IPC Status of Standardization

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This report shows the status of IPC documents under development. To ensure due process, all IPC specifications are circulated among IPC member companies for their review. If you would like to obtain a copy of a particular draft, please contact the IPC technical staff at answers@ipc.org.

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NOTE: Translations, amendments, addendums, incorporations, or supplements are not part of the one complimentary copy of each new or revised standard program.

Status of Standardization

Published Standards
IPC-A-600K July 2020 Acceptability of Printed Boards
IPC-1752B July 2020 Materials Declaration Management
IPC-1754 Am2 June 2020 Materials and Substances Declaration for Aerospace, Defense, and Other Industries
IPC-9797 June 2020 Press-fit Standard for Automotive Requirements and other High-Reliability Applications
IPC-1755A April 2020 Responsible Sourcing of Minerals Data Exchange Standard
IPC-4101E WAM1 April 2020 Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-1602 April 2020 Standard for Printed Board Handling and Storage
IPC-J-STD-001GA/A-610GA March 2020 Automotive Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610G Acceptability of Electronic Assemblies
IPC J-STD-001GS AM 1 March 2020 Space and Military Applications Electronic Hardware Addendum to IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies
IPC-6012ES February 2020 Space and Military Avionics Application Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards
IPC-6012E February 2020 Qualification and Performance Specification for Rigid Printed Boards
IPC-2223E January 2020 Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-2591 Version 1.1 January 2020 Connected Factory Exchange (CFX)
IPC-A-610GC January 2020 Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies
IPC/WHMA-A-620D January 2020 Requirements and Acceptance for Cable and Wire Harness Assemblies
IPC-1791A January 2020 Trusted Electronic Designer, Fabricator and Assembler Requirements

J-STD-001GS-AM1-DE June 2020 Ergänzung Elektronik-Hardware für Raumfahrt- und Militäranwendungen zu IPC J-STD-001G DE Anforderungen an gelötete elektrische und elektronische Baugruppen (German language)
IPC-7095D-WAM1-JP June 2020 ボールグリッドアレイ(BGA)の設計および組立プロセスの実施 – 改訂版1 (Japanese language)
IPC-J-STD-001GA/IPC-A-610GA-DE June 2020 Automotive-Ergänzung zu IPC J-STD-001G-DE Anforderungen an gelötete elektrische und elektronische Baugruppen und IPC-A-610G-DE, Abnahmekriterien für elektronische Baugruppen (German language)
IPC/WHMA-A-620D-CN June 2020 线缆及线束组件的要求与验收 (Chinese language)
IPC/WHMA-A-620D-DE June 2020 Anforderungen und Abnahmekriterien für Kabel- und Kabelbaum-Baugruppen (German language)
IPC/WHMA-A-620D-FR June 2020 Exigences et acceptation des assemblages de câbles et de faisceaux de fils (French language)
IPC/WHMA-A-620D-SP June 2020 Requisitos y admisibilidad de ensambles con cables y mazos de cables (Spanish language)
IPC-6012E-CN April 2020 刚性印制板的鉴定及性能规范 (Chinese language
IPC-9252B-CN April 2020 未组装印制板电气测试要求 (Chinese language)
IPC-A-610G-RU April 2020 Критерии приемки электронных сборок (Russian language)
IPC-2231-CN April 2020 卓越设计(DFX)指南 (Chinese language)
IPC-7351B-CN March 2020 表面贴装设计及连接盘图形标准通用要求 (Chinese language)
J-STD-001GS-DE January 2020 Ergänzung Elektronik-Hardware für Raumfahrt- und Militäranwendungen zu IPC J-STD-001G Anforderungen an gelötete elektrische und elektronische Baugruppen (German language)
IPC-7092-CN January 2020 埋入式元器件设计和组装工艺的实施 (Chinese language)
IPC-HERMES-9852-CN January 2020 表面贴装技术组装中机器对机器通信的全球标准 (Chinese language)
J-STD-004B-WAM1-JP January 2020 はんだ付用フラックスに関する要求事項 (Japanese language)
J-STD-006C-JP January 2020 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項 (Japanese language)
IPC-2226A-JP January 2020 分野別設計基準:高密度配線(HDI)プリント基板の設計 (Japanese language)
IPC-6017-CN January 2020 含埋入无源器件印制板的鉴定及性能规范 (Chinese language)

Proposed Standard for Ballot
IPC/WHMA-A-620DS Space and Military Applications Electronic Hardware Addendum to IPC/WHMA-A-620D.
IPC-2222B Sectional Design Standard for Rigid Organic Printed Boards
IPC-2581C Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-4552B Performance Specification for Electroless Nickel / Immersion Gold (ENIG) Plating for Printed Boards
IPC-6012EM Medical Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards
IPC-7093A Design and Assembly Process Implementation for Bottom Termination SMT Components
IPC-7526A Stencil and Misprinted Board Cleaning Handbook
IPC-7711/21C Am1 Rework, Modification and Repair of Electronic Assemblies - Amendment 1

Final Draft for Industry Review
IPC-2551 International Standard for Digital Twins
IPC-6902 Qualification and Performance Specifications for Printed Electronics (Additive Circuitry)
IPC-9257 Requirements for Electrical Testing of Flexible Printed Electronics

Working Draft
J-STD-001H Requirements for Soldered Electrical and Electronic Assemblies
IPC-HDBK-005A Guide to Solder Paste Assessment
IPC-A-610H Acceptability of Electronic Assemblies
IPC-SM-840F Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
IPC-1782A Standard for Manufacturing and Supply Chain Traceability of Electronic Products
IPC-2221C Generic Standard on Printed Board Design
IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards
IPC-2292A Design Standard for Printed Electronics on Flexible Substrates
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials
IPC/SGIA-5222 Process Guideline for Screen Printing for Printed Electronics (Additive Manufacturing)
IPC-5262 Design, Critical Process and Acceptance Requirements for Polymeric Applications
IPC-6012D MBB Addendum Metal Base Printed Boards Addendum to IPC-6012D
IPC-6013DM Medical Applications Addendum to IPC-6013D Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
IPC-6017A Qualification and Performance Specification for Printed Boards Containing Embedded Passive and/or Active Components
IPC-7091A Design and Assembly Process Implementation of 3-D Components
IPC-7092A Design and Assembly Process Implementation for Embedded Circuitry and Devices
IPC-7251 Generic Requirements for Through-Hole Design and Land Pattern Standard
IPC-7991 Process Guideline for 3D Printed Electronics
IPC-8941 Guideline on Connections for E-Textiles
IPC-9202A Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance
IPC-9203A Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle
IPC-9121A Troubleshooting Printed Board Fabrication Processes
IPC-9242 Guidelines for Microsection Evaluation
IPC-9709A Test Guidelines for Acoustic Emission Measurement during Mechanical Testing
IPC-T-50N Terms and Definitions for Interconnecting and Packaging Electronic Circuits

Project Approved
IPC-HDBK-001A Handbook and Guide to Supplement J-STD-001G and J-STD-001G - Revision A
IPC-2201 Requirements for Physics of Failure Analysis for Components and Assemblies
IPC-2611A Generic Requirements for Electronic Product Documentation
IPC-2612A Sectional Requirements for Electronic Diagramming Documentation (Schematic and Logic Descriptions)
IPC-2612-1A Sectional Requirements for Electronic Diagramming Symbol Generation Methodology
IPC-4412B Am 3 Specification for Finished Fabric Woven from ‘‘E’’ Glass for Printed Boards - Amendment 3
IPC-4557 Specification for Electrolytically Deposited Nickel/Gold Surface Finish for Printed Board Applications
IPC-7070 Guidelines for Printed Board Component Mounting
IPC-7352 Generic Guideline for Land Pattern Design
IPC-9205 Evaluating Electrochemical Performance of Electronics Manufacturing Materials and Processes


Test Method Proposals

SECTION 2.1 - 2.1 Visual Test Methods
TM Determining a Weave as Spread Glass

SECTION 2.2 - 2.2 Dimensional Test Methods
TM 2.2.14A Solder Powder Particle Size Distribution - Screen Method for Types 1-4
TM Solder Powder Particle Size Distribution - Measuring Microscope Method
TM Solder Powder Particle Size Distribution—Optical Image Analyzer Method
TM Determination of Maximum Solder Powder Particle Size
TM 2.2.20A Solder paste Metal Content by Weight

SECTION 2.3 - 2.3 Chemical Test Methods
TM 2.3.13 June 2013 Determination of Acid Value of Liquid Solder Flux - Potentiometric and Visual Titration Methods
TM 2.3.20 Measuring the Phosphorus Content in Deposited Electroless Nickel
TM Stripping Gold from Nickel with ENIG Surface Finish
TM 2.3.32E Flux Induced Corrosion (Copper Mirror Method)
TM 2.3.33E Presence of Halides in Flux, Silver Chromate Method
TM Fluorides By Spot Test, Fluxes-Qualitative
TM 2.3.43 Standard Test Method for Evaluation of Material Compatibility, Cleaning

SECTION 2.4 - 2.4 Mechanical Test Methods
TM 2.4.34A Solder Paste Viscosity - T-Bar Spin Spindle Method (Applicable for 300,000 to 1,600,000 Centipose)
TM Solder Paste Viscosity—T-Bar Spindle Method (Applicable at less than 300,000 Centipoise)
TM Solder Paste Viscosity—Spiral Pump Method (Applicable for 300,000 to 1,600,000 Centipoise)
TM Solder Paste Viscosity - Spiral Pump Method (Applicable at Less Than 300,000 Centipoise)
TM 2.4.35A Solder Paste – Slump Test
TM 2.4.43A Solder Paste - Solder Ball Test
TM 2.4.45A Solder Paste – Wetting Test

SECTION 2.5 - 2.5 Electrical Test Methods
TM 2.5.35 Capacitance of Printed Board Substrates After Exposure to Assembly, Rework and/or Reliability Tests

SECTION 2.6 - 2.6 Environmental Test Methods
TM Surface Insulation Resistance - Fluxes - Telecommunications
TM Surface Insulation Resistance
TM Electrochemical Migration Resistance Test
TM 2.6.15D Corrosion, Flux

Test Methods Approved

SECTION 2.6 - 2.6 Environmental Test Methods
TM March 2020 Thermal Shock, Continuity and Microsection, Printed Board
TM 2.6.27B February 2020 Thermal Stress, Convection Reflow Assembly Simulation

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