IPC and CALCE Seek Technical Papers for Tin Whiskers Symposium

Tin Whiskers Conference graphic FBBANNOCKBURN, Ill., USA, May 15, 2013
IPC — Association Connecting Electronics Industries® and the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland have issued a call for papers for the 7th International Symposium on Tin Whiskers. Sponsored by Lockheed Martin, the symposium will take place November 12–13, 2013, in Costa Mesa, Calif.

Expert presentations are sought on the full range of tin whiskers theory and practice in every market sector, including military/aerospace, aviation, medical, automotive, telecom and consumer. The content of the presentations should be noncommercial in nature and cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods and risk mitigation strategies.

Those interested in presenting have until July 1 to submit an abstract of 250 to 300 words summarizing technical work that has not been previously published, a professional biography and complete contact information to Dr. Michael Osterman, CALCE operations director, at Osterman@calce.umd.edu. Authors will be notified of status by July 29, and will have a deadline of October 11 to provide completed papers and full presentation slides.

More information about the conference and submission requirements is available at www.ipc.org/tin-whiskers-2013-cfp.

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About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

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