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Committee 4-14 Plating Processes Subcommittee
Gerard A O'Brien, Solderability Testing & Solutions, Inc.;
George Milad, Uyemura International Corp.
Staff Liaison Tom Newton
Committee Charter This subcommittee is responsible for the development of technical information, guidelines and testing techniques to evaluate plating characteristics for printed boards and interconnecting substrates. It is responsible for maintaining the IPC-455X-series of plating standards.
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