Description The advent of the Industry 4.0 Revolution and Internet of Manufacturing (IoM) has started to yield Smart factories, intelligent machines and networked processes, that have brought us improvements in yield and the ultimate in production efficiency and traceability. ... read more

Description Electronics assembly can be delivered at competitive market prices only as long as the manufacturing process is continuously improved. ... read more

Description With the ascent of Industry 4.0, the urgency of connecting to equipment on a manufacturing line is increasing. This article focuses on the electronics industry and summarizes what that interaction can entail, how it occurs, and the potential benefits. ... read more

Description Within-application reliability and fail-safe processes paramount, aerospace applications present unique challenges for materials suppliers. ... read more

Description Conformal coatings are essential components for the microelectronics packaging industry. These functional coatings aim to protect electronic circuits from environmental factors such as heat and moisture. ... read more

Description The demand for smaller, faster and smarter electronic devices that can communicate to each other via wireless networks is stretching current communication systems to their limits. ... read more

Description The migration to large panel substrates in advanced packaging applications is principally motivated by cost considerations. However, it is occurring at a time when package processing is becoming more complex and demanding. ... read more

Description The electroless deposition of Copper is widely used within the printed circuit board industry as it offers a simple and reliable method for metallizing holes, which subsequently enable multilayer PCBs. ... read more

Description Surface Insulation Resistance (SIR) testing is a standard method used to characterize soldering and cleaning processes that result in acceptable levels of flux and other residues. Several different materials are used to assemble printed circuit cards. ... read more

Description A series of flux systems have been developed which would result in a reduced viscosity after reflow. ... read more

Description Certain high-reliability pockets of the electronics industry, such as telecommunications, defense, aerospace, and medical, often put great weight on the cleanliness of the finished PCBA. ... read more

Description Every year, billions and billions of products are made and sold across the world. Each of these products, regardless of volume, are made in facilities that follow certain steps to assemble, test, and ship to customers. ... read more

Description Use cases, solutions and standards for single device traceability in the supply chain to enable root case analysis, recall containment, device pairing, yield and reliability improvement and liability protection. ... read more

Description Machine Learning  Edge Computing Edge AI Demonstrated using a Case Study on HiP (Head in Pillow) defect detection ... read more

Description New product introduction at an Original Equipment Manufacturer (OEM) typically includes reliability testing in the form of thermal cycling. Samplings from the engineering models of a new product line were consistently failing the optical testing following the reliability testing. ... read more

Description In automotive applications, electronic products are subject to several loads, among which thermomechanical loads are particularly affecting the product reliability. ... read more

Description This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). ... read more

Description Polymer Thick Film(PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry. ... read more

Description Today’s unique assembly challenges are comprised of complex PCB panelization, involving identical PCBs with a goal towards increased production capability, due to a reduced footprint of the Production Floor. ... read more

Description The drive for miniaturization of both commercial and aerospace/military technologies are not compatible with the current standard United States domestic PCB manufacturing processes at the volumes and lead times needed by OEMs and the Department of Defense. ... read more

Description The need for increasingly complex electronics combined with the obsolescence of larger component packages is driving innovation to provide alternatives to the traditional subtractive-etch fabrication process to reliably and repeatedly provide circuit layers with 25 micron or finer feature size.  ... read more

Description The competitive pressures that electronics companies experience today are exceptional, even for an industry accustomed to a relentlessly high rate of innovation. Manufacturers are challenged to keep up with customization (lower volume and higher mix) and globalization. ... read more

Description The Vertical Segments of the Electronic Products Manufacturing Industry (Semiconductor, Outsourced System Assembly, and Test, and Printed Circuit Board Assembly) are converging and service offerings are consolidating due to advanced technology adoption and market dynamics. ... read more

Description Robotic soldering is a growing market within the PCB Assembly industry and interest in robotic soldering equipment and applications is increasing every year. This method is more efficient than hand soldering and will aid in alleviating human mistakes. ... read more

Description The electronics industry is still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Alternative alloys with lower melting temperatures may wet faster and open the process window. ... read more

Description This paper presents results from a joined R&D project between two companies; Automotive Tier-1 and Technology Provider of structural electronics. Key benefits of structural electronics are 3-dimensional shapes, reduced thickness and weight as well as simplified assembly. ... read more

Description Electronic components are exposed to impact loadings and mechanical vibrations during assembly, material handling, and transportation. ... read more

Description Radio Detection and Ranging (radar) sensors require specialized materials and specific tolerances in order to optimize their function. ... read more

Description Commonly used integrated circuits have been increasingly moving from leaded packages that are reworkable with a soldering iron to leadless packages such as BGAs that require complex rework that cannot be visually inspected to confirm success. ... read more

Description Multiple Electronics Markets are driving the growing need for components with higher performance in smaller form factors with higher pin count and greater reliability. ... read more

Description Whilst many forward-thinking companies invest time, effort and cost into up front work to fix snags which would lead to issues with yield during production, this paper shows the efforts of a company who take things further. ... read more

Description If you don't measure, you don't know. These are appropriate words for the application of statistical methods for measuring machine and process capabilities in surface mount technology (SMT) manufacturing. ... read more

Description With the growth of Surface Mount Technology (SMT) driven by new technological innovations and next generation products, machine feeder density becomes extremely important in electronics manufacturing.  ... read more

Description Customer demands for smaller form factor electronic devices are driving the use of thinner electronic components and thinner printed circuit boards (PCB) in the assembly process. ... read more

Description Warning required to be provided for exposing person to a listed chemical, unless “person in the course of doing business” can demonstrate it does not pose “significant risk”   •Approximately 900 listed chemicals  •75+% involve lead and phthalates ... read more

Description California Clear and reasonable warnings •Overview of new warning regulation  •Retailer warnings accompanying sale  •Warnings website •Listings•Compliance assistance  •Safe Harbors  •Safe Use Determinations and Interpretive Guidance ... read more

Description Intended for use as technical guidance by ADHP (Aerospace, Defense, and High-Performance) electronics system customers to provide the technical structure needed to allow the designer to evaluate the options for using Pbfree BGAs in an assembly that has not converted to full Pb-free assembly ... read more

Description J-STD-001G Amendment 1 standard requires an OEM and EMS to qualify soldering and/or cleaning processes that result in acceptable levels of flux and other residues. Objective evidence shall be available for review. ... read more

Description Findings and recommendations are reported from phase 1 of the Transient AMR(absolute maximum ratings) project, which is sponsored by the EOS/ESD Association and Industry Council on ESD Targets, and DfR Solutions. ... read more

Description High-frequency materials are characterized by several important parameters, including the dielectric constant or relative permittivity (εr) and the dissipation factor (Df). ... read more

Description This paper analyzes the reasons of inaccurate PCB impedance simulation of the traditional simulator and introduces a novel and cost-effective method for accurate PCB impedance simulation of any specific stack-ups. ... read more

Description The importance of signal integrity is emphasized as signal speed increases, and higher frequencies are applied. The PCB manufacturer uses SI coupons that can replace the in-product circuit to measure and calculate the signal loss. ... read more

Description Driven by rapid changes and markets, the electronics industry has seen massive growth over the past few decades. The short product life cycle has pushed PCB fabrication technology to its limits. ... read more

Description Phosphorus content in electroless nickel deposits, for PCB and electronic connectors, is a critical factor in controlling the nickel layer’s corrosion resistance and solderability. ... read more

Description The development of nano-scale surface finishes over copper pads such as Electroless Palladium and Autocatalytic Gold (EPAG) has been evolving in the recent years due to ever increasing demands in terms of reliability, component miniaturization and signal transmission. ... read more

Description Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) is a well-accepted and established finish for high performance applications. ... read more

Description The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer.  Among the primary factors affecting the integrity of high-frequency signals is the surface finish applied on PCB copper pads ... read more

Description QFN-Quad Flat No-lead SMT-surface mount technology components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performance and reliability.  QFN device thermal pad regions have been observed w/ excessive void densities >30% i ... read more

Description Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. ... read more

Description WECC Global PCB Production Report is an annual report published by the World Electronic Circuits Council (WECC), including IPC. The members of WECC include the printed circuit associations of the major PCB-producing countries and regions. ... read more