PCB Troubleshooting and Defect Analysis

Date
-

 -  
Tuesday, Thursday
6:30 pm ~ 8:30 pm America/New_York

Enrollment Period
 - 

 

Description

Taught by an IPC-certified industry expert with more than 40 years of experience in the field, this 4-week online program is designed to provide the knowledge and skills necessary to identify printed circuit board defects and determine corrective action.

LEARNING AND PERFORMANCE OBJECTIVES

The IPC Advanced Troubleshooting and Defect Analysis course is designed to provide participants with the knowledge and skills necessary to identify printed circuit board defects and determine corrective action.

Upon completion, participants will be able to:

  • Identify and correct control processes that negatively affect circuit board quality
  • Establish the root cause of potential defects to minimize and prevent loss of quality
  • Recognize the interrelationships of PCB materials, processes, and equipment and how these relationships affect PCB and PCA quality
  • Identify the root cause and corrective action for PCB defects such as interconnect separation, delamination, wedge voids, plating folds, microvoids, surface pitting, and hole wall pull-away
  • Identify the root cause and corrective action for electrodeposition defects, such as mouse bites, pitting, and domed or crown plating.
  • Identify the root cause and corrective action for solderability and assembly related issues such as outgassing, black pad, creep corrosion and blow holes

Taught by an IPC-certified industry expert with 40+ years of experience in the field, this four-week program utilizes interactive webinars, on-demand recordings, and job-specific exercises to facilitate mastery of the key concepts required for successful printed circuit board trouble shooting and defect analysis

 

Online Event

3000 Lakeside Dr.
Suite 105N
Bannockburn, IL 60015
United States

Online Event

Online Event
3000 Lakeside Dr.
Bannockburn, IL 60015
United States