Technology Presentations

"New PCB Laminates for Use in High Temperature and Harsh Chemistry Environments"

Presentation by John Conrood of Rogers Corporation

This presentation was recorded live in Irvine, California at the IPC International Conference on Flexible Circuits, June 16, 2010

"Electrical vs. Mechanical Requirements and Their Impact on Material Selection"

Presentation by Mark Verbrugge of Minco Products and Sidney Cox of DuPont

This presentation was recorded live in Irvine, California at the IPC International Conference on Flexible Circuits, June 16, 2010

"Telecommunications Case Studies Address Head-in-Pillow (HnP) Defects and Mitigation through Assembly Process Modification and Control"

Presentation by George Wenger of the Andrew Division of CommScope

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

"Characterizing the Lead-free Impact on PCB Pad Craters"

Presentation by Brian Roggeman of AREA Consortium in conjunction with Advanced Process Laboratory, Universal Instruments Corporation

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

"Progress in Developing Industry Standard Test Requirements for Pb-Free Solder Alloys"

Presentation by Kristen Troxel, Hewlett-Packard Company

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

"Challenges in Reflow Profiling Large & High Density Ball Grid Array (BGA) Packages Using Backward Compatible Assembly Processes"

Presentation by Raiyomand Aspandiar, Intel Corporation

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

"The Lean SMT Line"

Presentation by Kenny Heifner of SMS Technologies, Inc.

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

"Implementing Quality and Reliability on the Assembly Line"

Presentation by David Bergman of IPC

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

"Solder Creep-Fatigue Model Parameters for SAC & SnAg Solder Joint Reliability Estimation"

Presentation by Werner Engelmaier of Engelmaier Associates, LLC

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

"Filling in the Gaps in Lead-free Reliability Modeling and Testing"

Presentation by Jean-Paul Clech of EPSI Inc.

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

"Constitutive and Failure Behavior of SnAgCu Solder Joints"

Presentation by Dr. Ganesh Subbarayan of Purdue University

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

"Improving Your Efficiency"

Presentation by Sean Murray of Assembléon

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™, March 31-April 2, 2009

"Improving Your Efficiency"

Presentation by Eric Slezak of Indium Corporation

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™, March 31-April 2, 2009

"IPC-9592: Scope, Applicable Documents and Terms & Definitions"

Presentation by Tom Newton Director of PCB Programs, Standards and Technology for IPC

This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

"IPC-9592: Design for Reliability & Appendix A, Derating Guidelines"

Presentation by Dr. Scott Strand of IBM

This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

"IPC-9592: Product Specification, Documentation & Appendix B"

Presentation by Mike Model of Lineage Power

This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

"IPC-9592: Design Verification Testing & Appendix C"

Presentation by Don Gerstle of Murata Power Solutions

This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

"IPC-9592: Environmental Stress Testing"

Presentation by T. Paul Parker of Lineage Power from a technical paper authored by Dr. Bill Tian, Hewlett-Packard

This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

"IPC-9592: Electromagnetic Susceptibility Testing"

Presentation by Jerry Strunk of Lineage Power

This presentation was recorded live in Irving, Texas at the IPC-9592 Conference, November 6, 2008

"IPC-9592: Quality Processes"

Presentation by Lynn Simmons of Dell, Inc.

This presentation was recorded live in Irving, Texas, at the IPC-9592 Conference, November 6, 2008

"Nozzle Design for Cleaning High Density, Low Profile Assemblies"

Presentation by Linda Woody of Lockheed Martin Martin Missiles and Fire Control Systems

This presentation was recorded live in Rosemont, Illinois, at the IPC/SMTA High-Performance Electronics Assembly Cleaning Symposium, October 29, 2008

"Roadmapping HDI — Interconnect Technology Analysis"

Presentation by Jack Fisher, Chairman of the IPC National Technology Roadmap For Electronic Interconnections and a consultant on interconnect technology

This presentation was recorded live in Irving, Texas during the IPC HDI Technology Conference: Building the Supply Chain Infrastructure, October 6-8, 2008

"Ionic Analysis of Common Beverages Spilled on Electronics"

Presentation by Bev Christian of Research In Motion

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

"The OEM View: PWB Level Integration, Challenges, & Roadmap Requirements"

Presentation by Jim Fuller of Endicott Interconnect Technology Inc.

This presentation was recorded live in Endicott, New York at The Endicott Technology Interchange sponsored by IPC, May 14, 2008

"Abilities and Gaps: Image Transfer Technologies in PWB Fabrication"

Presentation by Karl Dietz, Ph.D. of DuPont

This presentation was recorded live in Endicott, New York at The Endicott Technology Interchange sponsored by IPC, May 14, 2008

"Innovations: Leadership Challenge in PCB System Development Design"

Presentation by Happy Holden of Mentor Graphics

This presentation was recorded live in Endicott, New York at The Endicott Technology Interchange sponsored by IPC, May 14, 2008

Ball Grid Array Update

Design and Assembly Process Standard for Ball Grid Array update

IPC-2152

Standard for Determining Current-Carrying Capacity in Printed Board Design

IPC-4811

Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

IPC-6017

John Perry, IPC staff liaison of the IPC D-53 Embedded Device Performance Subcommittee, provides an overview of IPC-6017, Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

IPC 7711/7721 Revision B

Rework, Modification & Repair of Electronic Assemblies

IPC-9252

Cliff Maddox, co-chairman of the IPC 7-32c committee, provides an overview of IPC-9252, Requirements for Electrical Testing of Unpopulated Printed Boards

IPC-9592, Performance Parameters for Power Conversion Devices

Dr. Scott Strand, senior technical staff member, integrated technology, IBM, provides an overview of IPC-9592

IPC-J-STD-004

Revision B Requirements for Soldering Fluxes

IPC-J-STD-075

Paul Krystek, lead co-chairman of the ECA/IPC/JEDEC J-STD-075 committee, provides an overview of J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes

Medical electronics manufacturing and the RoHS revision

Fred Loneker, a senior manager with ENVIRON International Corp., talks about the implications the RoHS revision draft will have on the medical electronics industry

"Solder Alloy Test Methods: A Status Report"

Greg Munie, IPC conference director, provides an overview of the development of a new alloy test standard

"New Generation - Thermal stress simulation for evaluation of printed circuit boards"

An introduction to printed circuit board troubleshooting

Management Presentations

"Business Opportunities for Aerospace/Government and Consumer Electronics Flex Circuit Manufacturers"

Presentation by Al Wasserzug, Vulcan Flex Circuit Corporation and Jay Desai, MFLEX

This presentation was recorded live in Irvine, California at the IPC International Conference on Flexible Circuits, June 16, 2010

"Are the Consequences of Industry Consolidation Good or Bad?"

Presentation by Jack Calderon, Lincoln International

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

"How Does Cost Accounting Impact Pricing?"

Presentation by Brian Throneberry, API Technologies

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

"High Brightness LEDs: Opportunities, Technologies and Challenges"

Presentation by Ed Smith, Avnet Electronics Marketing Americas

This presentation was recorded live in Las Vegas, Nevada at IPC APEX EXPO™ 2010, April 6-8, 2010

"Recommendations for the North American Electronic Interconnect Industry Support for the Department of Defense"

Presentation by:

• James Fuller, Endicott Interconnect Technologies
• Joseph O’Neil, Hunter Technologies
• Mikel Williams, DDi Corp.

This presentation was recorded live in Washington, District of Columbia during the IPC Technology Interchange, "The North American PCB Industry: It Can and Will Support the Military Market," December 9-10, 2009

"Interconnect Opportunities & Challenges"

Presentation by Sydney Pope of the U.S. Department of Defense

This presentation was recorded live in Washington, District of Columbia during the IPC Technology Interchange, "The North American PCB Industry: It Can and Will Support the Military Market," December 9-10, 2009

"Strategies for Fighting Counterfeiting"

Presentation by Debra Eggeman of IDEA (Independent Distributors of Electronics Association)

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

"Possible IPC Counterfeit Avoidance Management Technique"

Presentation by Dennis Fritz of SAIC and MacDermid, Inc.

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

"Suspect/Counterfeit Electronic Components and Risk Mitigation"

Presentation by Rick Stanton of Symetrics Industries LLC

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

"High Performance Work Teams"

Presentation by Leo Reynolds, Consultant

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-24, 2009

"Opportunities in Large Format Electronics"

Presentation by Mike Carano of OMG Electronic Chemicals

This presentation was recorded live in Las Vegas, Nevada during IPC APEX EXPO™, March 31, 2009

"Partnering to Improve Your Business"

Presentation by John Hartner of Dover Electronic Technologies

This presentation was recorded live in Las Vegas, Nevada during IPC APEX EXPO™, March 31, 2009

"Death of a PCB Salesman"

Presentation by Greg Papandrew of Bare Board Group Inc.

This presentation was recorded at IPC’s PCB Executive Management Council Meeting in conjunction with the IPC Executive Marketing & Technology Forum Conference and Management Meetings in Kissimmee, Florida, October 29-30, 2008

"Opportunities in Low-Cost & Emerging Regions"

Presentation by Mark C. Hehl of Hehl & Associates

This presentation was recorded during the IPC SMEMA Management Council Meetings in conjuction with the IPC Executive Marketing & Technology Forum Council and Management Meetings in Kissimmee, Florida, October 29-30, 2008

"Your Company and the Research & Experimentation Tax Credit"

Presentation by TJ Sponsel II of McGuire Sponsel LLC

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

"Reducing Costs & Avoiding Risk in the Global Market"

Presentation by Lawrence M. Friedman of Barnes, Richardson & Colburn

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

The R&D Tax Credit

A special presentation with IPC and McGuire Sponsel LLC

Building a Marketing Strategy

Karen Carpenter outlines best practices in marketing

Death of a PCB Salesman

Greg Papandrew discusses best practices in sales

IPC Midwest Conference Highlights

IPC technical conference director Greg Munie shares highlights from the IPC Midwest Conference and Exhibition

Looking ahead to 2009

IPC President Denny McGuirk shares IPC’s goals for its members and the association in 2009

Put Your Stamp On It

Attorney Jason Mirabito weighs in on how to effectively develop a patent strategy

The Innovation Evolution

Innovation expert Robert Tucker describes the best path to optimal innovation

Government Relations Presentations

"DoD PCB Executive Agent"

Presentation by Ron Chamrin, Manager of Government Relations for IPC

This presentation was recorded live in Washington, DC during the IPC Capitol Hill Day event, May 6-8, 2009

"How to Effectively Lobby"

Presentation by Martha Cogdell of Rockwell Collins

This presentation was recorded live in Washington, DC during the IPC Capitol Hill Day event, May 6-8, 2009

"Net Operating Loss Relief"

Presentation by Monica McGuire of the National Association of Manufacturers (NAM)

This presentation was recorded live in Washington, DC during the IPC Capitol Hill Day event, May 6-8, 2009

"Research and Development Tax Credits"

Presentation by Karen Magee Myers of CA, Inc.

This presentation was recorded live in Washington, DC during the IPC Capitol Hill Day event, May 6-8, 2009

Understanding ITAR

Joe O'Neil explains best practices for these often misunderstood regulations

Environmental Presentations

"IPC 1752 - Standard for Materials Declaration"

Presentation by Mark Frimann of Texas Instruments

This presentation was recorded live in Irvine, California at the IPC conference "It’s Not Easy Being Green: Complying with Changing Global Environmental Laws," November 10, 2009

"Flame Retardants - Fire Safety, Regulatory Status & Sustainability"

Presentation by Susan D. Landry of Albemarle Corporation

This presentation was recorded live in Irvine, California at the IPC conference "It’s Not Easy Being Green: Complying with Changing Global Environmental Laws," November 10, 2009

"Update on Critical Environmental Issues for Electronics"

Presentation by Stephanie Castorina, Manager of Environmental Programs for IPC

This presentation was recorded live in Minneapolis, Minnesota at the Surface Mount Technology Association (SMTA) Upper Midwest (UMW) Chapter conference, March 10, 2009

"Halogen Free Update — Environmental Regulations and Review"

Presentation by Susan D. Landry of Albemarle Corporation

This presentation was recorded live in San Jose, California at the IPC Symposium on Electronics and the Environment, "It’s Not Easy Being Green: Compliance with Legislation and Customer Requirements," February 4–5, 2009

"Green Chemistry Initiative Final Report"

Presentation by Maureen Gorsen of the State of California

This presentation was recorded live in San Jose, California at the IPC Symposium on Electronics and the Environment, "It’s Not Easy Being Green: Compliance with Legislation and Customer Requirements", February 4–5, 2009

"Environmental Megatrends and the Future of the Electronics Industry"

Presentation by Paul Goodman of ERA Technology Ltd.

This presentation was recorded live in Kissimmee, Florida at IPC’s Executive Marketing & Technology Forum Conference and Management Meetings, October 29–30, 2008

"More Than One Way to Lead-Free: Status Report on Lead Free Processes"

Presentation by Leo Lambert of EPTAC Corporation

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

"Impact of the Öko-Institut Recommendations on an Avionics OEM"

Presentation by David Hillman of Rockwell Collins

This presentation was recorded live in Brussels, Belgium at IPC’s Meeting Industry Response to Öko-Institut Recommendations, June 18, 2008

"US EPA Flame Retardants in Printed Circuit Boards Partnership"

Presentation by Fern Abrams Director, Government Relations and Environmental Policy

This presentation was recorded live in Brussels, Belgium at IPC’s Meeting Industry Response to Öko-Institut Recommendations, June 18, 2008

"Summary of Öko–Institut Recommendations & General Issues"

Presentation by Paul Goodman of ERA Technology Ltd.

This presentation was recorded live in Brussels, Belgium at IPC’s Meeting Industry Response to Öko-Institut Recommendations, June 18, 2008

DSW Rule: Industry Perspective

Bret Bruhn, environmental operations manager for Merix Corporation in North America, and member of the IPC EHS steering committee, shares the benefits the new definition of solid waste rule brings the industry and provides an example of how the new rule will be used

Halogen-free challenges

Tim Jensen from Indium Corporation talks about the challenges the industry faces in becoming halogen-free

More Than One Way to Lead Free Assembly

Leo Lambert discusses the latest in lead-free assembly

RoHS revision draft

Fern Abrams, IPC director of government relations and environmental policy, tells us the implications the RoHS revision may have on the industry

Market Research Presentations

"New Findings from the Latest IPC Studies"

Presentation by Sharon Starr, Director of Market Research for IPC

This presentation was recorded live in Scottsdale, Arizona during the IPC Electronics Industry Executive Summit, October 21-22, 2009

"Good Industry Statistics: Where to Find Them and What They Mean"

Presentation by Sharon Starr, Director of Market Research for IPC

This presentation was recorded live in Schaumburg, Illinois during the IPC Midwest Conference and Exhibition, September 20-25, 2008

"Emerging Applications and Material Issues for Embedded Components"

Presentation by Karen Carpenter of TechSearch International

This presentation was recorded live at IPC's Executive Market & Technology Forums in Shanghai, China and Las Vegas, Nevada, September 19, 2007

"The Business of Managing Innovation: What Decision Makers Need to Know"

Presentation by Shauzab H. Ladha of IBM

This presentation was recorded live at IPC's Executive Market & Technology Forums in Shanghai, China and Las Vegas, Nevada, September 19, 2007

"The Inevitable Transition to HDI Boards"

Presentation by Martin Rausch of Intel Corporation

This presentation was recorded live in Las Vegas, Nevada at IPC’s Executive Market & Technology Forum, October 24, 2007

IPC Market Research

Sharon Starr, director of market research for IPC, illustrates some of the industry data available to IPC members and explains how the information can be used to help companies thrive

The road to the industry’s recovery

IPC’s Supply Chain Tracker offers important insights into the health of the electronics interconnect industry. Sharon Starr, director of market research for IPC, talks about some encouraging industry data for IPC’s members