Updated December 2007
Sorted in NUMBER order, ignore all letters
Product ID |
Document Name |
Status |
ANSI |
DoD |
J-STD-001 |
Requirements for Soldered Electrical and Electronic Assemblies |
Rev D 2/05 |
04/05 |
04/05 |
J-STD-001CS |
Space Applications Electronic Hardware Addendum for J-STD-001C |
CS 1/04 |
||
J-STD-001DS |
Space Applications Electronic Hardware Addendum for J-STD-001D |
DS 11/06 |
||
IPC-HDBK-001 |
Handbook and Guide to the Requirements for Soldered Electrical and Electronic Assemblies |
Amend 2 10/05 |
07/01 |
|
SMC-TR-001 |
An Introduction to Tape Automated Bonding Fine Pitch Technology |
Orig. 1/89 |
||
IT-WP-001 |
Myths of E-Commerce |
Orig. 9/00 |
||
SMC-WP-001 |
Soldering Capability White Paper Report |
Orig. 8/91 |
||
SMEMA 1.2 |
Mechanical Equipment Interface Standard |
Update IPC-SMEMA-9851 |
||
JP002 |
Current Tin Whiskers Theory and Mitigation Practices Guideline |
Orig. 3/06 |
||
J-STD-002 |
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires |
Rev. C 12/07 |
Y |
05/95 |
SMC-WP-002 |
An Assessment of the Use of Lead in Electronic Assembly |
Orig. 8/92 |
||
J-STD-003 |
Solderability Tests for Printed Boards |
Rev. B 02/07 |
Y |
|
SMC-WP-003 |
Chip Mounting Technology |
Orig. 8/93 |
||
SMEMA 3.1 |
Fiducial Mark Standard |
|||
J-STD-004 |
Requirements for Soldering Fluxes |
Rev. A 01/04 |
Y |
05/95 |
SMC-WP-004 |
Design for Success |
Orig. 4/97 |
||
SMEMA 4 |
Reflow Terms and Definitions |
Orig. |
||
J-STD-005 |
Requirements for Soldering Pastes |
Amend. 1 6/96 |
Y |
05/95 |
SMC-WP-005 |
PWB Surface Finishes |
Orig. 4/97 |
||
IPC-HDBK-005 |
Guide to Solder Paste Assessment |
Orig. 1/06 |
||
SMEMA 5 |
Screen Printing Terms and Definitions |
Orig. |
||
J-STD-006 |
Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications |
Rev. B 01/06 |
Y |
05/95 |
SMEMA 6 |
Electronics Cleaning Terms and Definitions |
Orig. |
||
SMEMA 7 |
Fluid Dispensing Terms and Definitions |
Orig. |
||
WP-008 |
Setting up Ion Chromatography Capability |
Orig. 12/05 |
||
J-STD-012 |
Implementation of Flip Chip and Chip Scale Technology |
Orig. 1/96 |
Y |
|
J-STD-013 |
Implementation of Ball Grid Array and Other High Density Technology |
Orig. 7/96 |
Y |
|
IPC-DRM-18 |
Component Identification Desk Reference Manual |
Rev. G 9/03 |
||
J-STD-020 |
Moisture/Reflow Sensitivity Classification of Plastic Surface Mount Devices |
Rev D 08/07 |
||
J-STD-026 |
Semiconductor Design Standard for Flip Chip Applications |
Orig. 8/99 |
||
J-STD-027 |
Mechanical Outline Standard for Flip Chip or Chip Scale Configurations |
Orig. 02/03 |
||
J-STD-028 |
Performance Standard for Flip Chip Scale Bumps |
Orig. 8/99 |
||
J-STD-030 |
Guideline for Selection and Application of Underfill Material for Flip Chip and Other Micropackages |
Orig. 9/05 |
||
J-STD-032 |
Performance Standard for Ball Grid Array Bumps and Columns |
Orig. 6/02 |
||
J-STD-033 |
Packaging and Handling of Moisture Sensitive Non-Hermetic Solid State Surface Mount Devices |
Rev B Amend 1 01/07 |
||
J-STD-035 |
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components |
Orig. 4/99 |
||
IPC-0040 |
Standards Roadmap for Optoelectronic Assembly and Packaging Technology |
Orig. 5/03 |
||
IPC-DRM-40 |
Through-Hole Solder Joint Evaluation Desk Reference Manual |
Rev D 11/05 |
||
IPC-T-50 |
Terms and Definitions Interconnecting and Packaging Electronic Circuits |
Rev. G 12/03 |
||
IPC-DRM-53 |
Introduction to Electronics Assembly |
Orig. 6/00 |
||
IPC-DRM-56 |
Wire Preparation & Crimping |
Orig. 07/02 |
||
IPC-SC-60 |
Post Solder Solvent Cleaning Handbook |
Rev. A 8/99 |
10/99 |
|
IPC-SA-61 |
Post-Solder Semi-Aqueous Cleaning Handbook |
Rev. A 6/02 |
||
IPC-AC-62 |
Post Solder Aqueous Cleaning Handbook |
Rev. A 1/96 |
||
IPC-CH-65 |
Guidelines for Cleaning of Printed Boards and Assemblies |
Rev. A 9/99 |
10/99 |
|
IPC-CS-70 |
Guidelines for Chemical Handling Safety in Printed Board Manufacturing |
Orig. 8/88 Obsolete without replacement |
||
IPC-CM-78 |
Guidelines for Surface Mounting and Interconnecting Chip Carriers |
Superseded by IPC-SM-780 |
||
IPC-MP-83 |
IPC Policy on Metrication |
Orig. 8/85 Obsolete without replacement |
||
IPC-PC-90 |
General Requirements for Implementation of Statistical Process Control |
Superseded by IPC-9191 |
||
IPC-QS-95 |
General Requirements for Implementation of ISO 9000 Quality Systems |
Obsolete without replacement |
||
IPC-L-108 |
Specification for Thin Metal Clad Base Materials for Multilayer Printed Boards |
Superseded by IPC-4101 |
||
IPC-L-109 |
Specification for Resin Impregnated Fabric (Pregreg) for Multilayer Printed Boards |
Superseded by IPC-4101 |
||
IPC-L-110 |
Preimpregnated, B-Stage Epoxy-Glass Cloth for Multilayer Printed Circuit Boards |
Rev. A Superseded by IPC-L-109 and IPC-4101 |
||
IPC-CC-110 |
Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications |
Superseded by IPC-4121 |
||
IPC-L-112 |
Specification for Composite Metal Clad Base materials for Printed Boards |
Superseded by IPC-4101 |
||
IPC-L-115 |
Specification for Rigid Metal Clad Base Materials for Printed Boards |
Superseded by IPC-4101 |
||
IPC-L-120 |
Inspection Procedure for Chemical Processing Suitability of Copper-Clad Epoxy-Glass Laminates |
Obsolete without replacement |
||
IPC-L-125 |
Specifications for Plastic Substrates Clad or Unclad for High Speed/High Frequency Interconnections |
Superseded by IPC-4103 |
||
IPC-L-130 |
Specifications for Thin Laminates, Metal Clad, Primarily for General-Purpose Multilayer Printed Boards |
Superseded by IPC-L-108 and IPC-4101 |
||
IPC-DD-135 |
Qualification Testing for Deposited Organic Interlayer Dielectric Materials for Multichip Modules |
Orig. 8/95 |
||
IPC-EG-140 |
Specification for Finished Fabric Woven from "E" Glass for Printed Boards |
Superseded by IPC-4412 |
||
IPC-SG-141 |
Specification for Finished Fabric Woven from "S" Glass for Printed Boards |
Orig. 2/92 |
||
IPC-A-142 |
Specification for Finished Fabric Woven from Aramid for Printed Boards |
Orig. 6/90 |
||
IPC-QF-143 |
General Specification for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards |
Orig. 2/92 |
||
IPC-CF-148 |
Resin Coated Metal for Printed Boards |
Superseded by IPC-4563 |
10/98 |
|
IPC-MF-150 |
Metal Foil for Printed Wiring Applications |
Superseded by IPC-4562 |
||
IPC-CF-152 |
Composite Metallic Material Specification for Printed Wiring Boards |
B 12/97 |
||
IPC-FC-203 |
Specification for Flat Cable, Round Conductor, Ground Plane |
Obsolete 7/96 |
||
IPC-FC-210 |
Performance Specification for Flat-Conductor Undercarpet Power Cable (Type FCC) |
Obsolete 7/96 |
||
IPC-FC-213 |
Performance Specification for Flat Undercarpet Telephone Cable |
Obsolete 7/96 |
||
IPC-FC-217 |
General Document for Connectors, Electric, Header, Receptacle,Insulation Displacement for Use with Round Conductor Flat Cable |
Obsolete 7/96 |
||
IPC-FC-218B/EIA-RS-429 |
General Specification for Connectors, Electrical Flat Cable Type |
Obsolete 7/96 |
||
IPC-FC-219 |
Environment Sealed Flat Cable Connectors for use in Aerospace Applications |
Obsolete 7/96 |
||
IPC-FC-220 |
Specification for Flat Cable, Flat Conductor, Unshielded |
obsolete 7/96 |
||
IPC-FC-221 |
Specification for Flat-Copper Conductors for Flat Cables |
Obsolete 7/96 |
||
IPC-FC-222 |
Specification of Flat Cable Round Conductor, Unshielded |
Obsolete 7/96 |
||
IPC-FC-225 |
Flat Cable Design Guide |
Obsolete (date) |
||
IPC-FC-231 |
Flexible Base Dielectrics for Use in Flexible Printed Wiring |
Superseded by IPC-4202 |
||
IPC-FC-232 |
Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Wiring and Flexible Bonding Films |
Superseded by 4203 |
||
IPC-FC-233 |
Flexible Adhesive Bonding Films |
Incorporated into IPC-FC-232B |
||
IPC-FC-234 |
PSA Assembly Guidelines for Single- & Double-Sided Flexible Printed Circuits |
Orig. 12/97 |
||
IPC-FC-240 |
Single sided flex |
Superseded by IPC-6013 |
||
IPC-FC-241 |
Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Wiring |
Superseded by IPC-4204 |
||
IPC-RF-245 |
Performance Specification for Rigid-Flex Printed Boards |
Superseded by IPC-6013 |
||
IPC-D-249 |
Design Standard for Flexible Single-and Double-Sided Printed Boards |
Superseded by IPC-2223 |
||
IPC-FC-250A |
Specification for Single - and Double-Sided Flexible Printed Wiring |
Superseded by IPC-6013 |
||
IPC-FA-251 |
Guidelines for Single and Double Sided Flex Circuits |
Orig. 2/92 |
||
IPC-D-275 |
Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies |
Superseded by IPC-2221 and 2222 |
||
IPC-RB-276 |
Qualification and Performance Specification for Rigid Printed Boards |
Superseded by IPC-6011 and IPC-6012 |
||
IPC-D-279 |
Design Guidelines for Reliable Surface Mount Technology Printed Board Assemblies |
Orig. 7/96 |
||
IPC-D-300 |
Printed Board Dimensions and Tolerances |
Superseded by IPC-2615 |
||
IPC-D-310 |
Guidelines for Phototool Generation and Measurement Techniques |
Rev. C 06/91 |
||
IPC-A-311 |
Process Control Guidelines for Phototool Generation and Use |
Orig. 3/96 |
||
IPC-D-316 |
Design Guide for Microwave Circuit Boards Utilizing Soft Substrates |
Superseded by IPC-2252 |
||
IPC-D-317 |
Design Guidelines for Electronic Packaging Utilizing High-Speed Techniques |
Superseded by IPC-2251 |
||
IPC-HF-318 |
Microwave End Product Board Inspection and Test |
Superseded by IPC-6018 |
||
IPC-D-319 |
Design Standard for Rigid Single-and Double-Sided Printed Boards |
Superseded by IPC-D-275, then by IPC-2221/2222 |
||
IPC-SD-320 |
Performance Specification for Rigid Single- and Double-Sided Printed Boards |
Superseded by IPC-RB-276 |
||
IPC-D-322 |
Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes |
Reaffirmed 9/91 |
||
IPC-MC-324 |
Performance Specifications for Metal Core Boards |
Superseded by IPC-6011 and IPC-6012 |
||
IPC-D-325 |
Documentation Requirements for Printed Boards, Assemblies and Support Drawings |
Rev. A 5/95 |
||
IPC-D-326 |
Information Requirements for Manufacturing Printed Board Assemblies |
Rev. A 1/04 |
||
IPC-D-330 |
Design Guide Manual |
Date |
||
IPC-PD-335 |
Electronic Packaging Handbook |
Orig. 12/89 |
||
IPC-NC-349 |
Computer Numerical Control Formatting for Drillers and Routers |
Orig. 8/85 |
||
IPC-D-350 |
Printed Board Description in Digital Form; Technical Content Identical to IEC-61182-1 |
Rev. D 7/92 |
||
IPC-D-351 |
Printed Board Drawings in Digital Form |
Orig. 8/85 |
||
IPC-D-352 |
Electronic Design Data Description for Printed Boards in Digital Form |
Orig. 8/85 |
||
IPC-D-354 |
Library Format Description for Printed Boards in Digital Form |
Orig. 2/87 |
||
IPC-D-355 |
Printed Board Assembly Description in Digital Form |
Orig. 1/95 |
||
IPC-D-356 |
Bare Board Electrical Test Information in Digital Form |
Rev. B 10/02 |
||
IPC-AM-361 |
Specification for Rigid Substrates for Additive Process Printed Boards |
Superseded by IPC-4101 |
||
IPC-MB-380 |
Guidelines for Molded Interconnection Devices |
Orig. 10/90 |
||
IPC-D-390 |
Automated Design Guidelines |
Rev. A 2/88 |
||
IPC-C-406 |
Design and Application Guidelines for Surface Mount Connectors |
Orig. 1/90 |
||
IPC-CI-408 |
Design and Application Guidelines for the Use of Solderless Surface Mount Connectors |
Orig. 1/94 |
||
IPC-BP-421 |
General Specification for Rigid Printed Board Backplanes with Press Fit Contacts |
Obsolete without replacement |
||
IPC-D-422 |
Design Guide for Press Fit Rigid Printed Board Backplanes |
Orig. 9/82 |
||
IPC-DW-424 |
General Specification for Encapsulated Discrete Wire Interconnection Boards |
Orig. 1/95 |
||
IPC-DW-425 |
Design and End Product Requirements for Discrete Wiring Boards |
Rev. A 5/90 |
||
IPC-DW-426 |
Specifications for Assembly of Discrete Wiring |
Orig. 12/87 |
||
IPC-TR-460 |
Trouble-Shooting Checklist for Wave Soldering Printed Wiring Boards |
Rev. A 2/84 |
||
IPC-TR-461 |
Solderability Evaluation of Thick and Thin Fused Coatings |
Orig. 3/79 |
||
IPC-TR-462 |
Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage |
Orig. 10/87 |
||
IPC-TR-464 |
Accelerated Aging for Solderability Evaluations |
Rev. A 12/87 |
||
IPC-TR-465-1 |
Round Robin Test on Steam Ager Temperature Control Stability |
Orig. 1993 |
||
IPC-TR-465-2 |
The Effect of Steam Aging Time and Temperature on Solderability Test Results |
Orig. 1993 |
||
IPC-TR-465-3 |
Evaluation of Steam Aging on Alternative Finishes, Phase IIA |
Orig. 7/96 |
||
IPC-TR-466 |
Wetting Balance Standard Weight Comparison Test |
Orig. 4/95 |
||
IPC-TR-467 |
Supporting Data and Numerical Examples for ANSI/J-STD-001 Appendix D |
Orig. 10/96 |
||
IPC-TR-468 |
Factors Affecting Insulation Resistance Performance of Printed Boards |
Orig. 3/79 |
||
IPC-TR-470 |
Thermal Characteristics of Multilayer Interconnection Boards |
Orig. 1/74 |
||
IPC-TR-474 |
An Overview of Discrete Wiring Techniques |
Obsolete without replacement |
||
IPC-TR-476 |
How to Avoid Metallic Growth
Problems on Electronic Hardware |
Rev. A 6/84 (new title) |
||
IPC-TR-480 |
Results of Multilayer Test Program Round Robin IV Phase I |
Obsolete without replacement |
||
IPC-TR-481 |
Results of Multilayer Test Program Round Robin V |
Orig. 4/81 |
||
IPC-TR-482 |
New Developments in Thin Copper Foils |
Orig. 1/76 |
||
IPC-TR-483 |
Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program |
Rev. A 3/91 |
||
IPC-TR-484 |
Results of IPC Cooper Foil Ductility Round Robin Study |
Orig. 4/86 |
||
IPC-TR-485 |
Results of Cooper Foil Rupture Strength Test Round Robin Study |
Orig. 3/85 |
||
IPC-TR-486 |
Report on Round Robin Study to Correlate Interconnect Stress Test (IST) with Thermal Stress/Microsectioning Evaluations for Detecting the Presence of Inner-layer Separations |
Orig. 07/01 |
||
IPC-TR-549 |
Measles in Printed Wiring Boards |
Orig. 11/78 |
||
IPC-TR-551 |
Quality Assessment of Printed Boards Used for Mounting and Interconnecting Electronic Components |
Orig. 7/93 |
||
IPC-DR-570 |
General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards |
Obsolete without replacement |
||
IPC-DR-572 |
Drilling Guidelines for Printed Boards |
Rev A 03/07 |
||
IPC-TR-576 |
Additive Process Evaluation |
Obsolete without replacement |
||
IPC-TR-578 |
Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor Width and Plated-Through Holes in Rigid, Bare Copper, Double-Sided Printed Wiring Boards |
Orig. 9/84 |
||
IPC-TR-579 |
Round Robin Reliability Evaluation of Small Diameter Plated Through Holes in Printed Wiring Boards |
Orig. 9/88 |
||
IPC-TR-580 |
Cleaning and Cleanliness Test Program Phase 1 Test Results |
Orig. 10/89 |
||
IPC-TR-581 |
IPC Phase 3 Controlled Atmosphere Soldering Study |
Orig. 8/94 |
||
IPC-TR-582 |
IPC Phase 3 No-Clean Flux Study |
Orig. 11/94 |
||
IPC-TR-583 |
An In-Depth Look At Ionic Cleanliness Testing |
Orig. 7/02 |
||
IPC-WP/TR-584 |
IPC White Paper and Technical Report on Halogen-Free Materials used for Printed Circuit Boards and Assemblies |
Rev A 08-07 |
||
IPC-TR-585 |
Time, Temperature and Humidity Stress of Final Board Finish Solderability |
Orig. 05/06 |
||
IPC-A-600 |
Acceptability of Printed Boards |
Rev. G 07/04 |
||
IPC-SS-605 |
Printed Board Quality Evaluation Slide Set |
Obsolete without replacement |
||
IPC-QE-605 |
Printed Board Quality Evaluation Handbook |
Rev. A 2/99 |
||
J-STD-609 |
Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb) Pb-Free and Other Attributes and Devices |
Orig. 05/07 |
||
IPC-A-610 |
Acceptability of Electronic Assemblies |
Rev. D 2/05 |
04/05 |
04/05 |
IPC-HDBK-610 |
Handbook and Guide to IPC-A-610 (Includes B-C-D comparison) |
Amend 1 10/05 |
||
IPC-QE-615 |
Assembly Quality Evaluation Handbook |
Obsolete without replacement |
||
IPC/WHMA-A-620 |
Acceptability of Electronic Wire Harnesses and Cables |
Rev A 07/06 |
03/02 |
|
IPC-AI-640 |
User's Guidelines for Automated Inspection of Unpopulated Thick Film Hybrid Substrates |
Obsolete without replacement |
||
IPC-AI-641 |
User's Guidelines for Automated Solder Joint Inspection |
Obsolete without replacement |
||
IPC-AI-642 |
User's Guidelines for Automated Inspection of Artwork, Interlayers, and Unpopulated PWB's |
Obsolete without replacement |
||
IPC-OI-645 |
Standard for Visual Optical Inspection Aids |
Orig. 10/93 |
||
IPC-TM-650 |
Test Methods Manual |
Updated per test method |
||
IPC-ET-652 |
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards |
Orig. 10/90 Superseded by IPC-9252 |
||
IPC-QL-653 |
Qualification of Facilities that Inspect/Test Printed Boards, Components, and Material |
Rev. A 11/97 |
||
IPC-MI-660 |
Incoming Inspection of Raw Materials Manual |
Orig. 2/84 |
||
IPC-R-700 |
Suggested Guidelines for Modification, Rework and Repair of Printed Boards and Assemblies |
Superseded by IPC-7711A/7721A |
||
IPC-TA-720 |
Technology Assessment Handbook on Laminates |
Orig. ’86 |
||
IPC-TA-721 |
Technology Assessment Handbook on Multilayer Boards |
Orig. ’88 |
||
IPC-TA-722 |
Technology Assessment of Soldering |
Orig. ’90 |
||
IPC-TA-723 |
Technology Assessment Handbook on Surface Mounting |
Orig. ’91 |
||
IPC-TA-724 |
Technology Assessment Series on Cleanrooms |
Orig. 4/98 |
||
IPC-PE-740 |
Troubleshooting Guide for Printed Board Manufacture and Assembly |
Rev. A 12/97 |
||
IPC-CM-770 |
Printed Board Component Mounting |
Rev. E 1/04 |
||
IPC-SM-780 |
Component Packaging and Interconnecting with Emphasis on Surface Mounting |
Orig. 3/88 |
||
IPC-SM-782 |
Surface Mount Design and Land Pattern Standard |
Superseded by IPC-7351 |
||
IPC-SM-784 |
Guidelines for Chip-on-Board Technology Implementation |
Orig. 11/90 |
||
IPC-SM-785 |
Guidelines for Accelerated Reliability Test of Surface Mount Solder Attachments |
Orig. 11/92 |
||
IPC-SM-786 |
Procedures for Characterizing and Handling of Moisture/ Reflow Sensitive ICs |
Superseded by J-STD-020 and J-STD-033 |
||
IPC-MC-790 |
Guidelines for Multichip Module Technology Utilization |
Orig. 8/92 |
||
IPC-S-801 |
Superseded by IPC-804 and J-STD-003 |
|||
IPC-S-803 |
Superseded by IPC-804 and J-STD-003 |
|||
IPC-S-804 |
Solderability Test Methods for Printed Wiring Boards |
Superseded by J-STD-003 |
||
IPC-S-805 |
Solderability Tests for Component Leads and Terminations |
Superseded by |
||
IPC-MS-810 |
Guidelines for High Volume Microsection |
Orig. 10/93 |
||
IPC-S-815 |
General Requirements for Soldering Electronic Interconnections |
Superseded byJ-STD-001 |
||
IPC-S-816 |
SMT Process Guideline and Checklist |
Orig. 7/93 |
||
IPC-SM-817 |
General Requirements for Dielectric Surface Mounting Adhesives |
Orig. 11/89 |
||
IPC-SF-818 |
General Requirement for Electronic Soldering Fluxes |
Superseded by J-STD-004 |
||
IPC-SP-819 |
General Requirements and Test Methods for Electronic Grade Solder Paste |
Orig. 10/88 Superseded by J-STD-005 |
||
IPC-AJ-820 |
Assembly and Joining Manual |
Orig. 8/96 |
||
IPC-CA-821 |
General Requirements for Thermally Conductive Adhesives |
Orig. 1/95 |
||
IPC-CC-830 |
Qualification and Performance of Electronic Insulating Compound for Printed Board Assemblies |
Rev B 08/02 |
08/02 |
|
IPC-HDBK-830 |
Conformal Coating Handbook |
Orig. 10/02 |
||
IPC-SM-839 |
Pre and Post Solder Mask Application Cleaning Guidelines |
Orig. 4/90 |
||
IPC-SM-840 |
Qualification and Performance of Permanent Polymer Coating (Solder Mask) for Printed Boards |
Rev. D 4/07 |
8/00 |
|
IPC-HDBK-840 |
Solder Mask Handbook |
Orig. 09/06 |
||
IPC-H-855 |
Hybrid Microcircuit Design Guide |
Obsolete without replacement |
||
IPC-D-859 |
Design Standard for Thick Film Multilayer Hybrid Circuits |
Orig. 12/89 |
Y |
|
IPC-HM-860 |
Specification for Multilayer Hybrid Circuits |
Orig. 1/87 |
Y |
|
IPC-TF-870 |
Qualification and Performance of Polymer Thick Film Printed Boards |
Orig. 11/89 |
Y |
|
IPC-ML-910 |
Design and End Production Specification for Rigid Multilayer Printed Boards |
Superseded by IPC-D-949, IPC-D-275, and subsequently
IPC-2221 for Design and IPC-ML-950, IPC-RB-276, and subsequently IIPC-6011
for End Product Specification |
||
IPC-D-949 |
Design Standard for Rigid Multilayer Printed Boards |
Superseded by IPC-D-275 and subsequently by
IPC-2221/2222 |
||
IPC-ML-950 |
Performance Specification for Rigid Multilayer Printed Boards |
Superseded by IPC-RB-276 and subsequently
IPC-6011/6012 |
||
IPC-ML-960 |
Qualification and Performance Specification for Mass Laminated Panels for Multilayer Printed Boards |
Orig. 7/94 |
Y |
|
IPC-ML-975 |
End Product Documentation Specification for Multilayer Printed Wiring Boards |
Superseded by IPC-D-325 |
||
IPC-ML-990 |
Performance Specification for Flexible Multilayer Wiring |
Superseded by IPC-6011 |
||
IPC-1043 |
Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 1 |
Orig. 8/92 |
||
IPC-1044 |
Cleaning & Cleanliness Test Program Phase 3 Water Soluble Fluxes Part 2 |
Orig. 10/92 |
||
IPC-1065 |
Material Declaration Handbook |
Orig. 01/05 |
||
IPC-1066 |
Labeling of PCBs and Assemblies |
Orig. 12/04 |
||
IPC-TP-1090 |
The Layman's Guide to Qualifying New Fluxes for MIL-STD-2000A or MT-0002 |
Orig. 7/96 |
||
IPC-TP-1103 |
Manufacturing Concerns When Soldering with Gold Plated Component Leads or Circuit Board Pads |
Obsolete without replacement |
||
IPC-TP-1114 |
The Layman's Guide to Qualifying a Process to J-STD-001B |
Orig. 1/98 |
||
IPC-TP-1115 |
Selection and Implementation Strategy for A Low-Residue No-Clean Process |
Orig. 12/98 |
||
IPC-1131 |
IT Guidelines for PWB Manufacturers |
Orig. 04/00 |
||
IPC-1331 |
Voluntary Safety Standard for Electrically Heated Process Equipment |
Orig. 3/00 |
||
IPC-1710 |
OEM Standard for Printed Board Manufacturers' Qualification Profile (MQP) |
Rev. A 7/04 |
||
IPC-1720 |
Assembly Qualification Profile (AQP) |
Rev. A 7/04 |
||
IPC-1730 |
Laminator Qualification Profile (LQP) |
Rev. A 6/00 |
||
IPC-1731 |
Strategic Raw Materials Supplier Qualification Profile |
Orig. Pub. 6/00 |
||
IPC-1751 |
Generic Requirements for Declaration Process Management |
Vers. 1.1 3/07 |
||
IPC-1752 |
Materials Declaration Management (Includes 2 PDF forms) |
Vers. 1.1 3/07 |
||
IPC-1902 |
Grid Systems for Printed Circuits (equivalent to IEC 60097) |
Orig. Pub. 03/99 |
||
IPC-2141 |
Controlled Impedance Circuit Boards and High Speed Logic Design |
Rev. A 3/04 |
||
IPC-2221 |
Generic Standard on Printed Board Design |
Rev. A 5/03 |
||
IPC-2222 |
Sectional Design Standard for Rigid Organic Printed Boards |
Supersedes IPC-D-275 |
||
IPC-2223 |
Sectional Design Standard for Flexible Printed Boards |
Rev. A 06/04 |
||
IPC-2224 |
Sectional Standard for Design of PWBs for PC Cards |
Orig. 01/98 |
||
IPC-2225 |
Sectional Design Standard for Organic Multichip Modules (MCM-L) and MCM-L Assemblies |
Orig. 05/98 |
||
IPC-2226 |
Design Standard for High-Density Array or Peripheral Leaded Component Mounting Structures |
Orig. 4/03 |
||
IPC-2251 |
Design Guidelines for Electronic Packaging Utilizing High Speed Techniques |
Orig. 12/03 |
||
IPC-2252 |
Design and Manufacturing Guide for RF/Microwave Circuit Boards |
Orig. 7/02 |
||
IPC/JPCA-2315 |
Design Guide for High Density Interconnects (HDI) and Microvia |
Orig. 6/00 |
||
IPC-2316 |
Design Guide for Embedded Passive Device Printed Boards |
Orig. 03/07 |
||
IPC-2501 |
Definition for Web-based Exchange of XML Data |
Orig. 7/03 |
Y |
|
IPC-2511 |
Generic Requirements for Implementation of Product Manufacturing Description Data and Transfer Methodology |
Rev. B 1/02 |
Y |
|
IPC-2512 |
Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description |
Rev A 11/00 |
||
IPC-2513 |
Sectional Requirements for Implementation of Drawing Methods for Manufacturing Data Description |
Rev A 11/00 |
||
IPC-2514 |
Sectional Requirements for Implementation of Printed Board Manufacturing Data Description |
Rev A 11/00 |
||
IPC-2515 |
Sectional Requirements for Implementation of Bare Board Product Electrical Testing Data Description |
Rev A 11/00 |
||
IPC-2516 |
Sectional Requirements for Implementation of Assembled Board Product Manufacturing Data Description |
Rev A 11/00 |
||
IPC-2517 |
Sectional Requirements for Implementation of Assembly In-Circuit Testing Data Description – 2-11gChair, Bob Neal, Agilent Technologies |
Rev A 11/00 |
||
IPC-2518 |
Sectional Requirements for Implementation of Part List Product Data Description - Chair, Harry Parkinson, Parkinson Consulting |
Rev A 11/00 |
||
IPC-2524 |
PWB Fabrication Data Quality Rating System |
Orig. 02/99 |
||
IPC-2531 |
Standard Recipe File Format Specification |
Orig. 03/99 |
||
IPC-2541 |
Generic Requirements for Electronic Manufacturing Shop Floor Equipment Communication |
Orig. 10/01 |
Y |
|
IPC-2546 |
Sectional Requirements for Shop Floor Electronic Assembly Equipment Communication |
Amend. 1 01/03 |
Y |
|
IPC-2547 |
Sectional Requirements for Shop Floor Electronic Inspection and Test Equipment Communication |
01/02 |
Y |
|
IPC-2571 |
Generic Requirements for Electronic Manufacturing Supply Chain Communication-Product Data Exchange (PDX) |
11/01 |
Y |
|
IPC-2576 |
Sectional Requirements for Electronics Manufacturing Supply Chain Communication of As-Built Product Data - Product Exchange (PDX) |
11/01 |
Y |
|
IPC-2578 |
Sectional Requirements for Supply Chain Communication of Bill of material and Product Design Configuration Data-Product Data Exchange (PDX) |
11/01 |
Y |
|
IPC-2581 |
Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology (Offspring) |
Amend 1 05/07 |
Y |
|
IPC-2582 |
Sectional Requirements for Implementation of Design Characteristics for Manufacturing Data Description |
Orig. 045.07 |
||
IPC-2583 |
Sectional Requirements for Implementation of Administrative Methods for Manufacturing Data Description |
Orig. 045.07 |
||
IPC-2584 |
Sectional Requirements for Implementation of Printed Board Fabrication Data Description |
Orig. 045.07 |
||
IPC-2588 |
Sectional Requirements for Implementation of Part List Product Data Description |
Orig. 045.07 |
||
IPC-2615 |
Printed Board Dimensions and Tolerances |
Supersedes IPC-D-300 |
Y |
|
IPC-3406 |
Guidelines for Electrically Conductive Surface Mount Adhesives |
Orig. 7/96 |
||
IPC-3408 |
General Requirements for Anistropically Conductive Adhesive Films |
Orig. 11/96 |
||
IPC-4101 |
Specification for Base Materials for Rigid and Multilayer Boards |
Rev. B Amends 1&2 04/07 |
TBA |
|
IPC-4103 |
Specification for Plastic Substrates, Clad or Unclad, for High Speed/High Frequency Interconnection |
Supersedes IPC-L-125 |
Y |
|
IPC/JPCA-4104 |
Specification for High Density Interconnect (HDI) and Microvia Materials |
Orig. 5/99 |
05/99 |
|
IPC-4110 |
Specification and Characterization Methods for Nonwoven Cellulose Based Paper for Printed Boards |
Orig. 8/98 |
10/98 |
|
IPC-4121 |
Guidelines for Selecting Core Constructions for Multilayer Printed Wiring Board Applications |
Supersedes IPC-CC-110A |
||
IPC-4130 |
Specification and Characterization Methods for Nonwoven "E" Glass Mat |
Orig. 9/98 |
12/99 |
|
IPC-4202 |
Flexible Base Dielectrics for Use in Flexible Printed Wiring |
Supersedes IPC-FC-231C |
06/02 |
02/03 |
IPC-4203 |
Adhesive Coated Dielectric Films for Use as Cover Sheets |
Supersedes IPC-FC-232C |
06/02 |
02/03 |
IPC-4204 |
Flexible Metal-Clad Dielectrics for Use in Fabrication of |
Supersedes IPC-FC-241C |
06/02 |
02/03 |
IPC-4411 |
Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement |
Rev. A 11/03 |
||
IPC-4412 |
Specification for Finished Fabric Woven form "E" Glass for Printed Boards |
Rev. A 01/06 |
||
IPC-4552 |
Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards |
Orig. 10/02 |
11/02 |
|
IPC-4553 |
Specification for Immersion Silver Plating for Printed Circuit Boards |
Orig. 06/05 |
09/06 |
|
IPC-4554 |
Specification for Immersion Tin Plating for Printed Circuit Boards |
Orig. 02/07 |
||
IPC-4562 |
Metal Foil for Printed Wiring Applications |
Amend. 1 |
05/05 |
02/03 |
IPC-4761 |
Design Guide for Protection of Printed Board Via Structures |
Orig. 07/06 |
||
IPC-4821 |
Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards |
Orig. 05/06 |
||
IPC-5701 |
Users Guide for Cleanliness of Unpopulated Printed Boards |
Orig. 7/03 |
||
IPC-5702 |
Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards |
Orig. 06/07 |
||
IPC-6011 |
Generic Performance Specification for Printed Boards |
Orig. 7/96 |
||
IPC-6012 |
Qualification and Performance Specification for Rigid Printed Boards |
Rev. B with Amend 1 02/07 |
||
IPC-6013 |
Qualification and Performance Specification for Flexible Printed Boards |
Rev. A with Amend. 2 04/06 |
||
IPC-6015 |
Qualification and Performance Specification for Organic Multichip Module (MCM-L) Mounting and Interconnecting Structures |
Orig. 2/98 |
||
IPC-6016 |
Qualification and Performance Specification for High Density Interconnect (HDI) Layers or Boards |
Orig. 05/99 |
8/99 |
|
IPC-6018 |
Microwave End Product Board Inspection and Test |
Rev. A 01/02 |
Y |
|
IPC/JPCA-6202 |
Performance Guide Manual for Single- and Double-Sided Flexible Printed Wiring Boards |
Orig. 2/99 |
||
IPC/JPCA-6801 |
Terms & Definitions, Test Methods, and Design Examples for Build-Up/High Density Interconnection |
Orig. 1/00 |
||
IPC-7095 |
Design and Assembly Process Implementation for BGAs |
Rev. A 11/04 |
||
IPC-7525 |
Guidelines for Stencil Design |
Rev. A 02/07 |
06/00 |
|
IPC-7526 |
Stencil and Misprinted Board Cleaning Handbook |
Orig. 02/07 |
||
IPC-7530 |
Guidelines for Temperature Profiling for Mass Soldering (Wave and Reflow) Processe |
Orig. 05/01 |
||
IPC-7351 |
Generic Requirements for Surface Mount Design and Land Pattern Standard |
Rev. A 02/07 |
||
IPC-7711/7721 |
Rev B renamed to: Rework, Repair and Modification of Electronic Assemblies |
Rev B 11/07 |
||
IPC-7912 |
Calculation of DPMO and Manufacturing Indices for Printed Wiring Assemblies |
Rev. A 01/04 |
01/04 |
|
IPC-8413-1 |
Specification for Manufacturing Process Carriers for Handling Optical Fiber |
Orig. 04/03 |
||
IPC-9151 |
Printed Board Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database |
Rev. B 02/07 |
||
IPC-9191 |
General Guideline for implementation of Statistical Process Control (SPC) |
Supersedes IPC-PC-90 |
||
IPC-9194 |
Implementation of Statistical Process Control (SPC) Applied to Printed Board Assembly Manufacture Guideline |
Orig. 09/04 |
||
IPC-9199 |
SPC Quality Rating |
Orig. 09/02 |
||
IPC-9201 |
Surface Insulation Resistance Handbook |
Rev A 08/07 |
||
IPC-9251 |
Test Vehicles for Evaluating Fine Line Capability |
Orig. 7/00 |
||
IPC-9252 |
Guidelines and Requirements for Electrical Testing of Unpopulated Printed Boards |
Supersedes IPC-ET-652A |
||
IPC-9261 |
In-Process DPMO and Estimated Yield for PWAs |
Rev. A 10/06 |
03/02 |
|
IPC-9501 |
PWB Assembly Process Simulation for Evaluation of Electronic Components |
Orig. 7/95 |
||
IPC-9502 |
PWB Assembly Soldering Process Guidelines for Non-IC Electronic Components |
Orig. 4/99 |
||
IPC-9503 |
Moisture Sensitivity Classification for Non-IC Components |
Orig. 4/99 |
||
IPC-9504 |
Assembly Process Simulation for Evaluation of Non-IC Components |
Orig. 6/98 |
10/98 |
|
IPC-9591 |
Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices |
Orig. 04/06 |
||
IPC-9691 |
User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing) |
Rev A 08/07 |
||
IPC-9701 |
Qualification and Performance Test Methods for Surface Mount Solder Attachments |
Rev. A 02/06 |
Y |
|
IPC/JEDEC-9702 |
Monotonic Bend Characterization of Board-Level Interconnects |
Orig. 06/04 |
||
IPC-9850 |
Surface Mount Equipment Performance Characterization |
Orig. 7/02 |
09/02 |
|
IPC-SMEMA-9851 |
Equipment Interface Specification |
Orig. 11/04 |
||
IPC-DRM-SMT |
Surface Mount Solder Joint Evaluation Desk Reference Manual |
Rev. B 4/00 |
||
IPC-EMSI-TC |
IPC Sample Master Ordering Agreement for EMS Companies and OEMs |
Orig. 03/02 |
||
Roadmap |
International Technology Roadmap for Electronic Interconnections |
Updated 2007 |