Document Revision Table

Updated March 2014

Product ID Document Name Responsible Committee Status ANSI DoD
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies 5-22a Rev. E  4/10
Rev. D Amend. 1 04/08
Rev. D 2/05
Rev. C 3/00
Rev. B 10/96
Rev. A 1/95
Orig. 4/92; Supersedes IPC-S-815
  07/01
J-STD-001xS Space Hardware Addendum Space Applications Electronic Hardware Addendum for J-STD-001. The addendum MUST be used with the same version of the standard; e.g. 001CS with 001C, 001DS with 001D, 001ES with 001D 5-22as ES 12/10
DS Amend. 1 09/09
DS 11/06
CS 1/04
   
IPC-HDBK-001 Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies 5-22f Rev. E 2/12
Amend. 2  10/05
Amend. 1  12/00
Orig. 3/98
  07/01
SMC-TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology   Orig. 1/89    
IT-WP-001 Myths of E-Commerce   Orig. 9/00    
SMC-WP-001 Soldering Capability White Paper Report   Orig. 8/91    
SMEMA 1.2 Mechanical Equipment Interface Standard   Update IPC-SMEMA-9851    
JP002 Current Tin Whiskers Theory and Mitigation Practices Guideline 5-23e Orig.  3/06    
J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 5-23b Rev. D 6/13
Rev. C Amend. 1 10/08
Rev. C 12/07
Rev. B  2/03
Rev. A 10/98
Orig. 4/92; Supersedes IPC-S-805
  5/95
SMC-WP-002 An Assessment of the Use of Lead in Electronic Assembly   Orig. 8/92    
J-STD-003 Solderability Tests for Printed Boards 5-23a Rev. C 9/13
Rev. B  2/07
Rev. A  2/03 Original 4/92; Supersedes IPC-S-804
  1/04
SMC-WP-003 Chip Mounting Technology   Orig. 8/93    
SMEMA 3.1 Fiducial Mark Standard        
J-STD-004 Requirements for Soldering Fluxes 5-24a Rev. B. Amend. 1 – 10/11
Rev. B 12/08
Rev. A  1/04
Orig. 1/95; Supersedes IPC-SF-818
  05/95
SMC-WP-004 Design for Success   Orig. 4/97    
SMEMA 4 Reflow Terms and Definitions   Orig.    
J-STD-005 Requirements for Soldering Pastes 5-24b Rev. A 2/12
Amend. 1  6/96
Orig. 1/95; Supersedes IPC-SP-819
  05/95
SMC-WP-005 PWB Surface Finishes   Orig. 4/97    
IPC-HDBK-005 Guide to Solder Paste Assessment 5-24b Orig. 1/06    
SMEMA 5 Screen Printing Terms and Definitions   Orig.    
J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications 5-24c Rev. C 7/13
Rev. B Amends 1 & 2 10/09
Rev. B Amend. 1  6/08
Rev. B  1/06
Rev. A  5/01
Amend. 1  7/96
Orig. 1/95
  05/95
SMEMA 6 Electronics Cleaning Terms and Definitions   Orig.    
SMEMA 7 Fluid Dispensing Terms and Definitions   Orig.    
WP-008 Setting up Ion Chromatography Capability   Orig. 12/05    
J-STD-012 Implementation of Flip Chip and Chip Scale Technology 5-21g Superseded by IPC-7094    10/13
Orig. 1/96
   
J-STD-013 Implementation of Ball Grid Array and Other High Density Technology 5-21f Superseded by IPC-7095   10/13
Orig. 7/96
   
IPC-DRM-18 Component Identification Desk Reference Manual   Rev. H 11/07
Rev. G 9/03
Rev. F 8/01
Rev. E 8/00
Rev. D 7/99
Rev. C 7/98
Rev. B 2/97
Rev. A 4/96
Orig. 9/95
   
J-STD-020 Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices B-10a Rev. D Amend. 1  3/08
Rev. D  8/07
Rev. C 7/04
Rev. B 7/02
Rev. A 4/99
Orig. 10/96
   
J-STD-026 Semiconductor Design Standard for Flip Chip Applications 5-21g Orig. 8/99    
J-STD-027 Mechanical Outline Standard for Flip Chip or Chip Scale Configurations 5-21g Orig.  2/03    
J-STD-028 Performance Standard for Flip Chip Scale Bumps 5-21g Orig. 8/99    
J-STD-030 Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages 5-24f Rev. A 03/14
Orig. 9/05
   
J-STD-032 Performance Standard for Ball Grid Array Bumps and Columns 5-21f Orig. 6/02    
J-STD-033 Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices B-10a Rev. C 2/12
Rev. B Amend. 1  1/07
Rev. B 10/05
Rev. A 7/02
Orig. 4/99
   
J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components B-10a Orig. 4/99    
IPC-0040 Optoelectronic Assembly and Packaging Technology  5-25 Orig. 5/03    
IPC-DRM-PTH
IPC-DRM-40
Through-Hole Solder Joint Evaluation Desk Reference Manual   Rev. E 7/10 Rev. D (2nd print) 11/08
Rev. D 11/05 Renamed to DRM-PTH
Rev. E 2/02
Rev. D 7/00
Rev. C 9/99
Rev. B 1/99
Rev. A 8/97
Orig. 5/97
   
IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits 2-30 Rev. K 7/13
Rev. J 10/11
Rev. I Skipped Due to Conflict with "L" and "1"
Rev. H  7/08
Rev. G 12/03
Rev. F 6/96
Rev. E 7/92
Rev. D 11/88
Rev. C 3/85
Rev. B 6/80
Rev. A 8/76
Orig. 8/75
  09/80
IPC-DRM-53 Introduction to Electronics Assembly   Orig. 6/00    
IPC-DRM-WHA IPC-DRM-56 Wire Preparation & Crimping   Rev. B 3/13 Rev. A 11/06 Renamed DRM-WHA
Orig.  7/02
   
IPC-SC-60 Post Solder Solvent Cleaning Handbook 5-31a Superseded and combined into CH-65B 5/11
Rev. A 8/99
Orig. 4/87
   
IPC-SA-61 Post-Solder Semi-Aqueous Cleaning Handbook 5-31b Superseded and combined into CH-65B 5/11
Rev. A 6/02
Orig. 7/95
   
IPC-AC-62 Post Solder Aqueous Cleaning Handbook 5-31b Superseded and combined into CH-65B 5/11
Rev. A 1/96
Orig. 12/86
   
IPC-CH-65 Guidelines for Cleaning of Printed Boards and Assemblies 5-31d Rev. B 7/11
Rev. A 9/99
Orig. 12/90
   
IPC-CS-70 Guidelines for Chemical Handling Safety in Printed Board Manufacturing   Orig. 8/88 Obsolete without replacement    
J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes B-10a Orig. 08/08    
IPC-CM-78 Guidelines for Surface Mounting and Interconnecting Chip Carriers   Superseded by IPC-SM-780
Rev. C - 3/88
Orig. 11/83
   
IPC-MP-83 IPC Policy on Metrication   Orig. 8/85 Obsolete without replacement    
IPC-PC-90 General Requirements for Implementation of Statistical Process Control 7-22 Superseded by IPC-9191
Orig. 10/90
   
IPC-QS-95 General Requirements for Implementation of ISO 9000 Quality Systems 7-22 Obsolete without replacement
Orig. 4/93
   
IPC-L-108 Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards 3-11 Superseded by IPC-4101
Rev. B  6/90
Rev. A 10/80
Orig. 3/76
   
IPC-L-109 Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards 3-11* Superseded by IPC-4101
Rev. B  7/92
Rev. A 10/80
Orig. 3/76
   
IPC-L-110 Preimpregnated, B-Stage Epoxy-Glass Cloth for Multilayer Printed Circuit Boards 3-11 Rev. A Superseded by IPC-L-109 and IPC-4101    
IPC-CC-110 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications 3-11c Superseded by IPC-4121
Rev. A 12/97
Orig. 1/94
   
IPC-L-112 Specification for Composite Metal Clad Base materials for Printed Boards 3-11 Superseded by IPC-4101
Rev. A 6/92
Orig. 7/81
   
IPC-L-115 Specification for Rigid Metal Clad Base Materials for Printed Boards 3-11 Superseded by IPC-4101
Rev. B 4/90
Rev. A 10/80
Orig. 3/77
   
IPC-L-120 Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates   Obsolete without replacement    
IPC-L-125 Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections D-23 Superseded by IPC-4103
Rev. A 7/92
Orig. 8/83
   
IPC-L-130 Specifications for Thin Laminates, Metal Clad, Primarily for General-Purpose Multilayer Printed Boards 3-11 Superseded by IPC-L-108 and IPC-4101
Orig. 1/77
   
IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules   Obsolete without replacement    
IPC-EG-140 Specification for Finished Fabric Woven from "E" Glass for Printed Boards 3-12d Superseded by IPC-4412
Amend. 1 & 2 6/97
Orig. 3/88
   
IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards 3-12d Orig. 2/92   07/93
IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards 3-12 Orig. 6/90    
IPC-QF-143 General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 3-12d Orig. 2/92   W6/11
IPC-CF-148 Resin Coated Metal for Printed Boards 3-12c Superseded by IPC-4563
Rev. A 9/98
Orig. 6/90
   
IPC-MF-150 Metal Foil for Printed Wiring Applications 3-12a Superseded by IPC-4562 5/00
Amend. 1 8/92
Rev. F 10/91 Changed from CF-150 to MF-150
Rev. E 5/81
Rev. D 3/76
Rev. C 8/74
Rev. B 2/71
Rev. A 9/67
Orig. 8/66
   
IPC-CF-152 Composite Metallic Material Specification for Printed Wiring Boards 3-12h

Rev. B 12/97
Rev. A 1/94
Orig. 6/90

   
IPC-FC-203 Specification for Flat Cable, Round Conductor, Ground Plane D-13 Obsolete 7/96
Orig. 7/85
   
IPC-FC-210 Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC) D-13 Obsolete 7/96
Orig. 9/85
   
IPC-FC-213 Performance Specification for Flat Undercarpet Telephone Cable D-13* Obsolete 7/96
Orig. 9/84
   
IPC-FC-217 General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable D-13 Obsolete 7/96
Reaffirmed 4/90
Orig. 8/82
   
IPC-FC-218B/EIA-RS-429 General Specification for Connectors, Electrical Flat Cable Type D-13 Obsolete 7/96
Reaffirmed 05/91
Reaffirmed 11/81
Orig. 7/76
   
IPC-FC-219 Environment Sealed Flat Cable Connectors for use in Aerospace Applications D-13 Obsolete 7/96
Orig. 5/84
   
IPC-FC-220 Specification for Flat Cable, Flat Conductor, Unshielded D-13 Obsolete 7/96
Rev. C 7/85
Rev. B 8/75
Rev. A 1/74
Orig. 5/70
   
IPC-FC-221 Specification for Flat-Copper Conductors for Flat Cables D-13 Obsolete 7/96
Rev. A 5/84
Orig. 8/75
   
IPC-FC-222 Specification of Flat Cable Round Conductor, Unshielded D-13 Obsolete 7/96
Reaffirmed 5/91
Orig. 6/80
   
IPC-FC-225 Flat Cable Design Guide   Obsolete
Reaffirmed 10/85
Orig. 8/75
   
IPC-FC-231 Flexible Base Dielectrics for Use in Flexible Printed Wiring D-13 Superseded by IPC-4202
Amend. 10/95
Rev. C 4/92
Rev. B 2/86
Rev. A 5/83
Orig. 7/74
   
IPC-FC-232 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films D-13 Superseded by 4203 5/02
Amend. 10/95
Rev. C 6/94
Rev. B 2/86
Rev. A 5/83
Orig. 7/74
   
IPC-FC-233 Flexible Adhesive Bonding Films D-13 Incorporated into IPC-FC-232C 6/94
Rev. A 2/86
Orig. 5/83
   
IPC-FC-234 PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits D-1 Orig. 12/97    
IPC-FC-240 Single sided flex D-12 Superseded by IPC-6013 Incorporated into FC-250
Rev. B 1/74
Rev. A 5/69
Orig. 12/65
   
IPC-FC-241 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring D-13* Superseded by IPC-4204
Amend. 10/95
Rev. C 4/92
Rev. B 2/86
Rev. A 5/83
Orig. 7/74
   
IPC-RF-245 Performance Specification for Rigid-Flex Printed Boards D-12 Superseded by IPC-6013
Orig. 4/87
   
IPC-D-249 Design Standard for Flexible Single-and Double-Sided Printed Boards D-11 Superseded by IPC-2223
Orig. 1/87
   
IPC-FC-250 Specification for Single - and Double-Sided Flexible Printed Wiring D-12 Superseded by IPC-6013
Rev. A 9/86
Orig. 1/74
   
IPC-FA-251 Guidelines for Single and Double Sided Flex Circuits D-12 Orig. 2/92    
IPC-D-275 Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies D-31b Superseded by IPC-2221 and 2222 Supersedes IPC-D-319 and IPC-D-949
Amendment 1  4/96
Orig. 9/91
   
IPC-RB-276 Qualification and Performance Specification for Rigid Printed Boards D-33a Superseded by IPC-6011 and IPC-6012
Orig. 3/92; Supersedes IPC-SC-320B and IPC-ML-950C
   
IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies 6-10b Orig. 7/96    
IPC-D-300 Printed Board Dimensions and Tolerances 1-10a Superseded by IPC-2615
Rev. G 1/84
Rev. F 11/74
Rev. E 10/70
Rev. D 1/70
Rev. C 10/65
Rev. B 1/64
Rev. A 7/61
Orig. 8/60
   
IPC-D-310 Guidelines for Phototool Generation and Measurement Techniques   Rev. C  6/91
Rev. B 12/85
Rev. A 12/77
Orig. 9/69
   
IPC-A-311 Process Control Guidelines for Phototool Generation and Use   Orig. 3/96    
IPC-D-316 Design Guide for Microwave Circuit Boards Utilizing Soft Substrates D-21b Superseded by IPC-2252
Orig. 5/95
   
IPC-D-317 Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques D-21a Superseded by IPC-2251
Rev. A 1/95
Orig. 4/90
   
IPC-HF-318 Microwave End Product Board Inspection and Test D-22 Superseded by IPC-6018
Rev. A 12/91
Orig. 6/85
   
IPC-D-319 Design Standard for Rigid Single-and Double-Sided Printed Boards D-31b Superseded by IPC-D-275, then by IPC-2221/2222
Orig. 1/87
   
IPC-SD-320 Performance Specification for Rigid Single- and Double-Sided Printed Boards D-33a Superseded by IPC-RB-276 Supersedes IPC-TC-500
Rev. B 11/86
Rev. A 3/81
Orig. 1/77
   
IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes   Reaffirmed 9/91
Orig. 8/84
  10/94
IPC-MC-324 Performance Specifications for Metal Core Boards D-33a Superseded by IPC-6011 and IPC-6012
Orig. 10/88
   
IPC-D-325 Documentation Requirements for Printed Boards, Assemblies and Support Drawings 2-40 Rev. A 5/95
Orig. 1/87
   
IPC-D-326 Information Requirements for Manufacturing Printed Board Assemblies 2-11a Rev. A 1/04
Orig. 4/91
   
IPC-D-330 Design Guide Manual   Orig. 1/92    
IPC-PD-335 Electronic Packaging Handbook   Orig. 12/89    
IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers   Orig. 8/85   10/85
IPC-D-350 Printed Board Description in Digital Form; Technical Content Identical to IEC-61182-1 2-11 Rev. D 7/92
Rev. C 10/85
Rev. B 8/77
Rev. A 2/75
Orig. 8/72
  07/78
IPC-D-351 Printed Board Drawings in Digital Form   Orig. 8/85   09/85
IPC-D-352 Electronic Design Data Description for Printed Boards in Digital Form   Orig. 8/85   09/85
IPC-D-354 Library Format Description for Printed Boards in Digital Form   Orig. 2/87    
IPC-D-355 Printed Board Assembly Description in Digital Form   Orig. 1/95    
IPC-D-356 Bare Board Electrical Test Information in Digital Form 2-11c Rev. B 10/02
Rev. A 1/98
Orig. 3/92
  08/92
IPC-AM-361 Specification for Rigid Substrates for Additive Process Printed Boards   Superseded by IPC-4101
Orig. 1/82
   
IPC-MB-380 Guidelines for Molded Interconnection Devices   Orig. 10/90    
IPC-D-390 Automated Design Guidelines   Rev. A 2/88
Orig. 7/74
   
IPC-C-406 Design and Application Guidelines for Surface Mount Connectors   Orig. 1/90    
IPC-CI-408 Design and Application Guidelines for the Use of Solderless Surface Mount Connectors   Orig. 1/94    
IPC-BP-421 General Specification for Rigid Printed Board Backplanes with Press Fit Contacts   Obsolete without replacement Reaffirmed 4/90
Orig. 10/80
   
IPC-D-422 Design Guide for Press Fit Rigid Printed Board Backplanes   Orig. 9/82    
IPC-DW-424 General Specification for Encapsulated Discrete Wire Interconnection Boards   Orig. 1/95    
IPC-DW-425 Design and End Product Requirements for Discrete Wiring Boards   Rev. A 5/90
Orig. 9/82
  03/94
IPC-DW-426 Specifications for Assembly of Discrete Wiring   Orig. 12/87    
IPC-TR-460 Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards   Rev. A 2/84
Orig. 1973
   
IPC-TR-461 Solderability Evaluation of Thick and Thin Fused Coatings   Orig. 3/79    
IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage   Orig. 10/87    
IPC-TR-464 Accelerated Aging for Solderability Evaluations 5-23b Rev. A 12/87
Orig. 4/84
   
IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability   Orig. 1993    
IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results   Orig. 1993    
IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase IIA   Orig. 7/96    
IPC-TR-466 Wetting Balance Standard Weight Comparison Test   Orig. 4/95    
IPC-TR-467 Supporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D   Orig. 10/96    
IPC-TR-468 Factors Affecting Insulation Resistance Performance of Printed Boards   Orig. 3/79    
IPC-TR-470 Thermal Characteristics of Multilayer Interconnection Boards   Orig. 1/74    
IPC-TR-474 An Overview of Discrete Wiring Techniques   Obsolete without replacement Reprint 1984
Orig. 3/79
   
IPC-TR-476 How to Avoid Metallic Growth Problems on Electronic Hardware Rev. A Electrochemical Migration Electrically Induced Failures In Printed Assembles   Rev. A 6/84 (new title)
Orig. 9/77
   
IPC-TR-480 Results of Multilayer Test Program Round Robin IV Phase I   Obsolete without replacement
Orig. 9/75
   
IPC-TR-481 Results of Multilayer Test Program Round Robin V   Orig. 4/81    
IPC-TR-482 New Developments in Thin Copper Foils   Orig. 1/76    
IPC-TR-483 Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program   Rev. A 3/91 Addendums 10/87
Orig. 4/84
   
IPC-TR-484 Results of IPC Cooper Foil Ductility Round Robin Study   Orig. 4/86    
IPC-TR-485 Results of Cooper Foil Rupture Strength Test Round Robin Study   Orig. 3/85    
IPC-TR-486 Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations   Orig. 7/01    
IPC-TR-549 Measles in Printed Wiring Boards   Orig. 11/78    
IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components   Orig. 7/93    
IPC-DR-570 General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards 4-12 Obsolete without replacement
Rev. A 4/84
Orig. 1/79
   
IPC-DR-572 Drilling Guidelines for Printed Boards 4-12 Rev. A  3/07
Orig. 4/88
   
IPC-TR-576 Additive Process Evaluation   Obsolete without replacement
Orig. 9/77
   
IPC-TR-578 Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards   Orig. 9/84    
IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards   Orig. 9/88    
IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results   Orig. 10/89    
IPC-TR-581 IPC Phase 3 Controlled Atmosphere Soldering Study   Orig. 8/94    
IPC-TR-582 IPC Phase 3 No-Clean Flux Study   Orig. 11/94    
IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing   Orig. 7/02    
IPC-WP/TR-584 IPC White Paper and Technical Report on Halogen-Free Materials used for Printed Circuit Boards and Assemblies 4-33 Rev. A  8-07
Orig.  4/03
   
IPC-TR-585 Time, Temperature and Humidity Stress of Final Board Finish Solderability   Orig.  5/06    
IPC-TR-586 Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium (supports IPC-4553A) 4-14 Orig. 5/09    
IPC-A-600 Acceptability of Printed Boards 7-31a & D-33a Rev. H  4/10
Amend. 1 01/08
Rev. G  7/04
Rev. F 11/99
Rev. E 8/95
Rev. D '89
Rev. C '78
Rev. B '74
Rev. A '70
Orig. '64
   
IPC-SS-605 Printed Board Quality Evaluation Slide Set   Obsolete without replacement    
IPC-QE-605 Printed Board Quality Evaluation Handbook   Rev. A 2/99    
J-STD-609 Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices 4-34b Rev. A  2/10
Orig. 5/07; supersedes IPC-1066
  01/08
IPC-A-610 Acceptability of Electronic Assemblies 7-31 Rev. E  4/10
Rev. D Amend. 1 4/08
Rev. D 2/05
Rev. C Amend. 1 11/01
Rev. C 1/00
Rev. B 12/94
Rev. A 3/90
Orig. 8/83
  02/02
IPC-A-610DC IPC-A-610D Telecom Addendum   Orig. 8/09    
IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes B-C-D comparison)   Amend. 1  10/05
Orig. 9/02
   
IPC-QE-615 Assembly Quality Evaluation Handbook   Obsolete without replacement    
IPC/WHMA-A-620 Acceptability of Electronic Wire Harnesses and Cables 7-31f Rev. B Amend. 1 8/13
Rev. B 10/12
Rev. A 7/06
Orig. 1/02
   
IPC/WHMA-A-620 Space Hardware Addendum Space Applications Electronic Hardware Addendum for IPC/WHMA-A-620. The addendum MUST be used with the same version of the standard; e.g. 620AS with 620A 7-31fs 620B-Space 6/13
620B-Space Amendment 1 7/12
620A-Space 1/11
   
IPC-A-630 Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures 7-31j Orig. 9/13    
IPC-AI-640 User's Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates   Obsolete without replacement
Orig. 1/87
   
IPC-AI-641 User's Guidelines for Automated Solder Joint Inspection   Obsolete without replacement
Orig. 1/87
   
IPC-AI-642 User's Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB's   Obsolete without replacement
Orig. 10/88
   
IPC-OI-645 Standard for Visual Optical Inspection Aids   Orig. 10/93    
IPC-TM-650 Test Methods Manual   Updated per test method    
IPC-ET-652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards   Superseded by IPC-9252
Orig. 10/90
   
IPC-QL-653 Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material   Rev. A 11/97
Orig. 8/88
  07/89
IPC-MI-660 Incoming Inspection of Raw Materials Manual   Orig. 2/84    
IPC-R-700 Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies   Superseded by IPC-7711A/7721A
Rev. C 1/88
Rev. B 9/77
Rev. A 12/71
Orig. 9/67
   
IPC-TA-720 Technology Assessment Handbook on Laminates   Orig. '86    
IPC-TA-721 Technology Assessment Handbook on Multilayer Boards   Orig. '88    
IPC-TA-722 Technology Assessment of Soldering   Orig. '90    
IPC-TA-723 Technology Assessment Handbook on Surface Mounting   Orig. '91    
IPC-TA-724 Technology Assessment Series on Cleanrooms   Orig. 4/98    
IPC-PE-740 Troubleshooting Guide for Printed Board Manufacture and Assembly 7-23 Rev. A 12/97
Orig. 1/85
   
IPC-CM-770 Printed Board Component Mounting   Rev. E 1/04
Rev. D 1/96
Rev. C 1/87
Rev. B 10/80
Rev. A 3/76
Orig. 9/68
   
IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting   Orig. 3/88    
IPC-SM-782 SurfaceMountDesign and Land Pattern Standard 1-13 Superseded by IPC-7351
Amend. 2  4/99
Amend. 1  10/96
Rev. A 8/93
Orig. 3/87
   
IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation   Orig. 11/90    
IPC-SM-785 Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments   Orig. 11/92    
IPC-SM-786 Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive Ics   Superseded by J-STD-020 and J-STD-033
Rev. A 1/95
Orig. 12/90
   
IPC-MC-790 Guidelines for Multichip Module Technology Utilization   Orig. 8/92    
IPC-S-801   5-23a Superseded by IPC-804 and J-STD-003    
IPC-S-803   5-23a Superseded by IPC-804 and J-STD-003    
IPC-S-804 Solderability Test Methods for Printed Wiring Boards 5-23a Superseded by J-STD-003
Rev. A 1/87
Orig. 1/82
   
IPC-S-805 Solderability Tests for Component Leads and Terminations 5-23b Superseded by J-STD-002
Orig. 1/85
   
IPC-MS-810 Guidelines for High Volume Microsection   Orig. 10/93    
IPC-S-815 General Requirements for Soldering Electronic Interconnections   Superseded byJ-STD-001
Rev. B 12/87
Rev. A 6/81
Orig. 11/77
   
IPC-S-816 SMT Process Guideline and Checklist   Orig. 7/93    
IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives   Orig. 11/89    
IPC-SF-818 General Requirement for Electronic Soldering Fluxes 5-24a Superseded by J-STD-004
Rev. 12/91
Orig. 2/88
   
IPC-SP-819 General Requirements and Test Methods for Electronic Grade Solder Paste 5-24b Superseded by J-STD-005
Orig. 10/88
   
IPC-AJ-820 Assembly and Joining Manual   Rev. A 2/12
Orig. 8/96
   
IPC-CA-821 General Requirements for Thermally Conductive Adhesives   Orig. 1/95    
IPC-CC-830 Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies   Rev. B. Amend. 1 10/08
Rev. B 08/02
Amend. 1 7/99
Rev. A 10/98
Orig. 1/84
   
IPC-HDBK-830 Conformal Coating Handbook 5-33c Rev. A 8/13
Orig. 10/02
   
IPC-SM-839 Pre and Post Solder Mask Application Cleaning Guidelines   Orig. 4/90    
IPC-SM-840 Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards 5-33b Rev. E 12/10
Rev. D 4/07
Rev. C Amend. 1 6/00
Rev. C 1/96
Rev. B 5/88
Rev. A 7/83
Orig. 11/77
  8/83
IPC-HDBK-840 Solder Mask Handbook   Orig. 09/06    
IPC-HDBK-850 Guidelines for Design, Selection and Application of Potting and Encapsulation Materials Used for Electronics Printed Circuit Board Assembly 5-33f Orig. 7/12    
IPC-H-855 Hybrid Microcircuit Design Guide   Obsolete without replacement
Orig. 10/82
   
IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits   Orig. 12/89    
IPC-HM-860 Specification for Multilayer Hybrid Circuits   Orig. 1/87    
IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards   Orig. 11/89    
IPC-ML-910 Design and End Production Specification for Rigid Multilayer Printed Boards D-31b & D-33a Superseded by IPC-D-949, IPC-D-275, and subsequently IPC-2221 for Design and IPC-ML-950, IPC-RB-276, and subsequently IPC-6011 for End Product Specification
Rev. A  8/76
Orig.  6/68
   
IPC-D-949 Design Standard for Rigid Multilayer Printed Boards D-31b Superseded by IPC-D-275 and subsequently by IPC-2221/2222
Orig. 1/87
   
IPC-ML-950 Performance Specification for Rigid Multilayer Printed Boards D-33a Superseded by IPC-RB-276 and subsequently IPC-6011/6012
Rev. C 11/8
Rev. B 12/77
Rev. A 9/70
Orig. 1/66
   
IPC-ML-960 Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards   Orig. 7/94    
IPC-ML-975 End Product Documentation Specification for Multilayer Printed Wiring Boards   Superseded by IPC-D-325
Orig. 9/69
   
IPC-ML-990 Performance Specification for Flexible Multilayer Wiring D-33a Superseded by IPC-6011
Orig. 9/72
   
IPC-TP-1043 Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1   Orig. 8/92    
IPC-TP-1044 Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2   Orig. 10/92    
IPC-1065 Material Declaration Handbook 4-34a Orig. 1/05    
IPC-1066 Labeling of PCBs and Assemblies 4-34b Superseded by J-STD-609
Orig. 12/04
   
IPC-1071 Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing E-20 Orig.  1/11    
IPC-TP-1090 The Layman's Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002   Orig. 7/96    
IPC-TP-1103 Manufacturing Concerns When Soldering with Gold Plated Component Leads or Circuit Board Pads   Obsolete without replacement    
IPC-TP-1114 The Layman's Guide to Qualifying a Process to J-STD-001B   Orig. 1/98    
IPC-TP-1115 Selection and Implementation Strategy for A Low-Residue No-Clean Process   Orig. 12/98    
IPC-1131 IT Guidelines for PWB Manufacturers   Orig. 4/00    
IPC-1331 Voluntary Safety Standard for Electrically Heated Process Equipment   Orig. 3/00    
IPC-1601 Printed Board Handling and Storage Guidelines D-35 Orig. 8/10    
IPC-1710 OEM Standard for Printed Board Manufacturers' Qualification Profile (MQP)   Rev. A 7/04 12/97 updated
Orig. 2/94
   
IPC-1720 Assembly Qualification Profile (AQP)   Rev. A 7/04
Orig. 7/96
   
IPC-1730 Laminator Qualification Profile (LQP)   Rev. A 6/00
Orig. 1/98
   
IPC-1731 Strategic Raw Materials Supplier Qualification Profile 3-12i Orig. 6/00    
IPC-1751 Generic Requirements for Declaration Process Management 2-18 Amendment 1  12/12
Rev. A  2/10 Vers. 1.1  3/07
Orig. 3/06
   
IPC-1752 Materials Declaration Management (Includes 2 PDF forms) 2-18b Rev. A. Amend. 2 2/14
Rev. A Amend. 1 12/12
Rev. A 2/10
Vers. 1.1 3/07
Orig. 3/06
   
IPC-1753 Laboratory Report Standard 2/18j Orig. 2/14    
IPC-1755 Conflict Minerals Data Exchange Standard 2-18h Orig. 3/14    
IPC-1756 Manufacturing Process Data Management 2-18a Orig. 4/10    
IPC-1758 Declaration Requirements for Shipping, Pack and Packing Materials 2-18f Orig. 3/12    
IPC-2141 Controlled Impedance Circuit Boards and High Speed Logic Design D-21c Rev. A 3/04
Amendment 1  2/99
Orig. 4/96
  12/09
IPC-2152 Standard for Determining Current Carrying Capacity in Printed Board Design 1-10b Orig. 8/09   02/11
IPC-2221 Generic Standard on Printed Board Design D-31b Rev. B 11/12
Rev. A 5/03
Amend. 1 01/00
Orig. 2/98; Supersedes IPC-D-275
  09/99
IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards D-31b Rev. A 12/10
Orig. 2/98; Supersedes IPC-D-275
   
IPC-2223 Sectional Design Standard for Flexible Printed Boards D-11 Rev. C 11/11
Rev. B 5/08
Rev. A 6/04
Orig. 11/98; Supersedes IPC-D-249
  09/99
IPC-2224 Sectional Standard for Design of PWBs for PC Cards   Orig. 1/98    
IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies   Orig. 5/98    
IPC-2226 Design Standard for High-Density Array or Peripheral Leaded Component Mounting Structures 1-10 Orig. 4/03   03/09
IPC-2251 Design Guidelines for Electronic Packaging Utilizing High Speed Techniques D-21a Orig. 12/03   08/09
IPC-2252 Design and Manufacturing Guide for RF/Microwave Circuit Boards D-21b Orig. 7/02    
IPC-2291 Design Guideline for Printed Electronics D-61 Orig. 7/13    
IPC/JPCA-2315 Design Guide for High Density Interconnects (HDI) and Microvia D-41a Orig. 6/00    
IPC-2316 Design Guide for Embedded Passive Device Printed Boards D-37a Orig. 3/07    
IPC-2501 Definition for Web-based Exchange of XML Data 2-50 Orig. 7/03    
IPC-2511 Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology 2-11 Rev. B  1/02
Rev. A  1/00
Orig. 1 1/98
   
IPC-2512

Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description

2-11 Rev. A 11/00
Orig. 11/98
   
IPC-2513 Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description 2-11h Rev. A 11/00    
IPC-2514 Sectional Requirements for Implementation of Printed Board Manufacturing Data Description 2-11 Rev. A 11/00    
IPC-2515 Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description 2-11 Rev. A 11/00    
IPC-2516 Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description 2-11e Rev. A 11/00    
IPC-2517 Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description 2-11g Rev. A 11/00    
IPC-2518 Sectional Requirements for Implementation of Part List Product Data Description 2-11 Rev. A 11/00    
IPC-2524 PWB Fabrication Data Quality Rating System 2-10 Orig. 2/99    
IPC-2531 Standard Recipe File Format Specification 2-12 Orig. 3/99    
IPC-2541 Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication 2-13a Orig. 10/01    
IPC-2546 Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication 2-13b Amend. 2  01/05
Amend. 1  01/03
Orig. 10/01
   
IPC-2547 Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication 2-13c Orig. 1/02    
IPC-2571 Generic Requirements for Electronic Manufacturing Supply Chain Communication-Product Data Exchange (PDX) 2-15a Orig. 11/01    
IPC-2576 Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Exchange (PDX) 2-15c Orig. 11/01    
IPC-2578 Sectional Requirements for Supply Chain Communication of Bill of material and Product Design Configuration Data-Product Data Exchange (PDX) 2-15e Orig. 11/01    
IPC-2581 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology (Offspring) 2-17 Rev. B 9/13
Rev. A 5/12
Amend. 1  5/07
Orig. 3/04
   
IPC-2582 Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description 2-17 Orig. 5/07    
IPC-2583 Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description 2-17 Orig. 5/07    
IPC-2584 Sectional Requirements for Implementation of Printed Board Fabrication Data Description 2-17 Orig. 5/07    
IPC-2588 Sectional Requirements for Implementation of Part List Product Data Description 2-17 Orig. 5/07    
IPC-2611 Generic Requirements for Electronic Product Documentation 2-40 Orig. 4/10    
IPC-2612 Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions) 2-40 Orig. 4/10    
IPC-2612-1 Sectional Requirements for Electronic Diagramming Symbol Generation Methodology 2-40 Orig. 4/10    
IPC-2614 Sectional Requirements for Board Fabrication Documentation 2-40 Orig. 4/10    
IPC-2615 Printed Board Dimensions and Tolerances   Orig. 6/00; Supersedes IPC-D-300   11/10
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives   Orig. 7/96    
IPC-3408 General Requirements for Anistropically Conductive Adhesive Films   Orig. 11/96    
IPC-4101 Specification for Base Materials for Rigid and Multilayer Boards 3-11 Rev. C 8/09
Rev. B Amends 1&2  4/07
Rev. B Amend. 1  2/07
Rev. B  6/06
Rev. A Amend. 1 6/02
Rev. A 6/02 Supersedes IPC-L-108, IPC-L-109, IPC-L-112, IPC-L-115
Orig. 12/97
   
IPC-4103 Specification for Plastic Substrates, Clad or Unclad, for High Speed/High Frequency Interconnection D-23 Rev. A Amend. 1 3/14
Rev. A 12/11
Orig. 01/02; Supersedes IPC-L-125
   
IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials 3-10 Orig. 5/99    
IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards 3-12* Orig. 8/98    
IPC-4121 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications 3-11c Orig. 1/00; Supersedes IPC-CC-110ª    
IPC-4130 Specification and Characterization Methods for Nonwoven "E" Glass Mat 3-12f Orig. 9/98    
IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Wiring D-13 Rev. A  4/10
Orig. 5/02; Supersedes IPC-FC-231C
  02/03
IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets D-13 Rev. A 1/13
Orig. 5/02; Supersedes IPC-FC-232C
  02/03
IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of D-13 Rev. A Amend. 1 2/14
Rev. A 10/11
Orig. 5/02; Supersedes IPC-FC-241C
  02/03
IPC-4411 Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement 3-12* Rev. A 11/03
Orig. 4/99
   
IPC-4412 Specification for Finished Fabric Woven form "E" Glass for Printed Boards 3-12d Rev. B 05/13
Rev. A w/Amends 1, 2 & 3 07/11
Rev. A Amend. 3 12/10
Rev. A Amend. 2  5/09
Rev. A Amend. 1  3/08
Rev. A 1/06
Orig. 6/02; Supersedes IPC-EG-140
  02/03
IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards 4-14 Amend. 2 12/12
Amend. 1 06/12
Orig. 10/02
   
IPC-4553 Specification for Immersion Silver Plating for Printed Circuit Boards 4-14 Rev. A 5/09
Orig. 6/05
   
IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards 4-14 Orig. Amend. 1 9/11
Orig. 2/07
   
IPC-4556 Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards 4-14 Orig. 1/13    
IPC-4562 Metal Foil for Printed Wiring Applications 3-12a Rev. A 4/08
Amend. 1  5/05
Orig. 5/00; Supersedes IPC-MF-150F
  02/03
IPC-4563 Resin Coated Copper Foil for Printed Boards Guideline 3-12c Orig. (replaces CF-148A) 11/07    
IPC-4591 Requirements for Printed Electronics Functional Conductive Materials D-62 Orig. 12/12    
IPC-4761 Design Guide for Protection of Printed Board Via Structures   Orig. 7/06    
IPC-4781 Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks 5-33e Orig. 5/08    
IPC-4811 Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards D-52 Orig. 4/08    
IPC-4821 Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards D-52 Amend. 1  4/10
Orig. 5/06
   
IPC-4921 Requirements for Printed Electronics Base Materials (Substrates) D-63 Orig. 6/12    
IPC-5701 Users Guide for Cleanliness of Unpopulated Printed Boards   Orig. 7/03    
IPC-5702 Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards 5-32c Orig. 6/07    
IPC-5703 Cleanliness Guidelines for Printed Board Fabricators 5-32c Orig. 5/13    
IPC-5704 Cleanliness Requirements for Unpopulated Printed Boards 5-32c Orig. 12/09    
IPC-6011 Generic Performance Specification for Printed Boards D-33a Orig. 7/96    
IPC-6012 Qualification and Performance Specification for Rigid Printed Boards D-33a Rev. C  4/10
Rev. B w/Amend. 1 & 2  3/08
Rev. B w/Amend. 1  2/07
Rev. B 8/04
Rev. A Amend. 1  7/00
Rev. A  10/99
Orig.  7/96
   
IPC-6012C-TC Test Coupon Addendum to IPC-6012C Qualification and Performance Specification for Rigid Printed Boards D-33ac Orig. 8/13    
IPC-6013 Qualification and Performance Specification for Flexible Printed Boards D-12 Rev. C. 12/13 
Rev. B.  1/09
Rev. A w/Amend. 2  4/06
Rev. A Amend. 1  1/05
Rev. A  11/03; Supersedes IPC-RF-245 and IPC-FC-250
Amend. 1  4/00
Orig. 11/98
   
IPC-6015 Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures N/A Orig. 2/98    
IPC-6016 Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards D-10 Orig. 5/99    
IPC-6017 Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices D-53 Orig. 3/09    
IPC-6018 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards D-22 Rev. B 11/11
Rev. A  1/02
Orig. 1/98
   
IPC/JPCA-6202 Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards D-12* Orig. 2/99    
IPC/JPCA-6801 Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection N/A Orig. 1/00    
IPC-7093 Design and Assembly Process Implementation for Bottom Termination SMT Components 5-21h Orig. 3/11    
IPC-7094 Design and Assembly Process Implementation for Flip Chip and Die Size Components 5-21g Orig. 1/09    
IPC-7095 Design and Assembly Process Implementation for BGAs 5-21f Rev. C 1/13
Rev. B  3/08
Rev. A 11/04
Orig. 8/00
   
IPC-7351 Generic Requirements for SurfaceMountDesign and Land Pattern Standard 1-13 Rev. B 6/10
Rev. A  2/07 Supersedes IPC-SM-782A with
Amendments 1 & 2
Orig.  2/05
   
IPC-7525 Guidelines for Stencil Design 7-21e Rev. B 10/11
Rev. A  2/07
Orig.  5/00
   
IPC-7526 Stencil and Misprinted Board Cleaning Handbook 5-21jND Orig.  2/07    
IPC-7527 Requirements for Solder Paste Printing 5/21jND Orig. 5/12    
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Wave and Reflow) Processes 5-20/5-22 Orig.  5/01    
IPC-7711/7721 Rev. B renamed to: Rework, Repair and Modification of Electronic Assemblies 5-31h Rev. B  11/07
Rev. A  10/03
Orig.  4/98; Supersedes IPC-R-700C
   
IPC-7912 Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies 5-22g Rev. A  1/04
Orig.  7/00
   
IPC-8413-1 Specification for Manufacturing Process Carriers for Handling Optical Fiber 5-25a Orig.  4/03    
IPC-8497-1 Cleaning Methods and Contamination Assessment for Optical Assembly 5-25e Orig. 12/05    
IPC-9151 Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database D-36 Rev. D 5/12
Rev. C 5/10
Rev. B  2/07
Rev. A 5/03
Orig.  6/02
   
IPC-9191 General Guideline for implementation of Statistical Process Control (SPC) 7-22 Supersedes IPC-PC-90
Orig. 11/99
  02/03
IPC-9194 Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline 7-22 Orig.  9/04    
IPC-9199 SPC Quality Rating 7-22 Orig.  9/02    
IPC-9201 Surface Insulation Resistance Handbook 5-32b Rev. A  8/07
Orig.  7/96
   
IPC-9202 Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance 5-32b Orig. 10/11    
IPC-9203 Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 5-32b Orig. 5/12    
IPC-9251 Test Vehicles for Evaluating Fine Line Capability   Orig.  7/00    
IPC-9252 Requirements for Electrical Testing of Unpopulated Printed Boards 7-32c Rev. A Amend. 1  10/12
Rev. A  11/08
Orig. 02/01; Supersedes IPC-ET-652A
  04/09
IPC-9261 In-Process DPMO and Estimated Yield for PWAs 5-22g Rev. A 10/06
Orig. 3/02
   
IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components 5-21c Orig. 7/95    
IPC-9502 PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components   Orig. 4/99    
IPC-9503 Moisture Sensitivity Classification for Non-IC Components   Superseded by J-STD-075 08/08
Orig. 4/99
   
IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components   Orig. 6/98    
IPC-9591 Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices 9-81 Orig.  4/06    
IPC-9592 Requirements for Power Conversion Devices for the Computer and Telecommunications Industries 9-82 Rev. B 1/13
Rev. A  5/10
Orig.  9/08
   
IPC-9631 User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation D-32 Orig. 12/10    
IPC-9641 High Temperature Printed Board Flatness Guideline 6-11 Orig. 7/13    
IPC-9691 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) 5-32e Rev. A  8/07
Orig. 10/05
   
IPC-9701 Qualification and Performance Test Methods for Surface Mount Solder Attachments 6-10d Rev. A  2/06
Orig.  1/02
   
IPC/JEDEC-9702 Monotonic Bend Characterization of Board-Level Interconnects 6-10d Orig.  6/04    
IPC/JEDEC-9703 Mechanical Shock Test Guidelines for Solder Joint Reliability 6-10d Orig.  3/09    
IPC/JEDEC-9704 Printed Wiring Board Strain Gage Test Guideline 6-10d Rev. A 2/12
Orig.  6/05
   
IPC/JEDEC-9706 Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection 6-10d Orig. 1/14    
IPC/JEDEC-9707 Spherical Bend Test Method for Characterization of Board Level Interconnects 6-10d Orig. 9/11    
IPC-9708 Test Methods for Characterization of Printed Board Assembly Pad Cratering 6-10d Orig. 12/10    
IPC-9709 Test Guidelines for Acoustic Emission Measurement during Mechanical Test 6-10d Orig. 12/13    
IPC-9850 SurfaceMountEquipment Performance Characterization   Rev. A 11/11
Orig.  7/02
   
IPC-SMEMA-9851 Equipment Interface Specification   Orig. 11/04    
IPC-DRM-SMT Surface Mount Solder Joint Evaluation Desk Reference Manual   Rev. C 11/05
Rev. B 4/00
Rev. A 3/99
Orig. 7/98
   
IPC-EMSI-TC IPC Sample Master Ordering Agreement for EMS Companies and OEMs   Orig.  3/02    
Roadmap International Technology Roadmap for Electronic Interconnections 8-40 Updated 2013
Updated 2011
Updated 2009
Updated 2007
Updated 2005
Updated 2003
Updated 2001
Updated 9/97
Orig. 6/95