IPC Issues Call for Participation for 2013 IPC APEX India

IPC APEX IndiaBANNOCKBURN, Ill., USA, April 22, 2013
IPC — Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for 2013 IPC APEX India at the NIMHANS Convention Centre in Bangalore, 27-29 August, 2013.

IPC APEX India will provide presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the electronics interconnection industry.

Expert presentations are being sought on design, materials, assembly, processes and equipment in the following areas:

1. Advanced Technologies
  • Flexible circuitry
  • HDI technologies
  • Microminiaturization
  • Nanotechnologies
  • Optoelectronics
  • Photovoltaics
2. Electronics Engineering Management
  • Automotive electronics
  • Business and supply chain issues
  • Counterfeit electronic components
  • Electronics Manufacturing Services (EMS)
  • Factory automation
3. Electronics Packaging
  • Assembly processes
  • BGA packaging
  • Embedded passive and active devices
  • Lead-free fabrication
  • PCB fabrication
  • Wire and cable harness
4. Electronics System Design
  • CAD techniques and signal integrity
  • Design for EMI/EMC & ESD
  • High speed and high frequency
5. EEE Components
  • Area array
  • Flip chip
  • RF
  • Solid state relays and connectors
6. Reliability & Quality Assurance
  • AOI
  • Environmental and ESD compliance
  • Failure analysis
  • Manufacturing quality control
  • Reliability engineering
  • Testing
A 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. In addition, course proposals are solicited from individuals interested in presenting full-day (six hours) or half-day (three hours) professional development courses on design, printed board and electronics manufacturing processes and materials. An honorarium is offered to professional development course instructors.

Both the technical conference paper abstracts and course proposals are due 6 May, 2013. Conference abstracts should be sent to David Bergman, IPC vice president of international relations. Professional development course proposals should be sent to IPCAPEXIndia@ipc.org. For additional information, visit www.ipc.org/APEX-India.

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About IPC
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

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