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Committee D-64 Printed Electronics Final Assembly Subcommittee
Co-Chair
Co-Chair
Jeff Shubrooks, Raytheon Company;
Michael J Jawitz, Northrop Grumman Innovation Systems
Staff Liaison Chris Jorgensen

Jeanne Cooney

Committee Charter This subcommittee is developing IPC-6902, Qualification and Performance Specifications for Printed Electronics on Flexible Substrates. This standard will establish and define the qualification and performance requirements for printed electronic applications and their forms of component mounting and interconnecting structures on flexible substrates.


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