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Committee 6-10d SMT Attachment Reliability Test Methods TG
Chair Reza Ghaffarian, Jet Propulsion Laboratory
Vice Chair Vasu S Vasudevan, Dell Inc.
Staff Liaison Debora Obitz
Committee Charter This task group is responsible for the maintenance and development of specific test and performance levels for solder attachment of surface mount devices to rigid, flexible and rigid-flex circuit structures which are based on the guidelines furnished in IPC-9701 Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments.

The documents which this group maintains are: IPC/JEDEC-9702 Monotonic Bend Characterization of Board-Level Interconnects, -9703 Mechanical Shock Test Guidelines for Solder Joint Reliability, -9704 Printed Wiring Board Strain Gage Test Guidelines, -9706 Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection, -9707 Spherical Bend Test Method for Characterization of Board Level Interconnects, IPC-9708 Test Methods for Characterization of Printed Board Assembly Pad Cratering, and IPC 9709 Test Guidelines for Acoustic Emission Measurement during Mechanical Test.


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