Description Flip-chip technology has become increasingly prevalent within the electronics industry due to its lower cost, increased package density, improved performance while maintaining or improving circuit reliability, and increased I/O density. ... read more

Description Recently new semi-aqueous in-line cleaning machines (CM) were installed; however, the associated increased volumes of circuit card assemblies (CCAs) being cleaned after SMT surface mount technology assembly resulted in correspondingly more solder paste residue or “goo” building-up on cleaning mac ... read more

Description Traditional Subtractive Etch (SE) processes used to manufacture Printed Circuit Boards (PCBs) are adequate for many of today’s circuit designs. ... read more

Description This paper will discuss the evolution of the printed board design to date, how process improvements and new manufacturing technologies and chemistry have enabled the new step down in miniaturization. ... read more

Description This paper will discuss the difference between traditional advanced any layer HDI PCB with subtractive process and Ultra High-Density Interconnect (Ultra HDI) or substrate-like-PCB (SLP) with modified Semi-Additive Process (mSAP). ... read more

Description Complex geometries, customized parts and new processes; these are characteristics that are readily associated with additive manufacturing (AM). At the same time, they are often associated with high hurdles in terms of mass production, suitability for series production and reliability. ... read more

Description Multilevel Additively Manufactured (AME) circuits and devices have been enabling circuit design and implementation that is not possible or is very expensive using traditional methods such as PCB production. ... read more

Description Surface mounted passive electrical components are beginning to reach hard limits for further reduction in size of their packages. Performance of the raw materials used have set capabilities for their volumes. ... read more

Description Thermal management must advance with the military’s requirements for increased performance, lower costs, and rapid technology changes. ... read more

Description Structural electronics enables design innovation by adding electronic functions to smart surfaces with 3-dimensional form factors. This paper describes the making of a structural electronics technology demonstrator that uses polypropylene (PP) film and injection molding (IM) resin. ... read more

Description Stretchable electronics is a new innovation and becoming popular in various fields, especially in the health care sector. ... read more

Description The journey to creating a connected factory can be a scary and arduous task, with some not even knowing where to start. ... read more

Description Specialists in IIoT and Industry 4.0 at the Manufacturing Technology Centre have developed the first stage of Europe's first smart factory demonstrator for the manufacture of electronic assemblies, helping electronics manufacturers “go digital”, transforming their businesses, and meeting the dema ... read more

Description Automation is growing in nearly every sector. Self-driving cars, touchless soft-drink dispensing machines that deliver over 100 different drinks, and robots doing everything from food sorting to helping pack packages. ... read more

Description Companies that place products onto the marketplace, whether they are internally manufactured or sourced from a supply chain, are often faced with ever increasing demands for data from a diverse set of stakeholders, requiring a multitude of different data reporting needs to be identified and reque ... read more

Description Traditionally sourcing strategies are resolved by a “make or buy” process where companies evaluate if it is more cost effective to make or buy a product. ... read more

Description The challenge of decrease PCB manufacturing environmental impact is here to stay. The rate at which a company can process change is key to strategical advantage. Any increase of the change rate requires resources in R&D. ... read more

Description The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their processing speed compared to the previous system (4G) in order to support data transfer rates. ... read more

Description Electroless palladium plating has been present in the PCB industry for over 20 years providing highly reliable finishes for high end applications in combination with nickel and gold plating. ... read more

Description Purpose ... read more

Description The growing use of electronics in every area of our lives around the world has resulted in an increased awareness of potential environmental issues related to their use and disposal. ... read more

Description The excellent IPC-TR-587 technical report, ‘Conformal Coating Material and Application ‘‘State of the Industry’’ Assessment’ delivers the results of a recent major study on conformal coating, outlining an IPC study of major conformal coating types, coating application techniques, and coating cure ... read more

Description A surface insulation resistance study is presented on coated B52-like test boards where a large number of QFN components of different package designs are coated with non-optimal conformal coating process parameters creating bubbles at the QFN leads. ... read more

Description A supplier was experiencing laminate cracks in an FR4 dielectric constructed material product after successfully producing this Printed Circuit Board (PCB) for a number of years. ... read more

Description This paper documents an investigation of printed circuit board (PCB) failures due to edge burn outs. Electrical shorts were observed at late-stage environmental stress screening and electrical testing. Failed boards had burn marks at edges that were absent of components or surface circuitry. ... read more

Description A dynamic flex test was performed on a spacecraft instrument harness composed of multiple individual flex cables, with each flex cable containing multiple copper traces. ... read more

Description Miniaturization and harsh environment market drivers within the electronics industry are presenting new challenges in terms of predictive reliabilities of control standards. ... read more

Description In 2017, the Society of Automotive Engineers (SAE) G-24 committee approved revision activity for GEIA-STD-0005-1A, “Standard for Managing the Risks of Pb-free Solders and Finishes in ADHP Electronic Systems” (formerly known as “Performance Standard for Aerospace and High-Performance Electronic Sy ... read more

Description Electrical contacts, although critically important for a wide range of applications, are susceptible to degradation due to fretting corrosion, especially when sliding and vibrations occur. To overcome fretting corrosion and sliding wear, lubricants are often used. ... read more

Description This work provides analytical solutions to the temperature rise of one-dimensional conductors such as whiskers and wires. Whisker growth from metal surfaces of electrical connectors and other components has shown itself to create reliability issues. ... read more

Description The FIDES guide 2009 (Edition A) proposes a methodology for the reliability assessment of electronic to evaluate and control product reliability progress throughout life cycle. ... read more

Description Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of those whiskers is case dependent and difficult to observe by optical microscopy methods. ... read more

Description The method to measure intermetallic compound layer thickness is discussed in a paper recently published by the author[1]. The method uses voltage/current sources, voltmeters, and electrolytes depending on the measurements and the type of material. ... read more

Description Light emitting diodes (LEDs) are widely used throughout the electronics industry due to their high efficiency, lumen output, and expected lifetime. LEDs are semiconductor devices that are commonly used as indicator lights on printed circuit board assemblies (PCBAs). ... read more

Description The proliferation of Artificial Intelligence (AI), big data, 5G, electric vehicles, Internet of Things (IoT), Edge Computing,High Performance Computing (HPC) and Electric Vehicle (EV) in recent years has necessitated the increased use of electronics. ... read more

Description In this study, a patent-pending new solder paste material has been developed for assembly of System in Package (SiP) with outstanding slump resistance without compromising the paste volume printed, and the solder joint service temperature. ... read more

Description Use of low-cost Aluminum based flexible printed circuit boards or Al-PCBs has been growing in popularity. Integrating them with conventional Copper based PCBs or Cu-PCBs is essential for their large-scale adoption. ... read more

Description The assembly of complex optical systems such as objective lenses for smartphone cameras, autonomous driving sensors / cameras, and light detection and ranging (LiDAR) require precise alignment during their production. ... read more

Description Printed Circuit Structures (PCSs) have the potential to revolutionize next generation printed circuit boards (PCBs) and electronics packaging. ... read more

Description In the LIFT (Laser Induced Forward Transfer) technology, a material, evenly coated on a transparent carrier film, passes under a laser. The laser applies a short burst of energy to it. This releases perfectly consistent drops of material onto the substrate below. ... read more

Description In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mandating push back on very complex high layer count designs. ... read more

Description Plated and filled microvias are a common feature in modern PCBs, so much so, that they are now considered as the industry norm as a means of achieving high-density designs for modern mobile devices. ... read more

Description Traditional PCB fabrication technology incorporates copper-plated vias after each press lamination connecting with microvias or mechanical vias. ... read more

Description Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very ambitions construction. ... read more

Description As Printed Circuit Board (PCB) designs increase in density, the need for High Density Interconnect (HDI) structures such as microvias is also increasing. With this uptick in microvia usage, there has also been an increase with reliability concerns. ... read more

Description As has long been known, each time there is a step up to the next level of PCB technology, the industry is faced with new or the broadening of existing challenges. Today, this is particularly true of microvias. ... read more

Description This paper presents test methods to effectively perform conducted testing on RF and high-speed data connectors for automotive applications. ... read more

Description In comprehensive humidity tests for the release of materials and processes for the assembly and interconnect technology of PCBAs of the automotive industry, the solder resist has emerged as a particular focus of defects with regard to electrochemical migration. ... read more

Description The viscosity of conformal coatings is critical in producing consistent and reliable applications of coating onto a printed circuit board (PCB). ... read more

Description A comprehensive SIR test-protocol for the release of materials and processes in the automotive industry is presented. ... read more