J-STD-001

Requirements for Soldered Electrical and Electronic Assemblies

Rev D 2/05
Rev. C 3/00
Rev. B 10/96
Rev. A 1/95
Orig. 4/92; Supersedes IPC-S-815

04/05

04/05

J-STD-001CS

Space Applications Electronic Hardware Addendum for J-STD-001C

CS 1/04

J-STD-001DS

Space Applications Electronic Hardware Addendum for J-STD-001D

DS 11/06

IPC-HDBK-001

Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies

Amend 2 10/05
Amend. 1 12/00
Orig. 3/98

07/01

SMC-TR-001

An Introduction to Tape Automated Bonding Fine Pitch Technology

Orig. 1/89

IT-WP-001

Myths of E-Commerce

Orig. 9/00

SMC-WP-001

Soldering Capability White Paper Report

Orig. 8/91

SMEMA 1.2

Mechanical Equipment Interface Standard

Update IPC-SMEMA-9851

JP002

Current Tin Whiskers Theory and Mitigation Practices Guideline

Orig. 3/06

J-STD-002

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

Rev. C 12/07
Rev. B 02/03
Rev. A 10/98
Orig. 4/92; Supersedes IPC-S-805

Y

05/95

SMC-WP-002

An Assessment of the Use of Lead in Electronic Assembly

Orig. 8/92

J-STD-003

Solderability Tests for Printed Boards

Rev. B 02/07
Rev. A 02/03
Original 4/92; Supersedes IPC-S-804

Y

SMC-WP-003

Chip Mounting Technology

Orig. 8/93

SMEMA 3.1

Fiducial Mark Standard

J-STD-004

Requirements for Soldering Fluxes

Rev. A 01/04
Orig. 1/95 Supersedes IPC-SF-818

Y

05/95

SMC-WP-004

Design for Success

Orig. 4/97

SMEMA 4

Reflow Terms and Definitions

Orig.

J-STD-005

Requirements for Soldering Pastes

Amend. 1 6/96
Orig. 1/95 Supersedes IPC-SP-819

Y

05/95

SMC-WP-005

PWB Surface Finishes

Orig. 4/97

IPC-HDBK-005

Guide to Solder Paste Assessment

Orig. 1/06

SMEMA 5

Screen Printing Terms and Definitions

Orig.

J-STD-006

Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

Rev. B 01/06
Rev. A 05/01
Orig. 1/95

Y

05/95

SMEMA 6

Electronics Cleaning Terms and Definitions

Orig.

SMEMA 7

Fluid Dispensing Terms and Definitions

Orig.

WP-008

Setting up Ion Chromatography Capability

Orig. 12/05

J-STD-012

Implementation of Flip Chip and Chip Scale Technology

Orig. 1/96

Y

J-STD-013

Implementation of Ball Grid Array and Other High Density Technology

Orig. 7/96

Y

IPC-DRM-18

Component Identification Desk Reference Manual

Rev. G 9/03
Rev. F 8/01
Rev. E 8/00
Rev. D 7/99
Rev. C 7/98
Rev. B 2/97
Rev. A 4/96
Orig. 9/95

J-STD-020

Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices

Rev D 08/07
Rev. C 7/04
Rev. B 7/02
Rev. A 4/99
Orig. 10/96

J-STD-026

Semiconductor Design Standard for Flip Chip Applications

Orig. 8/99

J-STD-027

Mechanical Outline Standard for Flip Chip or Chip Scale Configurations

Orig. 02/03

J-STD-028

Performance Standard for Flip Chip Scale Bumps

Orig. 8/99

J-STD-030

Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages

Orig. 9/05

J-STD-032

Performance Standard for Ball Grid Array Bumps and Columns

Orig. 6/02

J-STD-033

Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices

Rev B Amend 1 01/07
Rev B 10/05
Rev. A 7/02
Orig. 4/99

J-STD-035

Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components

Orig. 4/99

IPC-0040

Standards Roadmap for Optoelectronic Assembly and Packaging Technology

Orig. 5/03

IPC-DRM-40
IPC-DRM-PTH

Through-Hole Solder Joint Evaluation Desk Reference Manual

Rev D 11/05
Renamed to DRM-PTH
Rev. E 2/02
Rev. D 7/00
Rev. C 9/99
Rev. B 1/99
Rev. A 8/97
Orig. 5/97

IPC-T-50

Terms and Definitions Interconnecting and Packaging Electronic Circuits

Rev. G 12/03
Rev. F 6/96
Rev. E 7/92
Rev. D 11/88
Rev. C 3/85
Rev. B 6/80
Rev. A 8/76
Orig. 8/75

IPC-DRM-53

Introduction to Electronics Assembly

Orig. 6/00

IPC-DRM-56

Wire Preparation & Crimping

Orig. 07/02

IPC-SC-60

Post Solder Solvent Cleaning Handbook

Rev. A 8/99
Orig. 4/87

10/99

IPC-SA-61

Post-Solder Semi-Aqueous Cleaning Handbook

Rev. A 6/02
Orig. 7/95

IPC-AC-62

Post Solder Aqueous Cleaning Handbook

Rev. A 1/96
Orig. 12/86

IPC-CH-65

Guidelines for Cleaning of Printed Boards and Assemblies

Rev. A 9/99
Orig. 12/90

10/99

IPC-CS-70

Guidelines for Chemical Handling Safety in Printed Board Manufacturing

Orig. 8/88 Obsolete without replacement

IPC-CM-78

Guidelines for Surface Mounting and Interconnecting Chip Carriers

Superseded by IPC-SM-780
Rev. C - 3/88
Orig. 11/83

IPC-MP-83

IPC Policy on Metrication

Orig. 8/85 Obsolete without replacement

IPC-PC-90

General Requirements for Implementation of Statistical Process Control

Superseded by IPC-9191
Orig. 10/90

IPC-QS-95

General Requirements for Implementation of ISO 9000 Quality Systems

Obsolete without replacement
Orig. 4/93

IPC-L-108

Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards

Superseded by IPC-4101
Rev. B 6/90
Rev. A 10/80
Orig. 3/76

IPC-L-109

Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards

Superseded by IPC-4101
Rev. B 7/92
Rev. A 10/80
Orig. 3/76

IPC-L-110

Preimpregnated, B-Stage Epoxy-Glass Cloth for Multilayer Printed Circuit Boards

Rev. A Superseded by IPC-L-109 and IPC-4101

IPC-CC-110

Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications

Superseded by IPC-4121
Rev. A 12/97
Orig. 1/94

IPC-L-112

Specification for Composite Metal Clad Base materials for Printed Boards

Superseded by IPC-4101
Rev. A 6/92
Orig. 7/81

IPC-L-115

Specification for Rigid Metal Clad Base Materials for Printed Boards

Superseded by IPC-4101
Rev. B 4/90
Rev. A 10/80
Orig. 3/77

IPC-L-120

Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates

Obsolete without replacement

IPC-L-125

Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections

Superseded by IPC-4103
Rev. A 7/92
Orig. 8/83

IPC-L-130

Specifications for Thin Laminates, Metal Clad, Primarily for General-Purpose Multilayer Printed Boards

Superseded by IPC-L-108 and IPC-4101
Orig. 1/77

IPC-DD-135

Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules

Orig. 8/95

IPC-EG-140

Specification for Finished Fabric Woven from "E" Glass for Printed Boards

Superseded by IPC-4412
Amend. 1 & 2 6/97
Orig. 3/88

IPC-SG-141

Specification for Finished Fabric Woven from "S" Glass for Printed Boards

Orig. 2/92

IPC-A-142

Specification for Finished Fabric Woven from Aramid for Printed Boards

Orig. 6/90

IPC-QF-143

General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

Orig. 2/92

IPC-CF-148

Resin Coated Metal for Printed Boards

Superseded by IPC-4563
Rev. A 9/98
Orig. 6/90

10/98

IPC-MF-150

Metal Foil for Printed Wiring Applications

Superseded by IPC-4562
Rev. F 10/91 Changed from CF-150 to MF-150
Rev. E 5/81
Rev. D 3/76
Rev. C 8/74
Rev. B 2/71
Rev. A 9/67
Orig. 8/66

IPC-CF-152

Composite Metallic Material Specification for Printed Wiring Boards

B 12/97
A 1/94
Orig. 6/90

IPC-FC-203

Specification for Flat Cable, Round Conductor, Ground Plane

Obsolete 7/96
Orig. 7/85

IPC-FC-210

Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC)

Obsolete 7/96
Orig. 9/85

IPC-FC-213

Performance Specification for Flat Undercarpet Telephone Cable

Obsolete 7/96
Orig. 9/84

IPC-FC-217

General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable

Obsolete 7/96
Reaffirmed 4/90
Orig. 8/82

IPC-FC-218B/EIA-RS-429

General Specification for Connectors, Electrical Flat Cable Type

Obsolete 7/96
Reaffirmed 05/91
Reaffirmed 11/81
Orig. 7/76

IPC-FC-219

Environment Sealed Flat Cable Connectors for use in Aerospace Applications

Obsolete 7/96
Orig. 5/84

IPC-FC-220

Specification for Flat Cable, Flat Conductor, Unshielded

obsolete 7/96
Rev. C 7/85
Rev. B 8/75
Rev. A 1/74
Orig. 5/70

IPC-FC-221

Specification for Flat-Copper Conductors for Flat Cables

Obsolete 7/96
Rev. A 5/84
Orig. 8/75

IPC-FC-222

Specification of Flat Cable Round Conductor, Unshielded

Obsolete 7/96
5/91 Reaffirmed
Orig. 6/80

IPC-FC-225

Flat Cable Design Guide

Obsolete (date)
10/85 Reaffirmed
Orig. 8/75

IPC-FC-231

Flexible Base Dielectrics for Use in Flexible Printed Wiring

Superseded by IPC-4202
Amend. 10/95
Rev. C 4/92
Rev. B 2/86
Rev. A 5/83
Orig. 7/74

IPC-FC-232

Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films

Superseded by 4203
Amend. 10/95
Rev. C 6/94
Rev. B 2/86
Rev. A 5/83
Orig. 7/74

IPC-FC-233

Flexible Adhesive Bonding Films

Incorporated into IPC-FC-232B

IPC-FC-234

PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits

Orig. 12/97

IPC-FC-240

Single sided flex

Superseded by IPC-6013
Incorporated into FC-250
Rev. B 1/74
Rev. A 5/69
Orig. 12/65

IPC-FC-241

Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring

Superseded by IPC-4204
Amend. 10/95
Rev. C 4/92
Rev. B 2/86
Rev. A 5/83
Orig. 7/74

IPC-RF-245

Performance Specification for Rigid-Flex Printed Boards

Superseded by IPC-6013
Orig. 4/87

IPC-D-249

Design Standard for Flexible Single-and Double-Sided Printed Boards

Superseded by IPC-2223
Orig. 1/87

IPC-FC-250A

Specification for Single - and Double-Sided Flexible Printed Wiring

Superseded by IPC-6013
Rev. A 9/86
Orig. 9/86

IPC-FA-251

Guidelines for Single and Double Sided Flex Circuits

Orig. 2/92

IPC-D-275

Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies

Superseded by IPC-2221 and 2222
Supersedes IPC-D-319 and IPC-D-949
Amendment.1 4/96
Orig. 9/91

IPC-RB-276

Qualification and Performance Specification for Rigid Printed Boards

Superseded by IPC-6011 and IPC-6012
Orig. 3/92 Supersedes IPC-SC-320B and IPC-ML-950C

IPC-D-279

Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies

Orig. 7/96

IPC-D-300

Printed Board Dimensions and Tolerances

Superseded by IPC-2615
Rev. G 1/84
Rev. F 11/74
Rev. E 10/70
Rev. D 1/70
Rev. C 10/65
Rev. B 1/64
Rev. A 7/61
Orig. 8/60

IPC-D-310

Guidelines for Phototool Generation and Measurement Techniques

Rev. C 06/91
Rev. B 12/85
Rev. A 12/77
Orig. 9/69

IPC-A-311

Process Control Guidelines for Phototool Generation and Use

Orig. 3/96

IPC-D-316

Design Guide for Microwave Circuit Boards Utilizing Soft Substrates

Superseded by IPC-2252
Orig. 5/95

IPC-D-317

Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques

Superseded by IPC-2251
Rev. A 1/95
Orig. 4/90

IPC-HF-318

Microwave End Product Board Inspection and Test

Superseded by IPC-6018
Rev. A 12/91
Orig. 6/85

IPC-D-319

Design Standard for Rigid Single-and Double-Sided Printed Boards

Superseded by IPC-D-275, then by IPC-2221/2222
Orig. 1/87

IPC-SD-320

Performance Specification for Rigid Single- and Double-Sided Printed Boards

Superseded by IPC-RB-276
Supersedes IPC-TC-500
Rev. B 11/86
Rev. A 3/81
Orig. 1/77

IPC-D-322

Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes

Reaffirmed 9/91
Orig. 8/84

IPC-MC-324

Performance Specifications for Metal Core Boards

Superseded by IPC-6011 and IPC-6012
Orig. 10/88

IPC-D-325

Documentation Requirements for Printed Boards, Assemblies and Support Drawings

Rev. A 5/95
Orig. 1/87

IPC-D-326

Information Requirements for Manufacturing Printed Board Assemblies

Rev. A 1/04
Orig. 4/91

IPC-D-330

Design Guide Manual

Date

IPC-PD-335

Electronic Packaging Handbook

Orig. 12/89

IPC-NC-349

Computer Numerical Control Formatting for Drillers and Routers

Orig. 8/85

IPC-D-350

Printed Board Description in Digital Form; Technical Content Identical to IEC-61182-1

Rev. D 7/92
Rev. C 10/85
Rev. B 8/77
Rev. A 2/75
Orig. 8/72

IPC-D-351

Printed Board Drawings in Digital Form

Orig. 8/85

IPC-D-352

Electronic Design Data Description for Printed Boards in Digital Form

Orig. 8/85

IPC-D-354

Library Format Description for Printed Boards in Digital Form

Orig. 2/87

IPC-D-355

Printed Board Assembly Description in Digital Form

Orig. 1/95

IPC-D-356

Bare Board Electrical Test Information in Digital Form

Rev. B 10/02
Rev. A 1/98
Orig. 3/92

IPC-AM-361

Specification for Rigid Substrates for Additive Process Printed Boards

Superseded by IPC-4101
Orig. 1/82

IPC-MB-380

Guidelines for Molded Interconnection Devices

Orig. 10/90

IPC-D-390

Automated Design Guidelines

Rev. A 2/88
Orig. 7/74

IPC-C-406

Design and Application Guidelines for Surface Mount Connectors

Orig. 1/90

IPC-CI-408

Design and Application Guidelines for the Use of Solderless Surface Mount Connectors

Orig. 1/94

IPC-BP-421

General Specification for Rigid Printed Board Backplanes with Press Fit Contacts

Obsolete without replacement
Reaffirmed 4/90
Orig. 10/80

IPC-D-422

Design Guide for Press Fit Rigid Printed Board Backplanes

Orig. 9/82

IPC-DW-424

General Specification for Encapsulated Discrete Wire Interconnection Boards

Orig. 1/95

IPC-DW-425

Design and End Product Requirements for Discrete Wiring Boards

Rev. A 5/90
Orig. 9/82

IPC-DW-426

Specifications for Assembly of Discrete Wiring

Orig. 12/87

IPC-TR-460

Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards

Rev. A 2/84
Orig. 1973

IPC-TR-461

Solderability Evaluation of Thick and Thin Fused Coatings

Orig. 3/79

IPC-TR-462

Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage

Orig. 10/87

IPC-TR-464

Accelerated Aging for Solderability Evaluations

Rev. A 12/87
Orig. Pub.4/84

IPC-TR-465-1

Round Robin Test on Steam Ager Temperature Control Stability

Orig. 1993

IPC-TR-465-2

The Effect of Steam Aging Time and Temperature on Solderability Test Results

Orig. 1993

IPC-TR-465-3

Evaluation of Steam Aging on Alternative Finishes, Phase IIA

Orig. 7/96

IPC-TR-466

Wetting Balance Standard Weight Comparison Test

Orig. 4/95

IPC-TR-467

Supporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D

Orig. 10/96

IPC-TR-468

Factors Affecting Insulation Resistance Performance of Printed Boards

Orig. 3/79

IPC-TR-470

Thermal Characteristics of Multilayer Interconnection Boards

Orig. 1/74

IPC-TR-474

An Overview of Discrete Wiring Techniques

Obsolete without replacement
Reprint 1984
Orig. 3/79

IPC-TR-476

How to Avoid Metallic Growth Problems on Electronic Hardware
Rev. A Electrochemical Migration Electrically Induced Failures In Printed Assembles

Rev. A 6/84 (new title)
Orig. 9/77

IPC-TR-480

Results of Multilayer Test Program Round Robin IV Phase I

Obsolete without replacement
Orig. 9/75

IPC-TR-481

Results of Multilayer Test Program Round Robin V

Orig. 4/81

IPC-TR-482

New Developments in Thin Copper Foils

Orig. 1/76

IPC-TR-483

Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program

Rev. A 3/91
Addendums 10/87
Orig. 4/84

IPC-TR-484

Results of IPC Cooper Foil Ductility Round Robin Study

Orig. 4/86

IPC-TR-485

Results of Cooper Foil Rupture Strength Test Round Robin Study

Orig. 3/85

IPC-TR-486

Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations

Orig. 07/01

IPC-TR-549

Measles in Printed Wiring Boards

Orig. 11/78

IPC-TR-551

Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components

Orig. 7/93

IPC-DR-570

General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards

Obsolete without replacement
Rev. A 4/84
Orig. 1/79

IPC-DR-572

Drilling Guidelines for Printed Boards

Rev A 03/07
Orig. 4/88

IPC-TR-576

Additive Process Evaluation

Obsolete without replacement
Orig. 9/77

IPC-TR-578

Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards

Orig. 9/84

IPC-TR-579

Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards

Orig. 9/88

IPC-TR-580

Cleaning and Cleanliness Test Program Phase 1 Test Results

Orig. 10/89

IPC-TR-581

IPC Phase 3 Controlled Atmosphere Soldering Study

Orig. 8/94

IPC-TR-582

IPC Phase 3 No-Clean Flux Study

Orig. 11/94

IPC-TR-583

An In-Depth Look At Ionic Cleanliness Testing

Orig. 7/02

IPC-WP/TR-584

IPC White Paper and Technical Report on Halogen-Free Materials used for Printed Circuit Boards and Assemblies

Rev A 08-07
Orig. 04/03

IPC-TR-585

Time, Temperature and Humidity Stress of Final Board Finish Solderability

Orig. 05/06

IPC-A-600

Acceptability of Printed Boards

Rev. G 07/04
Rev. F 11/99
Rev. E 8/95
Rev. D '89
Rev. C '78
Rev. B '74
Rev. A '70
Orig. '64

IPC-SS-605

Printed Board Quality Evaluation Slide Set

Obsolete without replacement

IPC-QE-605

Printed Board Quality Evaluation Handbook

Rev. A 2/99

J-STD-609

Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices

Orig. 05/07

IPC-A-610

Acceptability of Electronic Assemblies

Rev. D 2/05
Rev. C 1/00
Rev. B 12/94
Rev. A 3/90
Orig. 8/83

04/05

04/05

IPC-HDBK-610

Handbook and Guide to IPC-A-610 (Includes B-C-D comparison)

Amend 1 10/05
Orig. 9/02

IPC-QE-615

Assembly Quality Evaluation Handbook

Obsolete without replacement

IPC/WHMA-A-620

Acceptability of Electronic Wire Harnesses and Cables

Rev A 07/06
Orig. 01/02

03/02

IPC-AI-640

User's Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates

Obsolete without replacement
Orig. 1/87

IPC-AI-641

User's Guidelines for Automated Solder Joint Inspection

Obsolete without replacement
Orig. 1/87

IPC-AI-642

User's Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB's

Obsolete without replacement
Orig. 10/88

IPC-OI-645

Standard for Visual Optical Inspection Aids

Orig. 10/93

IPC-TM-650

Test Methods Manual

Updated per test method

IPC-ET-652

Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards

Orig. 10/90 Superseded by IPC-9252

IPC-QL-653

Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material

Rev. A 11/97
Orig. 8/88

IPC-MI-660

Incoming Inspection of Raw Materials Manual

Orig. 2/84

IPC-R-700

Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies

Superseded by IPC-7711A/7721A
C 1/88
B 9/77
A 12/71
Orig. 9/67

IPC-TA-720

Technology Assessment Handbook on Laminates

Orig. ’86

IPC-TA-721

Technology Assessment Handbook on Multilayer Boards

Orig. ’88

IPC-TA-722

Technology Assessment of Soldering

Orig. ’90

IPC-TA-723

Technology Assessment Handbook on Surface Mounting

Orig. ’91

IPC-TA-724

Technology Assessment Series on Cleanrooms

Orig. 4/98

IPC-PE-740

Troubleshooting Guide for Printed Board Manufacture and Assembly

Rev. A 12/97
Orig. 1/85

IPC-CM-770

Printed Board Component Mounting

Rev. E 1/04
Rev. D 1/96
Rev. C 1/87
Rev. B 10/80
Rev. A 3/76
Orig. 9/68

IPC-SM-780

Component Packaging and Interconnecting with Emphasis on Surface Mounting

Orig. 3/88

IPC-SM-782

Surface Mount Design and Land Pattern Standard

Superseded by IPC-7351
Amend. 2 04/99
Amend. 1 10/96
Rev. A 8/93
Orig. 3/87

IPC-SM-784

Guidelines for Chip-on-Board Technology Implementation

Orig. 11/90

IPC-SM-785

Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments

Orig. 11/92

IPC-SM-786

Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive ICs

Superseded by J-STD-020 and J-STD-033
Rev. A 1/95
Orig. 12/90

IPC-MC-790

Guidelines for Multichip Module Technology Utilization

Orig. 8/92

IPC-S-801

Superseded by IPC-804 and J-STD-003

IPC-S-803

Superseded by IPC-804 and J-STD-003

IPC-S-804

Solderability Test Methods for Printed Wiring Boards

Superseded by J-STD-003
Rev. A 1/87
Orig. 1/82

IPC-S-805

Solderability Tests for Component Leads and Terminations

Superseded by
J-STD-002
Orig. 1/85

IPC-MS-810

Guidelines for High Volume Microsection

Orig. 10/93

IPC-S-815

General Requirements for Soldering Electronic Interconnections

Superseded byJ-STD-001
Rev. B 12/87
Rev. A 6/81
Orig. 11/77

IPC-S-816

SMT Process Guideline and Checklist

Orig. 7/93

IPC-SM-817

General Requirements for Dielectric Surface Mounting Adhesives

Orig. 11/89

IPC-SF-818

General Requirement for Electronic Soldering Fluxes

Superseded by J-STD-004
Rev. 12/91
Orig. 2/88

IPC-SP-819

General Requirements and Test Methods for Electronic Grade Solder Paste

Orig. 10/88 Superseded by J-STD-005

IPC-AJ-820

Assembly and Joining Manual

Orig. 8/96

IPC-CA-821

General Requirements for Thermally Conductive Adhesives

Orig. 1/95

IPC-CC-830

Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies

Rev B 08/02
Amend. 1 7/99
Rev. A 10/98
Orig. 1/84

08/02

IPC-HDBK-830

Conformal Coating Handbook

Orig. 10/02

IPC-SM-839

Pre and Post Solder Mask Application Cleaning Guidelines

Orig. 4/90

IPC-SM-840

Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards

Rev. D 4/07
Amend. 1 6/00
Rev. C 1/96
Rev. B 5/88
Rev. A 7/83
Orig. 11/77

8/00

IPC-HDBK-840

Solder Mask Handbook

Orig. 09/06

IPC-H-855

Hybrid Microcircuit Design Guide

Obsolete without replacement
Orig. 10/82

IPC-D-859

Design Standard for Thick Film Multilayer Hybrid Circuits

Orig. 12/89

Y

IPC-HM-860

Specification for Multilayer Hybrid Circuits

Orig. 1/87

Y

IPC-TF-870

Qualification and Performance of Polymer Thick Film Printed Boards

Orig. 11/89

Y

IPC-ML-910

Design and End Production Specification for Rigid Multilayer Printed Boards

Superseded by IPC-D-949, IPC-D-275, and subsequently IPC-2221 for Design and IPC-ML-950, IPC-RB-276, and subsequently IIPC-6011 for End Product Specification
Rev. A 08/76
Orig. 06/68

IPC-D-949

Design Standard for Rigid Multilayer Printed Boards

Superseded by IPC-D-275 and subsequently by IPC-2221/2222
Orig. 1/87

IPC-ML-950

Performance Specification for Rigid Multilayer Printed Boards

Superseded by IPC-RB-276 and subsequently IPC-6011/6012
Rev. C 11/8
Rev. B 12/77
Rev. A 9/70
Orig. 1/66

IPC-ML-960

Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards

Orig. 7/94

Y

IPC-ML-975

End Product Documentation Specification for Multilayer Printed Wiring Boards

Superseded by IPC-D-325
Orig. 9/69

IPC-ML-990

Performance Specification for Flexible Multilayer Wiring

Superseded by IPC-6011
Orig. 9/72

IPC-1043

Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1

Orig. 8/92

IPC-1044

Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2

Orig. 10/92

IPC-1065

Material Declaration Handbook

Orig. 01/05

IPC-1066

Labeling of PCBs and Assemblies

Orig. 12/04

IPC-TP-1090

The Layman's Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002

Orig. 7/96

IPC-TP-1103

Manufacturing Concerns When Soldering with Gold Plated Component Leads or Circuit Board Pads

Obsolete without replacement

IPC-TP-1114

The Layman's Guide to Qualifying a Process to J-STD-001B

Orig. 1/98

IPC-TP-1115

Selection and Implementation Strategy for A Low-Residue No-Clean Process

Orig. 12/98

IPC-1131

IT Guidelines for PWB Manufacturers

Orig. 04/00

IPC-1331

Voluntary Safety Standard for Electrically Heated Process Equipment

Orig. 3/00

IPC-1710

OEM Standard for Printed Board Manufacturers' Qualification Profile (MQP)

Rev. A 7/04
12/97 updated
Orig. 2/94

IPC-1720

Assembly Qualification Profile (AQP)

Rev. A 7/04
Orig. 7/96

IPC-1730

Laminator Qualification Profile (LQP)

Rev. A 6/00
Orig. 1/98

IPC-1731

Strategic Raw Materials Supplier Qualification Profile

Orig. Pub. 6/00

IPC-1751

Generic Requirements for Declaration Process Management

Vers. 1.1 3/07
Orig. Pub. 3/06

IPC-1752

Materials Declaration Management (Includes 2 PDF forms)

Vers. 1.1 3/07
Orig. Pub. 3/06

IPC-1902

Grid Systems for Printed Circuits  (equivalent to IEC 60097)

Orig. Pub. 03/99

IPC-2141

Controlled Impedance Circuit Boards and High Speed Logic Design

Rev. A 3/04
Orig. 4/96

IPC-2221

Generic Standard on Printed Board Design

Rev. A 5/03
Amend. 1 01/00
Supersedes IPC-D-275
Orig. 2/98

IPC-2222

Sectional Design Standard for Rigid Organic Printed Boards

Supersedes IPC-D-275
Orig. 2/98

IPC-2223

Sectional Design Standard for Flexible Printed Boards

Rev. A 06/04
Supersedes IPC-D-249
Orig. 11/98

IPC-2224

Sectional Standard for Design of PWBs for PC Cards

Orig. 01/98

IPC-2225

Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies

Orig. 05/98

IPC-2226

Design Standard for High-Density Array or Peripheral Leaded Component Mounting Structures

Orig. 4/03

IPC-2251

Design Guidelines for Electronic Packaging Utilizing High Speed Techniques

Orig. 12/03

IPC-2252

Design and Manufacturing Guide for RF/Microwave Circuit Boards

Orig. 7/02

IPC/JPCA-2315

Design Guide for High Density Interconnects (HDI) and Microvia

Orig. 6/00

IPC-2316

Design Guide for Embedded Passive Device Printed Boards

Orig. 03/07

IPC-2501

Definition for Web-based Exchange of XML Data

Orig. 7/03

Y

IPC-2511

Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology

Rev. B 1/02
Rev A 01/00
Orig. 11/98

Y

IPC-2512

Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description

Rev A 11/00
Orig. 11/98

IPC-2513

Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description

Rev A 11/00

IPC-2514

Sectional Requirements for Implementation of Printed Board Manufacturing Data Description

Rev A 11/00

IPC-2515

Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description

Rev A 11/00

IPC-2516

Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description

Rev A 11/00

IPC-2517

Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description – 2-11gChair, Bob Neal, Agilent Technologies

Rev A 11/00

IPC-2518

Sectional Requirements for Implementation of Part List Product Data Description - Chair, Harry Parkinson, Parkinson Consulting

Rev A 11/00

IPC-2524

PWB Fabrication Data Quality Rating System

Orig. 02/99

IPC-2531

Standard Recipe File Format Specification

Orig. 03/99

IPC-2541

Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication

Orig. 10/01

Y

IPC-2546

Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication

Amend. 1  01/03
Amend. 2  01/05
Orig. 10/01

Y

IPC-2547

Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication

01/02

Y

IPC-2571

Generic Requirements for Electronic Manufacturing Supply Chain Communication-Product Data Exchange (PDX)

11/01

Y

IPC-2576

Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Exchange (PDX)

11/01

Y

IPC-2578

Sectional Requirements for Supply Chain Communication of Bill of material and Product Design Configuration Data-Product Data Exchange (PDX)

11/01

Y

IPC-2581

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology (Offspring)

Amend 1 05/07
Orig. 3/04

Y

IPC-2582

Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description

Orig. 045.07

IPC-2583

Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description

Orig. 045.07

IPC-2584

Sectional Requirements for Implementation of Printed Board Fabrication Data Description

Orig. 045.07

IPC-2588

Sectional Requirements for Implementation of Part List Product Data Description

Orig. 045.07

IPC-2615

Printed Board Dimensions and Tolerances

Supersedes IPC-D-300
Orig. 06/00

Y

IPC-3406

Guidelines for Electrically Conductive Surface Mount Adhesives

Orig. 7/96

IPC-3408

General Requirements for Anistropically Conductive Adhesive Films

Orig. 11/96

IPC-4101

Specification for Base Materials for Rigid and Multilayer Boards

Rev. B Amends 1&2 04/07
Rev. B Amend 1 02/07
Rev. B 06/06
Rev. A Amend 1 6/02
Rev. A 06/02
Supersedes IPC-L-108, IPC-L-109, IPC-L-112, IPC-L-115
Orig. 12/97

TBA

IPC-4103

Specification for Plastic Substrates, Clad or Unclad, for High Speed/High Frequency Interconnection

Supersedes IPC-L-125
Orig. 01/02

Y

IPC/JPCA-4104

Specification for High Density Interconnect (HDI) and Microvia Materials

Orig. 5/99

05/99

IPC-4110

Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards

Orig. 8/98

10/98

IPC-4121

Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications

Supersedes IPC-CC-110A
Orig. 1/00

IPC-4130

Specification and Characterization Methods for Nonwoven "E" Glass Mat

Orig. 9/98

12/99

IPC-4202

Flexible Base Dielectrics for Use in Flexible Printed Wiring

Supersedes IPC-FC-231C
Orig. 05/02

06/02

02/03

IPC-4203

Adhesive Coated Dielectric Films for Use as Cover Sheets

Supersedes IPC-FC-232C
Orig. 05/02

06/02

02/03

IPC-4204

Flexible Metal-Clad Dielectrics for Use in Fabrication of

Supersedes IPC-FC-241C
Orig. 05/02

06/02

02/03

IPC-4411

Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

Rev. A 11/03
Orig. 4/99

IPC-4412

Specification for Finished Fabric Woven form "E" Glass for Printed Boards

Rev. A 01/06
Supersedes IPC-EG-140A
Orig. 06/02

IPC-4552

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

Orig. 10/02

11/02

IPC-4553

Specification for Immersion Silver Plating for Printed Circuit Boards

Orig. 06/05

09/06

IPC-4554

Specification for Immersion Tin Plating for Printed Circuit Boards

Orig. 02/07

IPC-4562

Metal Foil for Printed Wiring Applications

Amend. 1
Supersedes IPC-MF-150F
Orig. 5/00

05/05
09/00

02/03

IPC-4761

Design Guide for Protection of Printed Board Via Structures

Orig. 07/06

IPC-4821

Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

Orig. 05/06

IPC-5701

Users Guide for Cleanliness of Unpopulated Printed Boards

Orig. 7/03

IPC-5702

Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards

Orig. 06/07

IPC-6011

Generic Performance Specification for Printed Boards

Orig. 7/96

IPC-6012

Qualification and Performance Specification for Rigid Printed Boards

Rev. B with Amend 1 02/07
Rev. B 08/04
Amend. 1 07/00
Rev. A 10/99
Orig. 7/96

IPC-6013

Qualification and Performance Specification for Flexible Printed Boards

Rev. A with Amend. 2 04/06
Amend. 1 01/05
Rev. A 11/03
Supersedes IPC-RF-245 and IPC-FC-250
Amend. 1 04/00
Orig. 11/98

IPC-6015

Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures

Orig. 2/98

IPC-6016

Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards

Orig. 05/99

8/99

IPC-6018

Microwave End Product Board Inspection and Test

Rev. A 01/02
Orig. 1/98

Y

IPC/JPCA-6202

Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards

Orig. 2/99

IPC/JPCA-6801

Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection

Orig. 1/00

IPC-7095

Design and Assembly Process Implementation for BGAs

Rev. A 11/04
Orig. 8/00

IPC-7525

Guidelines for Stencil Design

Rev. A 02/07
Orig. 05/00

06/00

IPC-7526

Stencil and Misprinted Board Cleaning Handbook

Orig. 02/07

IPC-7530

Guidelines for Temperature Profiling for Mass Soldering (Wave and Reflow) Processe

Orig. 05/01

IPC-7351

Generic Requirements for Surface Mount Design and Land Pattern Standard

Rev. A 02/07
Supersedes IPC-SM-782A with Amendments 1 & 2
Orig. 02/05

IPC-7711/7721

Rev B renamed to:

Rework, Repair and Modification of Electronic Assemblies

Rev B 11/07
Rev A 10/03
Orig. 04/98
Supersedes IPC-R-700C

IPC-7912

Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies

Rev. A 01/04
Orig. 07/00

01/04

IPC-8413-1

Specification for Manufacturing Process Carriers for Handling Optical Fiber

Orig. 04/03

IPC-9151

Printed Board Capability, Quality and Relative Reliability (PCQR²) Benchmark Test Standard and Database

Rev. B 02/07
Rev. A 5/03
Orig. 06/02

IPC-9191

General Guideline for implementation of Statistical Process Control (SPC)

Supersedes IPC-PC-90
Orig. 11/99

IPC-9194

Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline

Orig. 09/04

IPC-9199

SPC Quality Rating

Orig. 09/02

IPC-9201

Surface Insulation Resistance Handbook

Rev A 08/07
Orig. 7/96

IPC-9251

Test Vehicles for Evaluating Fine Line Capability

Orig. 7/00

IPC-9252

Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards

Supersedes IPC-ET-652A
Orig. 02/01

IPC-9261

In-Process DPMO and Estimated Yield for PWAs

Rev. A 10/06
Orig. 3/02

03/02

IPC-9501

PWB Assembly Process Simulation for Evaluation of Electronic Components

Orig. 7/95

IPC-9502

PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components

Orig. 4/99

IPC-9503

Moisture Sensitivity Classification for Non-IC Components

Orig. 4/99

IPC-9504

Assembly Process Simulation for Evaluation of Non-IC Components

Orig. 6/98

10/98

IPC-9591

Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

Orig. 04/06

IPC-9691

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)

Rev A 08/07
Orig. 10/05

IPC-9701

Qualification and Performance Test Methods for Surface Mount Solder Attachments

Rev. A 02/06
Orig. 1/02

Y

IPC/JEDEC-9702

Monotonic Bend Characterization of Board-Level Interconnects

Orig. 06/04

IPC-9850

Surface Mount Equipment Performance Characterization

Orig. 7/02

09/02

IPC-SMEMA-9851

Equipment Interface Specification

Orig. 11/04

IPC-DRM-SMT

Surface Mount Solder Joint Evaluation Desk Reference Manual

Rev. B 4/00
Rev. A 3/99
Orig. 7/98

IPC-EMSI-TC

IPC Sample Master Ordering Agreement for EMS Companies and OEMs

Orig. 03/02

Roadmap

International Technology Roadmap for Electronic Interconnections

Updated 2007
Updated 2005
Updated 2003
Updated 2001
Updated 9/97
Orig. 6/95