This release is for two documents previously released in English now available in Hungarian and Czech.

7711/21B-HU

Elektronikai szerelvények újramunkálása, módosítása és javítása (7711/21) (Hungarian Language)

Member price: $75

Standard price: $150

A-610E-CZ

Kritéria přijatelnosti elektronických sestav (Czech language)

Member price: $55

Standard price: $110

To see additional formats and pricing, please click through the links above.

IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. You will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

Learn more about new options for new releases announcements for all documents, English documents only, European languages only or Asian languages only.

]]> https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=a4e08dd6-512a-e111-b2f9-00155d05285c 4103A

Specification for Base Materials for High Speed/High Frequency Applications

This specification covers the requirements for clad and unclad plastic laminate and bonding layer materials to be used for the fabrication of printed boards for microstrip, stripline, and high speed digital electrical and electronic circuits. In addition to updated testing parameters, inspection lot requirements, revised visual acceptance criteria, this revision incorporates a new specification sheet format for new materials that provides both mandatory (e.g., Df and Dk) requirements as well as "loose" requirements (e.g., thermal conductivity and moisture absorption) that can be certified to or called out on fabrication drawings. This new classification format allows for a reduced number of material specification sheets. 56 pages. Released 2011.

Member price: $46

Standard price: $93

IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file. 

Coping in an Era of Uncertainty - An Increasingly Agile Supply Chain and Lessons Learned from the Great Recession

This paper "Coping in an Era of Uncertainty - An Increasingly Agile Supply Chain and Lessons Learned from the Great Recession" was presented by Amitabh Passi, Electronics Supply Chain and NA Handset Analyst, USB at the October 2011 IPC Executive Summit Conference at San Jose, Calif. The author examines the recessions of 2001/2002 and 2008/2009 for their depth and duration and the effects on revenues and profitability on the electronics supply chain. He then explains how the recovery from the latest recession was driven by lessons learned from 2001/2002, supply chain agility, growth in emerging markets and new technologies. This paper includes the synchronized slides and recorded audio from the presentation. 35 minutes. Released 2011

Member price: $35

Standard price: $50

This product is available for download through the link above.

Surface Mount Placement Equipment Characterization

This document standardizes the parameters, measurement procedures and methodologies used to measure and report pick and place machine accuracy as a relationship to placement speed for a range of SMT component sizes and configurations. This product includes one printed copy of the standard and a CD with support documentation, report forms and the test material drawings in Gerber format. 40 Pages. Released November 2011.

Member price: $55

Standard price: $110

IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file. 

ESD Fundamentals  (Click for full description and complete free reviews.)

This six-video set provides ESD Control training for your entire staff – from comprehensive training for your assembly workers, to introductory awareness for administrative staff.  Also includes titles for yearly refresher / re-certification requirements – all at a significant discount of 1/3 off the individual list pricing.

Available on DVD for classroom presentation, or in our Online Video Training (OVT) format, for your computer-based learning network.

Includes free paper-based testing (by part #), and instant access to free online e-testing programs for verification of training – per ISO requirements – using IPC Training Certification.

Titles include (click on any link for free online review)…

DVD-55C – ESD Control for IT and Electronics Service Techs – For techs that handle equipment after it's manufactured.

DVD-74C – ESD Control for Electronics Assembly – For Electronics Assembly line workers.

DVD-75C – Ray's ESD Prevention Secrets – Useful as basic training or as a refresher / recertification course.

DVD-76C – ESD Control for Non-Mfg. Personnel – ESD training for administrative or non-touch staff.

DVD-77C – ESD Control for Material Handlers – Especially for Shipping & Handling, and transport personnel.

DVD-78C – The Seven Sins of ESD Control – A retraining course for your yearly certification requirements.

Product Code (Classroom format):  DVD-ESD-K 

Member price:  $1,470

Standard price:  $1,870

Save 33% when you purchase this package of six DVDs. Contact IPC Training to receive credit against previously purchased DVDs in this set.

Product Code (Learning Network format):  OVT-ESD-K (Site License)  (Includes free DVD-ESD-K with purchase.)

Member price:  $2,190

Standard price:  $2,800

Save 33% when you purchase this package of six OVTs. Contact IPC Training to receive credit against previously purchased OVTs in this set.

Sales/Technical Support

For sales help or technical questions on these media-based products, contact IPC Training (trainingsupport@ipc.org) or by phone at +1 575-758-7937.

Training home page:  www.ipctraining.org

Ordering Info

Click through the product title or part number links above for descriptions, pricing, Free Complete Reviews or to order online.  Contact IPC Customer Service by phone at +1 847-597-2862 or by email (orderipc@ipc.org) to place your order or to verify your IPC membership status.

PLASMA-IRVINE-11-11

Use of Plasma Deposition to Provide a Novel Surface Finish and Protective Coating for PCBs

"Use of Plasma Deposition to Provide a Novel Surface Finish and Protective Coating for PCBs" was presented at the IPC Conference on Reliability: Assembly Process for a Reliable Product in November 2011. The paper was written by David Rund, director of business development for materials of the Christopher Group, and was presented by Chrys Shea. The author describes a new method of applying a polymer material to the surface of a PCB to improve corrosion resistance while acting to improve reliability and solderability while being environmentally friendly. The solder joints were then tested for shear strength, contact resistance, corrosion resistance and RF signal loss. This presentation includes the synchronized slides and audio. 20 minutes. Released 2011. 

Member price: $35

Standard price: $50

UNDERFIL-IRVINE11-11

Underfill Selection and the Impact on Reliability

"Underfill Selection and the Impact on Reliability" was presented at the IPC Conference on Reliability: Assembly Process for a Reliable Product in November 2011 by Dr. Brian Toleno, director of technical services and applications for Henkel. The author defines underfill and describes the types. He explaines the need for underfill and where it is typically used. He also explains the effects of different types of underfill in augmenting product reliability whether environmental or mechanical and their effect on reworkability. This presentation includes the synchronized slides and audio. 27 minutes. Released 2011.

Member price: $35

Standard price: $50

Advanced Hand Soldering Techniques  (Click for full description and complete free review.)
Give your soldering technicians the latest tricks of the trade to make rework faster and to help avoid damage to your ever-shrinking and more complex assemblies. From the introduction of new styles and the miniaturization of components, to the transition from tin-lead to lead free solder alloys — some of the old methods of hand soldering just don't work the same way they used to. Learn contemporary hand soldering techniques required for lead free, ultra small chips, BGA land prep and more.

Includes free paper-based testing, and instant access to a free online e-testing program for verification of training – per ISO requirements – using IPC Training Certification.

Available on DVD for classroom presentation, or in our Online Video Training (OVT) format, for your computer-based learning network.

Free video review in Window's Media format.

Product Code (Classroom format):  DVD-111C 

Member price:  $395

Standard price:  $495

Product Code (Learning Network format):  OVT-111C (Site License)  (Includes free DVD-111C with purchase.)

Member price:  $590
Standard price:  $740

Sales / Technical Support:

For sales help or technical questions on these media-based products, contact IPC Training (trainingsupport@ipc.org), or by phone +1 575-758-7937.

Training home page:  www.ipctraining.org

Ordering Info:

Click through the product title or part number links above for descriptions, pricing, Free Complete Reviews, or to order online.  

Contact IPC Customer Service by phone at +1 847-597-2862, or by email (orderipc@ipc.org) to place your order, or to verify your IPC membership status.

J-STD-006B-RU

Требования к припойным сплавам для электроники и твердым припоям с флюсом и без флюса для применения при пайке электроники (Russian Language)

Данный стандарт устанавливает номенклатуру, требования и методы испытаний для припойных сплавов для электроники, для брусков с флюсом и без флюса, лент и порошка припоя для применения при пайке электроники, а также для «специальных» припоев для электроники. Данный стандарт представляет собой документ для управления качеством и не предназначен для использования в качестве документа, имеющего непосредственное отношение к поведению материала в производственном процессе. Припои для задач, отличных от производства электроники, следует приобретать с использованием стандарта ASTM B-32

Данный стандарт входит в набор из трех объединенных промышленных стандартов, устанавливающих требования и методики испытаний паяльных материалов для использования в электронной отрасли. Два других стандарта в данном наборе – это: IPC/EIA J-STD-004 «Требования к флюсам для пайки» и IPC/EIA J-STD-005 «Требования к паяльным пастам». 29 страниц. Выпущен в октябре 2009 г.

Изменения 1 и 2, включенные в данный стандарт J-STD-006B (переведен в августе 2011 г.), касаются следующего: 1. Добавлены ссылки на стандарт IPC/JEDEC J-STD-609 «Маркировка, этикетки и символы бессвинцовых и содержащих свинец материалов». 2. Объяснено значение сплавов, которые обозначены как бессвинцовые. 3. Включено руководство для поставщиков по обозначению и маркировке бессвинцовых сплавов. 4. Исправлены требования к максимальному допустимому содержанию примесей свинца (Pb) и сурьмы (Sb) в пункте 3.3 «Примеси в сплаве». 5. Все упоминания данных по распределению размеров частиц припоя и паяльным пастам перенесены в стандарт IPC J-STD-005 «Требования к паяльным пастам». 6. Исключена таблица 3-1 «Распределение размеров частиц стандартных порошков припоя». 7. Изменены данные таблицы A-1 «Состав и температурные характеристики бессвинцовых припойных сплавов» в Приложении A «Припойные сплавы». 8. В Приложении B-1 установлены согласованные требования к максимальным уровням загрязнений следующими элементами: серебро (Ag), свинец (Pb) и сурьма (Sb).

Member price:  $26
Standard price:  $52

All IPC new releases in all languages will continue to be posted on this notification service. If you are satisfied with this service, you do not need to do anything.

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Sectional Design Standard for Flexible Printed Boards

Used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. Revision C provides new design guidance and requirements for bends, folds and creases, staggered flexible layer bands, and strain relief fillets. Also included is a new design tutorial providing guidance on material selection, size and shape of flexible circuits and fabrication allowances. 39 pages. Released 2011.

Member price: $36

Standard price: $72

6018B

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Establishes requirements for qualification and performance of high frequency (microwave) printed boards. Covers both end product inspection and test of microwave boards for microstrip, stripline, mixed dielectric and multilayer stripline applications. It addresses final finish and surface plating coating requirements, conductors, holes/vias, and frequency of acceptance and quality conformance testing, as well as electrical, mechanical and environmental requirements. Revision B incorporates many new requirements in areas such as selection for procurement, new surface finishes, microvia requirements including hole plating thickness and copper wrap/cap plating of filled holes, laminate cracks and voids, etchback, PTFE resin smear, and thermal stress testing. 45 pages. Released 2011.

Member price: $46

Standard price: $93

7711/21B-CZ

Přepracování, modifikace a opravy elektronických sestav (7711/21) (Czech language)

Základni aktualizace pro bezolovnatou technologii a zlepšené návody pro kontrolu oprav a modifikací Tento návod obsahuje vše, čeho je zapotřebí pro opravy a přepracování elektronických sestav a desek plošných spojů! IPC 7711/7721 Přepracování,modifikace a opravy elektronických sestav prošla kompletní aktualizaci všech postupů aby byla zaručena kompatibilita pro bezolovnatou i tradiční SnPb technologii. Tento jediný svazek obsahuje všechny předtím publikované změny a řadu nových postupů pro BGA (včetně reballingu) a oprav flexibilních DPS. Část 1 Obecné požadavky byla rovněž upravena a zpřehledněna a přináší důležité pokyny a návody pro všechny postupy. Tato část zahrnuje postupy společné pro přepracování, opravy a modifikace. Část 2 je IPC 7711B a postupy zahrnují nástroje, materiály a metody potřebné k odstranění a výměně povrchově montovaných i vývodových součástek. Část 3 je IPC 7721B a zahrnuje postupy pro modifikaci sestav a opravy laminátu a vodičů. Tento návod je opatřen rychlovazačem pro snadné doplňování stran. Uživatel může vkládat specifické postupy platné interně v podniku, nebo vyjímat příslušné listy tak aby na pracovním stole bylo minimum dokumentů. Budoucí aktualizace mohou být volně staženy z www.ipc.org/downloads. řada postupů má barevné ilustrace které pomohou uživatelům porozumět instrukcím. Nahrazuje IPC 7711,IPC7721 a IPC-R-700. Přes 300 stran, vydáno v listopadu 2007 Přeloženo v červnu 2010

Member: $75

Nonmember: $150

IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

6013-CN

挠性印制板的鉴定及性能规范 (Chinese Language)

本规范涵盖了按IPC-2221和IPC-2223进行设计的挠性印制板的鉴定及性能要求。挠性印制板可以是单面板、双面板、多层板或刚-挠多层板。所有这些印制板的结构可以有或无增强板、镀覆孔（PTH）和盲/埋孔。B版本更新的内容包括：表面镀层、白斑、外来夹杂物、粘合剂挤出、可焊环宽、PTH铜包覆、镀层折叠、显微切片评定、验收测试频次等。取代IPC-6013A附修订本2。与IPC-6011结合使用。全文共45页，2009年1月正式发布英文版；2011年5月发布中文版。

Member: $52

Nonmember: $104

IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

This announcement is for the Chinese language document only. IPC-6011 was released in English in 1996.

6011-CN

印制板通用性能规范 (Chinese Language)

本规范为印制板供应商和用户建立了通用要求和职责。本规范担任IPC-6010印制板性能系列规范的基础，描述了必须满足的质量和可靠性的保证要求。与IPC-6012~IPC6018结合使用。取代IPC-RB-276、IPC-SC-320、IPC-TC-500、IPC-ML-950C。全文共15页，1996年7月正式发布英文版；2011年8月发布中文版。

Member: $26

Nonmember: $52

IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

]]> https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=66c61ced-6205-e111-8203-00155d05285cc This announcement is for the German language version only of IPC-7351B. The original in English was released in 2010.

7351B-DE

Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie (German Language)

IPC-7351B beinhaltet neben der Richtlinie einen Land Pattern Calculator auf einer CD-ROM für den Zugriff auf Bauteil- und Anschlussflächen-Daten. Der Calculator beinhaltet die mathematischen Algorithmen der Richtlinie. Damit kann der Anwender die Anschlussflächen für oberflächenmontierte Bauteile schnell und korrekt ermitteln. Dieses Werkzeug erlaubt auch die Modifizierung geometrischer Abmessungen von IPC-erprobten Anschlussflächen.

Dieses bekannte Dokument deckt das Anschlussflächen-Design für alle Typen von passiven und aktiven Bauteilen ab, inklusive MELFs, SOPs, QFPs, BGAs, QFNs und SONs. Der Standard unterstützt Leiterplatten-Designer mit durchdachten Anschlussflächen-Bezeichnungen, 0°-Drehlage der Bauteile für CAD-Systeme und drei unterschiedlichen Anschlussflächen-Geometrien (Design-Produzierbarkeitsstufen) für jedes Bauteil. Dies erlaubt dem Anwender die Anschlussflächen nach gewünschter Bauteildichte auszuwählen.

Revision B beinhaltet jetzt Anschlussflächen -Designregeln und Unterstützung für Bauteilfamilien wie Widerstandsnetzwerke, Aluminium-Elektrolytkondensatoren, Bauteile mit Reihen- und gerasterten Flächenanschlüssen, Flachanschluss-Bauteile (SODFL und SOTFL) und dual flat no-lead (DFN) Bauteile. Die Revision behandelt auch den Einsatz von Entwärmungs-Anschlussflächen und unterstützt ein neues Bezeichnungsschema für Padstacks, um die Form/Kontur und Abmessungen der Anschlussflächen unterschiedlichen Leiterplattenlagen zuweisen zu können.

Erhältlich ist außerdem eine 30-Tage Testversion des, von Mentor Graphics entwickelten, IPC-7351 Land Pattern Wizard. Der Land Pattern Wizard dient dem Anwender als Werkzeug bei der Erstellung von Anschlussflächen und Bibliotheken sowie beim Export von Anschlussflächen-Geometrien in die bevorzugten CAD-Formate, wie z.B. Allegro, Board Station, Expedition, PADS, CADSTAR, OrCAD, Pantheon und P-CAD. Die Richtlinie enthält ca.

100 Seiten und wurde im Juni 2010 veröffentlicht und im October 2011 übersetzt.

1601-DE

Handhabung und Lagerung von Leiterplatten (German Language)

Der einzige Industrie-Standard für das Handling, die Verpackung und Lagerung von Leiterplatten. Die Anwendung dieser Richtlinie soll Leiterplatten schützen vor Verunreinigung, mechanischer Beschädigung, Verschlechterung der Lötbarkeit und Feuchteaufnahme. Berücksichtigt werden Verpackungsmaterialien- und methoden, Produktionsumgebung, Handling und Transport der Produkte, etablierte und zu empfehlende Feuchtegehalte, anerkannte Trocknungsprofile für die Entfernung von Feuchtigkeit und die Auswirkung der Trocknung auf die Lötbarkeit der Leiterplatten. 18 Seiten, Veröffentlichung August 2010, Übersetzung Oktober 2011

Member: $36

Nonmember: $72

2223B-DE

Design-Richtlinie für flexible Leiterplatten (German Language)

Benutzung in Verbindung mit IPC-2221A, IPC-2223B etabliert die Anforderungen für das Design von einseitigen, doppelseitigen und Multilayer-Leiterplatten in flexibler und starrflexibler Ausführung. Die Änderungen und Erweiterungen in Revision B beinhalten Konstruktionen mit und ohne Kleber sowie die Anforderungen an partielle Abdeckung und Metallisierung. Außerdem neue Definitionen für Abdeckmaterialien, neue Anforderungen für metallisierte Löcher für starrflexible Verbindungen/Schnittstellen und erweiterte Abdeckung für nichtfunktionale Anschlussflächen. 30 Seiten. Veröffentlicht Mai 2008. Übersetzung Oktober 2011

Member: $26

Nonmember: $52

EXESUM10-11-CONFMIN

Conflict Minerals - Celestica Perspective

This presentation "Conflict Minerals - Celestica Perspective" by Kevin Weston, supply chain management environmental engineering, of Celestica was presented at the IPC Executive Summit Conference, in San Jose, Calif,.in October 2011. It shows how one company implemented the Dodd Frank act in the area of conflict minerals and the requirements imposed on its 4400 suppliers. Since the act is as yet incomplete, it cannot be fully implemented, thus impacting company policies. The presentation also explores some of the challenges for the industry. This presentation includes the synchronized slides and audio. 17 minutes. Released 2011.

Member: $35

Nonmember:  $50

EXESUM10-11-DISASTER

Disaster Preparedness: Strategies for Mitigating Supply Chain Disruption

This paper "Disaster Preparedness: Strategies for Mitigating Supply Chain Disruption" was presented by Greg Sheppard, chief research officer for HIS/iSuppli, at the IPC Executive Summit in San Jose, Calif., in October 2011. Preparation to protect your company from disruption due to fire, earthquake, etc. at your facilities and/or suppliers is described using lessons learned from the Japanese disaster. Direct and indirect impacts are described. The paper then goes on to describe how to identify risks and possible ways to lessen their impact. This presentation includes the synchronized slides and audio. 44 minutes. Released 2011.

Member: $35

Nonmember: $50

EXESUM10-11-FUTUREEM

Future of the EMS Industry and Its Impact on the PCB Industry

"Future of the EMS Industry and Its Impact on the PCB Industry" by Jack Calderon of Lincoln International Electronics Group, was presented at the IPC Executive Summit in San Jose, Calif, in October 2011.  He builds a case for why the path to increased company value for the PCB industry is vertical expansion by mergers or acquisition of EMS companies. Calderon examines geographic issues and the challenges of capital availability and environmental requirements facing the PCB industry. This presentation includes the synchronized slides and audio. 28 minutes. Released 2011.

Member: $35

2010-2011 Analysis and Forecast for the Electronics Manufacturing Services (EMS) Industry

Survey-based study presents data and analysis on the EMS industry, examining trends in sources of revenue, revenue per employee, services offered, markets served, manufacturing technology, capital investment, spending on equipment and materials and market size including forecasts and potential for market expansion. This study is based on data provided by a representative sample of 47 EMS companies with a total of 90 facilities worldwide that participated in IPC's EMS Annual Survey. These companies accounted for $8.1 billion in EMS sales in 2010. 86 pages. Released 2011.

Member: $475

Nonmember: $950

This market research report is only free for participants. Please follow the link above for more details, to purchase and/or to see a table of contents.

IPC Midwest 2011 Technical Conference Proceedings CD

Proceedings from this technical conference include 18 presentations on AOI Assembly, Cleaning and Residues, Cleanliness Testing, Design for Manufacturability, Design for Reliability, Design for Test, ICT, Moisture Sensitivity, Reflow and Wave Soldering, Reliability, Selective Soldering, Solderability, Test and Inspection, and Tin Whiskers Risk Mitigation. All papers are electronically searchable by title, author and key word. These Proceedings are available exclusively on CD and not in hard copy. The papers may be printed from the CD. Released October 2011.

Member: $75

Nonmember: $100

Additional electronic formats are available. Please click through the link above for pricing.

IPC Members can access this content at no charge in www.ipc.org/members-only under Proceedings.

Stencil Design Guidelines

This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included. 14 pages. Released October 2011.

Member: $31

Nonmember: $62

Additional electronic formats are available. Please click through the link above for pricing and more information on the standard, including a link to the table of contents.

IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

Material and Process Characterization/Qualification Test Protocol for Assessing Electrochemical Performance

This document provides tests that record changes in surface insulation resistance (SIR) on a representative sample of a printed circuit assembly. It quantifies any deleterious effects that might arise from solder flux or other process residues left on external surfaces after soldering, which can cause unwanted electrochemical reactions that grossly affect reliability. It uses test vehicles that are intended to be representative of the electronic circuits that are in production and is a test yielding both quantitative and qualitative data. This test may be used for process qualification, demonstrating that a proposed manufacturing process or process change can produce hardware with acceptable end-item performance related to cleanliness. This test may also be used for process characterizations, including development of new processes or improvements to an existing process. 11 pages. Released 2011.

Member: $26

Nonmember: $52

IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

Terms and Definitions for Interconnecting and Packaging Electronic Circuits

This essential industry standard provides descriptions and illustrations of electronics interconnect industry terminology to help users and their customers break down language barriers. Revision J contains nearly 400 new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and microvia technology. Also includes commonly used industry acronyms. 121 pages. Released 2011.

Member: $46

Nonmember: $93

IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

Handling in Electronics Assembly  (Click for complete description and free review.)

Now with completely new videography and updated technical contents, this video training program is the best tool around for your continuous improvement efforts.  DVD-24C is perfect for new employees who will be handling assemblies – as well as a great refresher for long-term employees – for learning best-industry practices to prevent handling defects and reduce scrap.

Includes free paper-based testing and instant access to a free online e-testing program for verification of training, per ISO requirements – using IPC Training Certification.

Available on DVD for classroom presentation or in our Online Video Training (OVT) format for your computer-based learning network.

Product Code:  DVD-24C 

Member: $350
Nonmember: $450

Product Code (PC/Network-based Video formats):  OVT-24C (Site License)  

(Includes free DVD-24C with purchase.)

Member: $525
Nonmember: $675

Are you a past purchaser of DVD- or OVT-24C?  Then you qualify for a 50% discount on this completely new version. Contact IPC Training, below.

Sales / Technical Support

For sales help or technical questions on these media-based products, contact IPC Training (trainingsupport@ipc.org) or by phone +1 575-758-7937.

Training home page:  www.ipctraining.org

Ordering Info

Click through the product title or part number links above for descriptions, pricing, Free Complete Reviews or to order online.  

A-610E-HI

इलेक्ट्रोनिक असेम्बलीज की स्वीकार्यता (Hindi Language)

A-610E-HU

Elektronikai szerelvények elfogadhatósága (Hungarian Language)

Hard copy

Member:  $55

Nonmember:  $110

To see additional formats and pricing, please click through the links above.

IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. You will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

板极互连的单向弯曲特性描述 (Chinese Language)

Product Code: 9702-CN

Member:  $26

Nonmember:  $52

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

A-610E-KR

Member: $55

Nonmember: $110

IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

전자 어셈블리의 허용 가능성 (Korean Language)

Product Code: A-610E-KR

IEC는 IPC-A-610을 전자 어셈블리에 대한 전세계적으로 선호되는 국제적인 허용 규격으로서 이를 승인하는 과정에 있다.

IPC-A-610은 세계에서 가장 널리 사용되는 전자 어셈블리 표준이다. 모든 품질 보증 및 어셈블리 부서들에 대해 하나의 필수적인 표준으로서, IPC-A-610E는 컬러 인쇄 사진들과 도해들을 통하여 전자 어셈블리들에 대한 업계가 인정하는 작업 수행 기준들을 예시한다. 주제들은 flex 부착, board in board, part on part, 무연 소재, 소자의 방향 맞춤과 쓰루홀에 대한 솔더링 기준들, SMT (새로운 종단 스타일들), 개별 배선 어셈블리들, 기계적인 어셈블리, 세정, 표식(Marking), 코팅, 그리고 라미네이트(laminate) 요구사항들을 포함한다.

IPC-A-610은 모든 검사자들, 운용자들 그리고 트레이너들에게 아주 귀중한 자료이다. 개정판 E는 허용 가능성 기준들에 대한 809개의 사진들과 도해들을 수록하고 있는데, 그 중에서 165개는 새로운 것이거나 업데이트된 것이다. 이 개정판은 명료성과 정확성을 위해 아주 비판적으로 검토가 되었다. 본 문건은 다른 산업계가 합의한 문건들에 표현된 그 요건들에 일치하고 있으며 그리고 재료 및 공정 표준인 IPC J-STD-001과 함께 사용된다. 400페이지로서, 2010.4월에 발간되어, 2011. 6월에 한국어로 번역되었다.

Member: $55

Nonmember: $110

IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

Spherical Bend Test Method for Characterization of Board Level Interconnects

This standard on spherical transient bend testing is intended to characterize the maximum allowable strain that a surface mount component's board level interconnects can withstand in flexural loading. Whereas four-point monotonic bend test methods only address simple planar bending, spherical bend tests establish strain limits of board level interconnects under worst-case flexure conditions that can occur during conventional printed board/system assembly, manufacturing and test operations. This method is applicable to surface mounted BGA components larger than 15.0 mm on a side with organically based substrates, attached to printed boards using conventional solder reflow technologies. This document was developed cooperatively with JEDEC. 15 pages. Released 2011.

Member:  $36

Nonmember:  $72

IPC members may request a free single user download of a document with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

Keynote: the Future of Flex: Opportunities and Challenges

This presentation "Keynote: the Future of Flex; Opportunities and Challenges," by Phil Plonski, managing partner, Prismark Partners, was presented at the IPC International Conference on Flexible Circuits, on June 22, in Minneapolis, Minnesota. The author discusses changes and growth in product mix and market for flex circuits since 2000. He then goes on to discuss production, assembly and materials and shows several applications of this technology. This presentation includes the synchronized slides and audio from the original presentation. 45 minutes.

Member: $35

Nonmember: $50

FLEXMAN-MN06-11

Staying Flexible with Manufacturing when the Military is in Flux

This presentation "Staying Flexible with Manufacturing when the Military is in Flux" was presented by Steve DeWaters, President of Penumbra Strategies, Inc. on June 22, 2011, at the IPC International Conference on Flexible Circuits. With decreased military budgets and increasing data rates, more must be accomplished with fewer dollars. Photonics (embedded optics with light integrated with electronics) is one way to meet DoD requirements for increased data rates. Polymer waveguides as part of flex circuits help to meet size, weight and power constraints. This presentation includes synchronized slides and audio recorded during the original presentation. 29 minutes.

Member: $35

Nonmember: $50

JIG101ED4

Joint Industry Guide Materials Composition Declaration for Electrotechnical Products

The Joint Industry Guide Material Composition Declaration for Electrotechnical Products has been updated to include the most recent substances for restriction. The JIG-101 is an industry materials declaration guide that facilitates reporting of material content information across the global electrotechnical supply chain. This document sets minimum requirements for a materials declaration. The document (also called JIG- 101 Ed. 4.0) now addresses the most updated regulatory requirements that require supply chain disclosure of material content in electrotechnical products. In addition, the criteria for substances to be declared have been changed, now requiring broader industry consensus and allowing companies to act proactively. 48 pages. released 2011.

Критерии приемки электронных сборок (Russian Language)

Product Code: A-610E-RO

В настоящее время МЭК находится в процессе рекомендации IPC-A-610 в качестве всемирно одобренного международного стандарта по приемке электронных сборок.

IPC-A-610 является наиболее широко известным в мире стандартом электронной сборки. Обязательный для отделов сборки и обеспечения качества, документ IPC-A-610E иллюстрирует критерии качества изготовления, принятые в промышленности, посредством цветных фотографий и иллюстраций. Рассматриваемые темы включают гибкие соединения, соединения печатных плат, компонентов, бессвинцовую пайку, ориентацию компонентов и критерии пайки компонентов, монтируемых в отверстия, поверхностных компонентов (новые типы соединений), объемный монтаж, механическую сборку, отмывку, маркировку, покрытие и требования к ламинату.

IPC-A-610 является бесценным для контролеров, операторов и специалистов по обучению. Издание Е включает 809 фотографий и иллюстраций критериев приемки, - 165 из них новые либо обновлены. Данное издание было отредактировано на предмет ясности и четкости. Данный документ соответствует требованиям других документов, а также используется совместно со стандартом IPC J-STD-001. 400 страниц. Издание Апрель 2010.

Member: $55

Nonmember: $110

World PCB Production Report for the Year 2010

IPC's World PCB Production Report offers consensus estimates of PCB production value by country and by product type, commentary on global and regional PCB industry trends, special sections on HDI/microvia and metal-clad PCBs, and historical PCB production data on regional production trends. The estimates are developed by a team of the world's leading industry analysts.

Published annually, this report is available free to IPC members through in the members-only web site or in the IPC online store through the hyperlink above. Log in and download is required. A free one-year IPC facility membership is included with the purchase of this report for nonmembers.

Member: $0

Nonmember: $1,050

Qualifikation und Leistungsspezifikation für starre Leiterplatten (German Language)

6012C-DE

Diese Spezifikation behandelt die Qualifikation und Leistungsspezifikation starrer Leiterplatten und umfasst einseitige und zweiseitige Leiterplatten mit/ohne durchmetallisierte Löcher und Multilayer-Leiterplatten mit/ohne Sacklöcher und nicht-durchgehende Verbindungslöcher sowie Metallkern-Leiterplatten. Sie behandelt Anforderungen an Endoberflächen und Metallisierungsbeschichtungen, Leiterbahnen, Löcher/Durchverbindungen, die erforderliche Häufigkeit von Annahmetests und Qualitätskontrollkriterien sowie elektrische, mechanische und Umwelt-Anforderungen. Die Ausgabe C beinhaltet zahlreiche neue Anforderungen in Bereichen wie Beschaffungsauswahl, neue Endoberflächen, Metallisierungsdicke in Löchern, Fleckenbildung, Gewebeaustritt, Kupfer-Deckflächenmetallisierung verfüllter Löcher, Laminat-Risse und –fehlstellen, Rückätzung, Verfüllung von Sacklöchern und nicht-durchgehenden Verbindungslöchern, Annahmetests und Testhäufigkeit sowie Anforderungen an thermische Stresstests. Diese Ausgabe ist auf IPC-A-600H abgestimmt. Vorgesehen für die Verwendung mit IPC-6011. Ersatz für IPC-6012B mit Ergänzung 1. 52 Seiten. Erschienen im April 2010.

Member:  $46

Nonmember:  $93

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

Guidelines for Cleaning of Printed Boards and Assemblies
CH-65B

This is a collection of information on electronic board and assembly cleaning in a single location. This major revision explains the relationship between materials, processes, and contaminants in fabrication and assembly operations. It also addresses cleanliness assessment and process control in relation to cleanliness. Color pictures help with understanding. 200 pages. Supersedes IPC-CH-65A, IPC-SC-60A, IPC-SA-61A, IPC-AC-62A, IPC-SM-839. Revised July 2011

Preview the table of contents (pdf).

Member:  $50

Nonmember:  $100

Learn more about this document:

FREE 30 minute webinar on August 17, 2011

Three hour in-person course: Cleaning Guidelines for Boards and Assemblies: Developing a Successful Process with the NEW IPC-CH-65B on September 22, 2011

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

Mount unlimited digital copies of our popular Training and Reference Guides on your PC(s)/server(s) in the Adobe PDF format.  Site (single facility) or Global (multi-site) Licenses available.

Training and Reference Guides  

(Complete description and free online review of both print and digital versions.)

These PDF files provide the functionality and convenience of Adobe Acrobat including: random access of data using custom bookmarks or document hyperlinks; the ability to add company-specific comments on any page; as well as enabling anytime access of these useful documents on any computer in your facility.  Important Notes:  The PDF version does not allow for printing – please purchase the hard copy edition if you require the document in print.  The PDF copy is only available via the IPC online store through links in this email and by credit card purchase only.

PDF Guides, listed individually (Global Licenses also available)…

Product Code:  DRM-18H (Site License) - Component Identification Training & Reference Guide

Member: $400 (For unlimited users – no expiration.)
Nonmember: $500  

Product Code:  DRM-PTH-E (Site License) - Through-Hole Solder Joint Training & Reference Guide

Member: $400 (For unlimited users – no expiration.)
Nonmember: $500

Product Code:  DRM-SMT-E (Site License) - Surface Mount Solder Joint Training & Reference Guide

Member: $400 (For unlimited users – no expiration.)
Nonmember: $500

Product Code:  DRM-WHA-A (Site License) - Wire Harness Assembly Training & Reference Guide

Member: $400 (For unlimited users – no expiration.)
Nonmember: $500

Sales / Technical Support
For sales help or technical questions on these media-based products, contact IPC Training (trainingsupport@ipc.org), or by phone +1 575-758-7937.

Training home page:  www.ipctraining.org

Ordering Info
Click through the product title or part number links above for descriptions, pricing, Free Complete

Reviews or to order online.  

Contact IPC Customer Service by phone at +1 847-597-2862, or by e-mail (orderipc@ipc.org) to order or to verify your IPC membership status.

]]> https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=8783bda7-278e-e011-811c-00155d052852 All DVD and OVT training & certification products are for unlimited students, with no expiration.

A-610E Common Inspection Errors  (Click for complete description and free online review.)
Even experienced IPC-A-610E interpreters can make these ten common inspection errors – costing their companies millions of dollars each year through misinterpreting defect criteria and unnecessary rework. While the IPC-A-610 provides a standard framework required to evaluate electronic assemblies--misunderstandings invariably arise, and become ingrained in the common production procedure. DVD-71C is a media-based training program that helps expose and eliminate errors such as: misinterpreting inspector responsibilities, using improper board-side criteria, misunderstanding minimum electrical clearance, rejecting excessive wetting angles, requiring complete vertical fill, misinterpreting through-hole part clearance, misapplying gull wing lead style criteria, misidentifying bottom termination components, rejecting measles and treating billboarding as an instant defect.

Includes free paper-based testing and instant access to a free online e-testing program for verification of training, per ISO requirements. Includes IPC Training Certification. 

Have your inspectors take the e-test now, and see how well they do.  

Available on DVD for classroom presentation or in our Online Video Training (OVT) format for your computer-based learning network.

Product Code:  DVD-71C 

Member: $495
Nonmember: $595

Product Code (PC/Network-Based Video formats):  OVT-71C (Site License)  (Includes free DVD-64C with purchase.)

Member: $740
Nonmember: $890

Sales/Technical Support
For sales help or technical questions on these media-based products, contact IPC Training (trainingsupport@ipc.org), or by phone +1 575-758-7937.

Training home page:  www.ipctraining.org

Ordering Info
Click through the product title or part number links above for descriptions, pricing, free complete reviews or to order online.  

Acceptabilitatea Ansamblurilor Electronice (Romanian Language)

A-610E-RO

Dintre standardele folosite în industria de asamblare aplicații electronice, IPC-A-610 are cea mai mare răspândire în lume. Ca o necesitate absolută pentru toate departamentele în asigurarea calității și în liniile de asamblare, IPC-A-610 ilustrează criterii industriale de acceptabilitate ale activităților practice din liniile de producție printr-o multitudine de fotografii color și ilustrații. Printre subiectele prezentate se regăsesc cerințe pentru atașamente de circuite flexibile, asamblare placă în placă, reper pe reper, aliaje fără plumb, orientarea componentelor și criterii pentru lipirea terminalelor în găuri, SMT (noi modele de terminații) și asamblare cu fire discrete, asamblări mecanice, curățenia aplicațiilor electronice, marcare, acoperiri și cele pentru laminatul plăcilor.

IPC-A-610 este de nelipsit pentru toți inspectorii, operatorii și trainerii. Revizia E are 809 fotografii și ilustrații ale criteriilor de acceptabilitate, 165 dintre acestea fiind noi sau aduse la zi. Această revizie a fost în mod critic reanalizată pentru mai multă claritate și acuratețe. Documentul este sincronizat cu cerințele exprimate în alte documente din industrie aprobate prin consens și este folosit cu un standard de proces și material IPC J-STD-001. Conține 400 de pagini. Apărut în Aprilie 2010. Traducere Martie 2011

Member: $55

Nonmember: $110

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

It's Not Easy Being Green: Roadmap to Compliance Proceedings

This meeting was held in May 2011. Achieving environmental compliance can be challenging. Understanding the regulations impacting your business is the first step along the road to compliance. These proceedings include presentations on the EU RoHS Directive and EU REACH Regulation, Asian chemicals regulations, South American chemicals regulations, conflict minerals and much more. In addition, there is information on sustainability, halogen-free, and carbon footprinting. These proceedings also include three presentations from individual companies on their compliance efforts. Each will show you what worked, what did not work, and their individual roadmaps toward implementing a successful compliance program.

Note: This product is only available through download.

Member: $75

Nonmember: $150

Purchase or view in the IPC online store.

Study of Quality Benchmarks for the Electronics Manufacturing Services (EMS) Industry for 2010

This survey-based study covers financial and production data, assembly attributes, yields, defect rates (DPMO), customer returns, supplier performance, customer satsifaction and certification data. This report enables EMS companies to compare their performance to industry averages. The survey sample includes 29 EMS companies with total sales revenue of $7.05 billion. 46 pages. Released May 2011.

Note: This product is only available by download.

Member: $475

Nonmember: $950

Purchase or view in the IPC online store.

Our special 7-DVD Certification Courses on Electronics Assembly…

EDU-101 – Intro to Electronics Assembly

EDU-102 – Surface Mount Assembly

EDU-103 – Through Hole Assembly

EDU-104 – Advanced Electronics Assembly

…Are now also available in our OVT (Online Video Training) format – for ease of use on your PC, learning network or intranet.  Discounts of up to 45% off individual list price for IPC member companies are available. See special membership rates for EDU institutions, small companies and government agencies to qualify for lower price.  Each OVT-set below includes the equivalent EDU DVD-set at no charge (for use in classroom presentations)…

Introduction to Electronics Assembly – 7-OVT Set  (Description, Free Reviews and Pricing.)
Gives your students the fundamental knowledge necessary for a career in Electronics Assembly: Overview of the entire assembly process; ESD Control; Component ID; Handling; Mechanical Assembly; Electrical Test; and General Safety.

Product Code:  EDU-101-OVT 

Member discount:  35%
Nonmember discount:  22%

Surface Mount Assembly – 7-OVT Set  (Description, Free Reviews and Pricing.)
Covers the basics in surface mount technology: Overview; Component Placement; Solder Paste Printing; Solder Paste Defect Analysis; Reflow Soldering; Adhesive Application; and Surface Mount Workmanship Standards. A great fit for college / Vo-Tech training programs.

Product Code:  EDU-102-OVT 

Member discount:  33%
Nonmember discount:  20%

Through Hole Assembly – 7-OVT Set  (Description, Free Reviews and Pricing.)
Understanding Through Hole Assembly has never been easier.  This set of programs covers: Intro / Overview; Wave Soldering; PTH Workmanship Standards; Component Prep / Manual Insertion; Hand Soldering for PTH Components; Soldering Terminals; and Through Hole Rework.  Also applicable for training centers / school-to-work programs.

Product Code:  EDU-103-OVT 

Member discount:  45%
Nonmember discount:  33%

Advanced Electronics Assembly – 7-OVT Set  (Description, Free Reviews and Pricing.)
A higher-level pre-employment or worker training program.  Covers: Print Reading; Advanced Safety; Bare Board Defect Recognition; Handling Moisture Sensitive Devices; The Major Errors in Surface Mount Processing; Soldering Iron Tip Care; ESD Follow-up training.

Product Code:  EDU-104-OVT 

Member discount:  38%
Nonmember discount:  30%

Sales/Technical Support
For sales help or technical questions on these media-based products, contact IPC Training (trainingsupport@ipc.org), or by phone +1 575-758-7937.

Training home page:  www.ipctraining.org

Ordering Info
Click through the product title or part number links above for descriptions, pricing, or to order online.  

Contact IPC Customer Service by phone at +1 847-597-2862, or by e-mail (orderipc@ipc.org) to order, or to verify your IPC membership status.

]]> https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=e9f30305-9372-e011-8c9a-00155d05284b This release is for the Russian Language J-STD-001E. The original document was released in English in April 2010.

J-STD-001E-RU

Требования к электрическим и электронным сборкам, изготавливаемым с помощью пайки (Russian Language)

Документ J-STD-001E признан по всему миру в качестве единого стандарта для обеспечения согласованности в отрасли по вопросам паяльных материалов и процессов пайки. Настоящая редакция, помимо более простых для понимания параметров материалов, методик и вопросов контроля для изготовления качественных паяных соединений и сборок, содержит данные по изготовлению бессвинцовых изделий. В документе содержатся требования к изделиям всех трех классов. Для лучшего восприятия информации имеются полноцветные иллюстрации. Данный стандарт в полной мере соответствует стандарту IPC-A-610E. 54 страницы. Выпущен в апреле 2010 г.

Member: $45

Nonmember: $90

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

Free Automated Testing – Instant Online  (For any video training program – by part #.)

This method offers immediate and free web access for these testing programs via the internet on IPC's server. Students can take the test at any time, no password required. A printable certificate of completion (Training Certification) is provided at the end of every exam as well as instant e-mail notification of student test data to an e-mail address of their choice. (E-mail notification requires a suitable address be input by the student during login.)

Premium Automated Testing – For your Learning Network  (For credit card, online purchase only.)

This option allows you to purchase a "Premium" version of the same Flash-based testing programs as listed above for use on your own company network or intranet. This option allows for user customization of the test (delete or edit existing questions or add your own company-specific ones), for adjustment of the passing score requirement and for adding your own on-screen company logo to brand the program with your corporate image. Be safe behind your own firewall and even automatically forward an e-mail with student name, test data and employee ID number to the appropriate HR or training administrator. (E-mail notification for the Premium version does not require student input of e-mail address during login.) Includes User's Guide and sample scripts for setting up e-mail notification.

Member:  $75 per test (For unlimited students/single facility)
Nonmember: $100 per test (For unlimited students/single facility)

Contact IPC Training for quantity discounts. Global license (multi-site) also available.

Sales/Technical Support
For sales help or technical questions on these media-based products, contact IPC Training (trainingsupport@ipc.org) or by phone +1 575-758-7937.

Training home page:  www.ipctraining.org

Ordering Info
Click through the product title links above for descriptions, pricing or to order online.  

EMSMTG-FUTUREEMS4-11

What Will the EMS Industry Look Like Five Years From Now?

This paper "What Will the EMS Industry Look Like Five Years From Now?" was presented at the IPC APEX EXPO EMS Executive Management Meeting, April 2011, by Jack Calderon, managing partner of Lincoln Partners. The author discusses why mergers and acquisitions should be considered by a company and the benefits of doing so. He uses several case studies to illustrate comparative performance of companies that have through mergers/acquisitions. He goes on to show areas of interest to be considered and the initial steps to merger or acquisition. This presentation includes the synchronized slides and audio of the original presentation. 23 minutes. Released 2011.

Member: $35

Nonmember: $50

EMSMTG-PRINTELEC4-11

The Impact of Printed Electronics on the EMS Industry

This information was presented by John Andresakis, vice president of strategic technology at Oak-Mitsui Technologies at the IPC APEX EXPO EMS Executive Management Meeting in April 2011. The author discusses some of the advantages of printed electronics as well as the challenges and opportunities of implementation. This presentation includes the synchronized slides and audio from the original presentation. 39 minutes. Released 2011.

Member: $35

Nonmember: $50

PCBMTG-ECON04-11

Global Economic Update: Short-Term Risks and Long-Term Uncertainties

This paper "Global Economic Update: Short-Term Risks and Long-Term Uncertainties" was presented at the IPC APEX EXPO PCB Executive Management Meeting in April 2011. The presenter was Duncan Meldrum, senior director, Center for Forecasting and Modeling at Global Insight. He discusses the worldwide economic impact and recovery from the recent recession with models of three phases: disinflation, crisis and finally recovery. His models point to a slow recovery in economic recovery. This presentation includes the synchronized slides and audio. 40 minutes. Released 2011.

Member: $35

IPC-1601-CN

印制板操作和贮存指南 (Chinese Language)

行业内唯一一份关于印制板操作、包装和贮存的指南。本文件中的指南是为了保护印制板，避免其受到污染、物理损伤、可焊性降低和吸潮。还给出了以下需考虑的因素：包装材料类型和方法、生产环境、产品操作和运输、建立推荐的湿气水平、建立去除湿气的烘烤曲线以及烘烤对印制板可靠性的影响。 全文共18页，2010年8月正式发布英文版；2011年5月发布中文版。

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

See free complete review (in PDF) of all posters before you buy!

IPC-A-610E Through Hole Solder Joint Evaluation Wall Posters  

Crucial through hole solder joint acceptance criteria from Rev. E of both the IPC-A-610 and IPC J-STD-001 in poster format.  Full color, 20 x 28-inch poster, laminated with eyelets for hanging, brings these important concepts to life: Wetting of Component Side Land, Lead & Barrel; Vertical Fill; Wetting of Solder Side Lead, Land & Barrel.

Product Code:  P-PTH2-E  (1 Poster – Class 2)

Product Code:  P-PTH3-E  (1 Poster – Class 3)

Member: $50 per poster (1 – 4 posters)  
Nonmember:  $75 per poster (1 – 4 posters)

IPC-A-610E Surface Mount Solder Joint Evaluation Wall Posters  

One poster each for Chip, J-Lead and Gull Wing components. Large 20 x 28-inch laminated posters with eyelets cover important IPC-A-610E and J-STD-001E surface mount criteria for soldering: Side / Toe Overhang; End / Side Joint Length; Min. / Max Fillet Heights; End Joint Width; End Overlap, etc.

Product Code:  P-SMT2-E  (Set of 3 Posters – Class 2)

Product Code:  P-SMT3-E  (Set of 3 Posters – Class 3)

Member: $100 per set (1 – 4 sets)
Nonmember: $150 per set (1 – 4 sets)

Sales/Technical Support
For sales help or technical questions on these media-based products, contact IPC Training (trainingsupport@ipc.org), or by phone +1 575-758-7937.

Training home page:  www.ipctraining.org

Ordering Info
Click through the product title or part number links above for descriptions, pricing, or to order online.

Contact IPC Customer Service by phone at +1 847-597-2862, or by email (orderipc@ipc.org) to order, or to verify your IPC membership status.

]]> https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=48aaa607-b586-db11-a4eb-005056875b22 All DVD and OVT training & certification products are for unlimited students, with no expiration.

Component Identification  

Now updated to include newer package styles from the latest revision of the printed Component Identification Training and Reference Guide/DRM-18H (PDF sample 2.5MB).  This video training program identifies and explains all of the most common Through Hole and Surface Mount components.  It also explains basic component functions, the assembly process, and component values and tolerances.

Includes free paper-based testing, and instant access to a free online e-testing program for verification of training, per ISO requirements – using IPC Training Certification.

Available on DVD for classroom presentation, or in our Online Video Training (OVT) format, for your computer-based learning network.

Product Code:  DVD-64C  (Includes free DRM-18H with purchase.)

Member: $495
Nonmember: $595

Product Code (PC/Network-Based Video formats):  OVT-64C (Site License)  (Includes free DVD-64C with purchase.)

Member: $740
Nonmember: $890

Are you a past purchaser of DVD-, or OVT-64C Version 1 – produced in 2002?  Contact IPC Training for special discount information on the 2010 Version 2 program.

Sales/Technical Support
For sales help or technical questions on these media-based products, contact IPC Training (trainingsupport@ipc.org), or by phone +1 575-758-7937.

Training home page:  www.ipctraining.org

Ordering Info
Click through the product title or part number links above for descriptions, pricing, Free Complete Reviews, or to order online.  

IPC-A-610E Illustrations  

Over 800 illustrations and photographs from the Acceptability of Electronic Assemblies.  Great for PowerPoint demonstrations or your own company standards.  Also available by chapter, or by the entire image set – at an 80% discount off individual list pricing.

Product Code:  A-610E-IL-1  (Includes discounts on quantity purchases.)

Member:  $30 per image
Nonmember:  $45 per image

IPC/WHMA-A-620A Illustrations  

Any of the 618 graphic or photographic images from the Requirements and Acceptance for Cable and Wire Harness Assemblies, can be purchased for your own in-house use.

Product Code:  A-620A-IL-1  (Includes discounts on quantity purchases.)

Member:  $30 per image
Nonmember:  $45 per image

Sales/Technical Support
For sales help or technical questions on these media-based products, contact IPC Training (trainingsupport@ipc.org), or by phone +1 575-758-7937.

Training home page:  www.ipctraining.org

Ordering Info
Click through the product title or part number links above for descriptions, pricing, or to order online.  

PDWEB10-BGAFAN

Effective BGA Fanouts

Choosing the appropriate fanout patterns for routing large BGAs can enable fewer layers, better signal integrity and lower costs. When using HDI, there are many options available which sometimes make the task daunting. This session is intended for PCB designers who want to find effective fanout methods for large, dense BGAs — and for those who are testing the HDI waters due to increased pin density. The principles for effective fanouts, independent of particular PCB design software, will be explored along with a demonstration of special software for this task in Expedition PCB.

This webinar was given on August 26, 2010 by Charles Pfeil, Mentor Graphics. It includes synchronized audio and slides. 57 minutes. This format is a single-user license and can only be used on a one-user computer. Site and global licenses are also available.

Member: $75

Nonmember $100

PDWEB10-ESDPROTECT

ESD Protection: The Next Generation

Integrated circuits (ICs) are becoming more sensitive to electrostatic discharge (ESD). Semiconductor manufacturers are finding it increasingly difficult to build ESD protection into the next generation of devices. ESD protection issues pose a serious potential problem for the users of semiconductor devices. User ESD programs must be reviewed and updated to ensure the devices are not damaged during handling.

What you will learn

• Trends in ESD sensitivity levels

• Problems handling the next generation of devices

• Possible solutions that will allow your company to handle devices today, and in the future

This downloadable webinar includes synchronized audio and slides. It was presented on June 22, 2010, by Ron Gibson of SH&A. 1 hour 10 minutes. This format is a single-user license and can only be used on a one-user computer. Site and global licenses are also available.

Member: $75

Nonmember: $100

PDWEB10-MOISTURE

Controlling Moisture Content in Boards: Best Practices

Reliability of printed circuit board (PCB) materials is strongly influenced by the presence of moisture. Moisture can be initially present in the epoxy glass prepreg, absorbed during the wet processes in PCB manufacturing or diffuse into the PCB during storage. Moisture can reside in the resin, resin/glass interfaces and micro-cracks or voids due to defects. Higher reflow temperatures associated with lead-free processing increase the vapor pressure, which can lead to higher amounts of moisture uptake as compared to eutectic tin lead reflow processes.

This webinar was given on July 28, 2010 by Bhanu Sood, CALCE. 1 hour 15 minutes. This downloadable webinar includes synchronized audio and slides. This format is a single-user license and can only be used on a one-user computer. Site and global licenses are also available.

What you will learn

• Governing models and dependent variables of the moisture diffusion process

• Effects of moisture on various susceptible components of a PCB (epoxy matrix, interfaces, vias, traces, solder masks, overcoats, etc.) and associated failure modes and mechanisms

• PCB material handling and storage guidelines

Member: $75

Nonmember: $100

PDWEB10-PCBMOIST

Effects of Moisture Content on Permittivity and Loss Tangent of Printed Circuit Board Materials

Printed circuit board laminate datasheets provide permittivity (dielectric constant, Dk) and loss tangent (dissipation factor, Df) values that are used for specification and board design. But past studies have shown that these properties vary with changes in the moisture content of the PCB laminate material. Major problems can arise when material substitutions are made using laminate datasheets as a guide, especially when the data is derived using dissimilar test conditions or methods. For example, initial impedance calculations on the basis of datasheet values may be acceptable, but actual board performance may be significantly different and may result in poorly functioning and unreliable boards.

This webinar will discuss the results of an experimental study to establish whether the preconditioning steps outlined in the IPC-TM-650 2.5.5.9 (Permittivity and Loss Tangent, Parallel Plate, 1MHz to 1.5 GHz) test standard account for varying moisture contents in PCB laminate test coupons. The moisture content in a PCB material may vary because of material constituents, board design or handling, processing, shipping and end use conditions. Results also shed light on the dependence of dielectric values on moisture content and type of flame retardant used. Commercially available PCB materials sourced from two manufacturers were tested in this study. Materials were classified on the basis of flame retardant type (halogenated or halogen-free) and glass transition temperature. Extent of variation in the dielectric properties is discussed as a function of material constituents and moisture content. Types of materials that are most affected—and reasons behind the variation—are also reviewed. 59 minutes. Released 2010.

This downloadable webinar includes synchronized audio and slides. It was presented by Bhanu Sood, CALCE. This format is a single-user license and can only be used on a one-user computer. Site and global licenses are also available.

Member: $75

Nonmember: $100

PDWEB10-PROFILE

Non-Destructive Profiling Methods

In this downloadable webinar, Brian O'Leary of KIC discusses a recent study by KIC and the Rochester Institute of Technology on reliable non-destructive methods for profiling sensitive critical components such as BGAs. 55 minutes. Released 2010.

What You Will Learn

• How to create off-sets for components that cannot be compromised for profiling purposes

• How to create an in-spec profile for a brand-new PCB

• How to create profiles without attaching thermocouples

• How to balance complex PCBs (i.e. PCBs with forward/backward compatibility issues/hybrid PCBs)

This webinar includes synchronized audio and slides. This format is a single-user license and can only be used on a one-user computer. Site and global licenses are also available.

Member: $75

Nonmember: $100

PDWEB10-SIGNALINT

What Every Layout Designer Needs to Know About Signal Integrity

This webinar was given on July 29, 2010 by Eric Bogatin, Ph.D, Bogatin Enterprises.

Choices made in board layout strongly affect signal integrity. Discover the solutions to the top five problems designers encounter. This webinar will cover practical design guidelines you can use. 1 hour 5 minutes. Released 2010.

What You Will Learn

• How to minimize ground bounce

• How to optimize differential pairs

• How to build a robust power distribution network

• Tips for achieving EMC certification.

This downloadable webinar includes synchronized audio and slides. This format is a single-user license and can only be used on a one-user computer. Site and global licenses are also available.

Member: $75

Nonmember: $100

PDWEB10-5704

How Clean is Clean: What You Need to Know about the new IPC-5704, Cleanliness Requirements for Unpopulated Printed Boards

IPC-5704, Cleanliness Requirements for Unpopulated Printed Boards, is the first major IPC specification to detail cleanliness requirements for printed boards based on ion chromatography. This presentation discusses the IPC-5704 document and attendant IPC Test Method 2.3.28.2. Fabricators can expect to see these requirements as they use IPC bare board standards. Other associated IPC specifications in the IPC-57XX series are outlined. In addition, a brief history of bare board ionic cleanliness testing is discussed.

1 hour 4 minutes. This downloadable webinar includes synchronized audio and slides. It was presented by noted cleaning expert and IPC Cleaning and Coating Committee Chairman Doug Pauls of Rockwell Collins.

This format is a single-user license and can only be used on a one-user computer. Site and global licenses are also available.

Member: $75

IPC APEX EXPO Proceedings CD

Now available in single-user or global license formats. Get access to 96 papers from 35 technical sessions, covering all aspects of the printed circuit board and electronics manufacturing industries. Sessions included materials, cleaning, surface finishes, lead-free issues, plating, solder paste, advanced packaging and more. The proceedings also include 27 industry poster presentations All papers are electronically searchable by title, author and keyword. Released April 2011.

Single-user CD or global license available.

Single User:

Members $125, Nonmembers $150

Global License:

Members $375, Nonmembers $450

IPC APEX EXPO Cyber Conference

Experience the technical conference in an entirely new way! IPC brings you full distance learning for seven selected sessions. Watch the speaker and access the synchronized audio on the slides. It's the second best thing to being there. Registrants of the full cyber conference will receive the full technical conference proceedings. The archive includes access to the conference papers for each session purchased.

Buy All Seven Sessions!

Buy all 7 sessions for $350 for members, $525 for nonmembers and receive online access to the conference proceedings, a $150 value.

Or, buy each session individually for $50 for members, $75 for nonmembers.

•S02: Encapsulation

•S08: Soldering Processes

•S13: Lead Free: Surface Effects

•S16: PCB Reliability Test Methods

•S24: Cleaning

•S28: Thermal Cycling Lead-Free Reliability

•S33: Embedded

IPC APEX EXPO full conference registrants are entitled to free access to the cyber conference and must register using a discount code. If you did not receive your discount code, please e-mail KimSterling@Ipc.org.

IPC is now offering these training materials created by Bob Willis, Electronic Presentation Services, in our online store. Please click through the links for more details or to order any of these items.

POP-CD

Package on Package (PoP) Assembly, Inspection & Rework interactive CD-ROM

Package on Package (PoP) applications are growing in popularity for mobile and handheld professional electronics applications and, with it, placing further demands on assembly engineers. In simple terms, PoP represents the stacking of components one on top of another either during the original component manufacture or during printed board assembly. As real estate is at a premium for logic and memory, PCB designers say the only way to go is up and up. PoP packaging systems may include direct soldering, wire bonding or conductive adhesives for device to device interconnection. PoP is new to many contract and OEM assembly staff but with the demands of paste dipping, reflow warpage, increased placement accuracy and Z height control, process introduction can be demanding. The difficulty in multi level ball inspection can be a challenge for x-ray equipment procedures as level one balls can mask level two and three interconnections. Manual inspection can be used but with these applications space is often not available for side viewing.

Member: $175

Nonmember: $225

POP-PHOTO-CD

Package on Package (PoP) Stack Package Assembly Photo CD

This photo CD provides process and quality engineers and marketing staff with a unique source of photographs which may be used in company inspection documents, technical presentations and web sites. The photographs can also be used in marketing and advertising material or in technical articles. They may be simply pasted into any Word or PowerPoint document for in-house company use. Photographs on the CD are provided in .jpg or .tiff file format.

The PoP Photo CD-ROM contains more than 380 images provided as either conventional colour images, x-rays or microsections covering printed boards, surface mount or conventional joints as well as solder paste, components and solder joints. A selection of satisfactory and rejects images are also provided.

Member: $175

Nonmember: $225

POP-WALL-PP

Package on Package (PoP) Stack Package Assembly Photo CD

A set of 25 color wall charts covering inspection and quality control in Package on Package (PoP) assembly. The photographic poster guide is ideal reference source and is provided as a .pdf file. The individual sheets can be printed in A4 (210 × 297 mm, 8.3 x 11.7 in.) or A3 (297 x 420 mm, 11.7 x 16.5 in.) size for display for operator reference or as a training aid.

Member: $85

Nonmember: $105

]]> https://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=1b05ee37-ee5a-e011-81fb-00155d05284b ASSEMBLYISSUE-03-11

HDI Assembly Related Issues

This presentation "HDI Assembly Related Issues" was given by Ian Williams, manager of customer interconnect core competency team at Intel Corp. at the IPC Conference on HDI Technology High Performance: Strategies for the 21st Century at Baltimore, Md., in March 2011. The author describes an Intel investigation into assembly challenges, capabilities, quality, reliability and testability of HDI designed boards. The component pad pitch and surface preparation impact on board quality and reliability are described as well as methods to strengthen solder joints. The challenges of rework are also discussed. The presentation includes synchronized audio and video from the live presentation. 33 minutes. Released 2011.

Member: $35.00

Nonmember: $50.00

HDIEAGLETEST-03-11

HDI Training & Implementation at Eagle Test Systems, a Teradyne Co.

This multimedia presentation was presented by Ron Evans, ETS operations & supply chain management, at the IPC Conference on HDI Technology High Performance: Strategies for the 21st Century, in March 2011. The author describes how a trial module was selected for conversion to HDI to train his employees in implementation of these techniques. He describes the goals of the conversion, the results and benefits achieved and finally a module is built and tested. Even though the end item is slightly more expensive, the follow-on cost savings are described. This presentation includes the synchronized slides and audio. 21 minutes. Released 2011.

Member: $35.00

Nonmember: $50.00

These presentations are available for download purchase only. Please follow the links above for more information and to order.

A-610E-PL

Dopuszczalność Zespołów Elektronicznych (Polish Language)

IEC jest w trakcie procesu zatwierdzania IPC-A-610 jako globalnie preferowanego miedzynarodowego standardu dopuszczania dla pakietów elektronicznych.

IPC-A-610 jest najpowszechniej na swiecie uzywanym standardem dla pakietów elektronicznych. Szczególnie przydatne dla dzialów zapewnienia jakosci i montazu, IPC-A-610E ilustruje zaakceptowane w przemysle kryteria jakosci dla pakietów elektronicznych poprzez kolorowe fotografie i ilustracje. Tematy zawieraja wymagania dla dodatków elastycznych, plytek na plytkach, komponentu na komponencie, lutowania bezolowiowego, orientacji komponentów i kryteriów lutowania dla montazu przewlekanego, SMT (nowe style wyprowadzen) i okablowania dyskretnego, montazu mechanicznego, czyszczenia, znakowania, pokryc i laminatów.

IPC-A-610 jest nieocenione dla wszystkich inspektorów, operatorów i trenerów. Rewizja E posiada 809 fotografii i ilustracji do kryteriów dopuszczenia – 165 z nich sa nowe lub zaktualizowane. Niniejsza rewizja zostala dokladnie sprawdzona w celu zapewnienia przejrzystosci i dokladnosci. Dokument synchronizuje wymagania wyrazone w innych uznanych dokumentach i jest uzywany wraz ze standardem materialu i procesu IPC J-STD-001.

400 stron. Wydanie – Kwiecien 2010.

Member: $55.00

Nonmember: $110.00

A-610E-DK

Godkendelseskrav for elektronikprodukter (Danish Language)

IEC er i gang med at godkende IPC-A-610 som den globale foretrukne godkendelsesstandard for elektroniske produkter.

IPC-A-610 er den mest udbredte godkendelsesstandard for elektronikprodukter. Et must for alle kvalitetssikrings- og produktionsafdelinger. IPC-A-610 illustrerer industrigodkendte workmanship kriterier for elektronikprodukter ved hjælp af farvefotografier og illustrationer. Emner omfatter montage af flex, indstiksprint, blyfri, komponentorientering og loddekriterier for hulmontage, SMT (nye termineringstyper) og montage af "discrete wiring", mekanisk montage, renhed, mærkning, coating og krav til laminater.

IPC-A-610 er uvurderlig for alle inspektører, operatører og undervisere. Revision E har 809 fotos og illustrationer af godkendelseskriterier, hvoraf 165 af dem er nye eller opdaterede. Denne revision er blevet nøje gennemgået for klarhed og præcision. Standarden er blevet synkroniseret i forhold til krav i andre industriudviklede standarder og anvendes sammen med materiale og processtandarden IPC J-STD-001. 400 sider. Udgivet april 2010. Oversat februar 2011.

Member: $55.00

Nonmember: $110.00

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

Design and Assembly Process Implementation for Bottom Termination Components

This standard describes the design and assembly challenges for implementing Bottom Termination surface mount Components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body. The BTCs in this document include all types and forms of bottom-only termination components intended for surface mounting. This includes such industry descriptive nomenclature as QFN, DFN, SON, LGA, MLP and MLF. The focus of the information is on critical design, assembly, inspection, repair, and reliability issues associated with BTCs.

The target audiences for this document are managers, design and process engineers, and operators and technicians who deal with the electronic design, assembly, inspection and repair processes. The intent is to provide useful and practical information to those companies who are using or considering tin/lead, lead free, adhesives or other forms of interconnection processes for assembly of BTC type components. Although not a complete recipe, the document identifies many of the characteristics that influence the successful implementation of robust and reliable assembly processes and provides guidance information to component suppliers regarding the issues being faced in the assembly process. 68 pages. Released March 2011.

Member: $52.00

Nonmember: $103.00

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

IPC-A-610, Acceptanskrav för kretskort (Swedish Language)

BESKRIVNING Beskrivning på engelska

IEC är på väg att godkänna IPC-A-610 som den globala rekommenderade internationella standarden för elektroniktillverkning.

IPC-A-610 är den mest använda standarden i världen för elektroniktillverkning. IPC-A-610E är ett måste för alla kvalitetssäkrings- och produktionsavdelningar och illustrerar industrigodkända acceptanskriterier genom fyrfärgsbilder och illustrationer. Områden inkluderar anslutning av flex, kort på kort, PoP, blyfritt, komponentorientering och lödningskriterier för hålmonterat, ytmonterat (nya typer av anslutningar) och lödfri virning, mekanisk montering, rengöring, märkning, lackning, och krav för laminat.

IPC-A-610 är ovärderlig för alla avsynare, operatörer och instruktörer. Revision E har 809 foton och illustrationer som visar acceptanskriterier varav 165 är nya eller uppdaterade. Denna revision har granskats kritiskt för att bli ännu tydligare och noggrannare. Dokumentet överensstämmer med kraven som finns beskrivna i andra industrigodkända dokument och används tillsammans med material- och processtandarden J-STD-001. 400 sidor. Utgiven april 2010. Översatt februari 2011.

IPC Conference on Printed Electronics:

ADVELECPK-IRVINE1-11

Manufacturing opportunities and challenges for printing of advanced electronic packaging

Mark Poliks, Director of Research and Development, Endicott Interconnect Technologies, discusses the goals of weight reduction, reliability and cost reduction for printed electronics at the IPC Conference on Printed Electronics in January 2011. The author discusses materials, processing and some markets this technology may impact as well as the challenges it presents. He also covers the equipment used for processing at his facility. This presentation includes the synchronized slides and audio from the live presentation. 34 minutes. Released 2011.

Member: $35.00

Nonmember: $50.00

FUTUREELE-IRVINE1-11

Future of Printed Electronics

This paper by Robert Tarzwell, president of DMR Ltd., was presented at the IPC Conference on Printed Electronics in January 2011. The author describes the advantages of "trench" technology in printing electronics with newly developed thermal dielectric materials. He describes several applications of these techniques and creating 2 mil silver ink lines in "trench" dielectric. This presentation includes the synchronized slides and audio presentation materials.

37 minutes. Released 2011.

Member: $35.00

Nonmember: $50.00

MEANPCB-IRVINE-01-11

Printed Electronics: What Does It Mean for the Printed Circuit Board Industry?

This paper "What Does It Mean for the Printed Circuit Board Industry?" was presented by Matt Timm, president of Soligie as keynote speaker at the IPC Conference on Printed Electronics in January 2011. The author discusses the history of printed electronics as an enabler, making possible interactive packaging, cosmetic patches, biosensors and large displays. Printed electronics are effective here due to light weight and opportunity for lower costs. He then discusses the history of Soligie, its vision and partnerships and the promise of further opportunities. This presentation includes the synchronized slides and recorded audio from the conference. 37 minutes. Released 2011

Member: $35.00

Nonmember: $50.00

IPC Executive Summit

EXESUM10-10-ECONOMIC

Effects of 2010 global economics on competition in the PCB and electronics manufacturing services markets.

These three papers, "2010 and Beyond: Competing for Dollars" by S. DuBravac of Consumer Electronics Association, "Global Economic Outlook" by E. Henderson and "The Worldwide Electronics Manufacturing Services Market" by R. Sherman of New Venture Research Corporation were presented at the IPC Executive Summit in October 2010. They examine how the recent recession has affected employment, wages and income growth in various markets. They discuss the GDP of developed and developing nations, world equipment and PCB production, labor rates and the strengths and weaknesses of outsourcing production to lower cost regions. This package includes the synchronized slides and recorded audio from the live presentations. 1 hour 55 minutes. Released 2011.

Member: $75.00

Nonmember: $100.00

EXESUM10-10-TECHPACK

Technology Package

This is a collection of three papers, "Oportunities in the Value Chain for the Next Wave of HBLEDs" by Leonard Livschitz, president and CEO, Luxera, Inc., "Core Enabling Process Technologies Driving Electronics Innovation" by Phil Plonski, managing partner, Prismark Partners and "New Advances in Miniaturization: It's Not Just for Consumer Electronics" by Jim Fuller, vice President of PWB Engineering, Endicott Interconnect Technologies. The first paper discusses opportunities for PCB development in LED drivers. The second discusses areas for innovation in growth segments of the electronics industry. These include light, radios, antennas, packaging, MEMS, and power management. The last paper shows the history of miniaturization of consumer elecronics and how it benefits the United States to be in the forefront of development. This package includes the synchronized slides and recorded audio from the live presentations at the IPC Executive Summit meeting in October 2010. 1 hour 30 minutes. Released 2011.

Member: $75.00

Nonmember: $100.00

IPC Conference for the North American EMS Industry, What it Takes to Supply the Military

MILCERT-0915

Trends in Military Certifications: What You Need to Know About the Obvious and the Obscure

This presentation "Trends in Military Certifications: What You Need to Know About the Obvious and the Obscure," was presented at the IPC Conference for the North American EMS Industry, What it Takes to Supply the Military, Management Session, in September 2010 by by Steve DeWaters, president of Penumbra Strategies, Inc. It describes the rise of Commercial Off the Shelf (COTS) items and why Military Specs will continue to be with us. It then goes on to discuss a better format for presentations to the military customer. 43 minutes. Released 2011.

Member: $75.00

Nonmember: $100.00

J-STD-001E-DE

Anforderungen an gelötete elektrische und elektronische Baugruppen

J-STD-001E ist der einzige weltweit anerkannte Industrie-Standard für Lötmaterialien und -prozesse. Die Revision E unterstützt die bleifreie Fertigung und erleichtert das Verständnis der Kriterien für Material, Methoden und Prüfung zur Produktion von Verbindungen und Baugruppen hoher Qualität. Die Anforderungen für die drei Konstruktionsklassen sind integriert. Farbige Abbildungen verbessern das Verständnis. Der Standard umfasst 54 Seiten ergänzt die IPC-A-610E. Veröffentlichung im April 2010, Deutsche Übersetzung im Oktober 2010.

Member:  $45.00

Nonmember:  $90.00

J-STD-001E-SP

Requisitos de Ensambles Eléctricos y Electrónicos Soldados

El J-STD-001E es reconocido a nivel mundial como el único estándar de la industria por consenso que comprende los materiales y procesos de soldadura. Esta revisión incluye el respaldo para la manufactura libre de plomo, en adición con criterios más fáciles de entender para materiales, métodos y verificación para la calidad de producción de ensambles e interconexiones soldadas. Se incluyen los requisitos paras las tres clases de construcción. Se provee un color completo de las ilustraciones para claridad. Este estándar completa plenamente el IPC-A-610E. 54 páginas. Publicado en Abril 2010. Traducido en Octubre del 2010.

Member:  $45.00

Nonmember:  $90.00

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

IPC-6012C-CN

刚性印制板的鉴定及性能规范

本规范涵盖了刚性印制板的鉴定和性能，包括带或不带镀覆孔的单面、双面板以及带或不带盲孔/埋孔和金属芯板的多层板。该规范涉及最终涂覆和表面电镀涂覆要求、导体、通孔/导通孔、验收测试的频次和质量一致性、电气与机械及环境要求。C版本新增了很多新要求，包括新表面涂覆层、孔镀层厚度、白斑、露织物、塞孔的铜盖覆电镀、层压板裂缝及空洞、凹蚀、盲孔和埋孔的填塞、验收测试及其频次的要求，以及对热应力测试的要求。本规范的有关要求已与IPC-A-600H统一，可与IPC-6011配套使用。取代IPC-6012B附修订本1。全文共52页，于2010年4月正式发布。

Member:  $46.00

Nonmember:  $93.00

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

Qualification and Performance Specifiation of Permanent Solder Mask and Flexible Cover Materials

Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reflect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision E incorporates requirements for flexible cover materials used as a flexible dielectric protective layer over etched conductors and other conductive features.

Member:  $31.00

Nonmember:  $62.00

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

IPC-A-610E-SP

Aceptabilidad de Ensambles Electrónicos

El IEC está en proceso de aprobar IPC-A-610 como el estándar internacional de aceptación de ensambles de electrónicos preferido globalmente. IPC-A-610 es el estándar de ensambles electrónicos más ampliamente utilizado en el mundo. Imprescindible para todos los departamentos calidad y ensamble, IPC-A-610 ilustra el criterio de técnicas aceptables para el ensamble de electrónicos por medio de fotografías e ilustraciones a color. Temas incluyen fijaciones flexibles, tablero en tablero, parte sobre parte, soldadura libre de plomo, orientación de componente y criterio de soldadura para through-hole y SMT (nuevos estilos de terminación) y ensambles de alambrado individual, ensambles mecánicos, limpieza, marcado, recubrimiento y requerimientos de laminado. IPC-A-610 es invaluable para todos los inspectores, operadores e instructores. Revisión E tiene 809 fotos e ilustraciones de criterio de aceptabilidad-165 de ellas nuevas o actualizadas. Esta revisión ha sido críticamente revisada para claridad y certeza. El documento sincroniza los requerimientos expresados en otros documentos del consenso de la industria y es usado con el material y proceso del estándar IPC-J-STD-001. 400 paginas. Liberado Abril 2010.

Member:  $55.00

Nonmember:  $110.00

A-600H-CN

印制板的可接受性 (Chinese language)

配有大量插图的印制电路板可接受性权威指南标准！本文件配有大量的彩色图片和示意图，提供了可从裸板内部或外部观察到的目标条件、可接受条件及不符合条件。确保操作员、检验人员及工程师掌握行业最新的信息。H版有90多幅图片为新增或经修订，新增的内容涉及铜包覆电镀、填塞孔的铜盖覆电镀及孔壁分离，更新和扩充了印制板的白斑覆盖、分层和晕圈、层压板空洞/裂缝、凹蚀、盲导通孔和埋导通孔的填塞及挠性电路等内容。本文件中的一些要求已与IPC-6012C及IPC-6013B相关的可接受性要求保持了同步。全文共157页，于2010年4月发布。

Member: $50.00

Nonmember: $100.00

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

A-610E Illustrations - Individual Images

Choose from the 813 illustrations and photographs from chapters 3–12 of the IPC-A-610E, Acceptability of Electronic Assemblies. All images are available for individual purchase in the TIF picture format.

Useful for all multimedia training purposes and as visual aids within company standards. Each high resolution, full color image is for internal use only (not for resale). See our Permissible Use page for more licensing details.

Select by IPC-A-610 figure number, shown underneath each image in the IPC-A610E. Quantity discounts available for multiple image purchases. Contact IPC Customer Service (or by phone: +1 847-597-2862) to specify the images of your choice.

Image(s) delivered on CD-R data disc. Must have computer with CD-ROM drive.

IPC-A-610E images also available in chapter sets, as well as the complete library of A-610E images. (Click through the link above to see all "related products" for sets and library.)

Member: $30.00

Nonmember: $45.00

Not available as free member benefit; these items must be purchased.

Sectional Design Standard for Rigid Organic Printed Boards

Used in conjunction with IPC-2221, IPC-2222 establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single-sided, double-sided or multi-layered boards. Key concepts in this document are: rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections. Revision A provides new design guidance and requirements for dielectric spacing, lead-free laminate materials, scoring and routing parameters, printed board thickness tolerance, nonfunctional lands, hole aspect ratios and clearance areas in planes.

Member:  $36.00

Nonmember:  $72.00

Follow the link above for additional formats and prices.

For this document and for IPC-9631 announced earlier today:

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing  MemberTechRequests@ipc.org within 90 days.

The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

IPC-9631 addresses concerns and considerations related to IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation. This document describes how the test method is intended for use and the rationale behind some of the protocols and requirements. This document was developed with the understanding that the test method will require special equipment and the proper set-up and calibration of that equipment.

Member:  $26.00

Nonmember:  $52.00

Test Methods for Characterization of Printed Board Assembly Pad Cratering

Mechanical bend and shock tests are routinely performed on SMT assemblies to ensure that they can sustain anticipated production, handling and end use conditions. The strains and strain rates applied to SMT assemblies during bend and shock testing can lead to a variety of failure modes in the vicinity of the solder joints. This document provides test methods to evaluate the susceptibility of printed board assembly (PBA) materials and designs to cohesive dielectric failure underneath surface mount technology (SMT) attach pads. The test methods, which include pin-pull, ball-pull, and ball shear, can be used to rank order and compare different printed board materials and design parameters.

Hard copy

Member:  $36.00

Nonmember:  $72.00

Additional electronic formats are available through the link above.

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

IPC Executive Compensation Study for the EMS Industry 2009-2010

This survey-based study provides comprehensive data on North American EMS industry executives' base salaries, bonuses and other forms of compensation and benefits. It covers 12 key executive positions. The results are reported by industry segment, region and company size. The survey sample includes 22 EMS companies from North America. 197 pages. Released October 2010.

Member: $800.00       

Nonmember: $1,600.00

This item is only available through purchase. Please click through the product code above to view it in the IPC online store.

7711/21B-CN

电子组件的返工、修改和维修 (Chinese)

本手册包括了维修和返工电子组件及印制板所需的一切。《IPC-7711/7721B电子组件的返工、修改和维修》收录了一整套经修订的程序，以确保其即适用于无铅电子组件，又适用于传统的有铅电子组件。B版包括了之前发布的修订变化及几项新的BGA维修及返工程序（包括重新植球）及挠性印制电路的维修。第一部分--通用程序也进行了更新，更易使用，并对所有的程序提供了重要的基本信息和指南。第一部分包括了返工、维修和修改的通用程序。第二部分是IPC-7711B，其中的程序包括拆除和替换表面贴装元器件及通孔元器件时所采用的工具、材料及方法。第三部分是IPC-7721B，其中包括修改组件和维修层压板、导体时所采用的程序。本手册采用活页夹装订，易于更新。用户可将公司内部的特殊程序插入其中，或拆下某一项具体工作所需的单页放在工作台面上，保持工作区域整洁。B版本所做的一些修订可从IPC网站（www.ipc.org/downloads）免费下载。多数程序都配有彩色插图，以帮助用户更好地理解本手册。B版本取代了IPC-7711、IPC-7721和IPC-R-700。全文共300多页，于2007年11月发布。

Member: $75.00

Nonmember: $150.00

A-610E-CN

电子组件的可接受性(Chinese)

IEC正在签署将IPC-A-610作为全球首选的电子组装国际验收标准的文件。 IPC-A-610是全球应用最广泛的电子组装标准。作为所有质量保证和组装部门的必备文件，它通过彩色图片和示意图图示了业界公认的工艺要求。主要内容包括挠性电路的连接、母子板、部件叠装、无铅、通孔元器件朝向和焊接要求、SMT（新端子类型）和分立布线组件、机械组装、清洗、标记、涂覆层和层压板要求。 对于所有检验人员、操作人员和培训员，IPC-A-610是一个无价之宝。E版本共有809张关于可接受性要求的图片和示意图，其中165张为新增或修订的。最新版本的清晰性和准确度经过了认真地审查。本文件中的一些要求已与业界一致同意的其他文件的相关要求同步，可与材料和工艺标准IPC J-STD-001配套使用。全文共400页，于2010年4月正式发布。 下载IPC-A-610E版本相对于D版本的主要修订变化文件，本文件为PDF文件（只有英文版）。

Member: $55.00

Nonmember: $110.00

J-STD-001E-CN

焊接的电气和电子组件要求 (Chinese)

J-STD-001E被业界公认为是全球唯一一份涵盖焊接材料和焊接工艺的标准。E版本更易理解用于生产高质量焊接互连和组件的材料、方法及验证要求，还包含了与无铅制造相关的内容。此外，还包括了对所有三个级别产品的要求。为了使用户更准确地了解本标准的要求，全书配有彩色插图。本标准完全可做为IPC-A-610E的补充文件。全文共54页，于2010年4月发布。

Member: $45.00

Nonmember: $90.00

4101C-DE

Spezifikation für Basismaterialien für starre Leiterplatten und Multilayerleiterplatten (German language)

Diese Spezifikation beinhaltet die Anforderungen an Basismaterialien, hier als Laminate oder Prepregs bezeichnet, die hauptsächlich in starren Leiterplatten oder Multilayerleiterplatten für elektrische und elektronische Schaltungen verwendet werden. Das Dokument enthält 66 einzelne Spezifikationsblätter, die nach Suchbegriffen sortiert sind. Diese Suchbegriffe erlauben es dem Anwender, Materialien mit vergleichbaren Eigenschaften zu finden und Laminate und/oder Prepregs, mit unterschiedlichem Verhalten, gezielt auszuwählen. Die 11 neuen Spezifikationsblätter dieser Revision spiegeln das erweiterte Angebot von Laminaten und Prepregs und enthalten verbesserte oder zusätzliche Eigenschaften wie z.B.: niedriger Halogengehalt, bleifreie Anwendungen, Leistungsfähigkeit für hohe Temperaturen und hohe Signalgeschwindigkeiten/hohe Frequenzen. Das Dokument umfasst 137 Seiten und wurde im August 2009 veröffentlicht.

Member: $50.00

Nonmember: $100.00

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

PCB Multi-Issue Microsection Wall Poster

Dubbed the "nightmare microsection," this full-color, 24x36-inch (60 x 90 cm) wall poster identifies 42 phenomena that can be seen in cross-sections of plated-through holes. Outstanding visual for supporting discussions of common (and not so common) phenomena. All defects are labeled and match the language used in IPC standards IPC-A-600, IPC-6012 and IPC-T-50. Use this poster as a tool to assist your staff identify more issues and effectively troubleshoot your manufacturing operation. Originally developed by the PCB industry in Europe, updated by IPC.

Member: $50.00

Nonmember: $75.00

Click through the link above to order from the IPC online store and for a preview of the poster content.

J-STD-033B-IT

Maneggiamento, Imballaggio, Spedizionee Utilizzo di Componenti a Montaggio Superficiale Sensibili a Umidità/ Rifusione (Italian Language)

Fornisce ai produttori e agli utilizzatori di componentistica a montaggio superficiale, metodi standardizzati per il maneggiamento, l'imballaggio, la spedizione e l'impiego di componentistica SMD sensibile all'umidità/rifusione.

Questi metodi aiutano ad evitare danni da assorbimento di umidità e da esposizione alla temperature di saldatura a rifusione che potrebbero provocarne calo di rendimento e degrado di affidabilità. Attraverso l'impiego di queste procedure, potrebbero essere ottenuti sia sicurezza e sia zero danneggiamenti in fase di rifusione e, tramite il processo di confezionamento asciutto mediante sacchetti sigillati a secco, è possibile garantire una durata minima di conservazione di 12 mesi a partire dalla data di sigillo. Sviluppato da IPC e JEDEC. 17 pagine. Data di pubblicazione ottobre 2005

Member: $26.00

Nonmember: $52.00

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

Printed Board Handling and Storage Guidelines

The industry's sole guideline on the handling, packaging and storage of printed boards. The guidelines in this document are intended to protect printed boards from contamination, physical damage, solderability degradation and moisture uptake. Consideration is given to packaging material types and methods, production environment, handling and transport of product, establishing recommended moisture levels, establishing baking profiles for moisture removal and the impact of baking on printed board solderability. 18 pages. Released August 2010.

Included in the IPC-C-105 & the IPC-C-1000 Collections.

IPC Member: $36.00

Nonmember: $72.00

Follow the link above for additional formats and prices.

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

This is IPC-A-610E in German Language only.

A-610E-DE

Abnahmekriterien für elektronische Baugruppen

Die IPC-A-610 befindet sich im Anerkennungsverfahren durch die IEC (International Electrotechnical Commision) als weltweit bevorzugter und international anerkannter Standard für elektronische Baugruppen.

IPC-A-610 ist der meist benutzte Standard für elektronische Baugruppen weltweit. IPC-A-610E zeigt die von der Industrie akzeptierten Kriterien für die Verarbeitungsgüte von elektronischen Baugruppen mittels mehrfarbiger Fotos und Darstellungen und ist ein "Muss" in jeder Fertigung und Qualitätssicherung. Insbesondere enthält sie Anforderungen und Abnahmekriterien für flexible Komponenten, Board-in-Board-Technologie, Package-on-Package-Technologie, bleifreie Fertigung, Ausrichtung von Bauteilen und Kriterien für das Löten in der Durchsteckmontage und SMD-Technik mit neuen, aktuellen Anschlussgeometrien und -technologien. Außerdem diskrete Anschlüsse und Drahtverbindungen, Montage von mechanischen Komponenten, Reinigung, Kennzeichnung, Beschichtung mit Lötstoppmaske und Conformal Coating sowie Anforderungen an Laminate und Leiterplatten.

IPC-A-610 leistet allen Prüfern, Bearbeitern und Trainern unschätzbare Dienste. Die Revision E beinhaltet 809 Fotos und Darstellungen von Abnahmekriterien, Davon wurden 165 neu aufgenommen oder aktualisiert. Bei der Revision wurde besonders auf Übersichtlichkeit und Genauigkeit geachtet. Das Dokument enthält 400 Seiten, ist auf die Ausdrucksweise in entsprechenden Industriestandards abgestimmt und wird gemeinsam mit Standard IPC-J-STD-001 angewendet. Veröffentlichung im April 2010.

IPC Member: $55.00

Nonmember: $110.00

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file. The free request period for IPC-A-610E in English ended July 1.

This is the Russian Language version of J-STD-033B. English version was released in October 2005, amended in 2007.

J-STD-033B-RU

Обращение, упаковка, транспортировка и использование компонентов для поверхностного монтажа, чувствительных к влаге при пайке методом оплавления (на русском языке)

Предлагает производителям и потребителям поверхностно монтируемых компонентов стандартизированные способы обращения, упаковки, транспортировки и использования компонентов для поверхностного монтажа, чувствительных к влаге. Эти способы помогают избежать повреждений, вызываемых накопленной влагой и воздействием температур пайки оплавлением, способных уменьшить выход годных и снизить надежность изделий. Применение этих процедур позволяет выполнять безопасную и бездефектную пайку оплавлением, что достигается применением сухой упаковки, обеспечивающей минимальный срок хранения 12 месяцев с момента герметизации в сухом пакете. Разработан IPC и JEDEC. 17 страниц. Выпущен в октябре 2005 года.

Member:  $26.00

Nonmember:  $52.00

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

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IPC-7351B

Generic Requirements for Surface Mount Design and Land Pattern Standard

IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data. The calculator includes the document’s mathematical algorithms so users can build a land pattern for a corresponding surface mount part quickly and accurately. The tool also allows for modification of dimensional attributes of IPC approved land patterns.

This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SSOPs, TSSOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.

Revision B now includes land pattern design guidance and rules for component families such as resistor array packages, aluminum electrolytic capacitors, column and land grid arrays, flat lead devices (SOFL and SOTFL) and dual flat no-lead (DFN) devices. The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards.

Purchasers also receive a 90-day trial of the IPC-7351 Land Pattern Wizard developed by PCB Matrix Corp., which is an advanced version of the IPC-7351B Land Pattern Calculator. The IPC-7351B Land Pattern Wizard tool enables users to not only save their land patterns within new land pattern library files, but also to instantly export land patterns to their preferred CAD format, such as Allegro, Board Station, Expedition, PADS, Pantheon and PCAD. 102 pages. Released June 2010.

Member:  $56.00

Nonmember:  $112.00

IPC members may request a free single user download of a document (one language only) with digital rights management of each new standard by e-mailing MemberTechRequests@ipc.org within 90 days. The file is enabled to print one copy of the standard. Please note that you will receive the file from an e-mail from IHS.com. The file must be opened within 2 business days and will LOCK to the computer of the person who OPENS the file.

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