Description This slide show discusses the cybersecurity risks associated with network integration.  The supply chain is the most vulnerable, especially sub suppliers.  A particular risk is when bad actor suppliers build in controlling components by changing the Gerber file.  This allows worms to infiltrate s ... read more

Description Current policies and regulations intended to protect supply chains from cyber threats, especially the supply chain to the US DoD, have proven ineffective. Nearly $1 trillion in intellectual property and controlled unclassified information (CUI) is stolen very year by foreign adversaries. ... read more

Description Published stories in 2015 of a maliciously altered server motherboard have made clear that the circuit board is vulnerable to hardware attacks. ... read more

Description This paper will discuss from an operational perspective what companies are or aren’t doing now and what steps companies can take to secure their overall IT enterprise which will logically help secure their Operational Technology (OT). ... read more

Description High Density Interconnect (HDI) Printed Circuit Boards (PCBs) and assemblies are essential to allow space projects to benefit from the ever-increasing functionality of modern integrated circuits. ... read more

Description This slide show discusses Automation of IST testing.  It utilizes Dielectric estimation laminate assessment method (DELAM).  The slides utilizes thermo-graphics to locate the failure in microvias.  The microvias are tested using IST standard X design and Reflow cycling.    Different Microvia stru ... read more

Description The push for faster data rates and increased signal density in printed circuit boards (PCBs) increases the risk of signal crosstalk on high-speed communication busses which can be highly detrimental to system performance. ... read more

Description Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicker PCBs with higher part densities. ... read more

Description The continued miniaturization of both packaging and component size in next-generation electronics presents a significant challenge for PCB designers and PCB fabricators. ... read more

Description The combination of increased I/O density, reduced footprint, and multi-die capability within a single platform makes embedded die an attractive solution. ... read more

Description The reliability control in airborne electronics products is essential due to safety and business reasons. ... read more

Description Over many years defect analysis has been used at the company to determine the root cause of various defects experienced in the field on electronic products from customers. Based on this work it has been found that around 25 percent of all case studies have been due to de-wetting issues. ... read more

Description Two independent Printed Circuit Board (PCB) suppliers found unusually high voiding anomalies in multiple manufacturing lots of PCBs that were processed over a 5 month period. ... read more

Description In recent years, neural network based deep learning models has demonstrated high accuracy in object detection and classification in the area of digital image processing. ... read more

Description Blockchain technology has a lot of publicity in the electronics industry because of the way it has been used to address issues with sharing data across distributed networks and is recognized for providing "greater transparency, enhanced security, improved traceability, increased efficiency and sp ... read more

Description Automated test equipment plays a large role in the manufacturing process at the Kansas City National Security Campus (KCNSC). Every test run generates data which is used to determine if a part meets its requirements or to troubleshoot failures if they occur. ... read more

Description Data is the New Oil ... read more

Description EMS factories have collected and used machine data for many decades. ... read more

Description Smart Factories require continuous and reliable operation of all equipment. Therefore, equipment maintenance is becoming more and more important. ... read more

Description This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structures, including air-to-air thermal shock, convection reflow assembly simulation and current induced thermal ... read more

Description As EMS Providers such as Contract Manufacturers look forward to Industry 4.0, their need for complex data analysis to inform manufacturing decisions takes on even more significance. ... read more

Description The smart factory project for Electronics Manufacturing initiative was developed to create a sandpit to carry out industry 4.0 use cases working with industrial members and partners. ... read more

Description Why use robotics? Precision -> improved quality Consistency -> improved quality Traceability -> improved quality Dexterity -> to handle the parts Robust -> reliability for multi shift operations Reconfigurable -> flexibility ... read more

Description This paper discusses the automation of inspection using Augmented Reality (AR).   Machine vision is used to find small components since it reduces the amount of time needed for inspection.  Augmented reality overlays the information from the design onto the PCB under the lens.  It then assists th ... read more

Description This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structures, including air-to-air thermal shock, convection reflow assembly simulation and current induced thermal ... read more

Description IPC/IMEC/ESA Microvia TV CITC Outline  CITC Coupon and Test Plan Overview  CITC Test Introduction  Temperature Coefficient of Resistance (TCR) Test and Results  Relative Life of the 3 HDI microvia structures provided  CITC Life Curves, Nf vs Temperature ... read more

Description The industry has been openly discussing the concern about weak microvia interfaces after IR reflow and the potential for an undetected open or latent defect that can escape after expensive components have been soldered to the board. ... read more

Description The electroless copper deposit must form a metallurgical bond between the target pad and electrolytic copper deposit to survive reflow assembly. 4-wire resistance measurements conducted on PWBs and coupons during reflow assembly revealed that thermal excursions fractured microvias. ... read more

Description Documentation shows that there are latent reliability issues with stacked filled Microvia designs for complex printed circuit boards. This issue is broadly defined as a weak interface between the plated copper and the blind via the target pad. ... read more

Description The Company has developed and industrialized an advanced technology of plastic-integrated structural electronics. Key benefits are 3-dimensional shapes, reduced thickness and weight as well as simplified assembly. The benefits are especially suited for automotive interior use cases. ... read more

Description The automotive industry is experiencing significant change in design and performance expectations as it moves to the future. Synonymous with high reliability in harsh conditions, today the automotive industry is also being linked to advanced electronics. ... read more

Description Electrical components in a car are predicted to double within the next years. Increased functionality per PCB, miniaturization and higher power density are coming in parallel with this trend. Keeping or increasing the reliability of assembled PCBs or other substrates (e.g. ... read more

Description The corrosion mechanism in the aqueous cleaning process is poorly understood. Much of the prior work is theoretical, based solely on Pourbaix Diagrams. These diagrams are based on the thermodynamic properties of the metal and select salts in a hypothetical situation. ... read more

Description Today, printed circuit boards used within electronic assemblies for high reliability applications are typically subjected to cleaning or defluxing processes. ... read more

Description Recently there has been an increase in the evaluation of low temperature lead-free soldering materials, such as tin-bismuth, in a process known as “hybrid assembly” in which higher temperature SnAgCu BGA/CSP components are assembled using low temperature tin-bismuth based pasts at typical tin-bis ... read more

Description Drive towards lead-free electronics began in the early 2000s. Solder pastes based on tin (Sn), copper (Cu), and silver (Ag) were the initial replacement for the traditional SnPb solder. ... read more

Description A novel epoxy SAC solder paste TIM system has been developedwith the use of non-volatile epoxy flux. Cu filler was added to the solder paste, with Cu volume % of metal ranged from 17 to 60 volume % of metal. ... read more

Description Industry 4.0, autonomous vehicles and 5G connectivity are driving a new Internet of Things (IoT) revolution. Assembly materials like thermal interface materials (TIMs) need to be selected keeping in mind both performance as well as economics viability. ... read more

Description Most dispensable thermosetting products are supplied as blends of monomers or pre-polymers. ... read more

Description Light-curable materials can provide significant benefits over conventional technologies, including very fast tack free curing, lower operating costs driven by lower labor needs, space savings, lower energy demand, and higher throughput. ... read more

Description   ... read more

Description Chip components are important elements in electronic production since surface mount technology was introduced. Over the years, package size has constantly decreased. ... read more

Description Industry demand for high-speed server product performance such as PCI express requires higher pin counts in order to support memory channels which in turn is driving pitch reduction in the printed circuit board(PCB).To provide better signal integrity for high-speed signals, ultra-low loss (ULL) P ... read more

Description The move from Plated Through Vias (PTVs) to advanced HDI interconnects is challenging the electronics industry, not only due to the increased complexity of design and manufacturing, but even more due to the difficulties associated with screening and testing at every level: PWB, assembly, and syst ... read more

Description High density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality of modern integrated circuits such as field programmable gate arrays (FPGAs), digital signal processors (D ... read more

Description Micro vias, be they mechanically, or more typically laser drilled have revolutionized the technical capabilities of today PCBs. ... read more

Description Automatic Test Equipment (ATE) in the form of in-circuit and manufacturing defects analyzers have been used successfully for finding catastrophic flaws that occur during production and assembly. ... read more

Description Several incidents occurred that prompted a team to investigate Printed Circuit Board (PCB) supplier best practices and rework procedures. ... read more

Description Printed circuit board manufacturers are continually challenged to fabricate denser solder mask patterns with smaller features to accommodate advanced electronic components. This trend is motivating manufacturers to adopt novel methods to achieve the required solder mask designs. ... read more

Description In manufacturing multilayer printed circuit boards (PCBs), the PCB layer stack-up usually includes multiple plies of various types of prepreg along with the inner layer core material. ... read more