IPC — Association Connecting Electronics Industries® Features http://www.ipc.org IPC current feature articles, podcast, slideshow, best of listserv and current industry trends en-us Shining the Spotlight on Clean Boards http://www.ipc.org/feature-article.aspx?aid=Cleaning-is-not-a-dirty-word When design and manufacturing stakeholders understand the negative impact particulates can have on reliability, they can provide products that will clean up in the marketplace. Maximizing the Value of Automatic Inspection in PCB Assembly http://www.ipc.org/html/presentations/Shea-ReliabilityConf-2011.wmv Presentation by Chrys Shea of Christopher Associates. Changing Consumer Trends Alter Electronics Market http://www.ipc.org/feature-article.aspx?aid=Leading-consumer-electronics-economist-to-detail-industry-trends Trends in wireless technologies and consumer products are blurring the lines between consumer and industrial hardware. Flex Made Simple: IPC-2223 Includes Tutorial http://www.ipc.org/feature-article.aspx?aid=Flex-standard-adds-tutorial The standard for flex boards, includes a tutorial and information on new technologies like adhesiveless materials. Road Map Adjusts Course http://www.ipc.org/feature-article.aspx?aid=Road-map-adjustments IPC has adjusted its road map direction to make it more useful, covering more types of technology and adding emulators. Standard Simplifies Comparison of Placement Equipment http://www.ipc.org/feature-article.aspx?aid=Equipment-comparisons-made-easy The newly revised IPC-9850A, Surface Mount Placement Characterization, makes it easier to compare multifunction production equipment that can be altered quickly by changing heads. Divining the Prospects for 2012 http://www.ipc.org/feature-article.aspx?aid=Business-Outlook-for-2012 Experts provide data for planners in an IPC Webinar: Business Outlook for 2012 IPC China Has Grown Quickly, but Challenges Abound http://www.ipc.org/feature-article.aspx?aid=Growth-in-China-faces-many-challenges IPC China is seeing solid growth, but marketing standards is not a simple task. BGA Processing for Reliability: Dealing with Dissimilar Alloys and Avoiding Head on Pillow http://www.ipc.org/MembersOnly/feature-article-archive.aspx?aid=BGA-Processing-for-Reliability-Dealing-with-Dissimilar-Alloys-and-Avoiding-Head-on-Pillow Presentation by Jason Fullerton of ACI Technologies, Inc. IPC China Plans for Growth http://www.ipc.org/feature-article.aspx?aid=IPC-China-paves-road-for-growth IPC China hopes to continue its solid expansion to grow to a third of IPC's membership by 2016. Embedded Actives May Be Next High Density Design Technique http://www.ipc.org/feature-article.aspx?aid=IPC-hopes-to-broaden-use-of-embedded-components Some high volume manufacturers are embedding active parts in circuit boards. An IPC standard now in development may help others employ this space-saving technology. As India Plans Vigorous Expansion, IPC is Also Growing Rapidly http://www.ipc.org/feature-article.aspx?aid=IPC-India-poised-for-rapid-growth As India's government plans a major expansion in electronics, IPC is already seeing solid growth. Study of Tin Whisker Inhibiting Systems, Controlling the Copper Substrate Roughness and Controlling the Tin Deposit Crystal Structure http://www.ipc.org/MembersOnly/feature-article-archive.aspx?aid=Tin-Whisker-Inhibiting-Systems Presentation by George Milad of Uyemura International Corporation Finding Answers in Wine Country http://www.ipc.org/feature-article.aspx?aid=Finding-answers-in-wine-country When controllers started failing in vineyards, diagnostic techs had plenty to whine about. It took a multi-year troubleshooting project to find the root cause of circuit board failures. Reliable Information Regarding Hi-rel Boards http://www.ipc.org/feature-article.aspx?aid=Reliable-information-hi-rel-boards As circuit boards become more complex, customers are also demanding higher reliability. Hand Soldering Contest Draws Considerable Attention http://www.ipc.org/feature-article.aspx?aid=Hand-soldering-competition-was-big-success The first hand soldering competition drew a full house. Test Can Reduce Mechanical Failures with Large BGAs http://www.ipc.org/feature-article.aspx?aid=Spherical-tests-BGAs Assembly and test can involve bend events that leads to failures. A new test lets users determine how much strain packages can take before reliability degradation. Practical Aspects for Subtractive Etching of High Density Interconnects http://www.ipc.org/MembersOnly/feature-article-archive.aspx?aid=Practical-Aspects-for-Subtractive-Etching-of-High-Density-Interconnects Presentation by Don Ball of Chemcut Corporation IPC Committee Will Focus ON the Box http://www.ipc.org/feature-article.aspx?aid=IPC-630-targets-enclosures IPC goes outside the box by setting standards for the boxes that house electronics. Standards Efforts Bring Many Paybacks http://www.ipc.org/feature-article.aspx?aid=Guidelines-pay-for-themselves Committee members say many personal and corporate benefits come with standards creation. Printed Electronics Poised for Takeoff http://www.ipc.org/feature-article.aspx?aid=Printed-electronics-make-their-move Additive processes for printed electronics have made great strides, prompting IPC to create committees that will help build an infrastructure. IPC is Creating the Infrastructure for Printed Electronics http://www.ipc.org/feature-article.aspx?aid=Creating-a-base-for-additive-processes IPC has created four subcommittees to address the emerging printed electronics field. No-clean is a Process, Not a Product http://www.ipc.org/feature-article.aspx?aid=To-clean-or-not-to-clean No-clean fluxes can save a lot of processing time, but residues that can be trapped under high density components are raising reliability concerns. Coming Clean on Residue Analysis http://www.ipc.org/feature-article.aspx?aid=Consolidated-cleaning-guideline-gets-update Updated cleaning guideline set to debut. OEM Technology Requirements http://www.ipc.org/MembersOnly/feature-article-archive.aspx?aid=OEM-Technology-Requirements Presentation by Eric Malo of Research In Motion A Close Look at Fine Pitch Rework http://www.ipc.org/feature-article.aspx?aid=Seminar-provides-hands-on-help-for-fine-pitch-rework When parts with the right solder interconnects aren't available, skilled technicians can rework them to keep production running. A half-day course will provide details. High Rel Suppliers Shift to New Cleaning Tests http://www.ipc.org/feature-article.aspx?aid=IPC-5704-focuses-on-hi-rel-cleanliness Residues left on boards can impact reliability, causing intermittent problems. IPC-5704 provides tests that determine whether residues have been removed. Lead-free Solder Brings Many Benefits http://www.ipc.org/feature-article.aspx?aid=Designing-with-lead-free-technologies Tighter line spacings and better moisture specs are among the benefits gained by eliminating lead. IPC-5704 Advances Printed Board Cleanliness http://www.ipc.org/feature-article.aspx?aid=Improving-board-cleanliness IPC-5704 helps users find residues that can cause problems. Applications, Needs and Requirements for Printed Electronics in Aerospace http://www.ipc.org/MembersOnly/feature-article-archive.aspx?aid=Applications-Needs-and-Requirements-for-Printed-Electronics-in-Aerospace Presentation by Jeff Duce of Boeing Member Perspectives: Standards Change as Industry Evolves http://www.ipc.org/feature-article.aspx?aid=Watching-standards-evolve The creation of standards is a fluid area that constantly changes as the industry evolves, according to long-time committee members. Flex Circuit Growth is Transforming Markets, Technology http://www.ipc.org/feature-article.aspx?aid=Flex-circuits-see-strong-growth Speakers at the flexible circuits conference will examine many facets of this rapidly growing technology. Building Standards, Building Knowledge http://www.ipc.org/feature-article.aspx?aid=Lifelong-learning-at-committee-meetings Dell's John Grosso says attending IPC committee meetings helped him learn plenty of technology and build solid relationships. Helping Companies Hurt by International Competition http://www.ipc.org/feature-article.aspx?aid=Trade-group-aids-in-global-competitiveness Regional trade assistance centers can help companies that have been hurt by international competition. IPC Summit on American Competitiveness http://www.ipc.org/feature-article.aspx?aid=IPC-Summit-on-American-Competitiveness-2011 As part of the IPC Summit on American Competitiveness, IPC's Capitol Hill Day affords members an excellent opportunity to meet with their elected officials in Washington, D.C. Photoresist Challenges and Opportunities for Imaging HDI Designs http://www.ipc.org/MembersOnly/feature-article-archive.aspx?aid=Photoresist-Challenges-and-Opportunities-for-Imaging-HDI-Designs Presentation by Dave McGregor of DuPont IPC-7093 Levels Bottom Termination Component Challenges http://www.ipc.org/feature-article.aspx?aid=Bottom-Termination-Component-standard-emerges Bottom termination parts like QFNs and LGAs haven seen rapidly growing use, but have posed assembly challenges. Tapping All Standards Have to Offer http://www.ipc.org/feature-article.aspx?aid=Celestica-relies-on-standards Standards help Celestica manage many aspects of its operations. IPC Honors Celestica, TTM Technologies http://www.ipc.org/feature-article.aspx?aid=Celestica-TTM-win-IPC-awards TTM Technologies and Celestica won prestigious awards for their continuing support of IPC. Standards Help TTM in Many Ways http://www.ipc.org/feature-article.aspx?aid=TTM-uses-wide-range-of-standards TTM relies on standards in many facets of its business. Rising to the Challenge of Pad Cratering http://www.ipc.org/feature-article.aspx?aid=Tests-for-pad-cratering Pad cratering is a growing issue as lead- and halogen-free assemblies grow. IPC-9708 provides testing techniques that eliminate the problem. Final Finishes for HDI http://www.ipc.org/MembersOnly/feature-article-archive.aspx?aid=Bayes-HDI-2011.wmv Presentation by Dr. Martin Bayes of Dow Electronic Materials Hot Tips on Opening Operations in India http://www.ipc.org/feature-article.aspx?aid=Setting-up-shop-in-India India's an attractive place to set up business operations. But it's not something to be done without considerable planning. Finding and Fixing Surface Mount Problems http://www.ipc.org/feature-article.aspx?aid=Finding-root-causes Spotting solder problems like bridging is difficult, but then comes the harder part. Finding the root cause. Tackling Small Product Testing http://www.ipc.org/feature-article.aspx?aid=Testing-small-boards Warping can seriously reduce reliability, but it can be eliminated or reduced to manageable levels. Whiskers Grown on PCBA http://www.ipc.org/MembersOnly/feature-article-archive.aspx?aid=Solis-Tin-Whiskers-Conf-2010.wmv Presentation by Paco Solis of Foresite, Inc. Training Changes as Standards Evolve http://www.ipc.org/feature-article.aspx?aid=Training-for-J-STD-001ES-and-IPC-A-610E Training programs for J-STD-001ES and IPC-A-610E have been significantly upgraded. If LEDs Stay Cool, Their Future's Bright http://www.ipc.org/feature-article.aspx?aid=Extending-LED-lifetimes Designers who pay close attention to packaging can increase LED lifetimes. Tips will be provided during APEX EXPO. Exploring the Complexities of High Density Designs http://www.ipc.org/feature-article.aspx?aid=Examining-HDI Many facets of high density interconnect are closely intertwined. A conference in Baltimore will provide plenty of detail on these complex designs. No Finish for Lead-free Issues http://www.ipc.org/feature-article.aspx?aid=Lead-free-reliability-Webinar Many subtle issues still impact lead-free reliability. Companies are continually working to minimize problems and improve reliability. Wealth of EMS Data Now Available http://www.ipc.org/feature-article.aspx?aid=EMS-surveys Upcoming IPC surveys will give EMS managers insight into factors as diverse as revenue growth and quality performance. Polymide Based Materials for Electronic Applications http://www.ipc.org/MembersOnly/feature-article-archive.aspx?aid=Polymide-Based-Materials-for-Electronic-Applications Presentation by Tom Lantzer of DuPont Circuit and Packaging Materials Examining the Impact of Two Updated Standards http://www.ipc.org/feature-article.aspx?aid=IPC-A-610E-and-IPC-J-STD-001E-examples Examples of IPC-A-610E and IPC J-STD-001E IPC-A-610 and J-STD-001 Assembly Standards Get Update http://www.ipc.org/feature-article.aspx?aid=IPC-J-STD-001E-and-IPC-A-610E-updated IPC J-STD-001E and IPC-A-610E have been revised to improve usability and update technology. New Materials and Their Impact on Thermal Management: Solder Mask http://www.ipc.org/MembersOnly/feature-article-archive.aspx?aid=New-Materials-and-Their-Impact-on-Thermal-Management-Solder-Mask Presentation by David Vaughan of Taiyo America How Will Printed Electronics Impact the Board Industry? http://www.ipc.org/feature-article.aspx?aid=Examining-printed-electronics Printed electronics will someday transform the electronics industry, but how quickly will it emerge and where will its impact be greatest? IEC Electronics Corp. Uses Standards to Improve Communication http://www.ipc.org/feature-article.aspx?aid=Standards-help-IEC-clarify-communications IPC standards can play a key role in communications between companies. Revamped Rigid Board Standard Has Many New Features http://www.ipc.org/feature-article.aspx?aid=IPC-2222-rigid-standard-gets-update Standard for rigid board design addresses many issues including board thickness, laminate material selection and aspect ratio. Thermal Management for LED Applications http://www.ipc.org/MembersOnly/feature-article-archive.aspx?aid=Thermal-Management-for-LED-Applications Presentation by Yash Sutariya of Saturn Electronics Corporation Conference Provides Global Stage for Leading Technologies http://www.ipc.org/feature-article.aspx?aid=Electronic-Circuits-World-Convention-has-global-reach The 12th Electronic Circuits World Convention provides a global stage for those who have technology that raises the bar in circuit board technology. No Faking the Need for Anti-counterfeiting Standards http://www.ipc.org/feature-article.aspx?aid=stopping-counterfeiters Counterfeiting parts hurt everyone, but it may take government input to create techniques to prevent losses. Standards Simplify Ratings for Suppliers http://www.ipc.org/feature-article.aspx?aid=standards-help-Oracle-pick-suppliers Oracle uses standards to find suppliers that can meet its requirements. Knowledge About Tin Whiskers is Growing http://www.ipc.org/feature-article.aspx?aid=Divining-tin-whiskers Tin whiskers are a mystery, and they're a serious problem. There are ways to reduce their impact. Telecommunications Case Studies Address Head-in-Pillow (HnP) Defects and Mitigation through Assembly Process Modification and Control http://www.ipc.org/MembersOnly/feature-article-archive.aspx?aid=Telecommunications-Case-Studies-Address-Head-in-Pillow-HnP-Defects Presentation by Russell Nowland of CommScope IPC China is Expanding in Many Directions http://www.ipc.org/feature-article.aspx?aid=IPC-China-broadens-its-reach IPC China is boosting its profile with a trade show, magazine and a growing role in standards IPC Builds Presence in India with New Office, Staff http://www.ipc.org/feature-article.aspx?aid=IPC-India-opens-its-doors IPC has set up shop in India, continuing its global expansion Flextronics Sets Standards for Expansion http://www.ipc.org/feature-article.aspx?aid=building-an-infrastructure-for-expansion Flextronics uses standards to simplify its expansion Honeywell Relies on Standards to Set Contractor Expectations http://www.ipc.org/feature-article.aspx?aid=Using-standards-to-set-expectations When Honeywell Aerospace writes contracts with suppliers and subcontractors, it relies on IPC documents to establish many details