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Committee B-11a 3D Electronic Packages Guideline Task Group
Chair Dudi Amir, Intel Corporation
Staff Liaison Jeanne Cooney

Chris Jorgensen

Committee Charter This task group is working on Revision A of IPC-7091, Design and Assembly Process Implementation of 3D Components.

IPC-7091 describes the design and assembly challenges and ways to address those challenges for implementing 3D component technology. Recognizing the effects of combining multiple uncased semiconductor die elements in a single package format can impact individual component characteristics and can dictate suitable assembly methodology.


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