IPC Online Presentation Library

Welcome to the IPC Online Presentation Library.  Viewing the presentations is a benefit of IPC membership. To view the presentations you will need to log on to IPC's Members-Only Web site.  

 
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Technology Presentations

Slide IconEnabling I/O Optimization with 3D SoC, SIP and PCB Co-design

Presentation by Humair Mandavia, Chief Strategy Officer at Zuken

This presentation was recorded live at the IPC Conference on Component Technology, Chandler, Arizona, September 11, 2013

Slide IconThe Impact of Different Interposers on Power Saving for Memory Modules

Presentation by Nozad Karim, VP of Electrical Engineering and Characterization at Amkor Technology, Inc.

This presentation was recorded live at the IPC Conference on Component Technology, Chandler, Arizona

Slide IconThinking Small: Building a Business out of Nanotechnology

Presentation by Dr. Patrick Murray, VP of Research and Development, Nanophase Technologies

This presentation was recorded live at the IPC Conference on Component Technology, Chandler, Arizona

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Advanced Package Migration to System Level Integration

Presentation by David Hiner, Sr. Director Chip-on-Chip Technology at Amkor Technology

This presentation, the keynote address, was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

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Films for Improved Reliability in PCB and IC Packages

Presentation by Chris Hunrath, VP of Technology for Integral Technology

This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 12, 2013.

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PCB Fabrication, Challenges & Solutions

Presentation by by Raj Kumar, VP of Technology – PCB of Viasystems Group, Inc.

This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 12, 2013.

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Leveraging PCB Infrastructure to Achieve Ultra-Fine Cu Geometries

Presentation by Michael Deley, Business Development Manager at Averatek Corporation

This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 12, 2013.

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Polymer Challenges on the Road to 3D Integration

Presentation by Jeff Gotro, PhD, CMC, President of InnoCentrix, LLC

This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 12, 2013.

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Design of High-performance DIMM-in-a-PACKAGE (DIAP) On-board Memory Module

Presentation by Zhuowen Sun, Staff Engineer at Invensas Corporation

This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

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Sintering Pastes: A Spectrum Solution to Electrical and Thermal Conduction in the Z-Axis

Presentation by Catherine Shearer, Senior Scientist, Ormet Circuits Inc.

This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

Slide IconImplementation of High Speed Plating for Copper Pillar Fabrication

Presentation by Lynn Michaelson, Senior Materials Scientist at Technic Inc.

This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

Slide IconOpportunities and Challenges for 2.5D/3D Glass Interposers

Presentation by Scott C. Pollard, Manager, Integration Technologies Science & Technology at Corning, Inc.

This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

Slide IconTrends in Advanced Circuit Board Technologies and the Impact on the Chip World

Presentation by Dr. H. Nakahara, President, N.T. Information Ltd.

This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

Slide Icon "Silicon Interposers: Advances and Alternatives"

Presentation by Linda C. Mathew, Senior Analyst, TechSearch International, Inc.

This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

Slide Icon "Manufacturing with Fiber Optics"

Presentation by Matt Hamand of Rockwell Collins

This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

Slide Icon "Printed Electronics: An Overview"

Presentation by Marc Chason of Marc Chason and Associates, Inc. on behalf of Dan Gamota of Jabil Electronics

This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

Slide Icon "Advance in Flexible Printed Lighting Technology for High Growth Markets"

Presentation by Marc Chason of Marc Chason and Associates, Inc.

This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

Slide Icon "BGA Voiding in Flexible Circuits"

Presentation by Mitch Holzer of Cookson Electronics

This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

Slide Icon "Supporting Electronic Innovations: Printed Electronics Opportunities"

Presentation by Happy Holden of GENTEX Corporation

This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

Slide Icon "Aspect Ratio Does Not Matter Anymore"

Presentation by Nick Koop of Minco Products, Inc.

This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

Slide Icon "Alternative Approaches to the Manufacture of Rigid Flex Circuit Assemblies"

Presentation by Joe Fjelstad of Silicon Pipe, Inc.

This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

Slide Icon "IPC-2223 Revision C Overview"

Presentation by Mark Finstad of Flexible Circuit Technologies, Inc.

This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

Slide Icon "Ask the Flexpert"

Presentation by Mark Finstad of Flexible Circuit Technologies, Inc. and Mark Verbrugge of Pica Manufacturing Solutions

This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

Slide Icon "Design, Fabrication and Electrical Analysis of High Speed Flex"

Presentation by Glen Oliver of DuPont Electronic Technologies

This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

Slide Icon "Tin Whisker Mitigation in Assembly"

Presentation by Polina Snugovsky, Ph.D., Sc.D. of Celestica

This presentation was recorded live in Ft. Worth, Texas during the IPC Tin Whiskers Conference sponsored by Lockheed Martin Corporation, April 17-19, 2012

Slide Icon "Special Consideration for Medical Sector: Product Reliability Issues Due to Pb-free"

Presentation by Po Tse of Philips Healthcare

This presentation was recorded live in Ft. Worth, Texas during the IPC Tin Whiskers Conference sponsored by Lockheed Martin Corporation, April 17-19, 2012

Slide Icon "Research at UNT on Metal (Tin, Zinc, and Cadmium) Whiskers"

Presentation by Aleksandra Fortier, Ph.D., of the University of North Texas

This presentation was recorded live in Ft. Worth, Texas during the IPC Tin Whiskers Conference sponsored by Lockheed Martin Corporation, April 17-19, 2012

Slide Icon "Tin Whisker Mitigation Process"

Presentation by Scott Sentz of AEM, Inc.

This presentation was recorded live in Ft. Worth, Texas during the IPC Tin Whiskers Conference sponsored by Lockheed Martin Corporation, April 17-19, 2012

Slide Icon "Mitigation Measurements and Whisker Survey of Commercial Components"

Presentation by Martin Wickham of NPL (UK)

This presentation was recorded live in Ft. Worth, Texas during the IPC Tin Whiskers Conference sponsored by Lockheed Martin Corporation, April 17-19, 2012

Slide Icon "An Investigation of Whisker Growth on Tin Coated Wire and Braid"

Presentation by David Hillman of Rockwell Collins and Tom Lesniewski of Northrup Grumman

This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "Backward Compatable Assembly, Microstructure and Thermal Reliability on an Extremely Large Ball Grid Array"

Presentation by Raiyo Aspandiar of Intel Corporation

This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "Assembly and Reliability of 1704 I/O FCBGA & FPBGAs"

Presentation by Reza Ghaffarian, Ph.D. of NASA/Jet Propulsion Laboratory (JPL)

This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes"

Presentation by Brandon Judd of Indium Corporation

This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "Halogen-free Lead-free Solder Paste with Advanced Activator Technology"

Presentation by Xiang Wei, Ph.D., of Kester

This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "Drop Test Performance of BGA Assembly Using SAC105Ti Solder Sphere"

Presentation by Ning-Chen Lee, Ph.D. of Indium Corporation

This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "An Investigation into Low Temperature Tin-bismuth and Tin-bismuth-silver Lead-free Alloy Solder Pastes"

Presentation by Jasmir Bath of Christopher Associates

This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "Morphology Evolution and Voiding of Solder Joints on QFN Central Pads with a Ni/Au Finish"

Presentation by Julie Silk of Agilent Technologies

This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "Effects of Tin and Copper Nanotexturization on Tin Whisker Formation"

Presentation by David Lee of Johns Hopkins Applied Physics Laboratory

This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "PCB Trace Impedance: Impact of Localized PCB Copper Density"

Presentation by Gary Brist of Intel Corporation

This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology"

Presentation by Jerry Chia of Intel Corporation

This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "Whiskers and Alternative Surface Finishes at Press-in Technology"

Presentation by Dr. Hans-Peter Tranitz of Continental Automotive GmbH

This presentation was recorded live in San Diego, California during the Technical Conference at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "Soldering and Assembly Defects - Causes and Cures"

Presentation by Bob Willis of SMART Group

This presentation was recorded live as a webinar on January 12, 2012

Slide Icon "Component Characteristics and Reliability Assessment of Lead Free Solder for Space Electronics Hardware"

Presentation by Jelena Bradic of Com Dev, Ltd.

This presentation was recorded live in Irvine, California at the IPC Conference on Reliability: Assembly Process for a Reliable Product, October 31-November 2, 2011

Slide Icon "Maximizing the Value of Automatic Inspection in PCB Assembly"

Presentation by Chrys Shea of Shea Engineering Services

This presentation was recorded live in Irvine, California at the IPC Conference on Reliability: Assembly Process for a Reliable Product, October 31-November 2, 2011

Slide Icon "BGA Processing for Reliability: Dealing with Dissimilar Alloys and Avoiding Head on Pillow"

Presentation by Jason Fullerton of ACI Technologies, Inc.

This presentation was recorded live in Irvine, California at the IPC Conference on Reliability: Assembly Process for a Reliable Product, October 31-November 2, 2011

Slide Icon "The Effect of Coating and Potting on the Reliability of QFN Devices"

Presentation by Sheryl Tulkoff and Dr. Nathan Blattau of DfR Solutions

This presentation was recorded live in Irvine, California at the IPC Conference on Reliability: Assembly Process for a Reliable Product, October 31-November 2, 2011

Slide Icon "Minimizing the Variables of Mechanical Drilling"

Presentation by Ian Hemmings of Tapco Circuit Supply

This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011

Slide Icon "New Developments in Materials for Rigid Flex Boards"

Presentation by Anthony Welo of Arlon

This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011

Slide Icon "Performance Reliability Data for Flex/Rigid-Flex PWBs"

Presentation by John Bauer of Rockwell Collins

This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011

Slide Icon "OEM Technology Requirements"

Presentation by Eric Malo of Research In Motion

This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011

Slide Icon "FR4-CCL Reclassification Explained — An update from UL"

Presentation by Crystal Vanderpan of UL

This presentation was recorded live as a webinar on May 4, 2011

Slide Icon "Practical Aspects for Subtractive Etching of High Density Interconnects "

Presentation by Don Ball of Chemcut Corporation

This presentation was recorded live in Baltimore, Maryland at the IPC Conference on HDI: High Performance Strategies for the 21st Century, sponsored by Northrup Grumman Corporation, March 1-2, 2011

Slide Icon "Final Finishes for HDI"

Presentation by Dr. Martin Bayes of Dow Electronic Materials

This presentation was recorded live in Baltimore, Maryland at the IPC Conference on HDI: High Performance Strategies for the 21st Century, sponsored by Northrup Grumman Corporation, March 1-2, 2011

Slide Icon "Photoresist Challenges and Opportunities for Imaging HDI Designs "

Presentation by Dave McGregor of DuPont

This presentation was recorded live in Baltimore, Maryland at the IPC Conference on HDI: High Performance Strategies for the 21st Century, sponsored by Northrup Grumman Corporation, March 1-2, 2011

Slide Icon "Via Filling and Plugging Considerations for HDI"

Presentation by Mike Carano of OMG Electronic Chemicals

This presentation was recorded live in Baltimore, Maryland at the IPC Conference on HDI: High Performance Strategies for the 21st Century, sponsored by Northrup Grumman Corporation, March 1-2, 2011

Slide Icon "Printed Electronic Technologies: Perspective of a PCB Manufacturer"

Presentation by Raj Kumar of DDi Corp.

This presentation was recorded live in Irvine, California at the IPC Conference on Printed Electronics, January 18-19, 2011

Slide Icon "The Intersection of Printed Electronics and PCB Assembly"

Presentation by John Andresakis of Oak-Mitsui Technologies

This presentation was recorded live in Irvine, California at the IPC Conference on Printed Electronics, January 18-19, 2011

Slide Icon "Applications, Needs and Requirements for Printed Electronics in Aerospace"

Presentation by Jeff Duce of Boeing

This presentation was recorded live in Irvine, California at the IPC Conference on Printed Electronics, January 18-19, 2011

Slide Icon "Tin Whiskers Grown on PCBA"

Presentation by Paco Solis of Foresite, Inc.

This presentation was recorded live in Schaumburg, Illinois at the IPC Tin Whiskers Conference, December 6-7, 2010

Slide Icon "Materials: Evaluation of a Nanotechnology Based Component Surface Finish"

Presentation by Robert Farrell of Benchmark Electronics

This presentation was recorded live in Schaumburg, Illinois at the IPC Tin Whiskers Conference, December 6-7, 2010

Slide Icon "Aerospace and Defense Response to Tin Whiskers"

Presentation by Ted Schnetker of Hamilton Sundstrand

This presentation was recorded live in Schaumburg, Illinois at the IPC Tin Whiskers Conference, December 6-7, 2010

Slide Icon "Study of Tin Whisker Inhibiting Systems, Controlling the Copper Substrate Roughness and Controlling the Tin Deposit Crystal Structure"

Presentation by George Milad of Uyemora International Corporation

This presentation was recorded live in Schaumburg, Illinois at the IPC Tin Whiskers Conference, December 6-7, 2010

Slide Icon "Thermally Conductive Printed Circuit Board Solutions"

Presentation by Greg Smith of Milplex Circuits, Inc. (Canada)

This presentation was recorded live in Irvine, California at the IPC Technology Interchange on Thermal Management, November 3-4, 2010

Slide Icon "New Materials and Their Impact on Thermal Management: Solder Mask"

Presentation by David Vaughan of Taiyo America

This presentation was recorded live in Irvine, California at the IPC Technology Interchange on Thermal Management, November 3-4, 2010

Slide Icon "Thermal Management for LED Applications"

Presentation by Yash Sutariya of Saturn Electronics Corporation

This presentation was recorded live in Irvine, California at the IPC Technology Interchange on Thermal Management, November 3-4, 2010

Slide Icon "Polymide Based Materials for Electronic Applications"

Presentation by Tom Lantzer of DuPont Circuit and Packaging Materials

This presentation was recorded live in Palm Springs, California at the IPC Electronics Industry Executive Summit, October 13, 2010

Slide Icon "New PCB Laminates for Use in High Temperature and Harsh Chemistry Environments"

Presentation by John Conrood of Rogers Corporation

This presentation was recorded live in Irvine, California at the IPC International Conference on Flexible Circuits, June 16, 2010

Slide Icon "Electrical vs. Mechanical Requirements and Their Impact on Material Selection"

Presentation by Mark Verbrugge of Minco Products and Sidney Cox of DuPont

This presentation was recorded live in Irvine, California at the IPC International Conference on Flexible Circuits, June 16, 2010

Slide Icon "Telecommunications Case Studies Address Head-in-Pillow (HnP) Defects and Mitigation through Assembly Process Modification and Control"

Presentation by George Wenger of the Andrew Division of CommScope

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

Slide Icon "Characterizing the Lead-free Impact on PCB Pad Craters"

Presentation by Brian Roggeman of AREA Consortium in conjunction with Advanced Process Laboratory, Universal Instruments Corporation

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

Slide Icon "Progress in Developing Industry Standard Test Requirements for Pb-Free Solder Alloys"

Presentation by Kristen Troxel, Hewlett-Packard Company

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

Slide Icon "Challenges in Reflow Profiling Large & High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes"

Presentation by Raiyomand Aspandiar, Intel Corporation

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

Slide Icon "The Lean SMT Line"

Presentation by Kenny Heifner of SMS Technologies, Inc.

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

Slide Icon "Implementing Quality and Reliability on the Assembly Line"

Presentation by David Bergman of IPC

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

Slide Icon "Solder Creep-Fatigue Model Parameters for SAC & SnAg Solder Joint Reliability Estimation"

Presentation by Werner Engelmaier of Engelmaier Associates, LLC

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

Slide Icon "Filling in the Gaps in Lead-free Reliability Modeling and Testing"

Presentation by Jean-Paul Clech of EPSI Inc.

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

Slide Icon "Constitutive and Failure Behavior of SnAgCu Solder Joints"

Presentation by Dr. Ganesh Subbarayan of Purdue University

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

Slide Icon "Improving Your Efficiency"

Presentation by Sean Murray of Assembléon

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™, March 31-April 2, 2009

Slide Icon "Improving Your Efficiency"

Presentation by Eric Slezak of Indium Corporation

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™, March 31-April 2, 2009

Slide Icon "IPC-9592: Scope, Applicable Documents and Terms & Definitions"

Presentation by Tom Newton, Director of PCB Programs, Standards and Technology for IPC

This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

Slide Icon "IPC-9592: Design for Reliability & Appendix A, Derating Guidelines"

Presentation by Dr. Scott Strand of IBM

This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

Slide Icon "IPC-9592: Product Specification, Documentation & Appendix B"

Presentation by Mike Model of Lineage Power

This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

Slide Icon "IPC-9592: Design Verification Testing & Appendix C"

Presentation by Don Gerstle of Murata Power Solutions

This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

Slide Icon "IPC-9592: Environmental Stress Testing"

Presentation by T. Paul Parker of Lineage Power from a technical paper authored by Dr. Bill Tian, Hewlett-Packard

This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

Slide Icon "IPC-9592: Electromagnetic Susceptibility Testing"

Presentation by Jerry Strunk of Lineage Power

This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

Slide Icon "IPC-9592: Quality Processes"

Presentation by Lynn Simmons of Dell, Inc.

This presentation was recorded live in Irving, Texas, at the IPC-9592 Conference, November 6, 2008

Audio "Nozzle Design for Cleaning High Density, Low Profile Assemblies"

Presentation by Linda Woody of Lockheed Martin Martin Missiles and Fire Control Systems

This presentation was recorded live in Rosemont, Illinois, at the IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium, October 29, 2008

Slide Icon "Roadmapping HDI — Interconnect Technology Analysis"

Presentation by Jack Fisher, Chairman of the IPC National Technology Roadmap For Electronic Interconnections and a consultant on interconnect technology

This presentation was recorded live in Irving, Texas during the IPC HDI Technology Conference: Building the Supply Chain Infrastructure, October 6-8, 2008

Slide Icon "Ionic Analysis of Common Beverages Spilled on Electronics"

Presentation by Bev Christian of Research In Motion

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

Slide Icon "The OEM View: PWB Level Integration, Challenges, & Roadmap Requirements"

Presentation by Jim Fuller of Endicott Interconnect Technology Inc.

This presentation was recorded live in Endicott, New York at The Endicott Technology Interchange sponsored by IPC, May 14, 2008

Slide Icon "Abilities and Gaps: Image Transfer Technologies in PWB Fabrication"

Presentation by Karl Dietz, Ph.D., of DuPont

This presentation was recorded live in Endicott, New York at The Endicott Technology Interchange sponsored by IPC, May 14, 2008

Slide Icon "Innovations: Leadership Challenge in PCB System Development Design"

Presentation by Happy Holden of Mentor Graphics

This presentation was recorded live in Endicott, New York at The Endicott Technology Interchange sponsored by IPC, May 14, 2008

Slide Icon Ball Grid Array Update

Design and Assembly Process Standard for Ball Grid Array update

 

Slide Icon IPC-2152

Standard for Determining Current-Carrying Capacity in Printed Board Design

 

Slide Icon IPC-4811

Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

 

Slide Icon IPC-6017

John Perry, IPC staff liaison of the IPC D-53 Embedded Device Performance Subcommittee, provides an overview of IPC-6017, Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices.

 

Slide Icon IPC 7711/7721 Revision B

Rework, Modification & Repair of Electronic Assemblies

 

Slide Icon IPC-9252

Cliff Maddox, co-chairman of the IPC 7-32c committee, provides an overview of IPC-9252, Requirements for Electrical Testing of Unpopulated Printed Boards.

 

Slide Icon IPC-9592, Performance Parameters for Power Conversion Devices

Dr. Scott Strand, senior technical staff member, integrated technology, IBM, provides an overview of IPC-9592.

 

Slide Icon IPC-J-STD-004

Revision B Requirements for Soldering Fluxes

 

Slide Icon IPC-J-STD-075

Paul Krystek, lead co-chairman of the ECA/IPC/JEDEC J-STD-075 committee, provides an overview of J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

 

Audio Medical electronics manufacturing and the RoHS revision

Fred Loneker, a senior manager with ENVIRON International Corp., talks about the implications the RoHS revision draft will have on the medical electronics industry.

 

Slide Icon "Solder Alloy Test Methods: A Status Report"

Greg Munie, IPC conference director, provides an overview of the development of a new alloy test standard.

 

Slide Icon "New Generation - Thermal stress simulation for evaluation of printed circuit boards"

An introduction to printed circuit board troubleshooting

 
Top

Management Presentations

Slide Icon "Business Outlook: The Global Electronics Industry"

Presentation by Presentation by Walt Custer of Custer Consulting Group

This presentation was recorded live in San Diego, California at the EMS Management Meeting during IPC APEX EXPO on February 18, 2013

Slide Icon "Developing a Disaster Preparedness Plan"

Presentation by John Sharp, Corporate Product Compliance Manager for TriQuint Semiconductor

This presentation was recorded live in San Diego, California at the EMS Management Meeting during IPC APEX EXPO on February 18, 2013

Slide Icon "Best Practices of Customer Relations: Secrets of a Certified EMS Program Manager"

Presentation by Chris Narup, Supervisor-Sales and Marketing, John Deere Electronic Solutions

This presentation was recorded live in San Diego, California at the EMS Management Meeting during IPC APEX EXPO on February 18, 2013

Slide Icon "Disruptive Environmental Trends (and Some Other Things of Concern)"

Presentation by Fern Abrams, Director Government Relations and Environmental Policy, IPC

This presentation was recorded live in San Diego, California at the EMS Management Meeting during IPC APEX EXPO on February 18, 2013

Slide Icon "The Dynamic EMS Industry"

Presentation by Jack Calderon, Managing Director at Lincoln International

This presentation was recorded live in San Diego, California at the EMS Management Meeting during IPC APEX EXPO on February 18, 2013

Slide Icon "HDI — Altering the Competitive Landscape for North America"

Presentation by Mike Carano of OMG Electronic Chemicals

This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

Slide Icon "Where is the Gap? What Our Customers Need from Us"

Presentation by Michael Goeringer of Arc-Tronics

This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

Slide Icon "Breaking Into Game Changing Technologies: Embedded"

Presentation by Jim Fuller of Endicott Interconnect Technologies, Inc.

This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

Slide Icon "How to Achieve High Speeds Without Breaking the Bank"

Presentation by Mike Freda of Oracle’s Semiconductor Packaging & Technology Group

This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

Slide Icon "Overview of Latin America’s Economy and the Electronics Industry"

Presentation by Sree Bhagwat of IPC

This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

Slide Icon "Creating and Following the EMS Dashboard"

Presentation by Rick Herndon of Firstronic, LLC

This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

Slide Icon "Where is the Gap? What Our Customers Need from Us"

Presentation by Scott Meyer of UTC Aerospace Systems

This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

Slide Icon "Creating and Following the EMS Dashboard"

Presentation by David Hollingsworth of Ascentron, Inc.

This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

Slide Icon "Transitioning from Rigid to Flex/Rigid-Flex PCB Manufacturing"

Presentation by Yash Sutariya of Saturn Electronics/Saturn Flex Systems, Inc.

This presentation was recorded live in Irvine, California during the IPC Flexible Circuits Conference, June 12-14, 2012

Slide Icon "China Perspective of the PCB Industry"

Presentation by George Dudnikov of Founder PCB

This presentation was recorded live in San Diego, California during the PCB Executive Management Meeting at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "The State of Consumer Tech"

Presentation by Shawn DuBravac of CEA

This presentation was recorded live in San Diego, California during the EMS Management Council Meeting at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "ERP Systems and Cloud Computing"

Presentation by Marty Bentley of EPIC Technologies

This presentation was recorded live in San Diego, California during the EMS Management Council Meeting at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "Trends in Distribution"

Presentation by Dave Doherty, Vice President – Global Supplier and Product Operations with Digi-Key Corporation

This presentation was recorded live in San Diego, California during the EMS Management Council Meeting at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "EMS Growth in India"

Presentation by Gary Barnier, Director of Business Development for North America with Centum Electronics

This presentation was recorded live in San Diego, California during the EMS Management Council Meeting at IPC APEX EXPO® 2012, February 28-March 1, 2012

Slide Icon "Military Technology Trends"

Presentation by Stephen Cambone, Executive VP, Strategic Development for QinetiQ NA

This presentation was recorded live in Washington, D.C. during the IPC Conference for the PCB Industry: Critical Issues for the Military Market on December 8, 2011

Slide Icon "Export Control Reform: Overview and Potential Impact on the Military Electronics Industry"

Presentation by Peter Lichtenbaum, Partner in Covington & Burling, LLP

This presentation was recorded live in Washington, D.C. during the IPC Conference for the PCB Industry: Critical Issues for the Military Market on December 8, 2011

Slide Icon "The Military Market Today and What it Means for Tomorrow"

Presentation by Sharon Starr, Director of Market Research for IPC

This presentation was recorded live in Washington, D.C. during the IPC Conference for the PCB Industry: Critical Issues for the Military Market on December 8, 2011

Slide Icon "Company Spotlight"

Presentation by Nilesh Naik of OneSource Group

This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011

Slide Icon "Any Layer Via Interconnects Using Sintered Paste"

Presentation by James Haley of Ormet Circuits

This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011

Slide Icon "IPC International Technology Roadmap for Electronic Interconnections"

Presentation by David Bergman of IPC

This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011

Slide Icon "Disruptive Environmental Trends"

Presentation by Fern Abrams of IPC

This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011

Slide Icon "Trends in the Flexible Circuit Industry"

Presentation by Sharon Starr of IPC

This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011

Slide Icon "Developing a Flexible Product Compliance Management System"

Presentation by Jacklin Adams of IBM

This presentation was recorded live in Boston, Massachussetts at IPC conference "It's Not Easy Being Green: Roadmap to Compliance", May 11, 2011

Slide Icon "EMS Executive Management Meeting — IPC APEX EXPO™ 2011"

Presentations:
  • Expanding into High-Growth Emerging Markets: Talent as a Critical Success Factor for Asia-Pacific
    David Everheart of Aperion Global


  • How to Start a Manufacturing Operation in Mexico
    Eduardo R. Saavedra of The Offshore Group


  • How to Start Your Business in India
    Gunjan Bagla of Amritt, Inc.

These presentations were recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011

Slide Icon "Technology Roadmap for Aerospace & Defense Electronics Assembly Industry"

Presentation by Bill Murphy of Lockheed Martin

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011

Slide Icon "A Laminator's Perspective of the PCB Market"

Presentation by Raymond Sharpe of Isola Group S.A.R.L.

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011

Slide Icon "Bridging the Gap Between Design and Fabrication — A PCB Manufacturer's Perspective"

Presentation by Yash Sutariya of Saturn Electronics Corporation and Saturn Flex Systems, Inc.

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011

Slide Icon "Impact of Materials Shortage"

Presentation by Rick Pierson of iSuppli Corporation

This presentation was recorded live in Palm Springs, California at the IPC Electronics Industry Executive Summit, October 13, 2010

Slide Icon "Developing a Counterfeit Parts Control Plan"

Presentation by Bruce Mahone, SAE International

This presentation was recorded live in Washington, D.C. at the IPC Conference for the North American EMS Industry, “What it Takes to Supply the Military,” September 15, 2010

Slide Icon "Regulations, Requirements & Compliance for Military Commercial Exports"

Presentation by Bob Davis, Excelerate, Inc.

This presentation was recorded live in Washington, D.C. at the IPC Conference for the North American EMS Industry, “What it Takes to Supply the Military,” September 15, 2010

Slide Icon "Business Opportunities for Aerospace/Government and Consumer Electronics Flex Circuit Manufacturers"

Presentation by Al Wasserzug, Vulcan Flex Circuit Corporation and Jay Desai, MFLEX

This presentation was recorded live in Irvine, California at the IPC International Conference on Flexible Circuits, June 16, 2010

Slide Icon "Are the Consequences of Industry Consolidation Good or Bad?"

Presentation by Jack Calderon, Lincoln International

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

Slide Icon "How Does Cost Accounting Impact Pricing?"

Presentation by Brian Throneberry, API Technologies

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

Slide Icon "High Brightness LEDs: Opportunities, Technologies and Challenges"

Presentation by Ed Smith, Avnet Electronics Marketing Americas

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

Slide Icon "Recommendations for the North American Electronic Interconnect Industry Support for the Department of Defense"

Presentation by:
  • James Fuller, Endicott Interconnect Technologies
  • Joseph O’Neil, Hunter Technologies
  • Mikel Williams, DDi Corp.

This presentation was recorded live in Washington, D.C. during the IPC Technology Interchange, "The North American PCB Industry: It Can and Will Support the Military Market," December 9-10, 2009

Slide Icon "Interconnect Opportunities & Challenges"

Presentation by Sydney Pope of the U.S. Department of Defense

This presentation was recorded live in Washington, D.C. during the IPC Technology Interchange, "The North American PCB Industry: It Can and Will Support the Military Market," December 9-10, 2009

Slide Icon "Strategies for Fighting Counterfeiting"

Presentation by Debra Eggeman of IDEA (Independent Distributors of Electronics Association)

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

Slide Icon "Possible IPC Counterfeit Avoidance Management Technique"

Presentation by Dennis Fritz of SAIC and MacDermid, Inc.

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

Slide Icon "Suspect/Counterfeit Electronic Components and Risk Mitigation"

Presentation by Rick Stanton of Symetrics Industries LLC

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

Slide Icon "High Performance Work Teams"

Presentation by Leo Reynolds, Consultant

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

Slide Icon "Opportunities in Large Format Electronics"

Presentation by Mike Carano of OMG Electronic Chemicals

This presentation was recorded live in Las Vegas, Nevada during IPC APEX EXPO™, March 31, 2009

Slide Icon "Partnering to Improve Your Business"

Presentation by John Hartner of Dover Electronic Technologies

This presentation was recorded live in Las Vegas, Nevada during IPC APEX EXPO™, March 31, 2009

Slide Icon "Death of a PCB Salesman"

Presentation by Greg Papandrew of Bare Board Group Inc.

This presentation was recorded at IPC’s PCB Executive Management Council Meeting in conjunction with the IPC Executive Marketing & Technology Forum Conference and Management Meetings in Kissimmee, Florida, October 29-30, 2008

Slide Icon "Opportunities in Low-Cost & Emerging Regions"

Presentation by Mark C. Hehl of Hehl & Associates

This presentation was recorded during the IPC SMEMA Management Council Meetings in conjuction with the IPC Executive Marketing & Technology Forum Council and Management Meetings in Kissimmee, Florida, October 29-30, 2008

Slide Icon "Your Company and the Research & Experimentation Tax Credit"

Presentation by TJ Sponsel II of McGuire Sponsel LLC

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

Slide Icon "Reducing Costs & Avoiding Risk in the Global Market"

Presentation by Lawrence M. Friedman of Barnes, Richardson & Colburn

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

Podcast The R&D Tax Credit

A special presentation with IPC and McGuire Sponsel LLC

 

Podcast Building a Marketing Strategy

Karen Carpenter outlines best practices in marketing.

 

Podcast Death of a PCB Salesman

Greg Papandrew discusses best practices in sales.

 

Podcast IPC Midwest Conference Highlights

IPC technical conference director Greg Munie shares highlights from the IPC Midwest Conference and Exhibition.

 

Podcast Looking ahead to 2009

IPC President Denny McGuirk shares IPC’s goals for its members and the association in 2009.

 

Podcast Put Your Stamp On It

Attorney Jason Mirabito weighs in on how to effectively develop a patent strategy.

 

Podcast The Innovation Evolution

Innovation expert Robert Tucker describes the best path to optimal innovation.

 
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Environmental Presentations

Slide Icon "California Safer Consumer Products Regulation"

Presentation by Mike Kirschner, Principal Consultant at Environ

This is the sixth of six presentations from the It's Not Easy Being Green conference at Boston, June 5 , 2013

Slide Icon "Voluntary Sustainability Initiatives"

Presentation by Jocelyn Cascio, Supply Chain sustainability Manager at Intel

This is the fifth of six presentations from the It's Not Easy Being Green conference at Boston, June 5 , 2013

Slide Icon "EU REACH Update"

Presentation by Mike Kirschner, Principal Consultant, of Environ

This is the fourth of six presentations from the It's Not Easy Being Green conference at Boston, June 5 , 2013

Slide Icon "Alternatives Assessment, Finding Better Alternatives to Restricted Substances"

Presentation by Helen Holder, Corporate Material Selection Manager of Hewlett-Packard

This is the third of six presentations from the It's Not Easy Being Green conference at Boston, June 5 , 2013

Slide Icon "Voluntary Initiatives: CDP, Measuring and reporting climate and water risk"

Presentation by Chrystina Gastelum of CDP

This is the second of six presentations from the It's Not Easy Being Green conference at Boston, June 5 , 2013

Slide Icon "Canadian Chemicals Management Plan"

Presentation by Bev Christian, Director of Materials Interconnection at Blackberry

This is the first of six presentations from the It's Not Easy Being Green conference at Boston, June 5, 2013

Slide Icon "Disruptive Environmental Trends (and Some Other Things of Concern)"

Presentation by Fern Abrams, Director Government Relations and Environmental Policy, IPC

This presentation was recorded live in San Diego, California at the EMS Management Meeting during IPC APEX EXPO on February 18, 2013

Slide Icon "Energy Efficiency and Global Warming: A View from the Trenches"

Presentation by William Haas of Seagate Technology

This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

Slide Icon "California’s Safer Consumer Products Regulations"

Presentation by Art Fong of IBM Corporation

This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

Slide Icon "iNEMI 2013 Environmentally Sustainable Electronics"

Presentation by Aimee Siegler of Benchmark Electronics

This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

Slide Icon "EPA and the Future of Sustainable Products"

Presentation by John Katz of the EPA

This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

Slide Icon "Streamlining Data Paths for Product Eco-footprinting"

Presentation by N. Nagaraj, Ph.D., PE, of Papros, Inc.

This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

Slide Icon "1752 Builder and Spreadsheet"

Presentation by John Kudet of PTC

This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

Slide Icon "India RoHS/WEEE, Vietnam RoHS"

Presentation by Mike Kirschner of ENVIRON

This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

Slide Icon "The Gallium Arsenide Industry Team (GAIT)"

Presentation by John Sharp of TriQuint Semiconductor, Inc.

This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

Slide Icon "EU REACH Update"

Presentation by Mike Kirschner of ENVIRON

This presentation was recorded live in San Francisco, California at the IPC conference, “It’s Not Easy Being Green: Regulations and Industry Trends Update” on October 30-31, 2012

Slide Icon "Environmental Policy and Corporate Social Responsibility"

Presentation by Fern Abrams of IPC

This presentation was recorded live in Schaumburg, Illinois during the IPC Executive Summit on August 21, 2012 in conjunction with IPC Midwest Conference & Exhibition™

Slide Icon "2-18/2-18b 175X Standard V1.1 and V2.0 Comparisons"

Presentation by Mark Frimann of Texas Instruments

This presentation was recorded live in Boston, Massachussetts at the IPC conference "It's Not Easy Being Green: Roadmap for Compliance," May 11, 2011

Slide Icon "IPC 1752 — Standard for Materials Declaration"

Presentation by Mark Frimann of Texas Instruments

This presentation was recorded live in Irvine, California at the IPC conference "It’s Not Easy Being Green: Complying with Changing Global Environmental Laws," November 10, 2009

Slide Icon "Flame Retardants — Fire Safety, Regulatory Status & Sustainability"

Presentation by Susan D. Landry of Albemarle Corporation

This presentation was recorded live in Irvine, California at the IPC conference "It’s Not Easy Being Green: Complying with Changing Global Environmental Laws," November 10, 2009

Slide Icon "Update on Critical Environmental Issues for Electronics"

Presentation by Stephanie Castorina, Manager of Environmental Programs for IPC

This presentation was recorded live in Minneapolis, Minnesota at the Surface Mount Technology Association (SMTA) Upper Midwest (UMW) Chapter conference, March 10, 2009

Slide Icon "Halogen Free Update — Environmental Regulations and Review"

Presentation by Susan D. Landry of Albemarle Corporation

This presentation was recorded live in San Jose, California at the IPC Symposium on Electronics and the Environment, "It’s Not Easy Being Green: Compliance with Legislation and Customer Requirements," February 4–5, 2009

Slide Icon "Green Chemistry Initiative Final Report"

Presentation by Maureen Gorsen of the State of California

This presentation was recorded live in San Jose, California at the IPC Symposium on Electronics and the Environment, "It’s Not Easy Being Green: Compliance with Legislation and Customer Requirements", February 4–5, 2009

Slide Icon "Environmental Megatrends and the Future of the Electronics Industry"

Presentation by Paul Goodman of ERA Technology Ltd.

This presentation was recorded live in Kissimmee, Florida at IPC’s Executive Marketing & Technology Forum Conference and Management Meetings, October 29–30, 2008

Slide Icon "More Than One Way to Lead-Free: Status Report on Lead Free Processes"

Presentation by Leo Lambert of EPTAC Corporation

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

Slide Icon "Impact of the Öko-Institut Recommendations on an Avionics OEM"

Presentation by David Hillman of Rockwell Collins

This presentation was recorded live in Brussels, Belgium at IPC’s Meeting Industry Response to Öko-Institut Recommendations, June 18, 2008

Slide Icon "US EPA Flame Retardants in Printed Circuit Boards Partnership"

Presentation by Fern Abrams Director, Government Relations and Environmental Policy

This presentation was recorded live in Brussels, Belgium at IPC’s Meeting Industry Response to Öko-Institut Recommendations, June 18, 2008

Slide Icon "Summary of Öko–Institut Recommendations & General Issues"

Presentation by Paul Goodman of ERA Technology Ltd.

This presentation was recorded live in Brussels, Belgium at IPC’s Meeting Industry Response to Öko-Institut Recommendations, June 18, 2008

Audio DSW Rule: Industry Perspective

Bret Bruhn, environmental operations manager for Merix Corporation in North America, and member of the IPC EHS steering committee, shares the benefits the new definition of solid waste rule brings the industry and provides an example of how the new rule will be used.

 

Audio Halogen-free challenges

Tim Jensen from Indium Corporation talks about the challenges the industry faces in becoming halogen-free.

 

Podcast More Than One Way to Lead Free Assembly

Leo Lambert discusses the latest in lead-free assembly.


Podcast RoHS revision draft

Fern Abrams, IPC director of government relations and environmental policy, tells us the implications the RoHS revision may have on the industry.


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Market Research Presentations

Slide Icon "Impact of the 2011 Disaster in Japan"

Presentation by Sharon Starr, Director of Market Research for IPC

This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011

Slide Icon "Trends in the Flexible Circuit Industry — Highlights from New IPC Studies"

Presentation by Sharon Starr, Director of Market Research for IPC

This presentation was recorded live in Minneapolis, Minnesota during the IPC International Conference on Flexible Circuits, June 22, 2011

Slide Icon "Market Update for the EMS Industry"

Presentation by Sharon Starr, Director of Market Research for IPC

This presentation was recorded live as a webinar, December 14, 2010

Slide Icon "Market Update for the PCB Industry"

Presentation by Sharon Starr, Director of Market Research for IPC

This presentation was recorded live as a webinar, November 30, 2010

Slide Icon "New Findings from the Latest IPC Studies"

Presentation by Sharon Starr, Director of Market Research for IPC

This presentation was recorded live in Scottsdale, Arizona during the IPC Electronics Industry Executive Summit, October 21-22, 2009

Slide Icon "Good Industry Statistics: Where to Find Them and What They Mean"

Presentation by Sharon Starr, Director of Market Research for IPC

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

Slide Icon "Emerging Applications and Material Issues for Embedded Components"

Presentation by Karen Carpenter of TechSearch International

This presentation was recorded live at IPC's Executive Market & Technology Forums in Shanghai, China and Las Vegas, Nevada, September 19, 2007

Slide Icon "The Business of Managing Innovation: What Decision Makers Need to Know"

Presentation by Shauzab H. Ladha of IBM

This presentation was recorded live at IPC's Executive Market & Technology Forums in Shanghai, China and Las Vegas, Nevada, September 19, 2007

Slide Icon "The Inevitable Transition to HDI Boards"

Presentation by Martin Rausch of Intel Corporation

This presentation was recorded live in Las Vegas, Nevada at IPC’s Executive Market & Technology Forum, October 24, 2007

Podcast IPC Market Research

Sharon Starr, director of market research for IPC, illustrates some of the industry data available to IPC members and explains how the information can be used to help companies thrive.

 

Podcast The road to the industry’s recovery

IPC’s Supply Chain Tracker offers important insights into the health of the electronics interconnect industry. Sharon Starr, director of market research for IPC, talks about some encouraging industry data for IPC’s members.

 
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Government Relations Presentations

Slide Icon"Conflict Minerals: It Can and Will Impact the Electronics Industry"

Presentation by Fern Abrams of IPC

This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011

Slide Icon"Trade Adjustment Assistance for Firms"

Presentation by Dr. John Mercer of MidAtlantic Trade Adjustment Assistance Center (MATAAC)

This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

Slide Icon"Surviving & Thriving"

Presentation by David Hollingsworth of Ascentron

This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

Slide Icon"The World View: Factors Impacting American Competitiveness"

Presentation by Philip Plonski of Prismark Partners, LLC

This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

Slide Icon"Start Over vs. Start Up"

Presentation by Mark Northrup of IEC Electronics

This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

Slide Icon"How US Electronics Manufacturers are Ensuring Their Competitiveness"

Presentation by Nilesh Naik of the OneSourceGroup

This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

Slide Icon"How U.S. Manufacturers Are Ensuring Their Competitiveness"

Presentation by Mark Kannenberg of RBP Chemical Technology, Inc.

This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

Slide Icon"How to Lobby: Effectively Communicating with Congress"

Presentation by Liz Reilly of the National Confectioners Association

This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

Slide Icon"Regulations: The Hidden Tax That Stops Economic Growth In America"

Presentation by David McIntosh, former Congressman, now of Meyer Brown, LLP

This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011

Slide Icon"The Political Climate's Impact on the Industry"

Presentation by Fern Abrams, Director, Government Relations and Environmental Policy, IPC

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011

Book "The Movement to Ban Conflict Metals: It Can and Will Impact the Electronics Industry"

Presentation by:
  • Anthony Hilvers, Vice President, Industry Programs, IPC
  • Kay Nimmo, ITRI
  • Fern Abrams, Director, Government Relations and Environmental Policy, IPC

This webinar took place on October 8, 2010

Slide Icon "The Directorate of Defense Trade Controls Overview"

Presentation by Candace M.J. Goforth, Directorate of Defense Trade Controls, U.S. Department of State

This presentation was recorded live in Washington, D.C. at the IPC Conference for the North American EMS Industry, “What it Takes to Supply the Military,” September 15, 2010

Slide Icon "DoD PCB Executive Agent"

Presentation by Ron Chamrin, Manager of Government Relations for IPC

This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event, May 6-8, 2009

Slide Icon "How to Effectively Lobby"

Presentation by Martha Cogdell of Rockwell Collins

This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event, May 6-8, 2009

Slide Icon "Net Operating Loss Relief"

Presentation by Monica McGuire of the National Association of Manufacturers (NAM)

This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event, May 6-8, 2009

Slide Icon "Research and Development Tax Credits"

Presentation by Karen Magee Myers of CA, Inc.

This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event, May 6-8, 2009

Podcast Understanding ITAR

Joe O'Neil explains best practices for these often misunderstood regulations.


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