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Committee D-55 Embedded Devices Process Implementation Subcommittee
Chair Rajesh C Kumar, TTM Technologies
Vice Chair Bruce V Hughes, U.S. Army Aviation & Missle Command
Staff Liaison Chris Jorgensen
Committee Charter This subcommittee is responsible for developing IPC-7092 Design and Assembly Process Implementation for Embedded Components. This document describes the design and assembly challenges for implementing passive and active components, in either formed or inserted methodology, into a printed board.


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