IPC Conference on Assembly and Reliability
27 January 2015 - Mövenpick Hotel Saigon, Ho Chi Minh City, Vietnam
29 January 2015 - Miracle Grand Convention Hotel, Bangkok, Thailand

Conference Agendas


29 January 2015 - Bangkok, Thailand

Time

Topic

Speaker

9:00-9:15

Conference Registration

9:15-10:00

Overview of IPC Programs and Standards

David Bergman
Vice President, International Relations, IPC

10:00-10:30

Coffee Break

10:30-11:00

Second Generation Shock Resistant and Thermally-Reliable Low Ag SAC Solder with Mn

Kenneth Thum
Senior Technical Engineer
Indium Corporation

11:00-11:30

Rosin Flux Designation in IPC J-STD-004 and Flux Performance in Pb-free Solder Paste Application

Wayne Ng
Regional Technical Manager
Nihon Superior Co. Ltd.

11:30-12:00

Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance

Tuck Weng Mok
Manager-Global Application Technology & Engineering, ALPHA

12:00-13:00

Lunch

13:00-13:30

Cleaning Flux Residue under BTCs in Batch Spray in Air Tools

Jason Chan
Asia Technology Manager
KYZEN Corporation

13:30-14:00

Why Clean No-Clean

Guan Tatt Yeoh
Senior Application Engineer
ZESTRON South Asia

14:00-14:30

Under-Stencil Wipe Cleaning Improves Stencil Printing Yields

Jason Chan
Asia Technology Manager
KYZEN Corporation

14:30-15:00

Coffee Break

15:00-15:30

Novel Solution for Circuit Board Protection

Kevin Tan
Senior Technical Service Engineer
Henkel Electronics

15:30-16:00

IPC Standards Development and Certification Quality Initiatives

David Bergman
Vice President, International Relations, IPC

16:00-16:30

Conclusion/Networking Session


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27 January 2015 Ho Chi Minh City, Vietnam

Time

Topic

Speaker

9:00-9:30

Conference Registration

9:30-10:15

Overview of IPC Programs and Standards

David Bergman
Vice President, International Relations, IPC

10:15-10:45

Coffee Break

10:45-11:30

Rosin Flux Designation in IPC J-STD-004 and Flux Performance in Pb-free Solder Paste Application

Wayne Ng
Regional Technical Manager
Nihon Superior Co. Ltd.

11:30-12:00

Thermal Pad Design and Process for Voiding Control at QFN Assembly

Nguyen Viet Truong
Assistant Technical Manager
Indium Corporation

12:15-13:15

Lunch

13:15-14:00

Cleaning Flux Residue under BTCs in Batch Spray in Air Tools

Jason Chan
Asia Technology Manager
KYZEN Corporation

14:00-14:45

Novel Solution for Circuit Board Protection

Kevin Tan
Senior Technical Service Engineer
Henkel Electronics

14:45-15:15

Coffee Break

15:15-16:00

Under-Stencil Wipe Cleaning Improves Stencil Printing Yields

Jason Chan
Asia Technology Manager
KYZEN Corporation

16:00-16:30

IPC Standards Development and Certification Quality Initiatives

David Bergman
Vice President, International Relations, IPC

16:30-17:00

Conclusion/Networking Session

 

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Gold Sponsors

Supporting Sponsors

  Indium Kyzen NIHON SUPERIOR
WIZ LOGIX