IPC Conference on Solder and Reliability
Materials, Processes and Tests

IPC Conferenece on Solder and ReliabilityThis important event will focus on practical methodologies that can be deployed today: critical information for staff and managers responsible for reliability. Industry experts representing every market sector will discuss solder technology and testing strategies. Focused presentations will address strategic reliability considerations related to solder alloys, defects like pad cratering, risk mitigation processes and data analysis.

This event follows the 7th International Symposium on Tin Whiskers, which runs from Tuesday, November 12 until noon on Wednesday, November 13. Together, these events provide a comprehensive perspective on lead-free reliability, from theory to practice. Take advantage of the opportunity to take home information you can use, with the Value Package that includes both events.

Register online at www.ipc.org/November-conferences-registration. For registration questions, please call +1 847-597-2861 or e-mail registration@ipc.org.

Member Rate
Nonmember Rate
7th International Symposium on Tin Whiskers   $495 $695
IPC Conference on Solder & Reliability   $495 $695
Value Package: Both Events $750 $1050*

*Includes a six-month trial IPC membership for your organization. Visit www.ipc.org/trial-membership for more information.


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