS with 001C, 001DS with 001D, 001ES with 001D |
5-22as |
- ES 12/10
- DS Amend. 1 9/09
- DS 11/06
- CS 1/04
|
|
|
| IPC-HDBK-001 |
Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies |
5-22f |
- Rev E 2/12
- Amend. 2 10/05
- Amend. 1 12/00
- Orig. 3/98
|
|
07/01 |
| SMC-TR-001 |
An Introduction to Tape Automated Bonding Fine Pitch Technology |
|
|
|
|
| IT-WP-001 |
Myths of E-Commerce |
|
|
|
|
| SMC-WP-001 |
Soldering Capability White Paper Report |
|
|
|
|
| SMEMA 1.2 |
Mechanical Equipment Interface Standard |
|
|
|
|
| JP002 |
Current Tin Whiskers Theory and Mitigation Practices Guideline |
5-23e |
|
|
|
| J-STD-002 |
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires |
5-23b |
- Rev. C Amend. 1 10/08
- Rev. C 12/07
- Rev. B 2/03
- Rev. A 10/98
- Orig. 4/92; Supersedes IPC-S-805
|
10/08 |
05/95 |
| SMC-WP-002 |
An Assessment of the Use of Lead in Electronic Assembly |
|
|
|
|
| J-STD-003 |
Solderability Tests for Printed Boards |
5-23a |
- Rev. B 2/07
- Rev. A 2/03
- Original 4/92; Supersedes IPC-S-804
|
|
02/93 |
| SMC-WP-003 |
Chip Mounting Technology |
|
|
|
|
| SMEMA 3.1 |
Fiducial Mark Standard |
|
|
|
|
| J-STD-004 |
Requirements for Soldering Fluxes |
5-24a |
- Rev B. Amend. 1 10/11
- Rev. B 12/08
- Rev. A 1/04
- Orig. 1/95; Supersedes IPC-SF-818
|
|
05/95 |
| SMC-WP-004 |
Design for Success |
|
|
|
|
| SMEMA 4 |
Reflow Terms and Definitions |
|
|
|
|
| J-STD-005 |
Requirements for Soldering Pastes |
5-24b |
- Rev. A 2/12
- Amend. 1 6/96
- Orig. 1/95; Supersedes IPC-SP-819
|
|
05/95 |
| SMC-WP-005 |
PWB Surface Finishes |
|
|
|
|
| IPC-HDBK-005 |
Guide to Solder Paste Assessment |
5-24b |
|
|
|
| SMEMA 5 |
Screen Printing Terms and Definitions |
|
|
|
|
| J-STD-006 |
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications |
5-24c |
- Rev. B Amends. 1 & 2 10/09
- Rev. B Amend. 1 6/08
- Rev. B 1/06
- Rev. A 5/01
- Orig. 1/95
|
|
05/95 |
| SMEMA 6 |
Electronics Cleaning Terms and Definitions |
|
|
|
|
| SMEMA 7 |
Fluid Dispensing Terms and Definitions |
|
|
|
|
| WP-008 |
Setting up Ion Chromatography Capability |
|
|
|
|
| J-STD-012 |
Implementation of Flip Chip and Chip Scale Technology |
5-21g |
|
Y |
|
| J-STD-013 |
Implementation of Ball Grid Array and Other High Density Technology |
5-21f |
|
Y |
|
| IPC-DRM-18 |
Component Identification Desk Reference Manual |
|
- Rev. H 11/07
- Rev. G 9/03
- Rev. F 8/01
- Rev. E 8/00
- Rev. D 7/99
- Rev. C 7/98
- Rev. B 2/97
- Rev. A 4/96
- Orig. 9/95
|
|
|
| J-STD-020 |
Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices |
B-10a |
- Rev. D Amend 1 3/08
- Rev. D 8/07
- Rev. C 7/04
- Rev. B 7/02
- Rev. A 4/99
- Orig. 10/96
|
|
|
| J-STD-026 |
Semiconductor Design Standard for Flip Chip Applications |
5-21g |
|
|
|
| J-STD-027 |
Mechanical Outline Standard for Flip Chip or Chip Scale Configurations |
5-21g |
|
|
|
| J-STD-028 |
Performance Standard for Flip Chip Scale Bumps |
5-21g |
|
|
|
| J-STD-030 |
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages |
5-24f |
|
|
|
| J-STD-032 |
Performance Standard for Ball Grid Array Bumps and Columns |
5-21f |
|
|
|
| J-STD-033 |
Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices |
B-10a |
- Rev. C 2/12
- Rev. B Amend. 1 1/07
- Rev. B 10/05
- Rev. A 7/02
- Orig. 4/99
|
|
|
| J-STD-035 |
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components |
B-10a |
|
|
|
| IPC-0040 |
Optoelectronic Assembly and Packaging Technology |
5-25 |
|
07/03 |
|
IPC-DRM-PTH
IPC-DRM-40 |
Through-Hole Solder Joint Evaluation Desk Reference Manual |
|
- Rev. E 7/10
- Rev. D (2nd print) 11/08
- Rev. D 11/05
- Renamed to DRM-PTH
- Rev. E 2/02
- Rev. D 7/00
- Rev. C 9/99
- Rev. B 1/99
- Rev. A 8/97
- Orig. 5/97
|
|
|
| IPC-T-50 |
Terms and Definitions for Interconnecting and Packaging Electronic Circuits |
2-30 |
- Rev. J 10/11
- Rev. I Skipped Due to Conflict with “L” and “1”
- Rev. H 7/08
- Rev. G 12/03
- Rev. F 6/96
- Rev. E 7/92
- Rev. D 11/88
- Rev. C 3/85
- Rev. B 6/80
- Rev. A 8/76
- Orig. 8/75
|
|
09/80 |
| IPC-DRM-53 |
Introduction to Electronics Assembly |
|
|
|
|
IPC-DRM-WHA
IPC-DRM-56 |
Wire Preparation & Crimping |
|
- Rev. A 11/06
- Renamed DRM-WHA
- Orig. 7/02
|
|
|
| IPC-SC-60 |
Post Solder Solvent Cleaning Handbook |
5-31a |
- Superseded and combined into CH-65B 5/11
- Rev. A 8/99
- Orig. 4/87
|
10/99 |
|
| IPC-SA-61 |
Post-Solder Semi-Aqueous Cleaning Handbook |
5-31b |
- Superseded and combined into CH-65B 5/11
- Rev. A 6/02
- Orig. 7/95
|
|
|
| IPC-AC-62 |
Post Solder Aqueous Cleaning Handbook |
5-31b |
- Superseded and combined into CH-65B 5/11
- Rev. A 1/96
- Orig. 12/86
|
|
|
| IPC-CH-65 |
Guidelines for Cleaning of Printed Boards and Assemblies |
5-31d |
- Rev. B 7/11
- Rev. A 9/99
- Orig. 12/90
|
10/99 |
|
| IPC-CS-70 |
Guidelines for Chemical Handling Safety in Printed Board Manufacturing |
|
- Orig. 8/88 Obsolete without replacement
|
|
|
| J-STD-075 |
Classification of Non-IC Electronic Components for Assembly Processes |
B-10a |
|
|
|
| IPC-CM-78 |
Guidelines for Surface Mounting and Interconnecting Chip Carriers |
|
- Superseded by IPC-SM-780
- Rev. C 3/88
- Orig. 11/83
|
|
|
| IPC-MP-83 |
IPC Policy on Metrication |
|
- Orig. 8/85 Obsolete without replacement
|
|
|
| IPC-PC-90 |
General Requirements for Implementation of Statistical Process Control |
7-22 |
- Superseded by IPC-9191
- Orig. 10/90
|
|
|
| IPC-QS-95 |
General Requirements for Implementation of ISO 9000 Quality Systems |
7-22 |
- Obsolete without replacement
- Orig. 4/93
|
|
|
| IPC-L-108 |
Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards |
3-11 |
- Superseded by IPC-4101
- Rev. B 6/90
- Rev. A 10/80
- Orig. 3/76
|
|
|
| IPC-L-109 |
Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards |
3-11* |
- Superseded by IPC-4101
- Rev. B 7/92
- Rev. A 10/80
- Orig. 3/76
|
|
|
| IPC-L-110 |
Preimpregnated, B-Stage Epoxy-Glass Cloth for Multilayer Printed Circuit Boards |
3-11 |
- Rev. A Superseded by IPC-L-109 and IPC-4101
|
|
|
| IPC-CC-110 |
Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications |
3-11c |
- Superseded by IPC-4121
- Rev. A 12/97
- Orig. 1/94
|
|
|
| IPC-L-112 |
Specification for Composite Metal Clad Base materials for Printed Boards |
3-11 |
- Superseded by IPC-4101
- Rev. A 6/92
- Orig. 7/81
|
|
|
| IPC-L-115 |
Specification for Rigid Metal Clad Base Materials for Printed Boards |
3-11 |
- Superseded by IPC-4101
- Rev. B 4/90
- Rev. A 10/80
- Orig. 3/77
|
|
|
| IPC-L-120 |
Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates |
|
- Obsolete without replacement
|
|
|
| IPC-L-125 |
Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections |
D-23 |
- Superseded by IPC-4103
- Rev. A 7/92
- Orig. 8/83
|
|
|
| IPC-L-130 |
Specifications for Thin Laminates, Metal Clad, Primarily for General-Purpose Multilayer Printed Boards |
3-11 |
- Superseded by IPC-L-108 and IPC-4101
- Orig. 1/77
|
|
|
| IPC-DD-135 |
Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules |
|
- Obsolete without replacement
|
|
|
| IPC-EG-140 |
Specification for Finished Fabric Woven from "E" Glass for Printed Boards |
3-12d |
- Superseded by IPC-4412
- Amend. 1 & 2 6/97
- Orig. 3/88
|
|
|
| IPC-SG-141 |
Specification for Finished Fabric Woven from "S" Glass for Printed Boards |
3-12d |
|
|
07/93 |
| IPC-A-142 |
Specification for Finished Fabric Woven from Aramid for Printed Boards |
3-12 |
|
03/92 |
03/92 |
| IPC-QF-143 |
General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards |
3-12d |
|
|
03/93 |
| IPC-CF-148 |
Resin Coated Metal for Printed Boards |
3-12c |
- Superseded by IPC-4563
- Rev. A 9/98
- Orig. 6/90
|
10/98 |
|
| IPC-MF-150 |
Metal Foil for Printed Wiring Applications |
3-12a |
- Rev. A 4/08
- Superseded by IPC-4562 5/00
- Amend. 1 8/92
- Rev. F 10/91 Changed from CF-150 to MF-150
- Rev. E 5/81
- Rev. D 3/76
- Rev. C 8/74
- Rev. B 2/71
- Rev. A 9/67
- Orig. 8/66
|
|
|
| IPC-CF-152 |
Composite Metallic Material Specification for Printed Wiring Boards |
3-12h |
- B 12/97
- A 1/94
- Orig. 6/90
|
|
|
| IPC-FC-203 |
Specification for Flat Cable, Round Conductor, Ground Plane |
D-13 |
|
|
|
| IPC-FC-210 |
Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC) |
D-13 |
|
|
|
| IPC-FC-213 |
Performance Specification for Flat Undercarpet Telephone Cable |
D-13* |
|
|
|
| IPC-FC-217 |
General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable |
D-13 |
- Obsolete 7/96
- Reaffirmed 4/90
- Orig. 8/82
|
|
|
| IPC-FC-218B/EIA-RS-429 |
General Specification for Connectors, Electrical Flat Cable Type |
D-13 |
- Obsolete 7/96
- Reaffirmed 5/91
- Reaffirmed 11/81
- Orig. 7/76
|
|
|
| IPC-FC-219 |
Environment Sealed Flat Cable Connectors for use in Aerospace Applications |
D-13 |
|
|
|
| IPC-FC-220 |
Specification for Flat Cable, Flat Conductor, Unshielded |
D-13 |
- Obsolete 7/96
- Rev. C 7/85
- Rev. B 8/75
- Rev. A 1/74
- Orig. 5/70
|
|
|
| IPC-FC-221 |
Specification for Flat-Copper Conductors for Flat Cables |
D-13 |
- Obsolete 7/96
- Rev. A 5/84
- Orig. 8/75
|
|
|
| IPC-FC-222 |
Specification of Flat Cable Round Conductor, Unshielded |
D-13 |
- Obsolete 7/96
- Reaffirmed 5/91
- Orig. 6/80
|
|
|
| IPC-FC-225 |
Flat Cable Design Guide |
|
- Obsolete (date)
- Reaffirmed 10/85
- Orig. 8/75
|
|
|
| IPC-FC-231 |
Flexible Base Dielectrics for Use in Flexible Printed Wiring |
D-13 |
- Superseded by IPC-4202
- Amend. 10/95
- Rev. C 4/92
- Rev. B 2/86
- Rev. A 5/83
- Orig. 7/74
|
|
|
| IPC-FC-232 |
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films |
D-13 |
- Superseded by 4203 5/02
- Amend. 10/95
- Rev. C 6/94
- Rev. B 2/86
- Rev. A 5/83
- Orig. 7/74
|
|
|
| IPC-FC-233 |
Flexible Adhesive Bonding Films |
D-13 |
- Incorporated into IPC-FC-232C 6/94
- Rev. A 2/86
- Orig. 5/83
|
2/86 |
5/86 |
| IPC-FC-234 |
PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits |
D-1 |
|
|
|
| IPC-FC-240 |
Single sided flex |
D-12 |
- Superseded by IPC-6013
- Incorporated into FC-250
- Rev. B 1/74
- Rev. A 5/69
- Orig. 12/65
|
|
|
| IPC-FC-241 |
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring |
D-13* |
- Superseded by IPC-4204
- Amend. 10/95
- Rev. C 4/92
- Rev. B 2/86
- Rev. A 5/83
- Orig. 7/74
|
|
|
| IPC-RF-245 |
Performance Specification for Rigid-Flex Printed Boards |
D-12 |
- Superseded by IPC-6013
- Orig. 4/87
|
|
|
| IPC-D-249 |
Design Standard for Flexible Single-and Double-Sided Printed Boards |
D-11 |
- Superseded by IPC-2223
- Orig. 1/87
|
|
|
| IPC-FC-250 |
Specification for Single - and Double-Sided Flexible Printed Wiring |
D-12 |
- Superseded by IPC-6013
- Rev. A 9/86
- Orig. 1/74
|
|
|
| IPC-FA-251 |
Guidelines for Single and Double Sided Flex Circuits |
D-12 |
|
|
|
| IPC-D-275 |
Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies |
D-31b |
- Superseded by IPC-2221 and 2222
- Supersedes IPC-D-319 and IPC-D-949
- Amendment 1 4/96
- Orig. 9/91
|
|
|
| IPC-RB-276 |
Qualification and Performance Specification for Rigid Printed Boards |
D-33a |
- Superseded by IPC-6011 and IPC-6012
- Orig. 3/92; Supersedes IPC-SC-320B and IPC-ML-950C
|
|
|
| IPC-D-279 |
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies |
6-10b |
|
|
|
| IPC-D-300 |
Printed Board Dimensions and Tolerances |
1-10a |
- Superseded by IPC-2615
- Rev. G 1/84
- Rev. F 11/74
- Rev. E 10/70
- Rev. D 1/70
- Rev. C 10/65
- Rev. B 1/64
- Rev. A 7/61
- Orig. 8/60
|
|
|
| IPC-D-310 |
Guidelines for Phototool Generation and Measurement Techniques |
|
- Rev. C 6/91
- Rev. B 12/85
- Rev. A 12/77
- Orig. 9/69
|
|
|
| IPC-A-311 |
Process Control Guidelines for Phototool Generation and Use |
|
|
|
|
| IPC-D-316 |
Design Guide for Microwave Circuit Boards Utilizing Soft Substrates |
D-21b |
- Superseded by IPC-2252
- Orig. 5/95
|
|
|
| IPC-D-317 |
Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques |
D-21a |
- Superseded by IPC-2251
- Rev. A 1/95
- Orig. 4/90
|
|
|
| IPC-HF-318 |
Microwave End Product Board Inspection and Test |
D-22 |
- Superseded by IPC-6018
- Rev. A 12/91
- Orig. 6/85
|
|
|
| IPC-D-319 |
Design Standard for Rigid Single-and Double-Sided Printed Boards |
D-31b |
- Superseded by IPC-D-275, then by IPC-2221/2222
- Orig. 1/87
|
|
|
| IPC-SD-320 |
Performance Specification for Rigid Single- and Double-Sided Printed Boards |
D-33a |
- Superseded by IPC-RB-276
- Supersedes IPC-TC-500
- Rev. B 11/86
- Rev. A 3/81
- Orig. 1/77
|
|
|
| IPC-D-322 |
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes |
|
- Reaffirmed 9/91
- Orig. 8/84
|
|
10/94 |
| IPC-MC-324 |
Performance Specifications for Metal Core Boards |
D-33a |
- Superseded by IPC-6011 and IPC-6012
- Orig. 10/88
|
|
|
| IPC-D-325 |
Documentation Requirements for Printed Boards, Assemblies and Support Drawings |
2-40 |
|
|
|
| IPC-D-326 |
Information Requirements for Manufacturing Printed Board Assemblies |
2-11a |
|
|
|
| IPC-D-330 |
Design Guide Manual |
|
|
|
|
| IPC-PD-335 |
Electronic Packaging Handbook |
|
|
|
|
| IPC-NC-349 |
Computer Numerical Control Formatting for Drillers and Routers |
|
|
|
10/85 |
| IPC-D-350 |
Printed Board Description in Digital Form; Technical Content Identical to IEC-61182-1 |
2-11 |
- Rev. D 7/92
- Rev. C 10/85
- Rev. B 8/77
- Rev. A 2/75
- Orig. 8/72
|
|
07/78 |
| IPC-D-351 |
Printed Board Drawings in Digital Form |
|
|
|
09/85 |
| IPC-D-352 |
Electronic Design Data Description for Printed Boards in Digital Form |
|
|
|
09/85 |
| IPC-D-354 |
Library Format Description for Printed Boards in Digital Form |
|
|
|
|
| IPC-D-355 |
Printed Board Assembly Description in Digital Form |
|
|
|
|
| IPC-D-356 |
Bare Board Electrical Test Information in Digital Form |
2-11c |
- Rev. B 10/02
- Rev. A 1/98
- Orig. 3/92
|
|
08/92 |
| IPC-AM-361 |
Specification for Rigid Substrates for Additive Process Printed Boards |
|
- Superseded by IPC-4101
- Orig. 1/82
|
|
|
| IPC-MB-380 |
Guidelines for Molded Interconnection Devices |
|
|
|
|
| IPC-D-390 |
Automated Design Guidelines |
|
|
|
|
| IPC-C-406 |
Design and Application Guidelines for Surface Mount Connectors |
|
|
|
|
| IPC-CI-408 |
Design and Application Guidelines for the Use of Solderless Surface Mount Connectors |
|
|
|
|
| IPC-BP-421 |
General Specification for Rigid Printed Board Backplanes with Press Fit Contacts |
|
- Obsolete without replacement
- Reaffirmed 4/90
- Orig. 10/80
|
|
|
| IPC-D-422 |
Design Guide for Press Fit Rigid Printed Board Backplanes |
|
|
|
|
| IPC-DW-424 |
General Specification for Encapsulated Discrete Wire Interconnection Boards |
|
|
|
|
| IPC-DW-425 |
Design and End Product Requirements for Discrete Wiring Boards |
|
|
|
03/94 |
| IPC-DW-426 |
Specifications for Assembly of Discrete Wiring |
|
|
|
|
| IPC-TR-460 |
Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards |
|
|
|
|
| IPC-TR-461 |
Solderability Evaluation of Thick and Thin Fused Coatings |
|
|
|
|
| IPC-TR-462 |
Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage |
|
|
|
|
| IPC-TR-464 |
Accelerated Aging for Solderability Evaluations |
5-23b |
- Rev. A 12/87
- Orig. Pub.4/84
|
|
|
| IPC-TR-465-1 |
Round Robin Test on Steam Ager Temperature Control Stability |
|
|
|
|
| IPC-TR-465-2 |
The Effect of Steam Aging Time and Temperature on Solderability Test Results |
|
|
|
|
| IPC-TR-465-3 |
Evaluation of Steam Aging on Alternative Finishes, Phase IIA |
|
|
|
|
| IPC-TR-466 |
Wetting Balance Standard Weight Comparison Test |
|
|
|
|
| IPC-TR-467 |
Supporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D |
|
|
|
|
| IPC-TR-468 |
Factors Affecting Insulation Resistance Performance of Printed Boards |
|
|
|
|
| IPC-TR-470 |
Thermal Characteristics of Multilayer Interconnection Boards |
|
|
|
|
| IPC-TR-474 |
An Overview of Discrete Wiring Techniques |
|
- Obsolete without replacement
- Reprint 1984
- Orig. 3/79
|
|
|
| IPC-TR-476 |
How to Avoid Metallic Growth Problems on Electronic Hardware
Rev. A Electrochemical Migration Electrically Induced Failures In Printed Assembles |
|
- Rev. A 6/84 (new title)
- Orig. 9/77
|
|
|
| IPC-TR-480 |
Results of Multilayer Test Program Round Robin IV Phase I |
|
- Obsolete without replacement
- Orig. 9/75
|
|
|
| IPC-TR-481 |
Results of Multilayer Test Program Round Robin V |
|
|
|
|
| IPC-TR-482 |
New Developments in Thin Copper Foils |
|
|
|
|
| IPC-TR-483 |
Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program |
|
- Rev. A 3/91
- Addendums 10/87
- Orig. 4/84
|
|
|
| IPC-TR-484 |
Results of IPC Cooper Foil Ductility Round Robin Study |
|
|
|
|
| IPC-TR-485 |
Results of Cooper Foil Rupture Strength Test Round Robin Study |
|
|
|
|
| IPC-TR-486 |
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations |
|
|
|
|
| IPC-TR-549 |
Measles in Printed Wiring Boards |
|
|
|
|
| IPC-TR-551 |
Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components |
|
|
|
|
| IPC-DR-570 |
General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards |
4-12 |
- Obsolete without replacement
- Rev. A 4/84
- Orig. 1/79
|
|
|
| IPC-DR-572 |
Drilling Guidelines for Printed Boards |
4-12 |
|
|
|
| IPC-TR-576 |
Additive Process Evaluation |
|
- Obsolete without replacement
- Orig. 9/77
|
|
|
| IPC-TR-578 |
Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards |
|
|
|
|
| IPC-TR-579 |
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards |
|
|
|
|
| IPC-TR-580 |
Cleaning and Cleanliness Test Program Phase 1 Test Results |
|
|
|
|
| IPC-TR-581 |
IPC Phase 3 Controlled Atmosphere Soldering Study |
|
|
|
|
| IPC-TR-582 |
IPC Phase 3 No-Clean Flux Study |
|
|
|
|
| IPC-TR-583 |
An In-Depth Look At Ionic Cleanliness Testing |
|
|
|
|
| IPC-WP/TR-584 |
IPC White Paper and Technical Report on Halogen-Free Materials used for Printed Circuit Boards and Assemblies |
4-33 |
|
|
|
| IPC-TR-585 |
Time, Temperature and Humidity Stress of Final Board Finish Solderability |
|
|
|
|
| IPC-TR-586 |
Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium (supports IPC-4553A) |
4-14 |
|
|
|
| IPC-A-600 |
Acceptability of Printed Boards |
7-31a & D-33a |
- Rev. H 4/10
- Amend. 1 01/08
- Rev. G 7/04
- Rev. F 11/99
- Rev. E 8/95
- Rev. D '89
- Rev. C '78
- Rev. B '74
- Rev. A '70
- Orig. '64
|
|
|
| IPC-SS-605 |
Printed Board Quality Evaluation Slide Set |
|
- Obsolete without replacement
|
|
|
| IPC-QE-605 |
Printed Board Quality Evaluation Handbook |
|
|
|
|
| J-STD-609 |
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices |
4-34b |
- Rev. A 2/10
- Orig. 5/07; Supersedes IPC-1066
|
07/08 |
01/08 |
| IPC-A-610 |
Acceptability of Electronic Assemblies |
7-31 |
- Rev. E 4/10
- Rev. D Amend. 1 4/08
- Rev. D 2/05
- Rev. C 1/00
- Rev. B 12/94
- Rev. A 3/90
- Orig. 8/83
|
04/05 |
02/02 |
| IPC-A-610DC |
IPC-A-610D Telecom Addendum |
|
|
|
|
| IPC-HDBK-610 |
Handbook and Guide to IPC-A-610 (Includes B-C-D comparison) |
|
- Amend. 1 10/05
- Orig. 9/02
|
|
|
| IPC-QE-615 |
Assembly Quality Evaluation Handbook |
|
- Obsolete without replacement
|
|
|
| IPC/WHMA-A-620 |
Acceptability of Electronic Wire Harnesses and Cables |
7-31f |
- Rev. B 10/12
- Rev. A 7/06
- Orig. 1/02
|
03/02 |
|
| IPC/WHMA-A-620AS Space Hardware Addendum |
Space Applications Electronic Hardware Addendum for IPC/WHMA-A-620. The addendum MUST be used with the same version of the standard; e.g. 620AS with 620A |
7-31fs |
|
|
|
| IPC-AI-640 |
User’s Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates |
|
- Obsolete without replacement
- Orig. 1/87
|
|
|
| IPC-AI-641 |
User’s Guidelines for Automated Solder Joint Inspection |
|
- Obsolete without replacement
- Orig. 1/87
|
|
|
| IPC-AI-642 |
User’s Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB’s |
|
- Obsolete without replacement
- Orig. 10/88
|
|
|
| IPC-OI-645 |
Standard for Visual Optical Inspection Aids |
|
|
|
|
| IPC-TM-650 |
Test Methods Manual |
|
|
|
|
| IPC-ET-652 |
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards |
|
- Superseded by IPC-9252
- Orig. 10/90
|
|
|
| IPC-QL-653 |
Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material |
|
|
|
07/89 |
| IPC-MI-660 |
Incoming Inspection of Raw Materials Manual |
|
|
|
|
| IPC-R-700 |
Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies |
|
- Superseded by IPC-7711A/7721A
- Rev. C 1/88
- Rev. B 9/77
- Rev. A 12/71
- Orig. 9/67
|
|
|
| IPC-TA-720 |
Technology Assessment Handbook on Laminates |
|
|
|
|
| IPC-TA-721 |
Technology Assessment Handbook on Multilayer Boards |
|
|
|
|
| IPC-TA-722 |
Technology Assessment of Soldering |
|
|
|
|
| IPC-TA-723 |
Technology Assessment Handbook on Surface Mounting |
|
|
|
|
| IPC-TA-724 |
Technology Assessment Series on Cleanrooms |
|
|
|
|
| IPC-PE-740 |
Troubleshooting Guide for Printed Board Manufacture and Assembly |
7-23 |
|
|
|
| IPC-CM-770 |
Printed Board Component Mounting |
|
- Rev. E 1/04
- Rev. D 1/96
- Rev. C 1/87
- Rev. B 10/80
- Rev. A 3/76
- Orig. 9/68
|
|
|
| IPC-SM-780 |
Component Packaging and Interconnecting with Emphasis on Surface Mounting |
|
|
|
|
| IPC-SM-782 |
Surface Mount Design and Land Pattern Standard |
1-13 |
- Superseded by IPC-7351
- Amend. 2 4/99
- Amend. 1 10/96
- Rev. A 8/93
- Orig. 3/87
|
|
|
| IPC-SM-784 |
Guidelines for Chip-on-Board Technology Implementation |
|
|
|
|
| IPC-SM-785 |
Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments |
|
|
|
|
| IPC-SM-786 |
Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive Ics |
|
- Superseded by J-STD-020 and J-STD-033
- Rev. A 1/95
- Orig. 12/90
|
|
|
| IPC-MC-790 |
Guidelines for Multichip Module Technology Utilization |
|
|
|
|
| IPC-S-801 |
|
5-23a |
- Superseded by IPC-804 and J-STD-003
|
|
|
| IPC-S-803 |
|
5-23a |
- Superseded by IPC-804 and J-STD-003
|
|
|
| IPC-S-804 |
Solderability Test Methods for Printed Wiring Boards |
5-23a |
- Superseded by J-STD-003
- Rev. A 1/87
- Orig. 1/82
|
|
|
| IPC-S-805 |
Solderability Tests for Component Leads and Terminations |
5-23b |
- Superseded by J-STD-002
- Orig. 1/85
|
|
|
| IPC-MS-810 |
Guidelines for High Volume Microsection |
|
|
|
|
| IPC-S-815 |
General Requirements for Soldering Electronic Interconnections |
|
- Superseded byJ-STD-001
- Rev. B 12/87
- Rev. A 6/81
- Orig. 11/77
|
|
|
| IPC-S-816 |
SMT Process Guideline and Checklist |
|
|
|
|
| IPC-SM-817 |
General Requirements for Dielectric Surface Mounting Adhesives |
|
|
|
|
| IPC-SF-818 |
General Requirement for Electronic Soldering Fluxes |
5-24a |
- Superseded by J-STD-004
- Rev. 12/91
- Orig. 2/88
|
|
|
| IPC-SP-819 |
General Requirements and Test Methods for Electronic Grade Solder Paste |
5-24b |
- Superseded by J-STD-005
- Orig. 10/88
|
|
|
| IPC-AJ-820 |
Assembly and Joining Manual |
|
|
|
|
| IPC-CA-821 |
General Requirements for Thermally Conductive Adhesives |
|
|
|
|
| IPC-CC-830 |
Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies |
|
- Amend. 1 10/08
- Rev. B 08/02
- Amend. 1 7/99
- Rev. A 10/98
- Orig. 1/84
|
08/02 |
|
| IPC-HDBK-830 |
Conformal Coating Handbook |
|
|
|
|
| IPC-SM-839 |
Pre and Post Solder Mask Application Cleaning Guidelines |
|
|
|
|
| IPC-SM-840 |
Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards |
5-33b |
- Rev. E 12/10
- Rev. D 4/07
- Amend. 1 6/00
- Rev. C 1/96
- Rev. B 5/88
- Rev. A 7/83
- Orig. 11/77
|
8/00 |
|
| IPC-HDBK-840 |
Solder Mask Handbook |
|
|
|
|
| IPC-HDBK-850 |
Guidelines for Design, Selection and Application of Potting and Encapsulation Materials Used for Electronics Printed Circuit Board Assembly |
5-33f |
|
|
|
| IPC-H-855 |
Hybrid Microcircuit Design Guide |
|
- Obsolete without replacement
- Orig. 10/82
|
|
|
| IPC-D-859 |
Design Standard for Thick Film Multilayer Hybrid Circuits |
|
|
Y |
|
| IPC-HM-860 |
Specification for Multilayer Hybrid Circuits |
|
|
Y |
|
| IPC-TF-870 |
Qualification and Performance of Polymer Thick Film Printed Boards |
|
|
Y |
|
| IPC-ML-910 |
Design and End Production Specification for Rigid Multilayer Printed Boards |
D-31b &
D-33a |
- Superseded by IPC-D-949, IPC-D-275, and subsequently IPC-2221 for Design and IPC-ML-950, IPC-RB-276, and subsequently IPC-6011 for End Product Specification
- Rev. A 8/76
- Orig. 6/68
|
|
|
| IPC-D-949 |
Design Standard for Rigid Multilayer Printed Boards |
D-31b |
- Superseded by IPC-D-275 and subsequently by IPC-2221/2222
- Orig. 1/87
|
|
|
| IPC-ML-950 |
Performance Specification for Rigid Multilayer Printed Boards |
D-33a |
- Superseded by IPC-RB-276 and subsequently IPC-6011/6012
- Rev. C 11/8
- Rev. B 12/77
- Rev. A 9/70
- Orig. 1/66
|
|
|
| IPC-ML-960 |
Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards |
|
|
Y |
|
| IPC-ML-975 |
End Product Documentation Specification for Multilayer Printed Wiring Boards |
|
- Superseded by IPC-D-325
- Orig. 9/69
|
|
|
| IPC-ML-990 |
Performance Specification for Flexible Multilayer Wiring |
D-33a |
- Superseded by IPC-6011
- Orig. 9/72
|
|
|
| IPC-TP-1043 |
Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1 |
|
|
|
|
| IPC-TP-1044 |
Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2 |
|
|
|
|
| IPC-1065 |
Material Declaration Handbook |
4-34a |
|
|
|
| IPC-1066 |
Labeling of PCBs and Assemblies |
4-34b |
- Superseded by J-STD-609
- Orig. 12/04
|
|
|
| IPC-1071 |
Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing |
E-20 |
|
|
|
| IPC-TP-1090 |
The Layman’s Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002 |
|
|
|
|
| IPC-TP-1103 |
Manufacturing Concerns When Soldering with Gold Plated Component Leads or Circuit Board Pads |
|
- Obsolete without replacement
|
|
|
| IPC-TP-1114 |
The Layman’s Guide to Qualifying a Process to J-STD-001B |
|
|
|
|
| IPC-TP-1115 |
Selection and Implementation Strategy for A Low-Residue No-Clean Process |
|
|
|
|
| IPC-1131 |
IT Guidelines for PWB Manufacturers |
|
|
|
|
| IPC-1331 |
Voluntary Safety Standard for Electrically Heated Process Equipment |
|
|
|
|
| IPC-1601 |
Printed Board Handling and Storage Guidelines |
D-35 |
|
|
|
| IPC-1710 |
OEM Standard for Printed Board Manufacturers’ Qualification Profile (MQP) |
|
- Rev. A 7/04
- 12/97 Updated
- Orig. 2/94
|
|
|
| IPC-1720 |
Assembly Qualification Profile (AQP) |
|
|
|
|
| IPC-1730 |
Laminator Qualification Profile (LQP) |
|
|
|
|
| IPC-1731 |
Strategic Raw Materials Supplier Qualification Profile |
3-12i |
|
|
|
| IPC-1751 |
Generic Requirements for Declaration Process Management |
2-18 |
- Amendment 1 12/12
- Rev. A 2/10
- Vers. 1.1 3/07
- Orig. Pub. 3/06
|
|
|
| IPC-1752 |
Materials Declaration Management (Includes 2 PDF forms) |
2-18b |
- Amendment 1 12/12
- Rev. A 2/10
- Vers. 1.1 3/07
- Orig. Pub. 3/06
|
|
|
| IPC-1756 |
Manufacturing Process Data Management |
2-18a |
|
|
|
| IPC-2141 |
Controlled Impedance Circuit Boards and High Speed Logic Design |
D-21c |
|
|
12/09 |
| IPC-2152 |
Standard for Determining Current Carrying Capacity in Printed Board Design |
1-10b |
|
|
02/11 |
| IPC-2221 |
Generic Standard on Printed Board Design |
D-31b |
- Rev. B 11/12
- Rev. A 5/03
- Amend. 1 1/00
- Orig. 2/98; Supersedes IPC-D-275
|
|
09/99 |
| IPC-2222 |
Sectional Design Standard for Rigid Organic Printed Boards |
D-31b |
- Rev. A 12/10
- Orig. 2/98; Supersedes IPC-D-275
|
|
|
| IPC-2223 |
Sectional Design Standard for Flexible Printed Boards |
D-11 |
- Rev. C 11/11
- Rev. B 5/08
- Rev. A 6/04
- Orig. 11/98; Supersedes IPC-D-249
|
|
09/99 |
| IPC-2224 |
Sectional Standard for Design of PWBs for PC Cards |
|
|
|
|
| IPC-2225 |
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies |
|
|
|
|
| IPC-2226 |
Design Standard for High-Density Array or Peripheral Leaded Component Mounting Structures |
1-10 |
|
|
03/09 |
| IPC-2251 |
Design Guidelines for Electronic Packaging Utilizing High Speed Techniques |
D-21a |
|
|
08/09 |
| IPC-2252 |
Design and Manufacturing Guide for RF/Microwave Circuit Boards |
D-21b |
|
|
|
| IPC/JPCA-2315 |
Design Guide for High Density Interconnects (HDI) and Microvia |
D-41a |
|
|
|
| IPC-2316 |
Design Guide for Embedded Passive Device Printed Boards |
D-37a |
|
|
|
| IPC-2501 |
Definition for Web-based Exchange of XML Data |
2-50 |
|
08/03 |
|
| IPC-2511 |
Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology |
2-11 |
- Rev. B 1/02
- Rev. A 1/00
- Orig. 1 1/98
|
02/02 |
|
| IPC-2512 |
Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description |
2-11 |
|
|
|
| IPC-2513 |
Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description |
2-11h |
|
|
|
| IPC-2514 |
Sectional Requirements for Implementation of Printed Board Manufacturing Data Description |
2-11 |
|
|
|
| IPC-2515 |
Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description |
2-11 |
|
|
|
| IPC-2516 |
Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description |
2-11e |
|
|
|
| IPC-2517 |
Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description |
2-11g |
|
|
|
| IPC-2518 |
Sectional Requirements for Implementation of Part List Product Data Description |
2-11 |
|
|
|
| IPC-2524 |
PWB Fabrication Data Quality Rating System |
2-10 |
|
|
|
| IPC-2531 |
Standard Recipe File Format Specification |
2-12 |
|
|
|
| IPC-2541 |
Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication |
2-13a |
|
Y |
|
| IPC-2546 |
Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication |
2-13b |
- Amend. 1 1/03
- Amend. 2 1/05
- Orig. 10/01
|
Y |
|
| IPC-2547 |
Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication |
2-13c |
|
Y |
|
| IPC-2571 |
Generic Requirements for Electronic Manufacturing Supply Chain Communication-Product Data Exchange (PDX) |
2-15a |
|
Y |
|
| IPC-2576 |
Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Exchange (PDX) |
2-15c |
|
Y |
|
| IPC-2578 |
Sectional Requirements for Supply Chain Communication of Bill of material and Product Design Configuration Data-Product Data Exchange (PDX) |
2-15e |
|
Y |
|
| IPC-2581 |
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology (Offspring) |
2-17 |
|
05/04 |
|
| IPC-2582 |
Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description |
2-17 |
|
|
|
| IPC-2583 |
Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description |
2-17 |
|
|
|
| IPC-2584 |
Sectional Requirements for Implementation of Printed Board Fabrication Data Description |
2-17 |
|
|
|
| IPC-2588 |
Sectional Requirements for Implementation of Part List Product Data Description |
2-17 |
|
|
|
| IPC-2611 |
Generic Requirements for Electronic Product Documentation |
2-40 |
|
|
|
| IPC-2612 |
Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions) |
2-40 |
|
|
|
| IPC-2612-1 |
Sectional Requirements for Electronic Diagramming Symbol Generation Methodology |
2-40 |
|
|
|
| IPC-2614 |
Sectional Requirements for Board Fabrication Documentation |
2-40 |
|
|
|
| IPC-2615 |
Printed Board Dimensions and Tolerances |
|
- Orig. 6/00; Supersedes IPC-D-300
|
Y |
11/10 |
| IPC-3406 |
Guidelines for Electrically Conductive Surface Mount Adhesives |
|
|
|
|
| IPC-3408 |
General Requirements for Anistropically Conductive Adhesive Films |
|
|
|
|
| IPC-4101 |
Specification for Base Materials for Rigid and Multilayer Boards |
3-11 |
- Rev. C 8/09
- Rev. B Amends. 1&2 4/07
- Rev. B Amend. 1 2/07
- Rev. B 6/06
- Rev. A Amend. 1 6/02
- Rev. A 6/02
- Supersedes IPC-L-108, IPC-L-109, IPC-L-112, IPC-L-115
- Orig. 12/97
|
|
|
| IPC-4103 |
Specification for Plastic Substrates, Clad or Unclad, for High Speed/High Frequency Interconnection |
D-23 |
- Rev. A 12/11
- Orig. 01/02;
Supersedes IPC-L-125
|
|
|
| IPC/JPCA-4104 |
Specification for High Density Interconnect (HDI) and Microvia Materials |
3-10 |
|
05/99 |
|
| IPC-4110 |
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards |
3-12* |
|
10/98 |
|
| IPC-4121 |
Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications |
3-11c |
- Orig. 1/00; Supersedes IPC-CC-110ª
|
|
|
| IPC-4130 |
Specification and Characterization Methods for Nonwoven “E” Glass Mat |
3-12f |
|
12/99 |
|
| IPC-4202 |
Flexible Base Dielectrics for Use in Flexible Printed Wiring |
D-13 |
- Rev. A 4/10
- Orig. 5/02; Supersedes IPC-FC-231C
|
06/02 |
02/03 |
| IPC-4203 |
Adhesive Coated Dielectric Films for Use as Cover Sheets |
D-13 |
- Rev. A 1/13
- Orig. 5/02; Supersedes IPC-FC-232C
|
06/02 |
02/03 |
| IPC-4204 |
Flexible Metal-Clad Dielectrics for Use in Fabrication of |
D-13 |
- Rev. A 10/11
- Orig. 5/02; Supersedes IPC-FC-241C
|
06/02 |
02/03 |
| IPC-4411 |
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement |
3-12* |
|
|
|
| IPC-4412 |
Specification for Finished Fabric Woven form “E” Glass for Printed Boards |
3-12d |
- Rev. A w/Amends. 1, 2 & 3 07/11
- Rev. A Amend. 3 12/10
- Rev. A Amend. 2 5/09
- Rev. A Amend. 1 3/08
- Rev. A 1/06
- Orig. 6/02; Supersedes IPC-EG-140ª
|
12/10 |
02/03 |
| IPC-4552 |
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards |
4-14 |
- Amend. 2
- Amend. 1 6/12
- Orig. 10/02
|
11/02 |
|
| IPC-4553 |
Specification for Immersion Silver Plating for Printed Circuit Boards |
4-14 |
|
09/05 |
|
| IPC-4554 |
Specification for Immersion Tin Plating for Printed Circuit Boards |
4-14 |
- Orig. Amend. 1 9/11
- Orig. 2/07
|
|
|
| IPC-4562 |
Metal Foil for Printed Wiring Applications |
3-12a |
- Rev. A 4/08
- Amend. 1 5/05
- Orig. 5/00; Supersedes IPC-MF-150F
|
|
02/03 |
| IPC-4563 |
Resin Coated Copper Foil for Printed Boards Guideline |
3-12c |
- Orig. (replaces CF-148A) 11/07
|
|
|
| IPC-4591 |
Requirements for Printed Electronics Functional Conductive Materials |
D-62 |
|
|
|
| IPC-4761 |
Design Guide for Protection of Printed Board Via Structures |
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| IPC-4781 |
Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks |
5-33e |
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| IPC-4811 |
Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards |
D-52 |
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| IPC-4821 |
Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards |
D-52 |
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| IPC-4921 |
Requirements for Printed Electronics Base Materials (Substrates) |
D-63 |
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| IPC-5701 |
Users Guide for Cleanliness of Unpopulated Printed Boards |
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| IPC-5702 |
Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards |
5-32c |
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| IPC-5704 |
Cleanliness Requirements for Unpopulated Printed Boards |
5-32c |
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| IPC-6011 |
Generic Performance Specification for Printed Boards |
D-33a |
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| IPC-6012 |
Qualification and Performance Specification for Rigid Printed Boards |
D-33a |
- Rev. C 4/10
- Amend. 2 3/08
- Rev. B with Amend 1 2/07
- Rev. B 8/04
- Amend. 1 7/00
- Rev. A 10/99
- Orig. 7/96
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| IPC-6013 |
Qualification and Performance Specification for Flexible Printed Boards |
D-12 |
- Rev. B. 1/09
- Rev. A with Amend. 2 4/06
- Amend. 1 1/05
- Rev. A 11/03
- Supersedes IPC-RF-245 and IPC-FC-250
- Amend. 1 4/00
- Orig. 11/98
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| IPC-6015 |
Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures |
N/A |
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| IPC-6016 |
Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards |
D-10 |
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8/99 |
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| IPC-6017 |
Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices |
D-53 |
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| IPC-6018 |
Qualification and Performance Specification for High Frequency (Microwave) Printed Boards |
D-22 |
- Rev. B 11/11
- Rev. A 1/02
- Orig. 1/98
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| IPC/JPCA-6202 |
Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards |
D-12* |
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| IPC/JPCA-6801 |
Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection |
N/A |
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| IPC-7093 |
Design and Assembly Process Implementation for Bottom Termination SMT Components |
5-21h |
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| IPC-7094 |
Design and Assembly Process Implementation for Flip Chip and Die Size Components |
5-21g |
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| IPC-7095 |
Design and Assembly Process Implementation for BGAs |
5-21f |
- Rev. C 1/13
- Rev. B 3/08
- Rev. A 11/04
- Orig. 8/00
|
07/08 |
|
| IPC-7351 |
Generic Requirements for Surface Mount Design and Land Pattern Standard |
1-13 |
- Rev. B 6/10
- Rev. A 2/07
- Supersedes IPC-SM-782A with Amendments 1 & 2
- Orig. 2/05
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| IPC-7525 |
Guidelines for Stencil Design |
7-21e |
- Rev. B 10/11
- Rev. A 2/07
- Orig. 5/00
|
06/00 |
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| IPC-7526 |
Stencil and Misprinted Board Cleaning Handbook |
5-21jND |
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| IPC-7530 |
Guidelines for Temperature Profiling for Mass Soldering (Wave and Reflow) Processes |
5-20/5-22 |
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| IPC-7711/7721 |
Rev B renamed to:
Rework, Repair and Modification of Electronic Assemblies |
5-31h |
- Rev. B 11/07
- Rev. A 10/03
- Orig. 4/98; Supersedes IPC-R-700C
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| IPC-7912 |
Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies |
5-22g |
|
01/04 |
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| IPC-8413-1 |
Specification for Manufacturing Process Carriers for Handling Optical Fiber |
5-25a |
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| IPC-8497-1 |
Cleaning Methods and Contamination Assessment for Optical Assembly |
5-25e |
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| IPC-9151 |
Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database |
D-36 |
- Rev. C 5/10
- Rev. B 2/07
- Rev. A 5/03
- Orig. 6/02
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| IPC-9191 |
General Guideline for implementation of Statistical Process Control (SPC) |
7-22 |
- Supersedes IPC-PC-90
- Orig. 11/99
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|
02/03 |
| IPC-9194 |
Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline |
7-22 |
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| IPC-9199 |
SPC Quality Rating |
7-22 |
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| IPC-9201 |
Surface Insulation Resistance Handbook |
5-32b |
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| IPC-9202 |
Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance |
5-32b |
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| IPC-9203 |
Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle |
5-32b |
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| IPC-9251 |
Test Vehicles for Evaluating Fine Line Capability |
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| IPC-9252 |
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards |
7-32c |
- Rev. A 11/08
- Orig. 02/01; Supersedes IPC-ET-652A
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|
04/09 |
| IPC-9261 |
In-Process DPMO and Estimated Yield for PWAs |
5-22g |
|
03/02 |
|
| IPC-9501 |
PWB Assembly Process Simulation for Evaluation of Electronic Components |
5-21c |
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| IPC-9502 |
PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components |
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| IPC-9503 |
Moisture Sensitivity Classification for Non-IC Components |
|
- Superseded by J-STD-075 8/08
- Orig. 4/99
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| IPC-9504 |
Assembly Process Simulation for Evaluation of Non-IC Components |
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10/98 |
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| IPC-9591 |
Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices |
9-81 |
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| IPC-9592 |
Requirements for Power Conversion Devices for the Computer and Telecommunications Industries |
9-82 |
- Rev. B 1/13
- Rev. A 5/10
- Orig. 9/08
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| IPC-9631 |
User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation |
D-32 |
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| IPC-9691 |
User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) |
5-32e |
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|
| IPC-9701 |
Qualification and Performance Test Methods for Surface Mount Solder Attachments |
6-10d |
|
Y |
|
| IPC/JEDEC-9702 |
Monotonic Bend Characterization of Board-Level Interconnects |
6-10d |
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| IPC/JEDEC-9703 |
Mechanical Shock Test Guidelines for Solder Joint Reliability |
6-10d |
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| IPC/JEDEC-9704 |
Printed Wiring Board Strain Gage Test Guideline |
6-10d |
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| IPC/JEDEC-9707 |
Spherical Bend Test Method for Characterization of Board Level Interconnects |
6-10d |
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| IPC-9708 |
Test Methods for Characterization of Printed Board Assembly Pad Cratering |
6-10d |
|
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| IPC-9850 |
Surface Mount Equipment Performance Characterization |
|
|
09/02 |
|
| IPC-SMEMA-9851 |
Equipment Interface Specification |
|
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|
|
| IPC-DRM-SMT |
Surface Mount Solder Joint Evaluation Desk Reference Manual |
|
- Rev. C 11/05
- Rev. B 4/00
- Rev. A 3/99
- Orig. 7/98
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|
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| IPC-EMSI-TC |
IPC Sample Master Ordering Agreement for EMS Companies and OEMs |
|
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|
|
| Roadmap |
International Technology Roadmap for Electronic Interconnections |
8-40 |
- Updated 2009
- Updated 2007
- Updated 2005
- Updated 2003
- Updated 2001
- Updated 9/97
- Orig. 6/95
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