IPC -- Association Connecting Electronics Industries® announces the addition of Clay Ervine as senior director of member success to its staff at IPC headquarters in Bannockburn (Chicago), Ill.

IPC announced today the February 2019 findings from its North American Printed Circuit Board (PCB) Statistical Program.

IPC’s High Reliability Forum and Microvia Summit, a three-day technical conference to be held in Hanover, Md., May 14-16, will focus on electronics for mil-aero, automotive, and long-life applications.

Employment in the European electronics sector is expected to grow according to a new study by Oxford Economics released today by

IPC’s popular standards, J-STD-001, recognized globally for its criteria on soldering processes and materials, and IPC-A-610, the most widely used electronics assembly acceptance document, complement each other when used together.

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