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Devan Iyer, Industry Leader on Chips Packaging Technology, Joins IPC

Devan Iyer, Ph.D., one of the semiconductor industry’s leading technology experts, has joined IPC as its chief strategist for advanced pack
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Events

IPC Offers First Advanced Packaging Symposium

Building the IC-Substrate and Package Assembly Ecosystem
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Pack
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