IPC High Reliability Forum

Date
-

The IPC High Reliability Forum is back and better than ever! If you manufacture, design or test Class 3 electronics for applications with unique safety, reliability, and lifetime requirements, you don’t want to miss this event! The IPC High Reliability Forum will be held October 17-19, 2023, at the Hilton Baltimore BWI Airport, located in Linthicum (Baltimore), Maryland.  

This event provides a unique opportunity to learn about the latest advancements in electronics, participate in industry discussions, and network with this respected community of professionals focused on electronics with high reliability requirements. 

Presentation topics will include:

  • Class 3 and safety critical electronics considerations
  • Military, aerospace, medical, automotive, e-Mobility and other applications with specialized reliability requirements
  • Well-rounded, industry-curated content covering many different topics related to high reliability issues in PCB design, PCB fabrication materials, PCB assembly, PCBA surface reliability, emerging electronic technologies, mitigation strategies and test methods

AGENDA

Tuesday, October 17, 2023
12:00 PM - 2:00 PM | Check-in

Registration and Check-in

2:00 PM - 5:30 PM | Technical Presentations and Keynote

Defining High Reliability Panel
Moderators: Teresa Rowe, IPC & Bhanu Sood, PhD, Nasa Goddard Space Flight Center, Conference Co-Chair

Panelists: 
Terry Hoffman, CISCO
Valentino De Leon, CISCO
Steve Murray, Northrop Grumman
Kevin Kusiak, Lockheed Martin
Brian Chislea, Dow Chemical Company

KEYNOTE TALK- The DART MISSION: Earth Strikes Back
Ed Reynolds | Johns Hopkins Applied Physics Lab

The Risky Game for High-Reliability Electronics
Chris Peters | USPAE

Future of Trust for US Microelectronics
Theresa Campobasso & Trevor Stansbury | Exiger

Joint Session Q&A

Wednesday, October 18, 2023
8:40 AM - 10:00 AM | Panel

EV Panel: Revving Up Reliability: Connect, Clean & Coat for Electric Vehicle Excellence
Brian Chislea, Dow
Brian O'Leary, Indium
Debbie Carboni, KYZEN

 

    10:30 AM PM - 12:30PM | Technical Presentations

    Direct Metallization for HDI and Microvia Reliability
    Leslie Kim | MacDermid Alpha Electronics Solutions

    Microvia Reliability Stacking and Staggering for a Successful Design
    Gerry Partida | Summit Interconnect

    Solder Joint Fatigue on Components for Telecom Products
    Kaixiang Yang | Ericsson

    1:30 PM - 3:00 PM | Technical Presentations

    Neuroprostheses for Controlling Hand and Finger Movements
    Cynthia Chestek, PhD | University of Michigan

    A novel surface finish can achieve robustness against copper creep corrosion for better reliability of Printed Circuit Boards (PCBs)
    Kunal Shah, PhD | LILOTREE

    3:30 PM - 5:30 PM | Technical Presentations

    CGA Parylene Undercoating
    Rachel Hartig | Johns Hopkins Applied Physics Lab

    Innovative Solutions for RF/Microwave Applications
    Yaad Eliya | PCB Technologies

    Why Are We Cleaning No-Clean Flux? Practical Answers to an Oxymoron
    Mike Konrad | Aqueous Technologies 

    Thursday, October 19, 2023
    8:30 AM - 10:00 AM | Technical Presentations

    Making Sense out of the “Objective Evidence” language in J-STD-001 Section 8
    Joe Russeau | Precision Analytical Laboratory, Inc

    SIR and Analytical Techniques to Assess the Reliability Impact of Process Enhancements
    Denis Barbini, PhD | Zestron

     

    10:30 AM - 12:00 PM | Technical Presentations

    Implementing Avionics/Electronics Integrity Program (AVIP) for IPC High Reliability Electronics
    Raymond Zhao, PhD | Northrop Grumman Systems Corporation

    Wrap Up Panel with the High Reliability Technical Program Committee
    Moderator: Teresa Rowe, IPC
    Panelists: 
    Bhanu Sood, PhD, Nasa Goddard Space Flight Center, Conference Co-Chair
    Martin Goetz, Northrup Grumman, Conference Co-Chair
    Steve Murray, Northrop Grumman
    Kevin Kusiak, Lockheed Martin
    Brian Chislea, Dow Chemical Company

    12:00 PM | Adjourn (Grab and Go lunch will be provided)

    Thank you for participating in the event! 

    **Schedule Subject to Change

    REGISTRATION INFORMATION

    Pricing Details
    Registration Member Nonmember
    Conference Registration  $695.00  $875.00
    Cancellation Policy

    Cancellation Policy:
    If you are unable to attend, you may send a coworker in your place. Please notify us of name changes as soon as possible. If you need to cancel, please e-mail KimDiCianni@ipc.org.
     
    Note, all cancellations must be a written notice. Please note the cancellation policy below:

    Attendees who cancel in writing by September 22, 2023 will incur a $100 cancellation fee. Cancellations received after September 22, 2023 will be responsible for the full fee.

    Register

    Discounted Group Registration
    Bring your colleagues and save 20%! Register five or more colleagues from the same company and receive 20% off each attendee's registration. If you would like to take advantage of this group discount, please reach out to KimDiCianni@ipc.org.

    MEET THE SPEAKERS

    Ed Reynolds
    Ed Reynolds | Keynote | The DART Mission: Earth Strikes Back

    Program Manager, Space Exploration Sector | JHU APL 

     

    Summary/Abstract

    On September 26, 2022 a small spacecraft named DART [Double Asteroid Redirection Test] impacted an asteroid moon at incredible speed. This was a test by NASA to try to change the trajectory of the asteroid. The asteroid moon was not very big, having a diameter of about the height of the Statue of Liberty. This test was the first planetary defense test mission ever attempted.  Its success validated the concept of kinetic impactors as a method to protect Earth and mankind from future asteroid impacts. Ed will discuss the overall DART mission and its development. The overview will describe the purpose of the mission  and its place in the overall planetary defense strategic plan. It will describe the mission design and spacecraft design and the new technologies that were being validated. Special emphasis will be made regarding the factors affecting reliability and some of the design and implementation decisions that were made during the spacecraft’s development and flight.

    Speaker Bio

    Ed Reynolds is a program manager at the Applied Physics Laboratory, working within its Space Exploration Sector. He has worked there for over 38 years, starting as an integration engineer, then a system engineer, and for the last 20 years as a project manager for NASA missions and instruments. His most recent management role was project manager for NASA’s Double Asteroid Redirection Test (DART) in which a spacecraft autonomously guided itself into a small asteroid at 14,000 miles per hour and successfully changed the trajectory of a celestial body for the first time. TIME magazine recognized the significance of this feat in terms of protecting Earth from catastrophic asteroid impacts in the future by naming Ed in their TIME 100 list of influential people for 2023. Ed has a bachelor’s degree in Electrical Engineering from Virginia Tech and a master’s degree in Project Management from George Washington University.

    Chris Peters
    Christopher Peters | Special Session | The Risky Game for High-reliability Electronics

    Senior Advisor
    U.S. Partnership for Assured Electronics

     

    Summary/Abstract

    Today’s supply chains are very dynamic leaving many technology organizations in a game of being left behind.  Supply chains must be designed, assembled and coordinated differently to reduce risks and achieve high reliability in systems.  Game changers are needed!  

    Speaker Bio

    As founding Executive Director of the U.S. Partnership for Assured Electronics (USPAE), Chris established and grew this non-profit organization that helps ensure the U.S. government has access to trusted and assured electronics supply chains. In this role, he led the capture and oversight of the $42 million Defense Electronics Consortium. Chris leads USPAE’s development of a unique public-private partnership that will deliver new domestic electronics manufacturing capabilities and quickly transition that technology to industry. 

    Chris has extensive experience in driving the innovation and adoption of solutions throughout manufacturing supply chains. He has worked with organizations ranging from start-ups to Fortune 500 manufacturers and the Department of Defense.

    Chris co-founded MetalSite, which was the world's first industry-backed manufacturing marketplace and funded by five of the country's largest metals producers. The company exceeded all adoption and revenue projections in the first six months and earned a $183 million return on a $20 million investment in the first year. Chris went on to create similar manufacturing consortia in 20 industries throughout North America, Europe and Asia, helping fundamentally change the way that supply chain partners interact.

    A frequent speaker on defense manufacturing supply chains, Chris has also written many related papers and articles. His work has been documented in several books and in publications ranging from “The Wall Street Journal” to “BusinessWeek” and “IndustryWeek.” Chris is proud to have served in the U.S. Coast Guard.

    Cynthia Chestek
    Cynthia A. Chestek, Ph.D. | Special Session | Neuroprostheses for Controlling Hand and Finger Movements

    Associate Professor of Biomedical Engineering, Electrical Engineering, Neuroscience and Robotics
    University of Michigan, Ann Arbor

     

    Summary/Abstract

    Brain machine interfaces or neural prosthetics have the potential to restore movement to people with paralysis or amputation, bridging gaps in the nervous system with an artificial device. Microelectrode arrays can record from up to hundreds of individual neurons in motor cortex, and machine learning can be used to generate useful control signals from this neural activity. Performance can already surpass the current state of the art in assistive technology in terms of controlling the endpoint of computer cursors or prosthetic hands. The natural next step in this progression is to control more complex movements at the level of individual fingers. Our lab has approached this problem from many stages along the translational research pathway. For people with upper limb amputation, we acquire signals from individual peripheral nerve branches using small muscle grafts to amplify the signal. Human study participants have been able to control individual fingers on a prosthesis using indwelling EMG electrodes within these grafts. For spinal cord injury, where no peripheral signals are available, we implant Utah arrays into finger areas of motor cortex in nonhuman primates, and have demonstrated the ability to control flexion and extension in multiple fingers simultaneously. All of these applications utilize implantable devices that are approved for human use in other applications, and often must be modified for novel studies. Quality is of paramount importance for implantable devices. Better methods for ensuring quality in novel use cases could be highly enabling for medical device studies in a wide range of applications.

    Speaker Bio 

    Cynthia A. Chestek received the B.S. and M.S. degrees in electrical engineering from Case Western Reserve University in 2005 and the Ph.D. degree in electrical engineering from Stanford University in 2010.  She is an associate professor of Biomedical Engineering and Robotics at the University of Michigan, Ann Arbor, MI, where she joined the faculty in 2012. She runs the Cortical Neural Prosthetics Lab, which focuses on brain and nerve control of finger movements as well as high-density carbon fiber electrode arrays. She is the author of 87 full-length scientific articles. Her research interests include high-density interfaces to the nervous system for the control of multiple degree of freedom hand and finger movements.

    Mike Konrad
    Mike Konrad | Why Are We Cleaning No-Clean Flux? Practical Answers to an Oxymoron

    Founder/CEO
    Aqueous Technologies, Corona, CA, USA. Reliability Matters Podcast, Corona, CA, USA

     

    Summary/Abstract

    Why Are We Cleaning No-Clean Flux? Answers to an Oxymoron.  

    Miniaturization, IOT, and the more frequent deployment of electronics into harsh environments has resulted in the reduction of residue tolerance on many circuit assemblies.  Common residues from board and component fabrication, process, humans, and flux, in totality, have created an environment whereby the volume of residues exceeds many assemblies’ ability to tolerate them.

    While the traditional reason to implement a post-reflow cleaning process was to prevent electro-chemical migration (ECM) failures, modern circuit assemblies populated with fine-pitch, bottom terminated components operating in harsh environments and subjected to IPC's new cleanliness standards have broadened the variety of problematic residues and raised the level of required cleanliness.

    This course will outline specific problematic residues and their associated failure mechanisms. Cleanliness quantification methods will be presented including a detailed overview of IPC's new cleanliness testing and process monitoring requirements outlined in IPC J-STD001H.

    Speaker Bio 

    Mike began his career in the electronic assembly equipment industry in 1985. Mike founded Aqueous Technologies in 1992 in response to the Montreal Protocol and the resulting international treaty banning most popular cleaning/defluxing solvents. Mike is an internationally known speaker on the subject of increasing reliability through contamination removal and cleanliness quantification techniques and procedures. Mike was awarded “Distinguish Speaker Status” with SMTA in 2018 and received the “Rich Freiberger Best of Conference Award” in 2019. Mike is also a member of the SMTA Global Board of Directors where he is Vice President of Communications. Mike is also Vice President of Technical Programs for the Los Angeles / Orange County SMTA Chapter. Mike is the host of the popular Reliability Matters Podcast.

    Kaixiang Yang
    Kaixiang Yang, Ph.D. | Solder Joint Fatigue on Components for Telecom Products

    Senior Reliability Engineer
    Ericsson AB, Stockholm, Sweden

     

    Summary/Abstract

    Solder joint fatigue is a typical failure mechanism for electronic equipment subjected to temperature cycling during operation. Telecom remote radio units are stressed with a combination of environmental temperature and equipment self-heating variations due to varying load levels that sometimes are severe. As this problem is more pronounced for remote radios, and the number produced and delivered by Ericsson is increasing, the importance and risk of this issue has increased significantly. In addition, the operating temperature of components on Ericsson’s products has increased, resulting in overall higher stress levels, this study tries to investigate the components for different packages.

    In this study, we utilized the Sherlock software tool to evaluate the reliability of solder joints on a printed circuit board (PCB) subjected to temperature cycling conditions. The test conditions were designed based on IPC-9701 standard guidelines. The PCB assembly was subjected to temperature cycling tests in a chamber with a range of -40°C to 125°C. The test duration was set at 1000 cycles. After the test, the solder joints were analyzed using dye & pry analysis, cross-section analysis, and shear test analysis. 

    Based on the analysis results, we found that some of the solder joints exhibited signs of fatigue failure, while others showed good reliability performance. Simulation using Sherlock tool showed a good correlation with the actual test results.

    Furthermore, the simulation results were used to identify the root cause of the failure and to propose a design change that would improve the reliability of the solder joints. The proposed design change was implemented, and the assembly was subjected to the same temperature cycling test.

    This study demonstrates the effectiveness of using a combination of simulation and testing to evaluate the reliability of solder joints and identify potential design improvements to enhance their performance

    Raymond Zhao
    Raymond Zhao, Ph.D. | Implementing Avionics/Electronics Integrity Program (AVIP) for IPC High Reliability Electronics

    Consulting Engineer
    Northrop Grumman Systems Corporation, Baltimore, MD, USA

     

    Summary/Abstract

    IPC Class 3 Electronics represent a category of electronics with high reliability, long life, and fail-proof quality for mission critical military, aerospace, and medical applications. Industry has been focusing on the critical aspects to ensure the compliance to customers’ needs including using high quality electronics components with consistent de-rating, conducting rigorous screening and endurance testing. However, implementing the Air Force proposed Avionics/Electronics Integrity Program (AVIP) will help achieve required performance over the life of the electronics with linkages to related systems engineering areas.

    Historically, many programs have not planned or scheduled comprehensive systems engineering efforts that link and properly phase the tasks of all appropriate disciplines. AVIP ensures the consideration of all usages, environments, and support by the customer (MIL-HDBK-87244, USAF). These factors are analyzed throughout the development process to ensure the equipment is capable of required performance while experiencing the cumulative effects of the environments in any combination the equipment is expected to experience during its durability/economic life.

    Northrop Grumman Systems Corporation (NGSC) has successfully supported the customers with mandates in the electronics design processes to ensure compliance to customers’ needs. One of the major challenges NGSC engineering team experienced is the lack of understanding early in the development phase of how the electronic equipment was to be used during its durability/economic life. This presentation will discuss the segmented requirements and lessons learned from a Northrop Grumman Systems Corporation program. The goal is to come up with a practical proposal to consider Avionics/Electronics Integrity Program (AVIP) guidelines for the integration of reliability, maintainability, and other factors to ensure high reliability of electronics. 

    Speaker Bio

    Raymond Zhao is a Consulting Engineer working for Northrop Grumman Corporation since 2004. He has over 40 years of experience working at positions with increasing responsibilities. His areas of expertise within the mechanical domain include airworthiness, safety of flight structural analysis, and damage-tolerance / fatigue evaluation of airborne structures. He is currently leading a multi-disciplinary airworthiness team in the Airborne Surveillance Hardware Engineering organization (MS, Baltimore). Raymond has a Ph.D. degree in Engineering Mechanics from University of Illinois.

     

    Gerry Partida
    Gerry Partida | Microvia Reliability Stacking and Staggering for a Successful Design

    Vice President of Technology
    Summit Interconnect, Anaheim, CA, USA

     

    Summary/Abstract

    Microvias have been a great enabler for allowing High Density Interconnections (HDI).  The employment of microvias began without a thorough understanding of the reliability of the HDI connections, especially when multiple depth microvias were utilized. 

    The early testing methods of microvias were unable to measure the resistance of a daisy chain network at the reflow precondition process. For example, the two-step method of reflow resistance testing followed by thermal shock testing can show passing results of stacked microvias for thermal shock, yet which had failed reflow conditions.  Earlier test methods preconditioned the test coupons to 6X reflow cycles but didn’t measure for resistance change.  With the use of IPC-TM-650 2.6.27 and 2.6.7.2 test methods, the industry has a greater understanding of the reliability of the design and a finished design fabrication. A deeper understanding is now possible with the use of microvia reliability simulation tools. The simulation tools now allow a design to be vetted for the material selection, the selection of the dielectrics construction, the diameter of the microvia, and the pitch of the design.

    The purpose of this presentation is to share with the PCB design community information regarding when and where it is safe to stack microvias many levels deep, and where in the same design that staggering of microvias is necessary at every level.  This presentation will demonstrate that it is possible to use 4 stack microvias in tight pitch devices, along with staggered microvias outside the tightly pitched devices. This presentation will also demonstrate that material expansion, pitch, microvia diameter, reflow temperature, and the length of the stacked microvia, are contributing attributes to the final reliability of the microvia.

    Speaker Bio

    Gerry Partida is the Vice President of Technology for Summit Interconnect, a world class PCB Fabricator. Gerry began his career in the Printed Circuit Board industry in 1984 at Everett Charles Test Equipment, and joined Optrotech/Orbotech in 1986. He was a member of the team that introduced CAM automation, net list compare, AOI/CAD reference to the PCB industry. His current position is focused on manufacturing cutting edge high density interconnect, high speed digital, Flex/Rigid Flex and RF/microwave printed circuit boards for military and commercial industries. He is a subject matter expert on IPC-6012, and a member of the IPC-6012 and IPC-6018 review committees. Gerry recently has become a Vice-Chair for IPC-6012/IPC-A-600 & IPC-V-TSL-MVIA Microvia Task Force.

     

    Kunal Shah
    Kunal Shah, Ph.D. | A novel surface finish can achieve robustness against copper creep corrosion for better reliability of Printed Circuit Boards (PCBs)

    President
    LILOTREE, Redmond, WA, USA

     

    Summary/Abstract

    Due to tremendous growth in Information Technology equipment in the Big Data/server applications, 5G-6G-high frequency, Edge Computing, Artificial Intelligent (AI) applications recently, the hardware reliability of these equipment is critical and paid more attention in the industry. With harsh environment and severe air pollution, hardware equipment is subjected to severe corrosion and reduce lifetime. Among various materials used in the electronics assembly, reliability evaluation of surface finishes on printed circuit boards (PCBs) is critical for long terms optimal operation of the equipment. The failure mode due to exposure to long term harsh environment, air pollution, etc. involves creep corrosion which can potentially cause electrical short failure. It is important to evaluate for the robustness against creep corrosion occurrence in the electronic assemblies.

    Mixed Flowing-Gas (MFG) test is an environmental stress laboratory test intended to simulate contaminated industrial ambiance. There are many controllable parameters, including temperature, relative humidity, corrosive gases type (e.g. H2S, Cl2, NO2, SO2, NH3 and O3…etc.), concentration and gaseous flowing rate, etc. Because many controllable parameters, complex equipment setup and continuous constant-flowing corrosive gases, MFG test is a popular accelerated corrosion test that has high availability to simulate the field environment corrosion. In order to observe the effective corrosive reactivity within a short period of time, a MFG test condition from International Electronics Manufacturing Initiative (iNEMI) was adopted in this research. iNEMI MFG test condition has high concentration of hydrogen sulfide (H2S), mixed with multiple corrosive gases that is an effective accelerated condition for corrosion test.

    Various, surface finishes were evaluated including Electroless Nickel Immersion Gold (ENIG), Immersion Sn, Organic Solderable Preservative (OSP), novel Ni-free surface finish. Creep corrosion tendencies and robustness were compared among various surface finish options and long-term reliability in harsh environmental conditions is evaluated.

    Speaker Bio

    Kunal Shah, Ph.D. is a President and chief Scientist at LiloTree. Dr. Shah leads efforts of advanced engineered materials development and product improvement solutions at LiloTree for numerous customers in various industries including aviation-aerospace, medical electronics, semiconductors, etc. He has been the key member in development of proprietary, innovative, award-winning and commercially-successful ENIG-Premium, Ni-less ENIG-Premium and other plating- surface finish solutions for optimum performance and better reliability of electronic assemblies. These technologies are now being accessed by leading electronics manufacturers globally. Previously, Dr. Shah worked as a Sr. Research Scientist at Intel Corporation and Pacific Northwest National Lab (PNNL). At Intel, he developed polymer interlayer, dielectric and passivation material that led to the design, adoption and integration of polymer passivation materials in Intel IC products in 2008. He is a recipient of several global technology awards and has authored several scientific papers & issued/pending patents for more than two decades.

    Denis Barbini
    Denis Barbini, Ph.D. | SIR and Analytical Techniques to Assess the Reliability Impact of Process Enhancements

    Technical Solutions Manager
    ZESTRON Corporation, Manassas, Virginia, USA.

     

    Summary/Abstract

    When introducing a new process, machine, or material, it is necessary to undergo a qualification event according to the updated IPC-J-Std-001 H Revision. Specifically, when altering certain materials or cleaning solutions, it is crucial to establish objective evidence that the proposed improvement does not increase the risk of residual unused material or flux. Instead, it should enhance the effectiveness of residue removal. Failure to address flux residues on the Printed Circuit Board Assembly (PCBA) may lead to product failure caused by electrochemical reactions during usage.

    To accurately assess the risk, the CM or OEM must gather quantitative data before implementing any process changes. This presentation emphasizes the importance of employing specific tools and analytical measurements, such as Surface Insulation Resistance (SIR), Ion Chromatography, and Rose testing, to ensure the reliability of the product. Real-life implementation of a material change and the subsequent qualification process serve as valuable examples discussed in this presentation.

    Keywords: IPC-J-Std-001, Electronics Industry, Implementation, Product Failure, Electrochemical Reactions, Qualification, SIR, Ion Chromatography, Rose Testing, IPC-TM-650

    Speaker Bio 

    Denis Barbini, Ph.D., is an esteemed electronics manufacturing and assembly professional. Formerly the Associate Director of the A.R.E.A. Consortium, he led the identification of critical needs in emerging technologies and assembly processes. With extensive hands-on experience, Denis has provided invaluable guidance and solutions to companies worldwide. His expertise lies in implementing cost-effective, reliable, and robust processes for electronic devices. Recently, he transitioned to the role of ZESTRON's Technical Solutions Manager, leveraging his 25 years of experience to drive the development of critical projects and explore new industry sectors. Denis's technical prowess, extensive experience, and commitment to innovation make him a respected authority in the field, shaping advancements and enabling excellence in manufacturing processes.

     

    Brian O Leary
    Brian O'Leary | EV Panel | Revving Up Reliability: Connect, Clean & Coat for Electric Vehicle Excellence

    Global Head e-Mobility & Infrastructure
    Indium Corporation

     

    Summary/Abstract

    This session centers on resolving durability concerns pertaining to PCBAs in e-Mobility infrastructure, encompassing electric vehicles, charging stations, and Battery Energy Storage System. The session delves into assembly design challenges and offers solutions for constructing more dependable systems. Through a collaborative study involving Indium, KYZEN, and Dow, three industry experts present valuable insights to improve uptime performance, thus mitigating costly warranty repairs and enhancing customer satisfaction. The session aims to provide practical strategies for enhancing the reliability of e-Mobility components and optimizing the overall user experience.

    Speaker Bio

    Brian O'Leary is responsible for promoting Indium Corporation's full range of products and services for e-Mobility, which includes electric cars, trucks, eVTOLs, charging stations, etc. He joined Indium Corporation in 2014 and has more than 20 years of experience in the electronics industry. He authored two books on thermal profiling called Profiling Guide for Profitability and Profiling Guide for Six Sigma. He currently serves as the chair of the IPC e-Mobility Quality & Reliability Advisory Council. In addition to regular technical conference participation, he co-hosts a free monthly webcast—EV InSIDER Live—with Loren McDonald of EVAdoption, interviewing a special high-profile guest.  In the webcast, they discuss current pressing issues and hot topics in the rapidly evolving electric vehicle landscape. 2023, Brian will be launching a new webcast focused on the many technical and manufacturing challenges of building our e-Mobility future.

    Terry Hoffman
    Terry Hoffman | Opening Session | Defining High Reliability

    Technical Leader, Electrical Engineering
    Cisco Systems

     

    Summary/ Abstract

    When you hear the words “high reliability,” what do they mean to you?  In this panel session, industry experts will provide their definitions of high reliability and what they, as consumers and citizens of the world, expect of high reliability products.  This will set the stage for the presentations and discussion that follow during the 2023 IPC High Reliability Forum.

    Speaker Bio

    Experienced Technical Leader with a demonstrated history of technical, leadership, and communications skills. Having had fourteen years design experience and over 22 years manufacturing experience is a benefit to both engineering and manufacturing teams in all aspects of hardware design and production. Experience in writing software also enables identification and resolution of issues from a software perspective.

    John Russeau
    Joe Russeau | Making Sense out of the “Objective Evidence” language in J-STD-001 Section 8

    President
    Precision Analytical Laboratory, Inc.

     

    SUMMARY/ABSTRACT

    The goal of this session would be to provide a “test labs” perspective for understanding the “Objective Evidence” requirements that are now called out in section 8 of IPC-J-STD-001.  In this session, we will discuss what is “Objective Evidence” and how to understand section 8.  In addition, we will give some practical advice for ways to evaluate a process in order to establish the evidence necessary to meet the requirements.  

    SPEAKER BIO

    Joe is the President of Precision Analytical Laboratory, Inc., in Kokomo, Indiana.   He has been involved in the analysis of chemical residues on electronic assemblies for the past 28 years, first with Contamination Studies Laboratories and now with his own business.  Joe is a leader in IPC and currently chairs the 7-11 Test Methods Subcommittee. He also maintains involvement with the 5-32G Residue Task Group and J-STD-004 Task Group. Joe’s expertise lies in the analysis of manufacturing residues and the determination of the effects of those residues on the performance of electronic assemblies.  In Joe’s free time, he enjoys spending time with his wife and their four children working their small cattle farm. 

    Trevor S
    Trevor Stansbury | Future of Trust for US Microelectronics

    PRESIDENT OF SUPPLY CHAIN TRANSFORMATION
    EXIGER

     

    Summary/Abstract

    The first portion of this session will cover the future threat and policy landscape facing the US microelectronics industry as major challenges like the changing global policy environment, compliance requirements such as the UFLPA, critical component and mineral shortages, and a diminishing manufacturer base continue to impact microelectronics supply chains.  Current compliance approaches will be covered, concluding with likely scenarios for the next 5-10 years, including ramifications of continuing tensions with China.

    SPEAKER BIO

    Trevor Stansbury is the President of Supply Chain Transformation at Exiger, where he serves as a senior operational executive and senior subject matter expert on Exiger’s multi-tier supply chain visibility, transformation, and risk management solutions. Previously, Trevor served as the CEO and Founder of Supply Dynamics, which was acquired by Exiger in 2022. At Supply Dynamics, he led supply chain transformations for the world’s largest manufacturing companies, including Lockheed Martin, Raytheon, Honeywell, Oshkosh Corporation, Thyssenkrupp and General Electric. Trevor has also held senior supply chain roles at advanced aerospace and defense companies, including Honeywell and Boeing.

    Theresa Campobasso
    Theresa Campobasso | Future of Trust for US Microelectronics

    Senior Vice President of Strategy
    Exiger

     

    Summary/Abstract

    The first portion of this session will cover the future threat and policy landscape facing the US microelectronics industry as major challenges like the changing global policy environment, compliance requirements such as the UFLPA, critical component and mineral shortages, and a diminishing manufacturer base continue to impact microelectronics supply chains.  Current compliance approaches will be covered, concluding with likely scenarios for the next 5-10 years, including ramifications of continuing tensions with China.

    speaker Bio

    Theresa Campobasso is the current Senior Vice President of Strategy at Exiger, the current Enterprise Supply Chain Risk Management solution for the US Government. She is a recognized expert in the field of Supply Chain Security and Resilience and advises the US Department of Defense, Congressional Committees, and other Federal clients on predicting, mitigating, and managing risks to critical US supply chains. Prior to her current role, Theresa built and led Exiger’s Defense business unit as the Vice President of Defense Programs and Global Head of Defense, where she expanded the Defense portfolio from 2 customers to over 30 over a period of 2 years.

    Prior to joining Exiger, Theresa was the manager of Forensic Investigations and Critical Asset Protection at KPMG, where she led development of a software solution to predict and assess microelectronics supply chain risk in defense technology. The solution was selected as one of the winners of the 2019 International Test Conference by the U.S. Air Force. She also led an initiative to leverage advances in artificial intelligence, data science, and behavioral psychology to reform the national background investigation process for security clearances. These changes were implemented and are in use today.

    In addition to her private sector experience, Theresa supported various operations and exercises in the Asia Pacific region as a Marine Corps Intelligence Officer with Marine Air Group 12. She also supported intelligence operations in Iraq and supported special operations missions with Naval Special Warfare units in Afghanistan.  After leaving active duty, she provided contract counterintelligence support to DIA’s Office of Counterintelligence as an analyst for emerging technology supply chain risk, operational risk management, and acquisition risk management, and helped to stand up the DIA Acquisition Risk Task Force.

    Theresa earned her bachelor’s degree in English from the University of Notre Dame and her graduate degree in Technology & National Security from the Georgetown Security Studies Program. She is a 2017 Rumsfeld Foundation Fellow, a Certified Insider Threat Program Manager from the Carnegie Mellon Software Engineering Institute, and a graduate of the Harvard Business School CORe Program.

    Debbie Carboni
    Debbie Carboni | EV Panel | Revving Up Reliability: Connect, Clean & Coat for Electric Vehicle Excellence

    Global Product Manager (Electronics) KYZEN Corporation
    Vice President Philadelphia SMTA Chapter   

     

    SUMMARY/ABSTRACT

    This session centers on resolving durability concerns pertaining to PCBAs in e-Mobility infrastructure, encompassing electric vehicles, charging stations, and Battery Energy Storage System. The session delves into assembly design challenges and offers solutions for constructing more dependable systems. Through a collaborative study involving Indium, KYZEN, and Dow, three industry experts present valuable insights to improve uptime performance, thus mitigating costly warranty repairs and enhancing customer satisfaction. The session aims to provide practical strategies for enhancing the reliability of e-Mobility components and optimizing the overall user experience.

    SPEAKER BIO

    Debbie Carboni is the Global Product Manager of Electronics for KYZEN Corporation and brings over 25 years of experience to the electronics manufacturing industry.  She continues to learn and stay up to date on the latest technology by attending technical conferences and assisting in leading-edge research.

    Debbie has authored and co-authored several papers related to cleaning solutions and regularly presents at and attends industry events, participating member of numerous industry organizations and committees. Having worked hand in hand with both OEMs and their suppliers to develop and implement global cleaning process stability in production conditions. Debbie is devoted to giving back to the industry, serving as VP of Expos on the SMTA Board of Directors (2014-2020), current Vice President of the Philadelphia SMA Local Chapter, as well as various SMTA and IPC committees, including the IPC E-mobility, Quality & Reliability Advisory Council. A strong advocate of women in the industry, Debbie is a very active member of the SMTA Women’s leadership committee and participates regularly in annual and focused events.   

    Her extensive real-world experience helps guide engineers during qualification to ensure success in production conditions. Always willing to share, Debbie is an excellent resource with extensive experience and passion.  

     You are welcome to call or email Debbie for answers to your questions at debbie_carboni@kyzen.com or +1 215-498-8856.

    Yaad headshot
    Yaad Eliya | Innovative Solutions for RF/Microwave Applications

    CTO
    PCB Technologies 

     

    SUMMARY/ABSTRACT

    RF/Microwave & highspeed boards required many considerations and aspects for maximizing thermal and electrical performance. Designers for high frequency applications must understand critical parameters at the PWB stage. These parameters must be understood in order to eliminate noise, reliability, poor electrical performance, high price and low yield risks. The presenter will highlight innovative solutions, based on close cooperation between Mil/Aero designers and the PWB vendor. Actual field performance sometimes demands “beyond IPC rules/specification”, and in that respect one must provide innovative solutions such as: Implementing Air cavity, Coin and buried passive components (resistors/ capacitors/ thermocouples/ heaters etc.), in a complex design. This is even more critical, when the hybrid/mixed materials are combined into a rigid flex stack up. Enabling designers to bring an innovation to fruition, with ALL material types in the same stackup, selective final finishes, back drill/deep cone drill/ HDI, so the compatibility between all technical requirements, is optimized will be explored during this discussion.

    Valentino De Leon
    Valentino De Leon | Opening Session | Defining High Reliability

    Electrical Engineer, IIoT Product Operations
    Cisco Systems

     

    SUMMARY/ ABSTRACT

    When you hear the words “high reliability,” what do they mean to you?  In this panel session, industry experts will provide their definitions of high reliability and what they, as consumers and citizens of the world, expect of high reliability products.  This will set the stage for the presentations and discussion that follow during the 2023 IPC High Reliability Forum.

    Rachel Hartig
    Rachel Hartig | CGA Parylene Undercoating

    Electronics Manufacturing Engineer
    The Johns Hopkins Applied Physics Lab, Laurel, MD, USA

     

    Summary/Abstract

    While conformal coating is a standard practice for most final product PWAs, the application process does not allow for conformal coating material to cover the area beneath a CGA or BGA. At best the edges get trace coating and can act as somewhat of a barrier to FOD threatening to lodge between inner columns. 

    For this study I will be conducting a qualification on both the process and reliability of paralyene undercoating for BGAs and CGAs. 

    If the findings prove to provide an enhancement to reliability, this process could be publicized at a recommended best practice for Class 1 or high risk applications. 

    Speaker Bio

    Rachel has worked as a manufacturing engineer in defense and aerospace applications for over three years since graduating from the University of Wisconsin-Madison. For the past two years she has been at the Johns Hopkins Applied Physics Laboratory supporting a variety of high-mix low-volume projects areas. Her current concentration is in Space the Exploration missions IMAP and Dragonfly in the flight production and prototyping phases respectively. After attending IPC APEX in 2022 as an Emerging Engineer, she has pursued continued involvement in IPC through conference and A-team involvement.

    Leslie Kim
    Leslie Kim | Direct Metallization for HDI and Microvia Reliability

    Director of Primary Metallization
    MacDermid Alpha ElectronicS Solutions, Waterbury, CT, USA

     

    Summary/Abstract

    Miniaturization, faster signal speeds, and increased functionality are drivers within electronics manufacturing. These challenges put pressure on the manufacturing process to address these issues while maintaining or improving end-product reliability - with laser-drilled microvia (MV) reliability being paramount.

    Electroless copper has been the dominant technology to metallize non-conductive surfaces of PCBs and IC substrates. However, this technology has several disadvantages regarding worker safety (Group 1 carcinogens), poor reliability due to process control, and a high amount of waste generation. Recently, we have perfected a direct metallization process which addresses all the environmental concerns plus demonstrable, improved reliability. 

    Direct metallization (DM) enables direct bonding between Base Copper and Electroplated Copper significantly reducing or eliminating interfacial defects that can occur in Electroless Copper processing, such as nano and micro-voids, separation at the target pad, etc. DM promotes epitaxial, copper crystalline growth, which is the strongest bond possible. Its reliability has been demonstrated through various reliability tests, including OM testing, IST, thermal shock tests, etc.

    DM is highly environmentally friendly compared to the electroless copper process, as DM has fewer process steps, operates at low temperature, and employs a simple yet reliable working bath composition. As a result, it significantly reduces water usage, power consumption, chemical usage, and wastewater treatment leading to a substantial reduction in CO2 emissions. Furthermore, the implementation of a Zero-Discharge System - a wastewater recycling technology - allows for the removal of various ions and bacteria, enabling up to a 98% reduction of water usage through rinse water reuse.

    In conclusion, Direct Metallization is a PCB and IC substrate fabrication technology which offers improved MV reliability through direct copper-to-copper bonding while delivering sustainability gains across the supply chain – important to the OEM and fabricator alike.

    Speaker Bio

    Kwangsuk Kim (Leslie Kim) is the Director of Primary Metallization at MacDermid Alpha Electronics Solutions. In his 24 years with MacDermid Alpha he has dedicated himself to the development and application of new processes and technologies in high technology PCB, IC substrate, LED and molded interconnects. He holds a Bachelor’s degree in Applied Chemistry and a Master’s in Business Administration, both from AJou U. in Korea. Prior to his current role in the USA, Mr. Kim spent 16 years with the company in Korea including New Product Development for processes including Via Fill Copper plating, Brown Oxide, Desmear, etc. for both PCB and IC substrate fabrication, and worked in Thailand for 2 years as a business manager.

    TECHNICAL PROGRAM COMMITTEE

    BHANU SOOD

    Co-Chair: Bhanu Sood Ph.D.
    NASA Goddard Space Flight Center

    Martin Goetz

    Co-Chair: Martin Goetz
    Northrop Grumman Corporation

    Brian Chislea

    Brian Chislea
    The Dow Chemical Company

    Kimera Cho

    Kimera Cho
    Collins Aerospace

    Kevin Kusiak

    Kevin Kusiak
    Lockheed Martin Corporation

    Steve Murray

    Steven Murray
    Northrop Grumman Corporation

    EXHIBIT & SPONSORSHIPS

    Promote Your Company Today!

    Order Exhibit and Sponsorships Now

    Cancellations will be accepted up to 15 days prior to the event. $100 cancellation fee will apply. No refunds will be given for notice less than 15 days prior to the event.

    Exhibitor Know Before You Go

    EXHIBITOR INFORMATION

    Tabletop Exhibits

    Tabletop Exhibits
    $1,500 Member | $1,875 Nonmember   
    Benefits include:

    • One 6' draped table
    • Two side chairs
    • One standard electrical outlet
    • Contact list of consented registered attendees
    • One complimentary Conference registration for your exhibit staff
    • Logo on promotional materials, electronic and printed

    SPONSORSHIP OPPORTUNITIES 

    Welcome Reception

    SOLD, purchased by ZESTRON Americas
    Benefits include:

    • Exclusive opportunity to deliver welcome address to attendees (3 minutes maximum)
    • One 6’ draped tabletop exhibit with two side chairs and one standard electrical outlet
    • Acknowledgment with sponsor logo on all printed conference materials
    • Acknowledgment with sponsor logo on all pre-conference electronics promotions
    • Signage at the event with all sponsor name and logo 
    • Opportunity to display sponsor promotional literature at the reception
    • Contact list of consented registered attendees
    • Two complimentary Conference registrations
    Wednesday Event Luncheon

    $2,500 Member | $3,125 Nonmember

    Benefits include:                                                           

    • One 6’ draped tabletop exhibit with two side chairs and one standard electrical outlet
    • Tent cards with sponsor logo placed at each table
    • Acknowledgment with sponsor logo on printed conference materials
    • Acknowledgment with sponsor logo on pre-conference electronic promotions
    • Signage at the event with sponsor name and logo
    • Opportunity to display sponsor promotional literature
    • Contact list of consented registered attendees
    • Two complimentary Conference registrations
    Refreshment Breaks

    $3,000 Member | $3,750 Nonmember

    Benefits include:                                                           

    • One 6’ draped tabletop exhibit with two side chairs and one standard electrical outlet
    • Acknowledgment with sponsor logo on printed conference materials
    • Acknowledgment with sponsor logo on pre-conference electronic promotions
    • Signage at the event with sponsor name and logo
    • Opportunity to display sponsor promotional literature
    • Contact list of consented registered attendees
    • Two complimentary Conference registrations
    Thursday Box Lunch Sponsor

    $1,200 Member | $1,500 Nonmember

    Benefits include:

    • Company logo on stickers included on the box lunch.
    • Acknowledgment of sponsorship with company logo on event website, pre-show promotions, event on-site guide and on signage at the event.
    Badge Lanyards, exclusive (sponsor provided)

    $1,000 Member | $1,250 Nonmember

    Benefits include:

    • Opportunity to distribute company-branded badge lanyards to event attendees.
    • Acknowledgment of sponsorship with company logo on event website, pre-show promotions, event on-site guide and on signage at the event.
    Attendee Giveaway (sponsor provided)

    $1,000 Member | $1,250 Nonmember

    Benefits include:

    • Opportunity to distribute company-branded gift to event attendees.
    • Acknowledgment of sponsorship with company logo on event website, pre-show promotions, event on-site guide and on signage at the event.

    HOTEL AND LOCATION

    HRF Hilton

    Hilton Baltimore BWI Airport
    1739 West Nursery Road
    Linthicum Heights, MD 21090
    Conference Location: Concourse A & B 
    Hotel Website

    The IPC room rate is $149 per night and available until Monday, September 25, 2023 or until all rooms are booked. 

    Reservations can be made by calling 410-694-0808 and mentioning IPC or by clicking the reserve your room button below.
    Reserve Your Room

    HRF Hilton Room

    Hotel Amenities

    • Complimentary self-parking
    • Airport shuttle
    • On-site restaurant
    • Indoor pool
    • Fitness center
    • Business center

    Traveling to the Hotel
    Hilton Baltimore BWI Airport is a half a mile from BWI Thurgood Marshall Airport and 10 minutes from the Baltimore city center

    Parking
    Parking at the hotel is complimentary for the IPC group. 
    Text D2 to 410-650-6360

    You will then receive a link to enter your name and license plate and then be able to pay their parking fees. On the payment screen, there is a space to enter a validation code to give you complimentary parking.

    Your event’s validation code is:  3BC3296A

    EXHIBITORS & SPONSORS 












    CONTACT US

    Speaker and General Event Information

    Julia Gumminger, MSEd, CMP
    Manager, Professional Development & Events
    JuliaGumminger@ipc.org

    Julia Flynn 
    Coordinator, Professional Development
    JuliaFlynn@ipc.org

    Exhibit and Sponsorship Sales Information

    Kim DiCianni, CEM
    Director, Trade Shows and Events
    KimDiCianni@ipc.org 

    Alicia Balonek, CEM
    Senior Director of Trade Shows and Events
    AliciaBalonek@ipc.org 

    Registration Information

    Kim DiCianni, CEM
    Director, Trade Shows and Events
    KimDiCianni@ipc.org 

    Hotel and Location Information

    Kristin Schueler, CMP
    Director of Meetings and Events
    KristinSchueler@ipc.org

    Remote video URL
    About IPC

    IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 5,000+ member-company sites which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Atlanta, Ga.; Brussels, Belgium; Stockholm, Sweden; Moscow, Russia; Bangalore and New Delhi, India; Bangkok, Thailand; and Qingdao, Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

    Hilton Baltimore BWI Airport

    1739 W Nursery Rd
    Linthicum Heights, MD 21090
    Vereinigte Staaten

    Hilton Baltimore BWI Airport

    Hilton Baltimore BWI Airport
    1739 W Nursery Rd
    Linthicum Heights, MD 21090
    United States