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Committee D-21 High Speed/High Frequency Design Subcommittee
Chair Scott A Bowles, L3 Fuzing and Ordnance Systems, Cincinnati
Vice Chair Kristopher Moyer
Staff Liaison John Perry
Committee Charter This subcommittee is responsible for developing guidelines and specifications for products requiring high speed, high frequency, controlled impedance or microwave characteristics. The subcommittee is working to develop an IPC-2228 design standard for RF/Microwave printed boards.
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