IPC Document Revision Table

Updated January 2013

Product ID Document Name Responsible Committee Status ANSI DoD
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies 5-22a
  • Rev. E  4/10
  • Rev. D Amend. 1  4/08
  • Rev. D 2/05
  • Rev. C 3/00
  • Rev. B 10/96
  • Rev. A 1/95
  • Orig. 4/92; Supersedes IPC-S-815
 04/05 07/01
J-STD-001xS Space Hardware Addendum Space Applications Electronic Hardware Addendum for J-STD-001. The addendum MUST be used with the same version of the standard; e.g. 001CS with 001C, 001DS with 001D, 001ES with 001D 5-22as
  • ES 12/10
  • DS Amend. 1 9/09
  • DS 11/06
  • CS 1/04
   
IPC-HDBK-001 Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies 5-22f
  • Rev E 2/12
  • Amend. 2  10/05
  • Amend. 1  12/00
  • Orig. 3/98
   07/01
SMC-TR-001 An Introduction to Tape Automated Bonding Fine Pitch Technology  
  • Orig. 1/89
    
IT-WP-001 Myths of E-Commerce  
  • Orig. 9/00
    
SMC-WP-001 Soldering Capability White Paper Report  
  • Orig. 8/91
    
SMEMA 1.2 Mechanical Equipment Interface Standard  
  • Update IPC-SMEMA-9851
   
JP002 Current Tin Whiskers Theory and Mitigation Practices Guideline 5-23e
  • Orig.  3/06
    
J-STD-002 Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires 5-23b
  • Rev. C Amend. 1 10/08
  • Rev. C 12/07
  • Rev. B  2/03
  • Rev. A 10/98
  • Orig. 4/92; Supersedes IPC-S-805
 10/08 05/95
SMC-WP-002 An Assessment of the Use of Lead in Electronic Assembly  
  • Orig. 8/92
    
J-STD-003 Solderability Tests for Printed Boards 5-23a
  • Rev. B  2/07
  • Rev. A  2/03
  • Original 4/92; Supersedes IPC-S-804
   02/93
SMC-WP-003 Chip Mounting Technology  
  • Orig. 8/93
    
SMEMA 3.1 Fiducial Mark Standard        
J-STD-004 Requirements for Soldering Fluxes 5-24a
  • Rev B. Amend. 1 10/11
  • Rev. B 12/08
  • Rev. A  1/04
  • Orig. 1/95; Supersedes IPC-SF-818
   05/95
SMC-WP-004 Design for Success  
  • Orig. 4/97
    
SMEMA 4 Reflow Terms and Definitions  
  • Orig.
    
J-STD-005 Requirements for Soldering Pastes 5-24b
  • Rev. A 2/12
  • Amend. 1  6/96
  • Orig. 1/95; Supersedes IPC-SP-819
   05/95
SMC-WP-005 PWB Surface Finishes  
  • Orig. 4/97
    
IPC-HDBK-005 Guide to Solder Paste Assessment 5-24b
  • Orig. 1/06
    
SMEMA 5 Screen Printing Terms and Definitions  
  • Orig.
    
J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications 5-24c
  • Rev. B Amends. 1 & 2 10/09
  • Rev. B Amend. 1  6/08
  • Rev. B  1/06
  • Rev. A  5/01
  • Orig. 1/95
   05/95
SMEMA 6 Electronics Cleaning Terms and Definitions  
  • Orig.
    
SMEMA 7 Fluid Dispensing Terms and Definitions  
  • Orig.
    
WP-008 Setting up Ion Chromatography Capability  
  • Orig. 12/05
    
J-STD-012 Implementation of Flip Chip and Chip Scale Technology 5-21g
  • Orig. 1/96
 Y  
J-STD-013 Implementation of Ball Grid Array and Other High Density Technology 5-21f
  • Orig. 7/96
 Y  
IPC-DRM-18 Component Identification Desk Reference Manual  
  • Rev. H 11/07
  • Rev. G 9/03
  • Rev. F 8/01
  • Rev. E 8/00
  • Rev. D 7/99
  • Rev. C 7/98
  • Rev. B 2/97
  • Rev. A 4/96
  • Orig. 9/95
    
J-STD-020 Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices B-10a
  • Rev. D Amend 1  3/08
  • Rev. D  8/07
  • Rev. C 7/04
  • Rev. B 7/02
  • Rev. A 4/99
  • Orig. 10/96
    
J-STD-026 Semiconductor Design Standard for Flip Chip Applications 5-21g
  • Orig. 8/99
    
J-STD-027 Mechanical Outline Standard for Flip Chip or Chip Scale Configurations 5-21g
  • Orig. 2/03
    
J-STD-028 Performance Standard for Flip Chip Scale Bumps 5-21g
  • Orig. 8/99
    
J-STD-030 Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages 5-24f
  • Orig. 9/05
    
J-STD-032 Performance Standard for Ball Grid Array Bumps and Columns 5-21f
  • Orig. 6/02
    
J-STD-033 Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices B-10a
  • Rev. C 2/12
  • Rev. B Amend. 1  1/07
  • Rev. B 10/05
  • Rev. A 7/02
  • Orig. 4/99
    
J-STD-035 Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components B-10a
  • Orig. 4/99
    
IPC-0040 Optoelectronic Assembly and Packaging Technology   5-25
  • Orig. 5/03
 07/03  
IPC-DRM-PTH
IPC-DRM-40		 Through-Hole Solder Joint Evaluation Desk Reference Manual  
  • Rev. E 7/10
  • Rev. D (2nd print) 11/08
  • Rev. D 11/05
  • Renamed to DRM-PTH
  • Rev. E 2/02
  • Rev. D 7/00
  • Rev. C 9/99
  • Rev. B 1/99
  • Rev. A 8/97
  • Orig. 5/97
    
IPC-T-50 Terms and Definitions for Interconnecting and Packaging Electronic Circuits 2-30
  • Rev. J 10/11
  • Rev. I Skipped Due to Conflict with “L” and “1”
  • Rev. H  7/08
  • Rev. G 12/03
  • Rev. F 6/96
  • Rev. E 7/92
  • Rev. D 11/88
  • Rev. C 3/85
  • Rev. B 6/80
  • Rev. A 8/76
  • Orig. 8/75
   09/80
IPC-DRM-53 Introduction to Electronics Assembly  
  • Orig. 6/00
    
IPC-DRM-WHA
IPC-DRM-56		 Wire Preparation & Crimping  
  • Rev. A 11/06
  • Renamed DRM-WHA
  • Orig.  7/02
    
IPC-SC-60 Post Solder Solvent Cleaning Handbook 5-31a
  • Superseded and combined into CH-65B 5/11
  • Rev. A 8/99
  • Orig. 4/87
 10/99  
IPC-SA-61 Post-Solder Semi-Aqueous Cleaning Handbook 5-31b
  • Superseded and combined into CH-65B 5/11
  • Rev. A 6/02
  • Orig. 7/95
    
IPC-AC-62 Post Solder Aqueous Cleaning Handbook 5-31b
  • Superseded and combined into CH-65B 5/11
  • Rev. A 1/96
  • Orig. 12/86
    
IPC-CH-65 Guidelines for Cleaning of Printed Boards and Assemblies 5-31d
  • Rev. B 7/11
  • Rev. A 9/99
  • Orig. 12/90
 10/99  
IPC-CS-70 Guidelines for Chemical Handling Safety in Printed Board Manufacturing  
  • Orig. 8/88 Obsolete without replacement
    
J-STD-075 Classification of Non-IC Electronic Components for Assembly Processes B-10a
  • Orig. 8/08
    
IPC-CM-78 Guidelines for Surface Mounting and Interconnecting Chip Carriers  
  • Superseded by IPC-SM-780
  • Rev. C 3/88
  • Orig. 11/83
    
IPC-MP-83 IPC Policy on Metrication  
  • Orig. 8/85 Obsolete without replacement
    
IPC-PC-90 General Requirements for Implementation of Statistical Process Control 7-22
  • Superseded by IPC-9191
  • Orig. 10/90
    
IPC-QS-95 General Requirements for Implementation of ISO 9000 Quality Systems 7-22
  • Obsolete without replacement
  • Orig. 4/93
    
IPC-L-108 Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards 3-11
  • Superseded by IPC-4101
  • Rev. B  6/90
  • Rev. A 10/80
  • Orig. 3/76
    
IPC-L-109 Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards 3-11*
  • Superseded by IPC-4101
  • Rev. B  7/92
  • Rev. A 10/80
  • Orig. 3/76
    
IPC-L-110 Preimpregnated, B-Stage Epoxy-Glass Cloth for Multilayer Printed Circuit Boards 3-11
  • Rev. A Superseded by IPC-L-109 and IPC-4101
    
IPC-CC-110 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications 3-11c
  • Superseded by IPC-4121
  • Rev. A 12/97
  • Orig. 1/94
    
IPC-L-112 Specification for Composite Metal Clad Base materials for Printed Boards 3-11
  • Superseded by IPC-4101
  • Rev. A 6/92
  • Orig. 7/81
    
IPC-L-115 Specification for Rigid Metal Clad Base Materials for Printed Boards 3-11
  • Superseded by IPC-4101
  • Rev. B 4/90
  • Rev. A 10/80
  • Orig. 3/77
    
IPC-L-120 Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates  
  • Obsolete without replacement
    
IPC-L-125 Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections D-23
  • Superseded by IPC-4103
  • Rev. A 7/92
  • Orig. 8/83
    
IPC-L-130 Specifications for Thin Laminates, Metal Clad, Primarily for General-Purpose Multilayer Printed Boards 3-11
  • Superseded by IPC-L-108 and IPC-4101
  • Orig. 1/77
    
IPC-DD-135 Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules  
  • Obsolete without replacement
    
IPC-EG-140 Specification for Finished Fabric Woven from "E" Glass for Printed Boards 3-12d
  • Superseded by IPC-4412
  • Amend. 1 & 2 6/97
  • Orig. 3/88
    
IPC-SG-141 Specification for Finished Fabric Woven from "S" Glass for Printed Boards 3-12d
  • Orig. 2/92
   07/93
IPC-A-142 Specification for Finished Fabric Woven from Aramid for Printed Boards 3-12
  • Orig. 6/90
 03/92 03/92
IPC-QF-143 General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards 3-12d
  • Orig. 2/92
   03/93
IPC-CF-148 Resin Coated Metal for Printed Boards 3-12c
  • Superseded by IPC-4563
  • Rev. A 9/98
  • Orig. 6/90
 10/98  
IPC-MF-150 Metal Foil for Printed Wiring Applications 3-12a
  • Rev. A 4/08
  • Superseded by IPC-4562 5/00
  • Amend. 1 8/92
  • Rev. F 10/91 Changed from CF-150 to MF-150
  • Rev. E 5/81
  • Rev. D 3/76
  • Rev. C 8/74
  • Rev. B 2/71
  • Rev. A 9/67
  • Orig. 8/66
    
IPC-CF-152 Composite Metallic Material Specification for Printed Wiring Boards 3-12h
  • B 12/97
  • A 1/94
  • Orig. 6/90
    
IPC-FC-203 Specification for Flat Cable, Round Conductor, Ground Plane D-13
  • Obsolete 7/96
  • Orig. 7/85
    
IPC-FC-210 Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC) D-13
  • Obsolete 7/96
  • Orig. 9/85
    
IPC-FC-213 Performance Specification for Flat Undercarpet Telephone Cable D-13*
  • Obsolete 7/96
  • Orig. 9/84
    
IPC-FC-217 General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable D-13
  • Obsolete 7/96
  • Reaffirmed 4/90
  • Orig. 8/82
    
IPC-FC-218B/EIA-RS-429 General Specification for Connectors, Electrical Flat Cable Type D-13
  • Obsolete 7/96
  • Reaffirmed 5/91
  • Reaffirmed 11/81
  • Orig. 7/76
    
IPC-FC-219 Environment Sealed Flat Cable Connectors for use in Aerospace Applications D-13
  • Obsolete 7/96
  • Orig. 5/84
    
IPC-FC-220 Specification for Flat Cable, Flat Conductor, Unshielded D-13
  • Obsolete 7/96
  • Rev. C 7/85
  • Rev. B 8/75
  • Rev. A 1/74
  • Orig. 5/70
    
IPC-FC-221 Specification for Flat-Copper Conductors for Flat Cables D-13
  • Obsolete 7/96
  • Rev. A 5/84
  • Orig. 8/75
    
IPC-FC-222 Specification of Flat Cable Round Conductor, Unshielded D-13
  • Obsolete 7/96
  • Reaffirmed 5/91
  • Orig. 6/80
    
IPC-FC-225 Flat Cable Design Guide  
  • Obsolete (date)
  • Reaffirmed 10/85
  • Orig. 8/75
    
IPC-FC-231 Flexible Base Dielectrics for Use in Flexible Printed Wiring D-13
  • Superseded by IPC-4202
  • Amend. 10/95
  • Rev. C 4/92
  • Rev. B 2/86
  • Rev. A 5/83
  • Orig. 7/74
    
IPC-FC-232 Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films D-13
  • Superseded by 4203 5/02
  • Amend. 10/95
  • Rev. C 6/94
  • Rev. B 2/86
  • Rev. A 5/83
  • Orig. 7/74
    
IPC-FC-233 Flexible Adhesive Bonding Films D-13
  • Incorporated into IPC-FC-232C 6/94
  • Rev. A 2/86
  • Orig. 5/83
 2/86 5/86
IPC-FC-234 PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits D-1
  • Orig. 12/97
    
IPC-FC-240 Single sided flex D-12
  • Superseded by IPC-6013
  • Incorporated into FC-250
  • Rev. B 1/74
  • Rev. A 5/69
  • Orig. 12/65
    
IPC-FC-241 Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring D-13*
  • Superseded by IPC-4204
  • Amend. 10/95
  • Rev. C 4/92
  • Rev. B 2/86
  • Rev. A 5/83
  • Orig. 7/74
    
IPC-RF-245 Performance Specification for Rigid-Flex Printed Boards D-12
  • Superseded by IPC-6013
  • Orig. 4/87
    
IPC-D-249 Design Standard for Flexible Single-and Double-Sided Printed Boards D-11
  • Superseded by IPC-2223
  • Orig. 1/87
    
IPC-FC-250 Specification for Single - and Double-Sided Flexible Printed Wiring D-12
  • Superseded by IPC-6013
  • Rev. A 9/86
  • Orig. 1/74
    
IPC-FA-251 Guidelines for Single and Double Sided Flex Circuits D-12
  • Orig. 2/92
    
IPC-D-275 Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies D-31b
  • Superseded by IPC-2221 and 2222
  • Supersedes IPC-D-319 and IPC-D-949
  • Amendment 1  4/96
  • Orig. 9/91
    
IPC-RB-276 Qualification and Performance Specification for Rigid Printed Boards D-33a
  • Superseded by IPC-6011 and IPC-6012
  • Orig. 3/92; Supersedes IPC-SC-320B and IPC-ML-950C
    
IPC-D-279 Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies 6-10b
  • Orig. 7/96
    
IPC-D-300 Printed Board Dimensions and Tolerances 1-10a
  • Superseded by IPC-2615
  • Rev. G 1/84
  • Rev. F 11/74
  • Rev. E 10/70
  • Rev. D 1/70
  • Rev. C 10/65
  • Rev. B 1/64
  • Rev. A 7/61
  • Orig. 8/60
    
IPC-D-310 Guidelines for Phototool Generation and Measurement Techniques  
  • Rev. C  6/91
  • Rev. B 12/85
  • Rev. A 12/77
  • Orig. 9/69
    
IPC-A-311 Process Control Guidelines for Phototool Generation and Use  
  • Orig. 3/96
    
IPC-D-316 Design Guide for Microwave Circuit Boards Utilizing Soft Substrates D-21b
  • Superseded by IPC-2252
  • Orig. 5/95
    
IPC-D-317 Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques D-21a
  • Superseded by IPC-2251
  • Rev. A 1/95
  • Orig. 4/90
    
IPC-HF-318 Microwave End Product Board Inspection and Test D-22
  • Superseded by IPC-6018
  • Rev. A 12/91
  • Orig. 6/85
    
IPC-D-319 Design Standard for Rigid Single-and Double-Sided Printed Boards D-31b
  • Superseded by IPC-D-275, then by IPC-2221/2222
  • Orig. 1/87
    
IPC-SD-320 Performance Specification for Rigid Single- and Double-Sided Printed Boards D-33a
  • Superseded by IPC-RB-276
  • Supersedes IPC-TC-500
  • Rev. B 11/86
  • Rev. A 3/81
  • Orig. 1/77
    
IPC-D-322 Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes  
  • Reaffirmed 9/91
  • Orig. 8/84
   10/94
IPC-MC-324 Performance Specifications for Metal Core Boards D-33a
  • Superseded by IPC-6011 and IPC-6012
  • Orig. 10/88
    
IPC-D-325 Documentation Requirements for Printed Boards, Assemblies and Support Drawings 2-40
  • Rev. A 5/95
  • Orig. 1/87
    
IPC-D-326 Information Requirements for Manufacturing Printed Board Assemblies 2-11a
  • Rev. A 1/04
  • Orig. 4/91
    
IPC-D-330 Design Guide Manual  
  • Orig. 1/92
    
IPC-PD-335 Electronic Packaging Handbook  
  • Orig. 12/89
    
IPC-NC-349 Computer Numerical Control Formatting for Drillers and Routers  
  • Orig. 8/85
   10/85
IPC-D-350 Printed Board Description in Digital Form; Technical Content Identical to IEC-61182-1 2-11
  • Rev. D 7/92
  • Rev. C 10/85
  • Rev. B 8/77
  • Rev. A 2/75
  • Orig. 8/72
   07/78
IPC-D-351 Printed Board Drawings in Digital Form  
  • Orig. 8/85
   09/85
IPC-D-352 Electronic Design Data Description for Printed Boards in Digital Form  
  • Orig. 8/85
   09/85
IPC-D-354 Library Format Description for Printed Boards in Digital Form  
  • Orig. 2/87
    
IPC-D-355 Printed Board Assembly Description in Digital Form  
  • Orig. 1/95
    
IPC-D-356 Bare Board Electrical Test Information in Digital Form 2-11c
  • Rev. B 10/02
  • Rev. A 1/98
  • Orig. 3/92
   08/92
IPC-AM-361 Specification for Rigid Substrates for Additive Process Printed Boards  
  • Superseded by IPC-4101
  • Orig. 1/82
    
IPC-MB-380 Guidelines for Molded Interconnection Devices  
  • Orig. 10/90
    
IPC-D-390 Automated Design Guidelines  
  • Rev. A 2/88
  • Orig. 7/74
    
IPC-C-406 Design and Application Guidelines for Surface Mount Connectors  
  • Orig. 1/90
    
IPC-CI-408 Design and Application Guidelines for the Use of Solderless Surface Mount Connectors  
  • Orig. 1/94
    
IPC-BP-421 General Specification for Rigid Printed Board Backplanes with Press Fit Contacts  
  • Obsolete without replacement
  • Reaffirmed 4/90
  • Orig. 10/80
    
IPC-D-422 Design Guide for Press Fit Rigid Printed Board Backplanes  
  • Orig. 9/82
    
IPC-DW-424 General Specification for Encapsulated Discrete Wire Interconnection Boards  
  • Orig. 1/95
    
IPC-DW-425 Design and End Product Requirements for Discrete Wiring Boards  
  • Rev. A 5/90
  • Orig. 9/82
   03/94
IPC-DW-426 Specifications for Assembly of Discrete Wiring  
  • Orig. 12/87
    
IPC-TR-460 Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards  
  • Rev. A 2/84
  • Orig. 1973
    
IPC-TR-461 Solderability Evaluation of Thick and Thin Fused Coatings  
  • Orig. 3/79
    
IPC-TR-462 Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage  
  • Orig. 10/87
    
IPC-TR-464 Accelerated Aging for Solderability Evaluations 5-23b
  • Rev. A 12/87
  • Orig. Pub.4/84
    
IPC-TR-465-1 Round Robin Test on Steam Ager Temperature Control Stability  
  • Orig. 1993
    
IPC-TR-465-2 The Effect of Steam Aging Time and Temperature on Solderability Test Results  
  • Orig. 1993
    
IPC-TR-465-3 Evaluation of Steam Aging on Alternative Finishes, Phase IIA  
  • Orig. 7/96
    
IPC-TR-466 Wetting Balance Standard Weight Comparison Test  
  • Orig. 4/95
    
IPC-TR-467 Supporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D  
  • Orig. 10/96
    
IPC-TR-468 Factors Affecting Insulation Resistance Performance of Printed Boards  
  • Orig. 3/79
    
IPC-TR-470 Thermal Characteristics of Multilayer Interconnection Boards  
  • Orig. 1/74
    
IPC-TR-474 An Overview of Discrete Wiring Techniques  
  • Obsolete without replacement
  • Reprint 1984
  • Orig. 3/79
    
IPC-TR-476 How to Avoid Metallic Growth Problems on Electronic Hardware
Rev. A Electrochemical Migration Electrically Induced Failures In Printed Assembles 		 
  • Rev. A 6/84 (new title)
  • Orig. 9/77
    
IPC-TR-480 Results of Multilayer Test Program Round Robin IV Phase I  
  • Obsolete without replacement
  • Orig. 9/75
    
IPC-TR-481 Results of Multilayer Test Program Round Robin V  
  • Orig. 4/81
    
IPC-TR-482 New Developments in Thin Copper Foils  
  • Orig. 1/76
    
IPC-TR-483 Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program  
  • Rev. A 3/91
  • Addendums 10/87
  • Orig. 4/84
    
IPC-TR-484 Results of IPC Cooper Foil Ductility Round Robin Study  
  • Orig. 4/86
    
IPC-TR-485 Results of Cooper Foil Rupture Strength Test Round Robin Study  
  • Orig. 3/85
    
IPC-TR-486 Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations  
  • Orig. 7/01
    
IPC-TR-549 Measles in Printed Wiring Boards  
  • Orig. 11/78
    
IPC-TR-551 Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components  
  • Orig. 7/93
    
IPC-DR-570 General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards 4-12
  • Obsolete without replacement
  • Rev. A 4/84
  • Orig. 1/79
    
IPC-DR-572 Drilling Guidelines for Printed Boards 4-12
  • Rev A  3/07
  • Orig. 4/88
    
IPC-TR-576 Additive Process Evaluation  
  • Obsolete without replacement
  • Orig. 9/77
    
IPC-TR-578 Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards  
  • Orig. 9/84
    
IPC-TR-579 Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards  
  • Orig. 9/88
    
IPC-TR-580 Cleaning and Cleanliness Test Program Phase 1 Test Results  
  • Orig. 10/89
    
IPC-TR-581 IPC Phase 3 Controlled Atmosphere Soldering Study  
  • Orig. 8/94
    
IPC-TR-582 IPC Phase 3 No-Clean Flux Study  
  • Orig. 11/94
    
IPC-TR-583 An In-Depth Look At Ionic Cleanliness Testing  
  • Orig. 7/02
    
IPC-WP/TR-584 IPC White Paper and Technical Report on Halogen-Free Materials used for Printed Circuit Boards and Assemblies 4-33
  • Rev. A  8/07
  • Orig.  4/03
    
IPC-TR-585 Time, Temperature and Humidity Stress of Final Board Finish Solderability  
  • Orig.  5/06
    
IPC-TR-586 Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium (supports IPC-4553A) 4-14
  • Orig. 5/09
    
IPC-A-600 Acceptability of Printed Boards 7-31a & D-33a
  • Rev. H  4/10
  • Amend. 1 01/08
  • Rev. G  7/04
  • Rev. F 11/99
  • Rev. E 8/95
  • Rev. D '89
  • Rev. C '78
  • Rev. B '74
  • Rev. A '70
  • Orig. '64
    
IPC-SS-605 Printed Board Quality Evaluation Slide Set  
  • Obsolete without replacement
    
IPC-QE-605 Printed Board Quality Evaluation Handbook  
  • Rev. A 2/99
    
J-STD-609 Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices 4-34b
  • Rev. A  2/10
  • Orig. 5/07; Supersedes IPC-1066
 07/08 01/08
IPC-A-610 Acceptability of Electronic Assemblies 7-31
  • Rev. E  4/10
  • Rev. D Amend. 1 4/08
  • Rev. D 2/05
  • Rev. C 1/00
  • Rev. B 12/94
  • Rev. A 3/90
  • Orig. 8/83
 04/05 02/02
IPC-A-610DC IPC-A-610D Telecom Addendum  
  • Orig. 8/09
    
IPC-HDBK-610 Handbook and Guide to IPC-A-610 (Includes B-C-D comparison)  
  • Amend. 1  10/05
  • Orig. 9/02
    
IPC-QE-615 Assembly Quality Evaluation Handbook  
  • Obsolete without replacement
    
IPC/WHMA-A-620 Acceptability of Electronic Wire Harnesses and Cables 7-31f
  • Rev. B 10/12
  • Rev. A 7/06
  • Orig. 1/02
 03/02  
IPC/WHMA-A-620AS Space Hardware Addendum Space Applications Electronic Hardware Addendum for IPC/WHMA-A-620. The addendum MUST be used with the same version of the standard; e.g. 620AS with 620A 7-31fs
  • Amendment 1 7/12
  • AS 1/11
    
IPC-AI-640 User’s Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates  
  • Obsolete without replacement
  • Orig. 1/87
    
IPC-AI-641 User’s Guidelines for Automated Solder Joint Inspection  
  • Obsolete without replacement
  • Orig. 1/87
    
IPC-AI-642 User’s Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB’s  
  • Obsolete without replacement
  • Orig. 10/88
    
IPC-OI-645 Standard for Visual Optical Inspection Aids  
  • Orig. 10/93
    
IPC-TM-650 Test Methods Manual  
  • Updated per test method
    
IPC-ET-652 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards  
  • Superseded by IPC-9252
  • Orig. 10/90
   
IPC-QL-653 Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material  
  • Rev. A 11/97
  • Orig. 8/88
   07/89
IPC-MI-660 Incoming Inspection of Raw Materials Manual  
  • Orig. 2/84
    
IPC-R-700 Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies  
  • Superseded by IPC-7711A/7721A
  • Rev. C 1/88
  • Rev. B 9/77
  • Rev. A 12/71
  • Orig. 9/67
    
IPC-TA-720 Technology Assessment Handbook on Laminates  
  • Orig. ’86
   
IPC-TA-721 Technology Assessment Handbook on Multilayer Boards  
  • Orig. ’88
    
IPC-TA-722 Technology Assessment of Soldering  
  • Orig. ’90
    
IPC-TA-723 Technology Assessment Handbook on Surface Mounting  
  • Orig. ’91
    
IPC-TA-724 Technology Assessment Series on Cleanrooms  
  • Orig. 4/98
    
IPC-PE-740 Troubleshooting Guide for Printed Board Manufacture and Assembly 7-23
  • Rev. A 12/97
  • Orig. 1/85
    
IPC-CM-770 Printed Board Component Mounting  
  • Rev. E 1/04
  • Rev. D 1/96
  • Rev. C 1/87
  • Rev. B 10/80
  • Rev. A 3/76
  • Orig. 9/68
    
IPC-SM-780 Component Packaging and Interconnecting with Emphasis on Surface Mounting  
  • Orig. 3/88
    
IPC-SM-782 Surface Mount Design and Land Pattern Standard 1-13
  • Superseded by IPC-7351
  • Amend. 2  4/99
  • Amend. 1  10/96
  • Rev. A 8/93
  • Orig. 3/87
    
IPC-SM-784 Guidelines for Chip-on-Board Technology Implementation  
  • Orig. 11/90
    
IPC-SM-785 Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments  
  • Orig. 11/92
    
IPC-SM-786 Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive Ics  
  • Superseded by J-STD-020 and J-STD-033
  • Rev. A 1/95
  • Orig. 12/90
    
IPC-MC-790 Guidelines for Multichip Module Technology Utilization  
  • Orig. 8/92
    
IPC-S-801   5-23a
  • Superseded by IPC-804 and J-STD-003
    
IPC-S-803   5-23a
  • Superseded by IPC-804 and J-STD-003
    
IPC-S-804 Solderability Test Methods for Printed Wiring Boards 5-23a
  • Superseded by J-STD-003
  • Rev. A 1/87
  • Orig. 1/82
    
IPC-S-805 Solderability Tests for Component Leads and Terminations 5-23b
  • Superseded by J-STD-002
  • Orig. 1/85
    
IPC-MS-810 Guidelines for High Volume Microsection  
  • Orig. 10/93
    
IPC-S-815 General Requirements for Soldering Electronic Interconnections  
  • Superseded byJ-STD-001
  • Rev. B 12/87
  • Rev. A 6/81
  • Orig. 11/77
    
IPC-S-816 SMT Process Guideline and Checklist  
  • Orig. 7/93
    
IPC-SM-817 General Requirements for Dielectric Surface Mounting Adhesives  
  • Orig. 11/89
    
IPC-SF-818 General Requirement for Electronic Soldering Fluxes 5-24a
  • Superseded by J-STD-004
  • Rev. 12/91
  • Orig. 2/88
    
IPC-SP-819 General Requirements and Test Methods for Electronic Grade Solder Paste 5-24b
  • Superseded by J-STD-005
  • Orig. 10/88
    
IPC-AJ-820 Assembly and Joining Manual  
  • Rev. A 2/12
  • Orig. 8/96
    
IPC-CA-821 General Requirements for Thermally Conductive Adhesives  
  • Orig. 1/95
    
IPC-CC-830 Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies  
  • Amend. 1 10/08
  • Rev. B 08/02
  • Amend. 1 7/99
  • Rev. A 10/98
  • Orig. 1/84
 08/02  
IPC-HDBK-830 Conformal Coating Handbook  
  • Orig. 10/02
    
IPC-SM-839 Pre and Post Solder Mask Application Cleaning Guidelines  
  • Orig. 4/90
    
IPC-SM-840 Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards 5-33b
  • Rev. E 12/10
  • Rev. D 4/07
  • Amend. 1 6/00
  • Rev. C 1/96
  • Rev. B 5/88
  • Rev. A 7/83
  • Orig. 11/77
 8/00  
IPC-HDBK-840 Solder Mask Handbook  
  • Orig. 9/06
    
IPC-HDBK-850 Guidelines for Design, Selection and Application of Potting and Encapsulation Materials Used for Electronics Printed Circuit Board Assembly 5-33f
  • Orig. 7/12
    
IPC-H-855 Hybrid Microcircuit Design Guide  
  • Obsolete without replacement
  • Orig. 10/82
    
IPC-D-859 Design Standard for Thick Film Multilayer Hybrid Circuits  
  • Orig. 12/89
 Y  
IPC-HM-860 Specification for Multilayer Hybrid Circuits  
  • Orig. 1/87
 Y  
IPC-TF-870 Qualification and Performance of Polymer Thick Film Printed Boards  
  • Orig. 11/89
 Y  
IPC-ML-910 Design and End Production Specification for Rigid Multilayer Printed Boards D-31b &
D-33a
  • Superseded by IPC-D-949, IPC-D-275, and subsequently IPC-2221 for Design and IPC-ML-950, IPC-RB-276, and subsequently IPC-6011 for End Product Specification
  • Rev. A  8/76
  • Orig.  6/68
    
IPC-D-949 Design Standard for Rigid Multilayer Printed Boards D-31b
  • Superseded by IPC-D-275 and subsequently by IPC-2221/2222
  • Orig. 1/87
    
IPC-ML-950 Performance Specification for Rigid Multilayer Printed Boards D-33a
  • Superseded by IPC-RB-276 and subsequently IPC-6011/6012
  • Rev. C 11/8
  • Rev. B 12/77
  • Rev. A 9/70
  • Orig. 1/66
    
IPC-ML-960 Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards  
  • Orig. 7/94
 Y  
IPC-ML-975 End Product Documentation Specification for Multilayer Printed Wiring Boards  
  • Superseded by IPC-D-325
  • Orig. 9/69
    
IPC-ML-990 Performance Specification for Flexible Multilayer Wiring D-33a
  • Superseded by IPC-6011
  • Orig. 9/72
    
IPC-TP-1043 Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1  
  • Orig. 8/92
    
IPC-TP-1044 Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2  
  • Orig. 10/92
    
IPC-1065 Material Declaration Handbook 4-34a
  • Orig. 1/05
    
IPC-1066 Labeling of PCBs and Assemblies 4-34b
  • Superseded by J-STD-609
  • Orig. 12/04
    
IPC-1071 Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing E-20
  • Orig.  1/11
    
IPC-TP-1090 The Layman’s Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002  
  • Orig. 7/96
    
IPC-TP-1103 Manufacturing Concerns When Soldering with Gold Plated Component Leads or Circuit Board Pads  
  • Obsolete without replacement
    
IPC-TP-1114 The Layman’s Guide to Qualifying a Process to J-STD-001B  
  • Orig. 1/98
    
IPC-TP-1115 Selection and Implementation Strategy for A Low-Residue No-Clean Process  
  • Orig. 12/98
    
IPC-1131 IT Guidelines for PWB Manufacturers  
  • Orig. 4/00
    
IPC-1331 Voluntary Safety Standard for Electrically Heated Process Equipment  
  • Orig. 3/00
    
IPC-1601 Printed Board Handling and Storage Guidelines D-35
  • Orig. 8/10
    
IPC-1710 OEM Standard for Printed Board Manufacturers’ Qualification Profile (MQP)  
  • Rev. A 7/04
  • 12/97 Updated
  • Orig. 2/94
    
IPC-1720 Assembly Qualification Profile (AQP)  
  • Rev. A 7/04
  • Orig. 7/96
    
IPC-1730 Laminator Qualification Profile (LQP)  
  • Rev. A 6/00
  • Orig. 1/98
    
IPC-1731 Strategic Raw Materials Supplier Qualification Profile 3-12i
  • Orig. Pub. 6/00
    
IPC-1751 Generic Requirements for Declaration Process Management 2-18
  • Amendment 1  12/12
  • Rev. A  2/10
  • Vers. 1.1  3/07
  • Orig. Pub.  3/06
    
IPC-1752 Materials Declaration Management (Includes 2 PDF forms) 2-18b
  • Amendment 1  12/12
  • Rev. A 2/10
  • Vers. 1.1 3/07
  • Orig. Pub. 3/06
    
IPC-1756 Manufacturing Process Data Management 2-18a
  • Orig. 4/10
    
IPC-2141 Controlled Impedance Circuit Boards and High Speed Logic Design D-21c
  • Rev. A 3/04
  • Orig. 4/96
   12/09
IPC-2152 Standard for Determining Current Carrying Capacity in Printed Board Design 1-10b
  • Orig. 8/09
   02/11
IPC-2221 Generic Standard on Printed Board Design D-31b
  • Rev. B 11/12
  • Rev. A 5/03
  • Amend. 1 1/00
  • Orig. 2/98; Supersedes IPC-D-275
   09/99
IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards D-31b
  • Rev. A 12/10
  • Orig. 2/98; Supersedes IPC-D-275
    
IPC-2223 Sectional Design Standard for Flexible Printed Boards D-11
  • Rev. C 11/11
  • Rev. B 5/08
  • Rev. A 6/04
  • Orig. 11/98; Supersedes IPC-D-249
   09/99
IPC-2224 Sectional Standard for Design of PWBs for PC Cards  
  • Orig. 1/98
    
IPC-2225 Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies  
  • Orig. 5/98
    
IPC-2226 Design Standard for High-Density Array or Peripheral Leaded Component Mounting Structures 1-10
  • Orig. 4/03
   03/09
IPC-2251 Design Guidelines for Electronic Packaging Utilizing High Speed Techniques D-21a
  • Orig. 12/03
   08/09
IPC-2252 Design and Manufacturing Guide for RF/Microwave Circuit Boards D-21b
  • Orig. 7/02
    
IPC/JPCA-2315 Design Guide for High Density Interconnects (HDI) and Microvia D-41a
  • Orig. 6/00
    
IPC-2316 Design Guide for Embedded Passive Device Printed Boards D-37a
  • Orig. 3/07
    
IPC-2501 Definition for Web-based Exchange of XML Data 2-50
  • Orig. 7/03
 08/03  
IPC-2511 Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology 2-11
  • Rev. B  1/02
  • Rev. A  1/00
  • Orig. 1 1/98
 02/02  
IPC-2512 Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description 2-11
  • Rev. A 11/00
  • Orig. 11/98
    
IPC-2513 Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description 2-11h
  • Rev. A 11/00
    
IPC-2514 Sectional Requirements for Implementation of Printed Board Manufacturing Data Description 2-11
  • Rev. A 11/00
    
IPC-2515 Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description 2-11
  • Rev. A 11/00
    
IPC-2516 Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description 2-11e
  • Rev. A 11/00
    
IPC-2517 Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description 2-11g
  • Rev. A 11/00
    
IPC-2518 Sectional Requirements for Implementation of Part List Product Data Description 2-11
  • Rev. A 11/00
    
IPC-2524 PWB Fabrication Data Quality Rating System 2-10
  • Orig. 2/99
    
IPC-2531 Standard Recipe File Format Specification 2-12
  • Orig. 3/99
    
IPC-2541 Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication 2-13a
  • Orig. 10/01
 Y  
IPC-2546 Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication 2-13b
  • Amend. 1  1/03
  • Amend. 2  1/05
  • Orig. 10/01
 Y  
IPC-2547 Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication 2-13c
  • 1/02
 Y  
IPC-2571 Generic Requirements for Electronic Manufacturing Supply Chain Communication-Product Data Exchange (PDX) 2-15a
  • 11/01
 Y  
IPC-2576 Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data – Product Exchange (PDX) 2-15c
  • 11/01
 Y  
IPC-2578 Sectional Requirements for Supply Chain Communication of Bill of material and Product Design Configuration Data-Product Data Exchange (PDX) 2-15e
  • 11/01
 Y  
IPC-2581 Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology (Offspring) 2-17
  • Amend. 1  5/07
  • Orig. 3/04
 05/04  
IPC-2582 Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description 2-17
  • Orig. 5/07
    
IPC-2583 Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description 2-17
  • Orig. 5/07
    
IPC-2584 Sectional Requirements for Implementation of Printed Board Fabrication Data Description 2-17
  • Orig. 5/07
    
IPC-2588 Sectional Requirements for Implementation of Part List Product Data Description 2-17
  • Orig. 5/07
    
IPC-2611 Generic Requirements for Electronic Product Documentation 2-40
  • Orig. 4/10
    
IPC-2612 Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions) 2-40
  • Orig. 4/10
    
IPC-2612-1 Sectional Requirements for Electronic Diagramming Symbol Generation Methodology 2-40
  • Orig. 4/10
    
IPC-2614 Sectional Requirements for Board Fabrication Documentation 2-40
  • Orig. 4/10
    
IPC-2615 Printed Board Dimensions and Tolerances  
  • Orig. 6/00; Supersedes IPC-D-300
 Y 11/10
IPC-3406 Guidelines for Electrically Conductive Surface Mount Adhesives  
  • Orig. 7/96
    
IPC-3408 General Requirements for Anistropically Conductive Adhesive Films  
  • Orig. 11/96
    
IPC-4101 Specification for Base Materials for Rigid and Multilayer Boards 3-11
  • Rev. C 8/09
  • Rev. B Amends. 1&2  4/07
  • Rev. B Amend. 1  2/07
  • Rev. B  6/06
  • Rev. A Amend. 1 6/02
  • Rev. A 6/02
  • Supersedes IPC-L-108, IPC-L-109, IPC-L-112, IPC-L-115
  • Orig. 12/97
    
IPC-4103 Specification for Plastic Substrates, Clad or Unclad, for High Speed/High Frequency Interconnection D-23
  • Rev. A 12/11
  • Orig. 01/02; Supersedes IPC-L-125
    
IPC/JPCA-4104 Specification for High Density Interconnect (HDI) and Microvia Materials 3-10
  • Orig. 5/99
 05/99  
IPC-4110 Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards 3-12*
  • Orig. 8/98
 10/98  
IPC-4121 Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications 3-11c
  • Orig. 1/00; Supersedes IPC-CC-110ª
    
IPC-4130 Specification and Characterization Methods for Nonwoven “E” Glass Mat 3-12f
  • Orig. 9/98
 12/99  
IPC-4202 Flexible Base Dielectrics for Use in Flexible Printed Wiring D-13
  • Rev. A  4/10
  • Orig. 5/02; Supersedes IPC-FC-231C
 06/02 02/03
IPC-4203 Adhesive Coated Dielectric Films for Use as Cover Sheets D-13
  • Rev. A 1/13
  • Orig. 5/02; Supersedes IPC-FC-232C
 06/02 02/03
IPC-4204 Flexible Metal-Clad Dielectrics for Use in Fabrication of D-13
  • Rev. A 10/11
  • Orig. 5/02; Supersedes IPC-FC-241C
 06/02 02/03
IPC-4411 Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement 3-12*
  • Rev. A 11/03
  • Orig. 4/99
    
IPC-4412 Specification for Finished Fabric Woven form “E” Glass for Printed Boards 3-12d
  • Rev. A w/Amends. 1, 2 & 3 07/11
  • Rev. A Amend. 3 12/10
  • Rev. A Amend. 2  5/09
  • Rev. A Amend. 1  3/08
  • Rev. A 1/06
  • Orig. 6/02; Supersedes IPC-EG-140ª
12/10 02/03
IPC-4552 Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards 4-14
  • Amend. 2
  • Amend. 1 6/12
  • Orig. 10/02
 11/02  
IPC-4553 Specification for Immersion Silver Plating for Printed Circuit Boards 4-14
  • Rev. A 5/09
  • Orig. 6/05
 09/05  
IPC-4554 Specification for Immersion Tin Plating for Printed Circuit Boards 4-14
  • Orig. Amend. 1 9/11
  • Orig. 2/07
    
IPC-4562 Metal Foil for Printed Wiring Applications 3-12a
  • Rev. A 4/08
  • Amend. 1  5/05
  • Orig. 5/00; Supersedes IPC-MF-150F
   02/03
IPC-4563 Resin Coated Copper Foil for Printed Boards Guideline 3-12c
  • Orig. (replaces CF-148A) 11/07
    
IPC-4591 Requirements for Printed Electronics Functional Conductive Materials D-62
  • Orig. 12/12
    
IPC-4761 Design Guide for Protection of Printed Board Via Structures  
  • Orig. 7/06
    
IPC-4781 Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Inks 5-33e
  • Orig. 5/08
    
IPC-4811 Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards D-52
  • Orig. 4/08
    
IPC-4821 Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards D-52
  • Amend. 1  4/10
  • Orig. 5/06
    
IPC-4921 Requirements for Printed Electronics Base Materials (Substrates) D-63
  • Orig. 6/12
    
IPC-5701 Users Guide for Cleanliness of Unpopulated Printed Boards  
  • Orig. 7/03
    
IPC-5702 Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards 5-32c
  • Orig. 6/07
    
IPC-5704 Cleanliness Requirements for Unpopulated Printed Boards 5-32c
  • Orig. 12/09
    
IPC-6011 Generic Performance Specification for Printed Boards D-33a
  • Orig. 7/96
    
IPC-6012 Qualification and Performance Specification for Rigid Printed Boards D-33a
  • Rev. C  4/10
  • Amend. 2  3/08
  • Rev. B with Amend 1  2/07
  • Rev. B 8/04
  • Amend. 1  7/00
  • Rev. A  10/99
  • Orig.  7/96
    
IPC-6013 Qualification and Performance Specification for Flexible Printed Boards D-12
  • Rev. B.  1/09
  • Rev. A with Amend. 2  4/06
  • Amend. 1  1/05
  • Rev. A  11/03
  • Supersedes IPC-RF-245 and IPC-FC-250
  • Amend. 1  4/00
  • Orig. 11/98
    
IPC-6015 Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures N/A
  • Orig. 2/98
    
IPC-6016 Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards D-10
  • Orig. 5/99
 8/99  
IPC-6017 Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices D-53
  • Orig. 3/09
    
IPC-6018 Qualification and Performance Specification for High Frequency (Microwave) Printed Boards D-22
  • Rev. B 11/11
  • Rev. A  1/02
  • Orig. 1/98
    
IPC/JPCA-6202 Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards D-12*
  • Orig. 2/99
    
IPC/JPCA-6801 Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection N/A
  • Orig. 1/00
    
IPC-7093 Design and Assembly Process Implementation for Bottom Termination SMT Components 5-21h
  • Orig. 3/11
    
IPC-7094 Design and Assembly Process Implementation for Flip Chip and Die Size Components 5-21g
  • Orig. 1/09
    
IPC-7095 Design and Assembly Process Implementation for BGAs 5-21f
  • Rev. C 1/13
  • Rev. B  3/08
  • Rev. A 11/04
  • Orig. 8/00
 07/08  
IPC-7351 Generic Requirements for Surface Mount Design and Land Pattern Standard 1-13
  • Rev. B 6/10
  • Rev. A  2/07
  • Supersedes IPC-SM-782A with Amendments 1 & 2
  • Orig.  2/05
    
IPC-7525 Guidelines for Stencil Design 7-21e
  • Rev. B 10/11
  • Rev. A  2/07
  • Orig.  5/00
 06/00  
IPC-7526 Stencil and Misprinted Board Cleaning Handbook 5-21jND
  • Orig.  2/07
    
IPC-7530 Guidelines for Temperature Profiling for Mass Soldering (Wave and Reflow) Processes 5-20/5-22
  • Orig.  5/01
    
IPC-7711/7721 Rev B renamed to:
Rework, Repair and Modification of Electronic Assemblies 		5-31h
  • Rev. B  11/07
  • Rev. A  10/03
  • Orig.  4/98; Supersedes IPC-R-700C
    
IPC-7912 Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies 5-22g
  • Rev. A  1/04
  • Orig.  7/00
 01/04  
IPC-8413-1 Specification for Manufacturing Process Carriers for Handling Optical Fiber 5-25a
  • Orig.  4/03
    
IPC-8497-1 Cleaning Methods and Contamination Assessment for Optical Assembly 5-25e
  • Orig. 12/05
    
IPC-9151 Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database D-36
  • Rev. C 5/10
  • Rev. B  2/07
  • Rev. A 5/03
  • Orig.  6/02
    
IPC-9191 General Guideline for implementation of Statistical Process Control (SPC) 7-22
  • Supersedes IPC-PC-90
  • Orig. 11/99
   02/03
IPC-9194 Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline 7-22
  • Orig.  9/04
    
IPC-9199 SPC Quality Rating 7-22
  • Orig.  9/02
    
IPC-9201 Surface Insulation Resistance Handbook 5-32b
  • Rev. A  8/07
  • Orig.  7/96
    
IPC-9202 Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance 5-32b
  • Orig. 10/11
    
IPC-9203 Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle 5-32b
  • Orig. 5/12
    
IPC-9251 Test Vehicles for Evaluating Fine Line Capability  
  • Orig.  7/00
    
IPC-9252 Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards 7-32c
  • Rev. A  11/08
  • Orig. 02/01; Supersedes IPC-ET-652A
  04/09
IPC-9261 In-Process DPMO and Estimated Yield for PWAs 5-22g
  • Rev. A 10/06
  • Orig. 3/02
 03/02  
IPC-9501 PWB Assembly Process Simulation for Evaluation of Electronic Components 5-21c
  • Orig. 7/95
    
IPC-9502 PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components  
  • Orig. 4/99
    
IPC-9503 Moisture Sensitivity Classification for Non-IC Components  
  • Superseded by J-STD-075 8/08
  • Orig. 4/99
    
IPC-9504 Assembly Process Simulation for Evaluation of Non-IC Components  
  • Orig. 6/98
 10/98  
IPC-9591 Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices 9-81
  • Orig.  4/06
    
IPC-9592 Requirements for Power Conversion Devices for the Computer and Telecommunications Industries 9-82
  • Rev. B 1/13
  • Rev. A  5/10
  • Orig.  9/08
    
IPC-9631 User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation D-32
  • Orig. 12/10
    
IPC-9691 User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) 5-32e
  • Rev. A  8/07
  • Orig. 10/05
    
IPC-9701 Qualification and Performance Test Methods for Surface Mount Solder Attachments 6-10d
  • Rev. A  2/06
  • Orig.  1/02
 Y  
IPC/JEDEC-9702 Monotonic Bend Characterization of Board-Level Interconnects 6-10d
  • Orig.  6/04
    
IPC/JEDEC-9703 Mechanical Shock Test Guidelines for Solder Joint Reliability 6-10d
  • Orig.  3/09
    
IPC/JEDEC-9704 Printed Wiring Board Strain Gage Test Guideline 6-10d
  • Rev. A 2/12
  • Orig.  6/05
    
IPC/JEDEC-9707 Spherical Bend Test Method for Characterization of Board Level Interconnects 6-10d
  • Orig. 9/11
    
IPC-9708 Test Methods for Characterization of Printed Board Assembly Pad Cratering 6-10d
  • Orig. 12/10
    
IPC-9850 Surface Mount Equipment Performance Characterization  
  • Rev. A 11/11
  • Orig.  7/02
 09/02  
IPC-SMEMA-9851 Equipment Interface Specification  
  • Orig. 11/04
    
IPC-DRM-SMT Surface Mount Solder Joint Evaluation Desk Reference Manual  
  • Rev. C 11/05
  • Rev. B 4/00
  • Rev. A 3/99
  • Orig. 7/98
    
IPC-EMSI-TC IPC Sample Master Ordering Agreement for EMS Companies and OEMs  
  • Orig.  3/02
    
Roadmap International Technology Roadmap for Electronic Interconnections 8-40
  • Updated 2009
  • Updated 2007
  • Updated 2005
  • Updated 2003
  • Updated 2001
  • Updated 9/97
  • Orig. 6/95