PLEASE NOTE: IPC's websites will be undergoing scheduled maintenance Saturday July 26, 2014, 6:00pm-12:00am Central time for approximately six (6) hours. We appreciate your patience.

New IPC Group Focuses on Inexpensive Protection Technologies for Electronics Assemblies

Low pressure molding technology provides protection from harsh environments, yet it's less expensive and easier to work with than some alternatives. IPC has formed a committee that's creating a standard that should help bring this solution into the mainstream.

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IPC Standard Automates Analysis of Banned-Substance Reports

Ensuring that all the electronic components that a company uses meet regulatory requirements for banned substances is a time-consuming manual task. A new standard provides a machine readable format that frees humans from tedious examinations of lab reports.

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Implementation of High Speed Plating for Copper Pillar Fabrication

Presentation by Lynn Michaelson, Senior Materials Scientist at Technic Inc. This presentation was recorded live at the IPC Conference on Component Technology, Chandler Arizona, September 11, 2013.

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February 24-26, 2015 San Diego, Calif., USA

Upcoming Events

IPC Southeast Asia High Reliability Conference
20 August – Penang, Malaysia

IPC Fall Standards Development Committee Meetings co-located with SMTAI
September 28 - October 2 – Rosemont, IL

IPC Europe High Reliability Forum
October 14-15 – Dusseldorf, Germany

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HKPCA International Printed Circuit & 
IPC APEX South China Fair

December 3-5, 2014 Shenzhen, China
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