IPC-Association Connecting Electronics Industries

As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.02 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; and Shanghai, Shenzhen and Beijing, China.

		Deutsch
Joint Industry Guideline Reduces the Stress of Setting Up Strain Gauge Tests A new guideline provides best practices for measuring the strain put on boards and components during manufacturing. Read more		Assembly and Reliability of 1704 I/O FCBGA & FPBGAs Presentation by Reza Ghaffarian, Ph.D. of NASA/Jet Propulsion Laboratory (JPL). View the presentation

Microwave Performance Standard Updates Address Growing Field IPC-6018B addresses a number of changes in microwave technologies and will help engineers design high reliability boards. Read more


Is it permissible to lay out PWBs with 0.8 mm pitch BGAs and meet Class 3 for spacing? Reference to IPC-6012 Specifying depanalization of circuit boards A wide ranging discussion on quality measures when outsourcing printed board fabrication and purchase of components and boards.		North American Electronics Supply Chain Leading Indicators are Positive Participate in new on-shoring survey. Open to all electronics manufacturers in the Americas. Deadline May 25.

Connections

IPC Blog

What are the pros and cons of cleaning no clean? IPC Outlook for Tuesday May 15 is available.

5/16/2012 9:34 AM by Kim Sterling

Plans for Dr. Bill Kenyon Memorial Service Announced

5/14/2012 1:15 PM by Kim Sterling

Ready, Set, GO – Message from new IPC President & CEO John Mitchell

5/11/2012 8:56 AM by Kim Sterling

IPC Tech Question Online

Causes of PCB Delamination

4/25/2012 4:03 PM by Kim Sterling

Industry expert Bob Willis explains and shows photos of the causes of PCB lamination defects with help from the NPL Defect Database.

Have a question? Send your technical question to answers@ipc.org.

See answers to previous Tech Questions Online on the IPC Tech Questions Online Blog.

IPC APEX EXPO^®
February 19-21, 2013 San Diego, Calif.

IPC Midwest Conference & Exhibition
August 22-23, 2012 Schaumburg, Ill.

2012 International Printed Circuit & Electronics Assembly Fair
November 28-30, 2012
Shenzhen, China.


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Events

IPC International Conference on Flexible Circuits
June 12-14, 2012 — Irvine, CA

IPC Executive Summit
August 21-22, 2012 — Schaumburg, IL

IPC Midwest Conference & Exhibition™
August 22-23, 2012 — Schaumburg, IL

IPC International Conference on HDI
October 24-25, 2012 — El Segundo, CA

News

May 15, 2012: IPC Releases Study on Quality Benchmarks for EMS Industry

May 14, 2012: IPC Midwest Spotlights New Resources and Solutions to Reliability Challenges in Electronics Manufacturing
Registration Now Open

May 10, 2012: IPC Board Chairman Steve Pudles Testifies Before Congress
Urges Changes to SEC Proposed Rule on Conflict Minerals

May 3, 2012: New IPC Survey to Measure Impact of On-Shoring in the Electronics Industry
Electronics manufacturers and suppliers encouraged to participate

May 3, 2012: Updates in IPC-6018B Help Engineers Design High-reliability Boards
Specification addresses growing field of microwave technology

April 30, 2012: New IPC President and CEO Begins Tenure with Promise to Accelerate Services to Support Membership

April 30, 2012: IPC-9203 Makes it Easier for Users to Determine Materials Compatibility

April 27, 2012: IPC Releases PCB Industry Results for March 2012

April 26, 2012: Space Selection for IPC APEX EXPO 2013 Set to Bloom in May
Contracted Square Footage for 2013 Already Up 11 Percent

April 24, 2012: IPC Technology Trends Study Reveals Changes in Store for PCB Fabricators and Suppliers

April 11, 2012: IPC Conference Explores Potential of Flexible Circuit Technology

April 6, 2012: IPC and ECIA to Work on Component Obsolesence Guideline

April 4, 2012: IPC Conference in Budapest Booms with Double-digit Growth

April 3, 2012: IPC Issues Call for Participation for 2013 IPC APEX EXPO

April 3, 2012: IPC-A-610E Japanese Language Released: Industry Requirements for Acceptability of Electronic Assemblies Updated

March 30, 2012: IPC Releases PCB Industry Results for February 2012

March 29, 2012: IPC Announces Spring 2012 Webinar Series
Tin Whiskers, PoP Cleaning, PCB Prototyping and Business Outlook to be Covered