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Committee 5-21f Ball Grid Array Task Group
Chair Ray Prasad, Ray Prasad Consultancy Group
Vice Chair Robert Rowland, Axiom Electronics, LLC
Staff Liaison Chris Jorgensen
Committee Charter This task group is responsible for the maintenance and further development of IPC-7095, Design and Assembly Process Implementation for BGAs. This document covers the characteristics for all elements of developing a cohesive product that uses BGA packages as components in the electronic assembly. In addition, there are recommendations for void acceptability and defect analysis.
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