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Committee D-55 Embedded Devices Process Implementation Subcommittee
Chair Rajesh C Kumar, TTM Technologies
Vice Chair Bruce V Hughes, U.S. Army Aviation & Missile Command
Staff Liaison Chris Jorgensen
Committee Charter This subcommittee is working on revision A of IPC-6017, Qualification and Performance Specification for Printed Boards Containing Embedded Active and Passive Circuitry. This specification covers qualification and performance of embedded active and passive circuitry within the finished printed board.


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