IPC-Association Connecting Electronics Industries
As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains offices in Bannockburn, Ill. (headquarters); Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.

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Article Exploring Board Design Challenges
Ground planes, decoupling and reflection are among the complex issues
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Article X-ray System Checks All Solder Balls
Automatic inspection accounts for BGA shadows
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Podcast Possible IPC Counterfeit Avoidance Management Technique
Presentation by Dennis Fritz of SAIC and MacDermid, Inc.
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Market Data Update for Winter 2009 is now available to IPC Members. Nonmembers can subscribe here.


 

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IPC Blog

Research and Development Tax Credit Extension Passes U.S. Senate

3/11/2010 8:47 AM  by  Ron Chamrin

On March 10 the U.S. Senate passed by vote of 62 to 36 “The American Workers, State, and Business Tax Relief Act” (H.R. 4213) that includes a seamless one year extension of the Research and Development (R&D) Tax Credit through the end of December 31, 2010. IPC, and fellow members of the R&D Credit Coalition, [...]

Embedded instrumentation set for takeoff

3/10/2010 1:14 PM  by  Terry Costlow

Test may be poised to make another transition, moving to a technique called embedded instrumentation. It’s being touted as a way to overcome the challenges of reaching hidden contacts, and probing circuits that run above 5 Gbits/second adds capacitance that can impact performance. Embedded instrumentation is an extension of boundary scan and built-in self test, in [...]

New Regulatory Requirements for Recycling Byproducts?

3/8/2010 3:18 PM  by  Kim Sterling

By Fern Abrams, IPC Director of Government Relations and Environmental Policy Although neither Congress nor the U.S. EPA (Environmental Protection Agency) have introduced new laws or regulations for byproducts, a new interpretation of existing chemicals regulations may put manufacturers in a bind for doing what they thought was the right thing — recycling. A new interpretation [...]

Tech Question of the Week

Does gold plated solder cup of connector need tinning per J-STD-001?

3/10/2010 5:10 PM  by  IPC

IPC Vice President David Bergman discusses gold embrittlement and why tinning is necessary per J-STD-001 in this video technical question.

Answered by IPC Vice President - International Relations, David Bergman
Originally posted 3/10/10


Have a question? Send your technical question to answers@ipc.org.

See answers to previous Tech Questions of the Week on the IPC Tech Question of the Week Blog.

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March 11, 2010: IPC’s Capitol Hill Day and Executive Market and Technology Conference Focus on Strengthening American Electronics Manufacturing

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February 26, 2010: IPC Releases PCB Industry Results for January 2010

February 25, 2010: New Members of IPC Government Relations Steering Committee Hit the Ground Running

February 24, 2010: New IPC Research Reports Indicate One-Third of North American EMS Companies Likely to Expand Capacity in 2010

February 23, 2010: IPC APEX EXPO™ Professional Development Courses Connect With Industry Needs

February 18, 2010: Latest Research on Lead-Free Implementation Challenges & New Opportunities Drives IPC APEX EXPO™ Technical Conference

February 17, 2010: PCB and EMS Leaders Poised to Find Ways to Thrive in 2010 at IPC APEX EXPO™

February 15, 2010: New IPC Standard Helps Define How Clean Is Clean

February 8, 2010: 2010 IPC Designers Day Has Designs on the Future

February 4, 2010: Global Business Outlook Keynote at IPC APEX EXPO™ Preps Industry for Recovery and Vital Planning

February 1, 2010: IPC Releases PCB Industry Results for December 2009

January 28, 2010: New Adversaries, New Challenges Changing the Focus of the U.S. Department of Defense: IPC APEX EXPO™ Keynote Highlights Role of the Electronics Industry

January 27, 2010: IPC Publishes Wage and Salary Study for EMS Industry

January 26, 2010: IPC Seeks Industry Votes on Top Ten Academic Posters

January 21, 2010: IPC Executive Summit Highlights Recorded Live: Major Market Opportunities and Key Management Issues Featured

January 11, 2010: IPC and Canon Communications to Collaborate on Midwest’s Largest Electronics Manufacturing Trade Show

January 6, 2010: IPC Issues Call for Nominations for Corporate and Individual Awards

January 4, 2010: IPC Solder Products Value Council Issues Report on Take Action Limits for SAC Lead-Free Solder Processes