Success of CHIPS Act Depends on Quickly Establishing a Pilot Facility for Integrated Circuit Substrates, Tech Leaders Warn
The success of the CHIPS for America program depends on establishing a U.S.
CHIPS Act Implementation Requires Strong Focus on "Advanced Packaging," Industry Leaders Say
Ever-more complex packaging of chips will be the key driver of future innovation, yet the United States and Europe are behind the curve
Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the U.S. government and European Commission gathered in Washington, D.C.
IPC Offers First Advanced Packaging Symposium
Building the IC-Substrate and Package Assembly Ecosystem
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Pack