IPC Conference on Assembly and Reliability
27 January 2015 - Mövenpick Hotel Saigon, Ho Chi Minh City, Vietnam
29 January 2015 - Miracle Grand Convention Hotel, Bangkok, Thailand

Conference Presenters

David Bergman
Vice President
International Relations, IPC

David Bergman, Vice President of International Relations, IPC, has more than 30 years of experience at the global trade association. He has organized and led task groups toward the implementation of IPC standards, spoken at various technology conferences and seminars around the world and has led the successful expansion of IPC in China and Southeast Asia.

Jason Chan
Asia Technology Manager
Kyzen Corporation

Jason Chan, Asia Technology Manager, Kyzen Corp., has 10 years of experience on semiconductor applications and electronic assemblies including the Wafer Bumping process, Flip Chip packaging, LED packaging, passive and hybrid components, PCB assembly applications, and other related fields. Jason is responsible for delivering cleaning knowledge and practical solutions to valuable customers and partners in Asia. Jason earned his master's in computer information systems at the University of Detroit Mercy in Detroit, Michigan, USA.

Kevin Tan
Senior Technical Service Engineer
Henkel Singapore

Kevin Tan, Senior Technical Service Engineer, Henkel Singapore, has been focusing mainly on surface mount adhesives, solder technology and die attach for semiconductor applications since 2010. He holds a BEng (1st Class Honors) from Nanyang Technological University in the area of materials science. In 2011, he published and presented an engineering paper at the Penang Chapter of the Surface Mount Technology Association Conference on the topic of "Flux spatter in reflow soldering". This same paper was also present in Nepcon Shenzhen China later that year. In 2012, he presented another paper entitled "Underfill and flux compatibility from a curing perspective" in China Semiconductor Conference held in Shanghai. In 2013, he continued his studies on underfill and flux compatibility and published the paper "Material set compatibility" which he presented at the IPC Conference in Thailand.

Wayne Ng

Regional Technical Manager
Nihon Superior Co. Ltd.

Wayne Ng Chee Weng is Regional Technical Manager of Nihon Superior Co. Ltd. He is handling the technical matters of Nihon Superior products and providing application consultancy to customers. With feedback from the field, he is helping company to develop products which can fit the market better. Wayne obtained his first degree in Mechanical-Industrial Engineering with First Class Honors in 2003 from University of Technology Malaysia. He had furthered his studies in the same university and graduated with Master of Engineering (Mechanical) with the research project of Integrated Circuit Package Reliability. He is certified in PMP and CIT IPC-A-610. Before joining Nihon Superior, he held positions in IC package development department of Infineon Technologies Asia Pacific and product reliability and quality management in Micron Semiconductor Asia, Singapore.

Guan Tatt Yeoh

Senior Application Engineer
ZESTRON South Asia

Guan Tatt Yeoh, Senior Application Engineer, ZESTRON South Asia is an active member of the SMTA as well as IPC and has presented the findings of ZESTRON's research papers at numerous industry events.  Yeoh graduated with a degree in Electrical & Electronics Engineering from Silicone Institute of Technology, Malaysia.  He has worked continuously within the electronics assembly equipment industry since 1997, mainly in semiconductor, machinery and equipment industry.  He has been with ZESTRON since 2009. 

Kenneth Thum

Senior Technical Engineer
Indium Corporation

Kenneth Thum is Senior Technical Support Engineer for Indium Corporation and is based in Penang, Malaysia. Kenneth assists customers in northern Malaysia with troubleshooting issues, and provides technical support for Indium Corporation's full product range. He has years of experience in leading teams of technicians to improve yields and supplier quality. Kenneth holds a bachelor's degree from the University of Malaya in computer aided design and computer aided manufacturing. Additionally, he is an SMTA-certified process engineer.

Nguyen Viet Truong
Assistant Technical Manager
Indium Corporation

Nguyen Viet Truong is the Assistant Technical Manager for Indium Corporation's Asia Pacific Operations. Based in Hanoi, he is responsible for providing technical support for Indium Corporation's full product range in Vietnam. He has years of experience working as a Service Engineer in solder screen printing, reflow, and pick-and-place machines. Truong holds a bachelor's degree from Hanoi University of Technology in Automation.  Truong also is an SMTA-certified Process Engineer.

Mok Tuck Weng,
Manager-Global Application Technology & Engineering,

Mok Tuck Weng, manager, Global Application Technology & Engineering at Alpha, started out 25 years ago in process engineering, responsible for military specification peripheral equipment. His next role involved participating in a factory setup for consumer office equipment as a manufacturing engineer. Stepping into the supply side of the business, he took on a global technical sales role in laser soldering and semiconductor brazing equipment, covering primarily Asia and Europe. Weng’s current role at Alpha is to function as the bridge between customer, R&D and marketing focused on material applications. As part of the R&D external interface with customers, Mok conducts material/process evaluations to optimize material performance while gathering feedback and relevant information for accurate material performance assessment and further development internally.




Gold Sponsors

Supporting Sponsors