Agenda

Wednesday, November 13
1:00 pm Check in/Exhibits
1:30 pm Welcome and Introductions
1:45 pm KEYNOTE Improving Interconnect Reliability Using Nanomaterials
Alan Rae, Ph.D., CEO, Nanomaterial Innovation Center
2:15 pm Specialty Low Temperature and Low Lead Solders
Joe Bahou, Director of Corporate Communications, Indium
3:00 pm Alternative Lead-Free Alloys for SMT Assembly
Carlos Tafoya, Technical Applications Manager, AIM Solder
3:30 pm Break/Exhibits
3:45 pm Mixed Solder Processing
Ning-Cheng Lee, Ph.D., Vice President of Technology, Indium
4:15 pm Enabling Technologies for Broadband Printing
Chrys Shea, President, Shea Engineering Services
4:45-5:00 pm Adjourn


Thursday, November 14

8:15 am Check in/Exhibits
8:30 am PERM Testing Document for Reliability
Linda Woody, Engineering Manager, Lockheed Martin
9:15 am Cleaning and Contamination Issues
Cheryl Tulkoff, Senior Member of Technical Staff, DfR Solutions
10:00 am Break/Exhibits
10:15 am A Process for Improved QFN Reliability
Lenora Toscano, Director of OEM Applications, MacDermid Inc.
11:00 am Criticality of Stencil Aperture Design and Implementation for a QFN Package
Larry Bright, Assembly Engineering Manager, MicroSemi
Noon Lunch/Exhibits
1:00 pm Pad Crater Risk Assessment Generated by Spherical Bend Testing
John McMahon, Manager of Assembly Technology Services, Celestica
1:45 pm Corrosion and Reliability Characteristics of Fluxes
Renee Michalkiewicz, General Manager, Trace Laboratories - Baltimore
2:30 pm Understanding Key Reliability Factors and IPC Specifications
Reza Ghaffarian, Ph.D., Principal Engineer, Jet Propulsion Laboratory,
CalTech; Chair, IPC 6-10d SMT Attachment Reliability Test Methods
3:15 pm Break/Exhibits
3:30 pm Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing
Ronald Lasky, Ph.D., Senior Technologist, Indium; Professor, Dartmouth College
4:15 pm Computational Modeling Simulation for Solder Joint Fatigue
Michael Neilsen, Staff Engineer, Sandia National Laboratories
4:45 pm A “Drop-In” Solution for Pad Cratering
Jim Ryan, Vice President, Integral Technologies
5:15 pm Adjourn

 

Tabletop Exhibitors

 
         

Supporting Media