Technology Presentations

"IPC-9592 Sections 1 & 2: Scope, Applicable Documents and Terms & Definitions"

Presented by Tom Newton Director of PCB Programs, Standards and Technology for IPC.

This presentation was recorded live in Irving, Texas during The IPC-9592 Conference — the NEW Industry Standard for Power Conversion event, November 6, 2008

"IPC-9592 Section 3: Product Specification, Documentation Requirements and Appendix B, Typical Comprehensive Data Sheets"

Presented by Mike Model, Technical Marketing Manager for Board Mounted Power (BMP) Modules for Lineage Power

This presentation was recorded live in Irving, Texas during The IPC-9592 Conference — the NEW Industry Standard for Power Conversion event, November 6, 2008

"IPC-9592 Section 4: Design for Reliability & Appendix A, Derating Guidelines"

Presented by Dr. Scott Strand, Senior Technical Staff Member in Integrated Technology Delivery Quality for IBM

This presentation was recorded live in Irving, Texas during The IPC-9592 Conference — the NEW Industry Standard for Power Conversion event, November 6, 2008

"IPC-9592 Section 5.3: Environmental Stress Testing"

Presented by T. Paul Parker, Consulting Member of Technical Staff Quality Organization Lineage Power from a technical paper authored by Dr. Bill Tian, Hewlett-Packard Co.

This presentation was recorded live in Irving, Texas during The IPC-9592 Conference — the NEW Industry Standard for Power Conversion event, November 6, 2008

"Roadmapping HDI — Interconnect Technology Analysis"

Presented by Jack Fisher, Chairman of the IPC National Technology Roadmap For Electronic Interconnections and a consultant on interconnect technology.

This presentation was recorded live in Irving, Texas during the IPC HDI Technology Conference: Building the Supply Chain Infrastructure, October 6-8, 2008

"The OEM View: PWB Level Integration, Challenges, & Roadmap Requirements"

Presented by James Fuller at The Endicott Technology Interchange sponsored by IPC.

This presentation was recorded live in Endicott, NY on May 14, 2008

"Abilities and Gaps: A Panel Discussion Image Transfer Technologies in PWB Fabrication"

Presented by Karl Dietz, PhD at The Endicott Technology Interchange sponsored by IPC.

This presentation was recorded live in Endicott, NY on May 14, 2008

"Abilities and Gaps: A Panel Discussion
Innovations: Leadership Challenge in PCB System Development Design"

Presented by Happy Holden at The Endicott Technology Interchange sponsored by IPC.

This presentation was recorded live in Endicott, NY on May 14, 2008

Ball Grid Array Update

Design and Assembly Process Standard for Ball Grid Array update.

IPC-2152

Standard for Determining Current-Carrying Capacity in Printed Board Design

IPC-J-STD-004

Revision B Requirements for Soldering Fluxes

Halogen-free challenges

Tim Jensen from Indium Corporation talks about the challenges the industry faces in becoming halogen-free.

More Than One Way to Lead Free Assembly

Leo Lambert discusses the latest in lead-free assembly.

The Innovation Evolution

Innovation expert Robert Tucker describes the best path to optimal innovation.

"What’s the Problem?"

An introduction to printed circuit board troubleshooting.

Management Presentations

"Death of a PCB Salesman"

Presented by Greg Papandrew, President of Bare Board Group Inc.

This presentation was recorded at IPC’s PCB Executive Management Council Meeting in conjunction with the IPC Executive Marketing & Technology Forum Conference and Management Meetings in Kissimmee, Florida, October 29-30, 2008

"Opportunities in Low-Cost & Emerging Regions"

Presented by Mark C. Hehl, Partner in Hehl & Associates

This presentation was recorded during the IPC SMEMA Management Council Meetings in conjuction with the IPC Executive Marketing & Technology Forum Council and Management Meetings in Kissimmee, Florida, October 29-30, 2008

"Your Company and the Research & Experimentation Tax Credit"

Presented by TJ Sponsel II, co-founder of and partner in McGuire Sponsel and director of McGuire Sponsel’s Research & Experimentation Tax Credit Practice.

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

"Good Industry Statistics: Where to Find Them and What They Mean to Your Business"

Presented by Sharon Starr, Director of Market Research for IPC.

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

"Reducing Costs & Avoiding Risk in the Global Market"

Presented by Lawrence M. Friedman, a partner with Barnes, Richardson & Colburn, specializing in the representation of importers and exporters facing challenges in complying with U.S. international trade laws.

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

Building a Marketing Strategy

Karen Carpenter outlines best practices in marketing.

Death of a PCB Salesman

Greg Papandrew discusses best practices in sales.

IPC Midwest Conference Highlights

IPC technical conference director Greg Munie shares highlights from the IPC Midwest Conference and Exhibition.

Put Your Stamp On It

Attorney Jason Mirabito weighs in on how to effectively develop a patent strategy.

The Innovation Evolution

Innovation expert Robert Tucker describes the best path to optimal innovation.

Government Relations Presentations

Understanding ITAR

Joe O'Neil explains best practices for these often misunderstood regulations.

Environmental Presentations

"Executive's Guide to Environmental Megatrends That Will Shape the Future of the Electronics Industry"

Presented by Paul Goodman, Senior Materials Consultant, Reliability and Failure Analysis Group, ERA Technology Ltd. and consultant to the EU on WEEE and RoHS directives and REACH regulations.

This presentation was recorded live in Kissimmee, Florida at IPC’s 2008 Executive Marketing & Technology Forum Conference and Management Meetings, October 29–30, 2008

"There's More Than One Way to Lead-Free: Status Report on Lead Free Processes"

Presented by Leo Lambert, Vice President and Technical Director, EPTAC Corporation, Manchester, NH

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

"Impact of the Öko-Institut Recommendations on an Avionics OEM"

Presented by David Hillman, Metallurgical Engineer in the Advanced Operations Engineering Department of Rockwell Collins Inc. at IPC’s 2008 Meeting Industry Response to Oko-Institut Recommendations.

This presentation was recorded live in Brussels, Belgium on June 18, 2008

"US EPA Flame Retardants in Printed Circuit Boards Partnership"

Presented by Fern Abrams Director, Government Relations and Environmental Policy, IPC at IPC’s 2008 Meeting Industry Response to Öko-Institut Recommendations.

This presentation was recorded live in Brussels, Belgium on June 18, 2008

"Summary of Öko–Institut Recommendations & General Issues and Discussion"

Presented by Paul Goodman, Senior Materials Consultant, Reliability and Failure Analysis Group, ERA Technology Ltd. and consultant to the EU on WEEE and RoHS directives and REACH regulations at IPC’s 2008 Meeting Industry Response to Öko-Institut Recommendations.

This presentation was recorded live in Brussels, Belgium on June 18, 2008

Halogen-free challenges

Tim Jensen from Indium Corporation talks about the challenges the industry faces in becoming halogen-free.

More Than One Way to Lead Free Assembly

Leo Lambert discusses the latest in lead-free assembly.

Market Research Presentations

"Emerging Applications and Material Issues for Embedded Components"

Presented by Karen Carpenter at IPC's 2007 Executive Market & Technology Forum Conferences in Shanghai and Las Vegas

This presentation was recorded live in Shanghai on September 19, 2007

"The Business Side of Managing Innovation: What Decision Makers Need to Know"

Presented by Shauzab H. Ladha at IPC's 2007 Executive Market & Technology Forum Conferences in Shanghai and Las Vegas

This presentation was recorded live in Shanghai on September 19, 2007

"The Inevitable Transition to HDI Boards"

Presented by Martin Rausch at IPC's 2007 Executive Market & Technology Forum Conferences in Shanghai and Las Vegas

This presentation was recorded live in Shanghai on September 19, 2007