Tuesday, October 25

8:00 am
Check-in with Coffee

9:00 am

DFX – Design For Excellence: Focus on DFR-Design For Reliability of Hardware to be Cleaned
Instructor: Dale Lee, Senior DFX Engineer, Plexus Corporation
12:00 pm Lunch
1:00 pm Check-in for afternoon Tutorial
2:00 pm Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies
Instructors: Doug Pauls, Principal Materials & Process Engineer, Rockwell Collins and
Jason Keeping, P.Eng., Corporate Engineering Project Manager, Ruggedized Electronics Sector, Celestica Inc.
5:00 Adjourn

Wednesday, October 26: Technical Conference — Day 1

7:30 am

Check-in, Coffee, Networking, Exhibits

9:00 am Opening Remarks by Program Chair
Dr. Mike Bixenman, CTO and Founder, KYZEN Corporation

Keynote Presentation: Building Reliable Hardware
Siva Sivasankar, Quality & Reliability Engineer, Google
Session 1: Processes for Achieving Reliability and Ruggedization
Session Chair: Mike Konrad, Aqueous Technologies
9:45 am Use of No-Clean Flux Activator Residues on SIR
Bruno Tolla, Ph.D., R&D Director, Kester
10:15 am Break
10:30 am Real-Time SIR Test Method: Test Boards with Sensors Under the Bottom Termination
Mark McMeen, VP of Engineering, STI Electronics
11:00 am Focus on Field Failures: Spot Extractions for IC to Benchmark End-Use Environment
Kelly Flanagan, Materials Scientist, Rockwell Collins
11:30 am Research for Improvement in Transfer Efficiency Coatings on Stencils
Chrys Shea, Principal, Shea Engineering
12:00 pm Networking Luncheon
Session 2: Cleaning Materials, Machines, Rinsing and Process Control
Session Chair: Sal Sparacino, ZESTRON Americas
1:30 pm Power Electronics Cleaning — Solvent to pH Neutral: Enhancing Safety, Process Efficiency and Productivity Case Study
Ravi Parthasarathy, M.S.Ch.E., Senior Application Engineer, ZESTRON Americas
2:00 pm The Lonely Rinse Cycle — Keys to Successful Cleaning
Mike Konrad, President, Aqueous Technologies
2:30 pm Cleaning High-Density Interconnects: Equipment Case Study
Jody Saultz, Application Engineer, Speedline Technologies
3:00 pm Break
3:15 pm Reliability of the Cleaning Process: A Case Study
Ram Wissel, Technology Manager, KYZEN Corporation
3:45 pm Process Control & Optimization — Case Studies
Naveen Ravindran, M.S. Ch.E., Senior Application Engineer, ZESTRON Americas
Session 3: Conformal Coating for Class 2 and 3 Electronic Assemblies
Session Chair: Jason Keeping, Celestica Inc.
4:15 pm Air Plasma at Atmospheric-Pressure for Improving Conformal Coating Reliability
Mathieu Gonsolin, Deputy Managing Director and Ronan Subilieau, Technology Manager, eXelsius
4:45 pm Performance as a Function of Coating Thickness for Ultrathin Fluoropolymer Coatings
Molly Smith, Product Development, 3M
5:15 pm Introduction to an Innovative Cleaning Process for Class 3 Electronic Assemblies
Erik Deschuyffeleer, Business Development Manager North America, MBtech
5:45–7:00 pm Networking Reception for all Event Participants: Attendees, Speakers, Instructors, Exhibitors

Thursday, October 27: Technical Conference — Day 2

7:00 am Coffee, Networking, Exhibits
8:00 am

Opening Remarks by Program Chair
Dr. Mike Bixenman, CTO and Founder, KYZEN Corpopation

Keynote: Requirements for both Cleaning and Coating to Building Reliable Medical Hardware
Dock Brown, Senior Technical Staff, DfR Solutions

Session 4: Customer Cleaning Challenges and Needs
Session Chairs: Dave Adams and Eddie Hofer, Rockwell Collins
8:45 am Low Standoff Cleaning Comparison Batch vs. Inline vs Vertical Conveyor
Eric Camden, Lead Investigator, Foresite
9:15 am A Guide to a Multi-Metal Safe Cleaning Agent Design
Haley Jones, R & D Chemist, KYZEN Corporation
9:45 am Pitting / Crevice Corrosion Research, Sponsored by HDPug Consortium
Dr. Mike Bixenman, CTO and Founder, KYZEN Corporation
10:15 am Break
10:30 am Optimization of Chemistry for a Vapour Phase Process for Defluxing No-Clean Lead-Free Materials 
Leigh Gesick, Director of Operations-USA, Inventec
11:00 am New Vapor Degreasing Chemistries to Remove Difficult Lead-Free and No-Clean Fluxes from Modern PCBs 
Venesia Hurtubise, Chemical Analyst & Sales Engineer, MicroCare Corporation
11:30 am

Material Compatibility: Status Update for IPC 5-31j Document for Component Cleaning-Compatibility- Test
Dave Adams, Principal Materials & Process Engineer and Eddie Hofer, M & P Engineer, Rockwell Collins

Cleaning Compatibility: An Evaluation of Solvent vs Aqueous Cleaning Processes Utilizing Methods
Outlined by IPC Task Group 5-31j

Wendy Casker, Section Supervisor, Johns Hopkins APL

12:15 pm Working Lunch
Session 5: Ultra-Thin or Nanocoatings in Electronics Assembly Operations
Session Chair: Doug Pauls, Rockwell Collins
1:00 pm Conformal Coating for Class 3 Hardware
Amanda Rickman, Process Engineer, Raytheon
1:30 pm Evaluating Masking Residues
Doug Pauls, Principal Materials & Process Engineer, Rockwell Collins
2:00 pm The Impact of Improper Conformal Coating Processes on Lead-free BGA Solder Joint Integrity
Dave Hillman, Principal Materials & Process Engineer, Rockwell Collins
2:30 pm Closing Remarks from Program Chair
Dr. Mike Bixenman, CTO and Founder, KYZEN Corporation
3:00 pm Adjourn


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