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IPC the premier standard provider to the electronics industry is proud to announce recently released standards. These standards were developed to keep pace with the ever-changing technology we see daily in the electronics industry. The documents should be used by OEMs, EMS, designers and suppliers of printed circuit boards and electronic assemblies.

Purchase these new standards now!

IPC-9505, Guideline Methodology for Assessing Component and Cleaning Materials Compatibility — This NEW standard from IPC provides details of test methodologies for cleaning chemistry compatibility with electronic assembly materials that replace those in MIL-STD-202 Method 215 for testing electronic and electrical components such as capacitors, resistors, transformers and inductors. The test methods can also be used, when applicable, to parts not covered by military specifications or drawings.

IPC-6012D-AM1, Qualification and Performance Specification for Rigid Printed Boards-English — The standard makes changes to the existing acceptance criteria for copper wrap plating measurements as defined by IPC-6012D. The IPC-6012D-AM1 implements a dual criterion for Class 3 copper wrap plating, based on design effectivity (before and after January 01, 2018), so as not to impose onto legacy designs any additional qualification activity associated with adopting acceptance requirements proven on newer designs. The IPC-6012D-AM1 is not applicable to legacy product that will remain subject to IPC-6012D copper wrap plating requirements.

IPC-7091, Design and Assembly Process Implementation of 3D Components — IPC-7091 intends to provide useful and practical information to those who are designing, developing or using 3D-packaged semiconductor components or those who are considering 3D package implementation. The 3D semiconductor package may include multiple die elements — some homogeneous and some heterogeneous. The package may also include several discrete passive SMT devices, some of which are surface mounted and some of which are integrated (embedded) within the components’ substrate structure.

IPC-J-STD-003C-WAM1&2, Solderability Tests for Printed Boards The IPC-J-STD-003C-WAM1&2 standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands and plated-through holes (PTHs). The IPC-J-STD-003C-WAM1&2 standard is not intended to verify the potential of successful processing at assembly or to evaluate design impact on wettability. The IPC-J-STD-003C-WAM1&2 standard describes procedures or methods to determine the acceptable wettability of a finish. Wettability can be affected by handling, finish application and environmental conditions. This standard describes solderability determinations that are made to verify that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered. Reference coupons or representative portions of a printed board may be used. Solderability is determined by evaluation of a test specimen which has been processed as part of a panel of boards and subsequently removed for testing per the method selected.

IPC would like to thank you for your interest in these and other standards that support the growth of your business. Keep watch for future notices with newly released standards from IPC.

If you have any questions concerning the purchase of standards, please contact IPC’s Customer Service department at +1-847-597-2862 or orderIPC@ipc.org.

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