Technology Presentations
Presentation by Bob Willis of SMART Group
This presentation was recorded live as a webinar on January 12, 2012
Presentation by Jelena Bradic of Com Dev, Ltd.
This presentation was recorded live in Irvine, California at the IPC Conference on Reliability: Assembly Process for a Reliable Product, October 31-November 2, 2011
Presentation by Chrys Shea of Shea Engineering Services
This presentation was recorded live in Irvine, California at the IPC Conference on Reliability: Assembly Process for a Reliable Product, October 31-November 2, 2011
Presentation by Jason Fullerton of ACI Technologies, Inc.
This presentation was recorded live in Irvine, California at the IPC Conference on Reliability: Assembly Process for a Reliable Product, October 31-November 2, 2011
Presentation by Sheryl Tulkoff and Dr. Nathan Blattau of DfR Solutions
This presentation was recorded live in Irvine, California at the IPC Conference on Reliability: Assembly Process for a Reliable Product, October 31-November 2, 2011
Presentation by Ian Hemmings of Tapco Circuit Supply
This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011
Presentation by Anthony Welo of Arlon
This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011
Presentation by John Bauer of Rockwell Collins
This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011
Presentation by Eric Malo of Research In Motion
This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011
Presentation by Crystal Vanderpan of UL
This presentation was recorded live as a webinar on May 4, 2011
Presentation by Don Ball of Chemcut Corporation
This presentation was recorded live in Baltimore, Maryland at the IPC Conference on HDI: High Performance Strategies for the 21st Century, sponsored by Northrup Grumman Corporation, March 1-2, 2011
Presentation by Dr. Martin Bayes of Dow Electronic Materials
This presentation was recorded live in Baltimore, Maryland at the IPC Conference on HDI: High Performance Strategies for the 21st Century, sponsored by Northrup Grumman Corporation, March 1-2, 2011
Presentation by Dave McGregor of DuPont
This presentation was recorded live in Baltimore, Maryland at the IPC Conference on HDI: High Performance Strategies for the 21st Century, sponsored by Northrup Grumman Corporation, March 1-2, 2011
Presentation by Mike Carano of OMG Electronic Chemicals
This presentation was recorded live in Baltimore, Maryland at the IPC Conference on HDI: High Performance Strategies for the 21st Century, sponsored by Northrup Grumman Corporation, March 1-2, 2011
Presentation by Raj Kumar of DDi Corp.
This presentation was recorded live in Irvine, California at the IPC Conference on Printed Electronics, January 18-19, 2011
Presentation by John Andresakis of Oak-Mitsui Technologies
This presentation was recorded live in Irvine, California at the IPC Conference on Printed Electronics, January 18-19, 2011
Presentation by Jeff Duce of Boeing
This presentation was recorded live in Irvine, California at the IPC Conference on Printed Electronics, January 18-19, 2011
Presentation by Paco Solis of Foresite, Inc.
This presentation was recorded live in Schaumburg, Illinois at the IPC Tin Whiskers Conference, December 6-7, 2010
Presentation by Robert Farrell of Benchmark Electronics
This presentation was recorded live in Schaumburg, Illinois at the IPC Tin Whiskers Conference, December 6-7, 2010
Presentation by Ted Schnetker of Hamilton Sundstrand
This presentation was recorded live in Schaumburg, Illinois at the IPC Tin Whiskers Conference, December 6-7, 2010
Presentation by George Milad of Uyemora International Corporation
This presentation was recorded live in Schaumburg, Illinois at the IPC Tin Whiskers Conference, December 6-7, 2010
Presentation by Greg Smith of Milplex Circuits, Inc. (Canada)
This presentation was recorded live in Irvine, California at the IPC Technology Interchange on Thermal Management, November 3-4, 2010
Presentation by David Vaughan of Taiyo America
This presentation was recorded live in Irvine, California at the IPC Technology Interchange on Thermal Management, November 3-4, 2010
Presentation by Yash Sutariya of Saturn Electronics Corporation
This presentation was recorded live in Irvine, California at the IPC Technology Interchange on Thermal Management, November 3-4, 2010
Presentation by Tom Lantzer of DuPont Circuit and Packaging Materials
This presentation was recorded live in Palm Springs, California at the IPC Electronics Industry Executive Summit, October 13, 2010
Presentation by John Conrood of Rogers Corporation
This presentation was recorded live in Irvine, California at the IPC International Conference on Flexible Circuits, June 16, 2010
Presentation by Mark Verbrugge of Minco Products and Sidney Cox of DuPont
This presentation was recorded live in Irvine, California at the IPC International Conference on Flexible Circuits, June 16, 2010
Presentation by George Wenger of the Andrew Division of CommScope
This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010
Presentation by Brian Roggeman of AREA Consortium in conjunction with Advanced Process Laboratory, Universal Instruments Corporation
This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010
Presentation by Kristen Troxel, Hewlett-Packard Company
This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010
Presentation by Raiyomand Aspandiar, Intel Corporation
This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010
Presentation by Kenny Heifner of SMS Technologies, Inc.
This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010
Presentation by David Bergman of IPC
This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009
Presentation by Werner Engelmaier of Engelmaier Associates, LLC
This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009
Presentation by Jean-Paul Clech of EPSI Inc.
This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009
Presentation by Dr. Ganesh Subbarayan of Purdue University
This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009
Presentation by Sean Murray of Assembléon
This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™, March 31-April 2, 2009
Presentation by Eric Slezak of Indium Corporation
This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™, March 31-April 2, 2009
Presentation by Tom Newton Director of PCB Programs, Standards and Technology for IPC
This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008
Presentation by Dr. Scott Strand of IBM
This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008
Presentation by Mike Model of Lineage Power
This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008
Presentation by Don Gerstle of Murata Power Solutions
This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008
Presentation by T. Paul Parker of Lineage Power from a technical paper authored by Dr. Bill Tian, Hewlett-Packard
This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008
Presentation by Jerry Strunk of Lineage Power
This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008
Presentation by Lynn Simmons of Dell, Inc.
This presentation was recorded live in Irving, Texas, at the IPC-9592 Conference, November 6, 2008
Presentation by Linda Woody of Lockheed Martin Martin Missiles and Fire Control Systems
This presentation was recorded live in Rosemont, Illinois, at the IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium, October 29, 2008
Presentation by Jack Fisher, Chairman of the IPC National Technology Roadmap For Electronic Interconnections and a consultant on interconnect technology
This presentation was recorded live in Irving, Texas during the IPC HDI Technology Conference: Building the Supply Chain Infrastructure, October 6-8, 2008
Presentation by Bev Christian of Research In Motion
This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008
Presentation by Jim Fuller
of Endicott Interconnect Technology Inc.
This presentation was recorded live in Endicott, New York at The Endicott Technology Interchange sponsored by IPC, May 14, 2008
Presentation by Karl Dietz, Ph.D. of DuPont
This presentation was recorded live in Endicott, New York at The Endicott Technology Interchange sponsored by IPC, May 14, 2008
Presentation by Happy Holden of Mentor Graphics
This presentation was recorded live in Endicott, New York at The Endicott Technology Interchange sponsored by IPC, May 14, 2008
Design and Assembly Process Standard for Ball Grid Array update
Standard for Determining Current-Carrying Capacity in Printed Board Design
Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
John Perry, IPC staff liaison of the IPC D-53 Embedded Device Performance Subcommittee, provides an overview of IPC-6017, Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
Rework, Modification & Repair of Electronic Assemblies
Cliff Maddox, co-chairman of the IPC 7-32c committee, provides an overview of IPC-9252, Requirements for Electrical Testing of Unpopulated Printed Boards
Dr. Scott Strand, senior technical staff member, integrated technology, IBM, provides an overview of IPC-9592
Revision B Requirements for Soldering Fluxes
Paul Krystek, lead co-chairman of the ECA/IPC/JEDEC J-STD-075 committee, provides an overview of J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes
Fred Loneker, a senior manager with ENVIRON International Corp., talks about the implications the RoHS revision draft will have on the medical electronics industry
Greg Munie, IPC conference director, provides an overview of the development of a new alloy test standard
An introduction to printed circuit board troubleshooting
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Management Presentations
Presentation by Stephen Cambone, Executive VP, Strategic Development for QinetiQ NA
This presentation was recorded live in Washington, D.C. during the IPC Conference for the PCB Industry: Critical Issues for the Military Market on December 8, 2011
Presentation by Peter Lichtenbaum, Partner in Covington & Burling, LLP
This presentation was recorded live in Washington, D.C. during the IPC Conference for the PCB Industry: Critical Issues for the Military Market on December 8, 2011
Presentation by Sharon Starr, Director of Market Research for IPC
This presentation was recorded live in Washington, D.C. during the IPC Conference for the PCB Industry: Critical Issues for the Military Market on December 8, 2011
Presentation by Nilesh Naik of OneSource Group
This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011
Presentation by James Haley of Ormet Circuits
This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011
Presentation by David Bergman of IPC
This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011
Presentation by Fern Abrams of IPC
This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011
Presentation by Sharon Starr of IPC
This presentation was recorded live in Minneapolis, Minnesota at the IPC International Conference on Flexible Circuits, June 21-23, 2011
Presentation by Jacklin Adams of IBM
This presentation was recorded live in Boston, Massachussetts at IPC conference "It's Not Easy Being Green: Roadmap to Compliance", May 11, 2011
Presentations:- Expanding into High-Growth Emerging Markets: Talent as a Critical Success Factor for Asia-Pacific
David Everheart of Aperion Global
- How to Start a Manufacturing Operation in Mexico
Eduardo R. Saavedra of The Offshore Group
- How to Start Your Business in India
Gunjan Bagla of Amritt, Inc.
These presentations were recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011
Presentation by Bill Murphy of Lockheed Martin
This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011
Presentation by Raymond Sharpe of Isola Group S.A.R.L.
This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011
Presentation by Yash Sutariya of Saturn Electronics Corporation and Saturn Flex Systems, Inc.
This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011
Presentation by Rick Pierson of iSuppli Corporation
This presentation was recorded live in Palm Springs, California at the IPC Electronics Industry Executive Summit, October 13, 2010
Presentation by Bruce Mahone, SAE International
This presentation was recorded live in Washington, D.C. at the IPC Conference for the North American EMS Industry, “What it Takes to Supply the Military,” September 15, 2010
Presentation by Bob Davis, Excelerate, Inc.
This presentation was recorded live in Washington, D.C. at the IPC Conference for the North American EMS Industry, “What it Takes to Supply the Military,” September 15, 2010
Presentation by Al Wasserzug, Vulcan Flex Circuit Corporation and Jay Desai, MFLEX
This presentation was recorded live in Irvine, California at the IPC International Conference on Flexible Circuits, June 16, 2010
Presentation by Jack Calderon, Lincoln International
This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010
Presentation by Brian Throneberry, API Technologies
This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010
Presentation by Ed Smith, Avnet Electronics Marketing Americas
This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010
Presentation by: - James Fuller, Endicott Interconnect Technologies
- Joseph O’Neil, Hunter Technologies
- Mikel Williams, DDi Corp.
This presentation was recorded live in Washington, D.C. during the IPC Technology Interchange, "The North American PCB Industry: It Can and Will Support the Military Market," December 9-10, 2009
Presentation by Sydney Pope of the U.S. Department of Defense
This presentation was recorded live in Washington, D.C. during the IPC Technology Interchange, "The North American PCB Industry: It Can and Will Support the Military Market," December 9-10, 2009
Presentation by Debra Eggeman of IDEA (Independent Distributors of Electronics Association)
This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009
Presentation by Dennis Fritz of SAIC and MacDermid, Inc.
This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009
Presentation by Rick Stanton of Symetrics Industries LLC
This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009
Presentation by Leo Reynolds, Consultant
This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009
Presentation by Mike Carano of OMG Electronic Chemicals
This presentation was recorded live in Las Vegas, Nevada during IPC APEX EXPO™, March 31, 2009
Presentation by John Hartner of Dover Electronic Technologies
This presentation was recorded live in Las Vegas, Nevada during IPC APEX EXPO™, March 31, 2009
Presentation by Greg Papandrew of Bare Board Group Inc.
This presentation was recorded at IPC’s PCB Executive Management Council Meeting in conjunction with the IPC Executive Marketing & Technology Forum Conference and Management Meetings in Kissimmee, Florida, October 29-30, 2008
Presentation by Mark C. Hehl of Hehl & Associates
This presentation was recorded during the IPC SMEMA Management Council Meetings in conjuction with the IPC Executive Marketing & Technology Forum Council and Management Meetings in Kissimmee, Florida, October 29-30, 2008
Presentation by TJ Sponsel II of McGuire Sponsel LLC
This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008
Presentation by Lawrence M. Friedman of Barnes, Richardson & Colburn
This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008
A special presentation with IPC and McGuire Sponsel LLC
Karen Carpenter outlines best practices in marketing
Greg Papandrew discusses best practices in sales
IPC technical conference director Greg Munie shares highlights from the IPC Midwest Conference and Exhibition
IPC President Denny McGuirk shares IPC’s goals for its members and the association in 2009
Attorney Jason Mirabito weighs in on how to effectively develop a patent strategy
Innovation expert Robert Tucker describes the best path to optimal innovation
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Environmental Presentations
Presentation by Mark Frimann of Texas Instruments
This presentation was recorded live in Boston, Massachussetts at the IPC conference "It's Not Easy Being Green: Roadmap for Compliance," May 11, 2011
Presentation by Mark Frimann of Texas Instruments
This presentation was recorded live in Irvine, California at the IPC conference "It’s Not Easy Being Green: Complying with Changing Global Environmental Laws," November 10, 2009
Presentation by Susan D. Landry of Albemarle Corporation
This presentation was recorded live in Irvine, California at the IPC conference "It’s Not Easy Being Green: Complying with Changing Global Environmental Laws," November 10, 2009
Presentation by Stephanie Castorina, Manager of Environmental Programs for IPC
This presentation was recorded live in Minneapolis, Minnesota at the Surface Mount Technology Association (SMTA) Upper Midwest (UMW) Chapter conference, March 10, 2009
Presentation by Susan D. Landry of Albemarle Corporation
This presentation was recorded live in San Jose, California at the IPC Symposium on Electronics and the Environment, "It’s Not Easy Being Green: Compliance with Legislation and Customer Requirements," February 4–5, 2009
Presentation by Maureen Gorsen of the State of California
This presentation was recorded live in San Jose, California at the IPC Symposium on Electronics and the Environment, "It’s Not Easy Being Green: Compliance with Legislation and Customer Requirements", February 4–5, 2009
Presentation by Paul Goodman of ERA Technology Ltd.
This presentation was recorded live in Kissimmee, Florida at IPC’s Executive Marketing & Technology Forum Conference and Management Meetings, October 29–30, 2008
Presentation by Leo Lambert of EPTAC Corporation
This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008
Presentation by David Hillman of Rockwell Collins
This presentation was recorded live in Brussels, Belgium at IPC’s Meeting Industry Response to Öko-Institut Recommendations, June 18, 2008
Presentation by Fern Abrams Director, Government Relations and Environmental Policy
This presentation was recorded live in Brussels, Belgium at IPC’s Meeting Industry Response to Öko-Institut Recommendations, June 18, 2008
Presentation by Paul Goodman of ERA Technology Ltd.
This presentation was recorded live in Brussels, Belgium at IPC’s Meeting Industry Response to Öko-Institut Recommendations, June 18, 2008
Bret Bruhn, environmental operations manager for Merix Corporation in North America, and member of the IPC EHS steering committee, shares the benefits the new definition of solid waste rule brings the industry and provides an example of how the new rule will be used
Tim Jensen from Indium Corporation talks about the challenges the industry faces in becoming halogen-free
Leo Lambert discusses the latest in lead-free assembly
Fern Abrams, IPC director of government relations and environmental policy, tells us the implications the RoHS revision may have on the industry
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Market Research Presentations
Presentation by Sharon Starr, Director of Market Research for IPC
This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011
Presentation by Sharon Starr, Director of Market Research for IPC
This presentation was recorded live in Minneapolis, Minnesota during the IPC International Conference on Flexible Circuits, June 22, 2011
Presentation by Sharon Starr, Director of Market Research for IPC
This presentation was recorded live as a webinar, December 14, 2010
Presentation by Sharon Starr, Director of Market Research for IPC
This presentation was recorded live as a webinar, November 30, 2010
Presentation by Sharon Starr, Director of Market Research for IPC
This presentation was recorded live in Scottsdale, Arizona during the IPC Electronics Industry Executive Summit, October 21-22, 2009
Presentation by Sharon Starr, Director of Market Research for IPC
This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008
Presentation by Karen Carpenter of TechSearch International
This presentation was recorded live at IPC's Executive Market & Technology Forums in Shanghai, China and Las Vegas, Nevada, September 19, 2007
Presentation by Shauzab H. Ladha of IBM
This presentation was recorded live at IPC's Executive Market & Technology Forums in Shanghai, China and Las Vegas, Nevada, September 19, 2007
Presentation by Martin Rausch of Intel Corporation
This presentation was recorded live in Las Vegas, Nevada at IPC’s Executive Market & Technology Forum, October 24, 2007
Sharon Starr, director of market research for IPC, illustrates some of the industry data available to IPC members and explains how the information can be used to help companies thrive
IPC’s Supply Chain Tracker offers important insights into the health of the electronics interconnect industry. Sharon Starr, director of market research for IPC, talks about some encouraging industry data for IPC’s members
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Government Relations Presentations
Presentation by Fern Abrams of IPC
This presentation was recorded live in San Jose, California during the IPC Executive Summit on October 4, 2011
Presentation by Dr. John Mercer of MidAtlantic Trade Adjustment Assistance Center (MATAAC)
This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011
Presentation by David Hollingsworth of Ascentron
This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011
Presentation by Philip Plonski of Prismark Partners, LLC
This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011
Presentation by Mark Northrup of IEC Electronics
This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011
Presentation by Nilesh Naik of the OneSourceGroup
This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011
Presentation by Mark Kannenberg of RBP Chemical Technology, Inc.
This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011
Presentation by Liz Reilly of the National Confectioners Association
This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011
Presentation by David McIntosh, former Congressman, now of Meyer Brown, LLP
This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event as part of the Summit on American Competitiveness, June 15, 2011
Presentation by Fern Abrams, Director, Government Relations and Environmental Policy, IPC
This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2011, April 12-14, 2011
Presentation by:
- Anthony Hilvers, Vice President, Industry Programs, IPC
- Kay Nimmo, ITRI
- Fern Abrams, Director, Government Relations and Environmental Policy, IPC
This webinar took place on October 8, 2010
Presentation by Candace M.J. Goforth, Directorate of Defense Trade Controls, U.S. Department of State
This presentation was recorded live in Washington, D.C. at the IPC Conference for the North American EMS Industry, “What it Takes to Supply the Military,” September 15, 2010
Presentation by Ron Chamrin, Manager of Government Relations for IPC
This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event, May 6-8, 2009
Presentation by Martha Cogdell of Rockwell Collins
This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event, May 6-8, 2009
Presentation by Monica McGuire of the National Association of Manufacturers (NAM)
This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event, May 6-8, 2009
Presentation by Karen Magee Myers of CA, Inc.
This presentation was recorded live in Washington, D.C. during the IPC Capitol Hill Day event, May 6-8, 2009
Joe O'Neil explains best practices for these often misunderstood regulations
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