Solderability and reliability have never been more critical than in today’s high technology electronic products. Building on the past two IPC conferences in Budapest, this new conference focuses on how IPC standards can be your resource for improving quality, making better materials choices and achieving “the perfect solder joint.”
IPC has brought together an international panel of experts to discuss critical areas of the assembly process and how your design and materials choices will affect cost, reliability and turnaround time. The conference will also cover the growing importance and effect of environmental regulations and future prospects for growth in Central Europe.
In addition to the conference, suppliers from across Europe will show the next generation of services, equipment and materials designed to assist you in reaching your manufacturing goals. Budapest, located in the crossroads of Europe’s electronics manufacturing centers, is an ideal location to come, learn and network with other electronics manufacturing engineers and top management. Sign up today for this cost-effective event designed to meet your needs.