IPC Europe Forum: Innovation for Reliability

REGISTER NOW FOR THE HIGH RELIABILITY FORUM

If you are involved in mil-aero or automotive electronics, you won’t want to miss this technical conference focused on electronics subjected to harsh use environments.

Join us in Linthicum (Baltimore), MD May 15-17

Topics of discussion include:

  • HDI Microvia Reliability for Any Temperature Extreme
  • System-level Effects on Solder Joint Reliability
  • How MSI Applied Technology Beat the Microvia Hidden Threat
  • A Review of Metallization Interfaces on Microvia Reliability
  • Reliability Coupons
  • Revisions to IPC-6012: Test Coupons, Test Boards and Reflow Testing

The program will kickoff with a half-day tutorial: Achieving Improved Reliability with Failure Analysis, presented by Bhanu Sood, Commodity Risk Assessment Engineer, NASA Goddard Space Flight Center.

There will also be a special presentation on the results from the Department of Commerce study on the printed circuit board industry and a featured panel discussion: Forgotten Tribal Knowledge addressing conformal coating reliability, use of material combinations and stripping off gold from components.

The event will include presentations from the following:

  • i3 Electronics
  • American Standard Circuits
  • Conductor Analysis Technologies, Inc.
  • DfR Solutions
  • Honeywell Aerospace
  • Lockheed Martin Missiles and Fire Control
  • Motorola
  • Raytheon
  • RBP Chemical
  • SAIC
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